JP2010123906A - Device and method of mounting parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently perform stack mount on each substrate block while preventing occurrence of defective components in performing stack mount of upper stage components on faultily mounted lower stage components when performing stack mount of components on each substrate block of a multi-piece substrate. <P>SOLUTION: After mounting lower stage components 24 for stack on each substrate block 22 of a multi-piece substrate 21, the lower stage components 24 are photographed by a camera for mark photographing and mounting conditions of the lower stage components 24 are judged based on the image processing results. Resultantly, when faulty mounting of the lower stage components 24 of any substrate block 22 is detected, stack mount of the upper stage components on the faulty mounting of the lower stage components 24 of the relevant substrate block 22 is skipped and mounting of the other components is allowed. Alternatively, when faulty mounting of the lower stage components 24 of any substrate block 22 is detected, mounting of all components including the upper stage components may be skipped afterwards regarding the relevant block 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus and a component mounting method for stacking and mounting at least some components in two or more stages on each substrate block of a multi-chip substrate in which a large number of substrate blocks are integrally formed.

In recent years, in order to meet the demand for miniaturization and high integration of electronic devices, a mounting technology called POP (Package On Package) that puts other components on top of components mounted on a substrate has been put into practical use. Has been. In this type of stack mounting, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2007-158213), as a countermeasure against component mounting mistakes, when mounting the upper component on the lower component, the upper component is normal. If there is a component mounting error that can be brought back to the suction nozzle without being mounted on the printer, it recognizes the position of the lower part image, determines whether the lower part part is misaligned, and the lower part part is misaligned. If there is no position, the upper part is re-mounted, and if there is a position shift of the lower part, the part mounting apparatus is stopped to notify the abnormality.
Japanese Unexamined Patent Publication No. 2007-158213 (see abstract, etc.)

  In the technique of Patent Document 1 described above, when stack mounting is performed, if a component mounting error occurs in which the upper part is not normally mounted and is taken back by being sucked by the suction nozzle, the position of the lower part is recognized, Since it is determined whether or not there is a position shift of the lower part, if there is no component mounting error that can be brought back while the upper part is sucked by the suction nozzle, even if there is a position shift of the lower part, The positional deviation is not detected, and the upper part is mounted on the displaced lower part, resulting in the production of a defective product.

  In order to improve productivity, after mounting components on each board block of a multi-chip board in which a large number of board blocks are integrally formed, and after mounting all components on all board blocks, There is known a mounting method in which the multi-chip substrate is divided along a boundary line (break groove or the like) between the substrate blocks and divided into individual component-mounted substrates. When the technique disclosed in Patent Document 1 is applied to this mounting method, the component mounting apparatus is stopped when the position shift of the lower component is detected in any of the board blocks. There is also a problem that the mounting of all the other board blocks that have been stopped is stopped and the productivity is lowered.

  The present invention has been made in consideration of these circumstances. Therefore, when stacking components on each board block of a multi-chip substrate, the object of the present invention is to stack and mount an upper component on the lower component of the mounting failure. An object of the present invention is to provide a component mounting apparatus and a component mounting method capable of efficiently stack-mounting each board block while preventing the occurrence of defective products.

  In order to achieve the above object, the present invention is such that at least some components are stacked and mounted in two or more stages on each board block of a multi-chip board in which a large number of board blocks are integrally formed. After mounting the lower part of the stack on the board block, the quality of the lower part of each board block is determined to be good. As a result, when a mounting failure of the lower part of any board block is detected, In this case, stack mounting of the upper part on at least the lower part of the mounting failure of the board block is skipped.

  In this way, when a mounting failure of the lower part of any board block is detected from among the board blocks of the multi-cavity board, at least the upper part of the board block to the lower part of the mounting fault By skipping the stack mounting, stack mounting can be continued as usual for other board blocks having no mounting failure. As a result, when stacking components on each board block of a multi-chip board, mounting the lower components while preventing the occurrence of defective products caused by stack mounting the upper components on the lower components of the mounting failure Stack mounting can be efficiently performed on other substrate blocks excluding the substrate block in which a defect is detected.

  In this case, what is necessary is just to determine the quality of the mounting state of the said lower stage component based on the image which imaged the lower stage component with the camera mounted in the component mounting apparatus. For example, image recognition of the position of the component position mark, specific shape conductor pattern, pad, etc. provided on the upper surface of the lower part component to determine whether the lower part component is misaligned, or image recognition of the outer shape of the lower part component You may determine the presence or absence of position shift of the lower part.

  In addition, when a mounting failure of the lower part of any board block is detected from each board block of the multi-chip board, the mounting of all parts including the upper part will be skipped for that board block. You may make it do.

  Or, when a mounting failure of the lower part of any board block is detected, for that board block, only stack mounting of the upper part on the lower part of the mounting fault is skipped, and other parts are mounted. You may make it do. In this case, for the board block that skips stack mounting of the upper part, if the lower part of the mounting failure is removed and mounted again, stack mounting can be performed normally, and the board block in which the mounting failure of the lower part is detected is detected. But normal products can be produced.

  Alternatively, when a mounting failure of the lower part of any board block is detected, only the stack mounting of the upper part on the lower part of the mounting failure of the board block is skipped, and mounting of other parts is permitted. A first skip means, a second skip means for skipping mounting of all subsequent components for the board block when a mounting failure of a lower part of any board block is detected, and the first skip means, A configuration including a skip unit and a selection unit that selects one of the second skip units may be employed. For example, if it is possible to “repair” by removing and re-mounting the lower part of the mounting failure, select the first skip means, and if the lower part of the mounting failure cannot be repaired, select the second skip means Just do it.

  Hereinafter, two embodiments 1 and 2 will be described which are embodied by applying the best mode for carrying out the present invention to a module type component mounting apparatus.

A first embodiment of the present invention will be described with reference to FIGS.
First, the configuration of the modular component mounting apparatus will be described with reference to FIG.
A plurality of mounter modules 12 are arranged on the base table 11 of the module type component mounting system so as to be interchangeable in the circuit board transport direction. Each mounting machine module 12 is configured by mounting a feeder 14, a circuit board transport device 15, a component imaging device 16, a component mounting device 17, etc. on a main body bed 13, and an operation panel is provided on the front surface of the upper frame 18. A part 19 is provided. A circuit board and a multi-chip board 21 (see FIG. 2) are sequentially transferred by the circuit board transfer device 15 of each mounting machine module 12, and components are mounted on each board by the component mounting device 17.

Next, a method of stacking components on the multi-piece substrate 21 using the module type component mounting apparatus having the above configuration will be described.
As shown in FIG. 2, the multi-chip substrate 21 is a single large substrate in which a large number of substrate blocks 22 are integrally formed in a grid pattern, and finally the boundary line of each substrate block 22 after component mounting. (Break groove etc.) are used by dividing. Board position marks 23 (global fiducial marks) are formed at a plurality of positions (for example, four corners) outside the board block 22 on the upper surface of the board block 22, and the component mounting device 17 is moved in the XY directions. The substrate position mark 23 is imaged by a mark imaging camera (not shown) attached to an XY robot (not shown) to recognize the position of the multi-chip substrate 21.

  As shown in FIGS. 3 and 4, component position marks 27 (local features) are provided at a plurality of locations (for example, two locations in the diagonal direction) on the upper surface of the lower component 24 that is stacked and mounted on each substrate block 22 of the multi-cavity substrate 21. The position of the lower part 24 is image-recognized by imaging the part position mark 27 with a mark imaging camera.

  As shown in FIG. 4, one or a plurality of upper stage components 25 are stacked and mounted on the lower stage component 24 mounted on each substrate block 22 of the multi-chip substrate 21. In addition to the stacking components 24 and 25, a normal component 26 that is not stacked is mounted on each board block 22. The parts 24 and 25 to be stacked and mounted on each board block 22 are not limited to one set, and a plurality of sets of parts may be stacked and mounted. In addition, only one set or a plurality of sets of stacking components may be mounted on each board block 22, and other normal components may not be mounted.

  Further, stacking parts may be stacked on each board block 22 in three or more stages. In this case, when stacking the second-stage component on the first-stage component, the first-stage component corresponds to the “lower-part component” and the second-stage component corresponds to the “upper-stage component”. When the third-stage component is stacked and mounted on the component, the second-stage component corresponds to the “lower-part component” and the third-stage component corresponds to the “upper-stage component”.

  A control device (not shown) of the module type component mounting apparatus mounts the lower part 24 for stacking on each board block 22 of the multi-piece substrate 21, and then images the lower part 24 with a mark imaging camera. The quality of the mounting state of the lower part 24 is determined based on the image processing result (this function corresponds to the lower part mounting state determination means in the claims). At this time, for example, the part position mark 27 of the lower part 24 is imaged, and the presence or absence of the positional deviation of the lower part 24 is determined based on the image processing result, or the entire lower part 24 is imaged to perform image processing. The quality of the mounting posture of the lower part 24 is determined based on the result.

  Further, the control device of the module type component mounting apparatus stacks the upper component 25 on the lower component 24 of the mounting failure of the board block 22 when the mounting failure of the lower component 24 of any of the board blocks 22 is detected. Mounting is skipped, and mounting of other components is permitted (this function corresponds to skip means in the claims).

  The mounting control described above is executed according to the mounting control program of FIG. 5 by the control device of the modular component mounting apparatus. When the mounting control program of FIG. 5 is started, first, in step 101, the substrate position mark 23 of the multi-chip substrate 21 is imaged by the mark imaging camera, and the position of the multi-chip substrate 21 is recognized. Thereafter, the process proceeds to step 102 where the lower component 24 is mounted at a predetermined position of each board block 22 of the multi-chip board 21.

Thereafter, the process proceeds to step 103, where the part position mark 27 of the lower part 24 mounted on each board block 22 is imaged with a mark imaging camera, and the position of the lower part 24 is recognized.
In addition, after mounting the lower component 24 on all the substrate blocks 22 of the multi-cavity substrate 21, the component position marks 27 of the lower component 24 of each substrate block 22 may be recognized in order. Each time the lower component 24 is mounted on one board block 22, the component position mark 27 of the lower component 24 may be image-recognized.

  Thereafter, the process proceeds to step 104, where it is determined whether an image processing error has occurred for each substrate block 22 or not. Here, the image processing error is caused when the component position mark 27 of the lower part 24 cannot be normally recognized (for example, when the lower part 24 cannot be mounted normally due to take-out or the like, or the lower part 24 is tilted). Such as when mounted in a posture).

  If this image processing error has occurred, there is a high possibility that the lower part 24 is not mounted in a normal state. Therefore, the process proceeds to step 107, and the lower part 24 is normal for the board block 22 in which the image processing error has occurred. It is determined that it is not mounted in the correct state (mounting failure), and stack mounting of the upper part 25 is skipped.

  For the board block 22 in which no image processing error has occurred, the process proceeds from step 104 to step 105, and the positional deviation amount of the lower part 24 is determined for each board block 22 based on the image processing result of the part position mark 27 of the lower part 24. Is determined to be within the allowable range, and if any positional deviation of the lower part component 24 exceeds the allowable range in any of the board blocks 22, it is determined that the lower part 24 of the board block 22 is not mounted correctly. Then, the process proceeds to Step 107, and the stack mounting of the upper part 25 is skipped for the board block 22 in which the amount of displacement of the lower part 24 exceeds the allowable range.

  On the other hand, for the board block 22 in which the amount of displacement of the lower part component 24 is within the allowable range, the process proceeds to step 106, and the upper part 25 is stacked and mounted on the lower part component 24. Thereafter, the process proceeds to step 108, and another normal component 26 is mounted on each board block 22 of the multi-chip board 21. In this case, the normal component 26 is also mounted on the board block 22 in which the stack mounting of the upper component 25 is skipped.

  In the mounting control program shown in FIG. 5, the normal components 26 are mounted after stacking the stack components 24 and 25. On the contrary, after mounting the normal components 26, The stacking parts 24 and 25 may be mounted in a stack.

  In the first embodiment, the part position mark 27 of the lower part 24 is imaged by a mark imaging camera so that the position of the lower part 24 is recognized. However, the lower part is provided with a part position mark. If there is not, the image of the position of the conductor pattern, pad, etc. of the specific shape of the lower part can be recognized to determine whether the lower part is misaligned, or the outer shape of the lower part can be recognized to recognize the position of the lower part. The presence or absence may be determined.

  According to the first embodiment described above, when a mounting failure of the lower part 24 of any one of the board blocks 22 is detected from among the board blocks 22 of the multi-chip board 21, the board block 22 By skipping the stack mounting of the upper part 25 to the lower part 24 of the mounting failure, the stack mounting can be continued as usual for the other board blocks 22 having no mounting failure. As a result, when the components 24 and 25 are stacked and mounted on each board block 22 of the multi-cavity substrate 21, the generation of defective products caused by stack mounting the upper component 25 on the lower component 24 is prevented in advance. However, it is possible to efficiently perform stack mounting on other board blocks 22 except for the board block 22 in which the mounting failure of the lower component 25 is detected.

  In the first embodiment, when a mounting failure of the lower part 24 of any of the board blocks 22 is detected, only the stack mounting of the upper part 25 on the lower part 24 of the mounting fault is performed for the board block 22. Since the other components 26 are mounted, the board block 22 in which the stack mounting of the upper component 25 is skipped is removed (repaired) by removing the lower component 24 and mounting it again. Stack mounting can be performed normally, and normal products can be produced even with the substrate block 22 in which a mounting failure of the lower part 24 is detected.

  In the first embodiment, the position deviation of the lower part component 24 is obtained based on the position of the multi-piece substrate 21 based on the recognition of the substrate position mark 23. However, each substrate block 22 is provided with a reference mark, and the reference The positional deviation of the lower part 24 may be obtained based on the mark.

  In the first embodiment, when a mounting failure of the lower part 24 of any one of the substrate blocks 22 is detected from among the substrate blocks 22 of the multi-chip substrate 21, the substrate block 22 is not mounted correctly. Only the stack mounting of the upper part 25 on the lower part 24 is skipped and the other parts 26 are mounted. However, in the second embodiment of the present invention, a large number can be obtained by executing the mounting control program of FIG. When a mounting failure of the lower part 24 of any one of the board blocks 22 is detected from among the board blocks 22 of the individual substrate 21, all the parts including the upper part 25 will be described for the board block 22 thereafter. Is skipped (step 107a). The processing of other steps is the same as that in the first embodiment (FIG. 5).

  The second embodiment may be performed, for example, when the lower part 24 in which a mounting failure is detected cannot be repaired or when the cost for repair is large. This is because when the lower-stage component 24 with poor mounting cannot be repaired, even if other components are mounted on the board block 22, all of them are wasted.

In addition, the present invention may be implemented by combining the above two embodiments 1 and 2.
Specifically, when a mounting failure of the lower part 24 of any of the board blocks 22 is detected, only the stack mounting of the upper part 25 on the lower part 24 of the mounting fault of the board block 22 is skipped and the others A first skip means for permitting the mounting of other components, and when a mounting failure of the lower part 24 of any of the board blocks 22 is detected, the board block 22 skips the mounting of all subsequent parts. It is good also as a structure provided with the 2 skip means, and the selection means which selects any one of the said 1st skip means and the said 2nd skip means. For example, the first skip means may be selected when repairing the lower part 24 with poor mounting is possible, and the second skip means may be selected when the lower part 24 with poor mounting cannot be repaired.

  In the present invention, the position recognition of the lower part and the skip of mounting of the parts may be performed not only within the same mounting machine module but also between different mounting apparatuses or mounting machine modules. In this case, the upstream mounting apparatus or mounting machine module determines whether or not the lower-stage component is mounted, and the downstream mounting apparatus or mounting machine module performs mounting skipping based on the result.

  In addition, the present invention is not limited to the module type component mounting apparatus as shown in FIG. 1, but can be applied to a component mounting apparatus having various configurations in which components are stacked and mounted on each board block of a multi-chip board.

It is a perspective view which shows the structure of the module type component mounting apparatus in one Example of this invention. It is a front view which shows an example of a multi-piece substrate. It is a front view which shows the state which mounted the lower stage components for stacking on each board block of a multi-piece board. It is the elements on larger scale which show typically an example of the component mounting state of one board block. 3 is a flowchart illustrating a flow of processing of a mounting control program according to the first embodiment. 12 is a flowchart illustrating a flow of processing of a mounting control program according to the second embodiment.

Explanation of symbols

  21 ... Multi-chip board, 22 ... Board block, 23 ... Board position mark, 24 ... Lower part, 25 ... Upper part, 26 ... Normal part, 27 ... Part position mark

Claims (5)

In a component mounting apparatus that stacks and mounts at least some components in two or more stages on each board block of a multi-piece board in which a large number of board blocks are integrally formed,
Lower part mounting state determination means for determining the quality of the mounting state of the lower part of each board block after mounting the lower part for stacking on each board block;
Skip means for skipping stack mounting of the upper part of the board block at least on the lower part of the board block when the lower part part mounting state determining means detects the lower part of the board block. The component mounting apparatus characterized by the above-mentioned. A camera for imaging the component mounted on each of the substrate blocks;
The component mounting apparatus according to claim 1, wherein the lower component mounting state determination unit determines whether the lower component is mounted based on an image obtained by imaging the lower component with the camera.   The skip means, when the mounting failure of the lower part of any board block is detected by the lower part mounting state determination means, the board block thereafter mounts all parts including the upper part. The component mounting apparatus according to claim 1, wherein skipping is performed.   The skip means skips only the stack mounting of the upper part on the lower part of the board block mounting failure when the lower part mounting state determination means detects the lower part mounting fault of the board block. The first skip means for permitting the mounting of other parts and the lower part mounting state determination means detect the lower part mounting failure of any of the board blocks for the board block. 2. A second skip unit that skips mounting of the component, and a selection unit that selects one of the first skip unit and the second skip unit. 4. The component mounting apparatus according to any one of 3 above. In a component mounting method in which at least some components are stacked and mounted in two or more stages on each substrate block of a multi-cavity substrate in which a large number of substrate blocks are integrally formed.
A lower part mounting state determination process for determining whether the mounting state of the lower part of each board block after mounting the lower part for stacking on each board block;
A skip process for skipping stack mounting of the upper part of the board block at least on the lower part of the board block when a lower part mounting fault of the board block is detected by the lower part mounting state determination process. A component mounting method characterized by comprising:

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