JP2005064366A - Component mounting apparatus and error recovering method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus properly performing recovery operation depending on circumstances that a falling error of a part, a withdrawal error thereof, and an absorption error from tray type component supplying equipment, and an error recovering method thereof. <P>SOLUTION: An error screen is displayed when the falling error occurs (S701), and either the recovery (S703) or the confirmation of a mounting position (S704) is selected. In the case of the confirmation of the mounting position, an image in the vicinity of the mounting position is displayed by using a teaching screen (S705), and a user can confirm the circumstances by visual observation. After the confirmation, a verification inputting screen is displayed (S708), and either a re-mounting process (S715) or a mounting process for the next part by skipping a part (S719) is made selectable. In the case of recovery at the first selection, either the confirmation of the mounting position by using the teaching screen (S705) or the immediate verification process (S708) is made selectable. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus and an error recovery method thereof.

2. Description of the Related Art Conventionally, there is a component mounting apparatus that automatically mounts a large number of chip-shaped electronic components such as ICs, resistors, and capacitors on a printed circuit board that is automatically carried into the apparatus by a work head to produce a board unit.
In such a component mounting apparatus, the work head of the component mounting apparatus sucks a chip-shaped electronic component supplied from a tape reel-type component supply device or a tray-type component supply device with a suction nozzle, and uses a component recognition camera to pick up the component. The suction state is imaged, image recognition is performed to correct the difference between the suction posture and the posture to be mounted, and the chip-shaped electronic component is mounted at a predetermined position on the printed circuit board.

  At this time, for example, when a malfunction due to a change over time occurs in the suction nozzle or vacuum device of the work head, or when the chip-like electronic component itself supplied from the component supply device is defective, the chip Component-like electronic components that are picked up by the suction nozzle from the pick-up nozzle or mounted on the printed circuit board during the period from picking up the electronic component to image recognition and mounting on the substrate A part take-away error may occur, such as taking away a chip-like electronic part without being mounted.

  When such an error occurs, the component mounting apparatus stops in error. Then, the operator inserts his head into the apparatus and visually confirms the error state of the printed circuit board in the apparatus, or once the production is finished, the printed circuit board is taken out from the apparatus, and the same as above. After visually confirming the error state of the printed circuit board, the mounting operation of the unmounted portion of the printed circuit board is advanced to complete the production of the board unit.

Further, when the chip-shaped electronic component is supplied from a tray component supply device having a transport device, the chip-shaped electronic component remains held on the transport device without being picked up by the work head of the component mounting device. There is a case. Also in this case, the component mounting apparatus stops with an error.
However, in this way, after the chip-like electronic component is picked up, after the image is recognized and mounted on the printed circuit board, if the chip-like electronic component falls off the suction nozzle, or the chip-like electronic component that should have been mounted When an error judgment is made as being brought home, the device stops in error and the printed circuit board in the device is visually checked for the error state in order to check the state of the printed circuit board. Since the head must be inserted into the work, it is extremely dangerous work and there is a problem with safety.

In addition, once the production is finished, the printed circuit board is taken out from the apparatus and the error state is visually confirmed, and it takes time and labor to once finish the production and reset the setting. For this reason, there is a problem that the production efficiency is extremely lowered.
Also, whether you insert your head in the device or take out the printed circuit board from the device, tape reel type component supply devices, tray type component supply devices, etc. are arranged without gaps in the opening of the device. As a result, there is a problem that the work space for workers to perform work is extremely narrow, and the work does not progress easily.

  In addition, as described above, when the chip-shaped electronic component supplied from the tray component supply device having the transport device is stopped by an error while being held by the transport device without being picked up by the work head of the component mounting device When the normal recovery operation (recovery operation) is performed as it is, the chip-shaped electronic components that are still adsorbed by the transport device are dropped out of or into the device, and the device is opened by opening the device cover. Troubles such as having to remove electronic components occur. In the worst case, the problem also arises that the chip-shaped electronic component dropped into the device is caught in the active part and the device is damaged.

  In addition, an erroneous determination may occur in the error determination for the state as described above. In this case, if the recovery operation is performed as it is based on the error determination of the erroneous determination, there is a problem of a shortage or a double mounting. Occurs and becomes a problem.

  In view of the above-described conventional situation, the problem of the present invention is that a recovery operation is appropriately performed depending on the situation in the event of a chip-type electronic component drop error or take-away error, a suction error from a tray-type component supply device having a transport device, etc. Thus, there is provided a component mounting apparatus and an error recovery method for reducing time loss as much as possible and preventing damage to the apparatus.

  The component mounting apparatus of the present invention sucks a chip-shaped electronic component supplied from the component supply device by a suction nozzle of the mounting head held in the work head and movable in a three-dimensional work space of X, Y, and Z. Then, the suction state of the chip-shaped electronic component is imaged with a component recognition camera to recognize the image, the mounting posture is corrected based on the image recognition, and the chip-shaped electronic component is carried into the apparatus based on the correction. In the component mounting apparatus that performs mounting processing at a predetermined position on the printed circuit board, the chip electronic component is sucked between the mounting of the chip electronic component by the mounting head and the mounting processing on the printed circuit board. Suction determination means for determining whether the nozzle is sucked or not, and whether the chip-like electronic component is mounted on the printed circuit board after the mounting process or to the mounting Mounting determination means for determining whether or not the suction nozzle is still sucked by the suction nozzle; and when the chip-like electronic component is determined not to be sucked by the suction nozzle by the suction determination means, or the mounting determination means When it is determined that the chip-shaped electronic component is still sucked by the suction nozzle, an error screen is displayed on the display device, and the error screen displays the vicinity of the position where the component is to be mounted. An image is picked up and displayed on the display device to check the state near the mounting position of the substrate, whether to immediately remount, or to skip the mounting process for one component. And an error screen display means.

  The component mounting apparatus holds a chip-shaped electronic component by, for example, a transport device, transports the held chip-shaped electronic component to a component suction position of the component mounting device, and supplies the chip-shaped electronic component to the component mounting device. Holding determination means for determining whether or not the chip-like electronic component is held on the transfer device after the chip-like electronic component is supplied from the transfer device to the component mounting device, and the holding A tray-type component supply device including a determination result notifying unit for notifying a determination result by the determination unit to a control unit of the component mounting device, and connecting the chip-shaped electronic device on the transport device by the determination result notifying unit. When receiving a notification that the component is held, an error screen is displayed to instruct the chip-shaped electronic component to be manually removed from the transfer device. Further, when the determination result notifying means receives a notification that the chip-like electronic component is held on the transfer device, an error that allows selection input of whether to remove the component again or immediately remount A suction error screen display means for displaying a screen is further provided.

  Further, the error recovery method in the component mounting apparatus according to the present invention is a chip supplied from the component supply apparatus by the suction nozzle of the mounting head held in the work head and movable in the three-dimensional work space of X, Y, and Z. A chip-like electronic component is picked up, and the pick-up state of the chip-like electronic component is picked up by a component recognition camera to recognize the image, and the mounting posture is corrected based on the image recognition. Error recovery method in a component mounting apparatus that performs mounting processing at a predetermined position on a printed circuit board carried into the apparatus, wherein the mounting head mounts the chip-like electronic component on the printed circuit board. A suction determination step for determining whether or not the chip-like electronic component has been sucked by the suction nozzle, and the chip after the mounting process. A mounting determination step for determining whether a chip-shaped electronic component is mounted on the printed circuit board or remains sucked by the suction nozzle of the mounting head, and the chip-shaped electronic component is moved to the suction nozzle by the suction determination step. An error screen is displayed on the display device when it is determined that the chip-like electronic component is still sucked by the suction nozzle in the mounting determination step. A screen is used to image the vicinity of the position where the component is to be mounted on the board, and the imaging screen is displayed on a display device to check the state near the mounting position of the board, or a remounting process is performed immediately, or 1 And an error screen display step for displaying whether or not to skip the mounting process for the parts.

  The error recovery method in the component mounting apparatus is, for example, holding a chip-shaped electronic component by a transport device, transporting the held chip-shaped electronic component to a component suction position of the component mounting device, and supplying the component mounting device to the component mounting device. Holding configured to supply a chip-shaped electronic component, and determining whether the chip-shaped electronic component is held on the transfer device after supplying the chip-shaped electronic component from the transfer device to the component mounting device A tray-type component supply device comprising: a determination step; and a determination result notification step of notifying a determination result of the holding determination step to a control unit of the component mounting device. When receiving notification that the chip-shaped electronic component is held on the chip-shaped electronic component, remove the chip-shaped electronic component from the transfer device manually. When a notification that the chip-like electronic component is held on the transfer device is received in the determination result notification step after that, the component removal operation is performed again or immediately is restarted. It further includes a suction error screen display step for displaying whether or not mounting is possible.

  As described above, according to the present invention, when a chip-like electronic component drop error or take-away error occurs, the board recognition camera images the printed circuit board mounting position and displays it on the screen. Error status can be confirmed on the screen, eliminating the danger of inserting a head into the device and checking the error status of the printed circuit board, and reducing the work space of the operator by arranging the component supply device. The inefficiency of error confirmation work based on the situation is eliminated.

Further, since it is not necessary to stop the production for checking the error state, the time loss can be reduced and the work efficiency is improved.
Also, if the error judgment is a false judgment, you can easily confirm that the chip-like component is normally mounted by checking on the printed circuit board by the error judgment. Can be prevented, and the processing can be skipped to immediately shift to the processing for mounting the next chip-shaped electronic component, thereby improving the work efficiency.

  Further, even when the chip-shaped electronic component is held in the transport device of the tray-type component supply device having the transport device, it is impossible to shift to the next operation until the chip-shaped electronic component is surely removed. Therefore, the troubles such as the chip-like electronic parts held in the transport device falling into the device and removing it, or being bitten by other operating parts and breaking the device are solved. The

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 (a) is an external perspective view of a component mounting apparatus according to an embodiment, and FIG. 1 (b) is a perspective view schematically showing an internal configuration by removing upper and lower protective covers. .
As shown in FIG. 2A, the component mounting device 1 includes a monitor device 2 composed of a CRT display before and after the ceiling cover, and an alarm lamp 3 for notifying the operating state on the left and right sides of the ceiling cover. It has. Further, on the front and rear surfaces of the upper protective cover 4, an operation input display device 5 which is composed of a liquid crystal display and a touch input device and can input various instructions by external operation is disposed. (The display unit 5 for operation input on the rear side which is obliquely upward to the right in the figure is shaded and cannot be seen).

  On the lower base 6, a pair of fixed and movable parallel substrate guide rails 7 is provided in the center in the direction of conveyance of the substrate 8 (X-axis direction, diagonally lower right in the figure). (Slanting upper left direction) and extends horizontally. A loop-shaped conveyance belt (conveyor belt) that is not visible in the drawing is disposed so as to be in contact with the lower part of the board guide rails 7.

  The conveyor belt is driven by a belt drive motor (not shown) with the side of the belt having a width of several millimeters looking into the substrate conveyance path from below the substrate guide rail 7, and travels in the substrate conveyance direction. While the printed circuit board (hereinafter simply referred to as the board) 8 shown in FIG. 1 is supported from below, the board 8 before mounting the components is carried into the apparatus main body from the upstream side of the line, and the boards 8 on which the components are mounted are sequentially placed downstream of the line. Carry out to the side. In the component mounting apparatus 1, two substrates 8 are always carried in, positioned, and fixed until the mounting of chip-shaped electronic components (hereinafter simply referred to as components) is completed.

  Parts supply stages 9 are formed on the front and rear sides of the base 6, respectively (the rear part supply stage 9 which is obliquely upward to the right in the figure is hidden behind and cannot be seen. In FIG. (B), the rear part supply stage 9 is not shown). The component supply stage 9 is provided with a large number of 50 to 70 tape reel type component supply devices 11. The tape reel type component supply device 11 is detachably mounted at its rear end with a tape reel 12 on which a tape containing components is attached.

Also, above the base 6, two top fishing Y-axis rails 13 fixed separately on the left and right (X-axis direction) of the main body frame, and these two Y-axis rails 13 are slidable. Two X-axis rails 14 supported in total (four in total for the entire apparatus) are arranged.
The X-axis rails 14 can slide in the Y-axis direction along the Y-axis rails 13, and each of these X-axis rails 14 (four in total as a whole device) 15 working heads 15 (15-1, 15-2 and 15-3, 15-4) are suspended along the X-axis rail 14 so as to be slidable in the X-axis direction.

  In the component mounting program, the work heads 15-1 and 15-2 are handled as front (front side) work heads facing the main work path of the component mounting apparatus 1 arranged on the production line. 15-3 and 15-4 are handled as work heads on the rear side (rear side) facing the work path on the opposite side of the main work path.

In each working head 15, two mounting heads 16 are disposed in the example shown in FIG. That is, a total of eight mounting heads 16 are disposed in the component mounting apparatus 1. A suction nozzle 17 is detachably attached to the tip of each mounting head 16.
The working head 15 is mounted on an electrical component motherboard inside the base 6 of the apparatus main body 1 through a plurality of signal cords (not shown) that are protected and accommodated in a belt-like chain body 18 that is bendable and hollow inside. It is connected to the central control unit. The work head 15 is supplied with electric power and a control signal from the central control unit via these signal codes, and transmits image data indicating information on a substrate positioning mark and a component mounting position to the central control unit.

  Further, between the board guide rail 7 and the component supply stage 9, a plurality of types of component recognition cameras 19 for recognizing images of components sucked by the suction nozzle 17 of the mounting head 16 include four work heads. In the vicinity thereof, although not shown in the drawing, a plurality of types of suction nozzles 17 for exchangeably mounting to the mounting head 16 are accommodated. Nozzle changer is arranged.

In addition to the above-described central control unit, the base 6 is provided with a substrate positioning device, a substrate fixing mechanism for fixing the substrate between the two substrate guide rails 7 and the like, although not particularly illustrated. ing.
FIG. 2 is a perspective view of the working head 15. As shown in the figure, the work head 15 is connected to the central control unit of the main body device by the bendable belt-like chain body 18 as described above, and the two mounting heads 16 supported by the support unit 21. And 16, and a substrate recognition camera 22 with a lighting device. A lighting device 23 and a suction nozzle 17 are mounted on the tip of the mounting head 16 respectively. The suction nozzle 17 is formed of a light diffusing plate 17-1 and a nozzle 17-2.

  The work head 15 is freely moved back and forth and right and left by the Y-axis rail 13 and the X-axis rail 14 described above. Each of the two mounting heads 16 supported by these work heads 15 can be moved up and down in the Z-axis direction (vertical direction) and can be rotated in the θ-axis direction (360 ° direction).

Thereby, the suction nozzle 17 mounted at the tip of the mounting head 16 can be moved back and forth and left and right in each work area via the work head 15 and the mounting head 16, and can be moved up and down. And it is freely rotatable in the 360 ° direction.
FIGS. 3A and 3B are diagrams showing various forms of the component supply apparatus set on the component supply stage 9. In FIG. 1 (a), the same components as those shown in FIGS. 1 (a) and 1 (b) are given the same reference numerals as those in FIGS. 1 (a) and 1 (b). .

  FIG. 2A shows a state in which tape reel type component supply 11 is continuously and closely arranged on the component supply stage 9. FIG. 5B shows the component supply stage from both sides (upstream and downstream of the production line) of the component mounting apparatus 1 instead of the tape reel type component supply 11 on the component supply stage 9. 9 shows a tray-type component supply device in which a component conveying device is inserted and arranged as indicated by arrows A and B.

  The mounting head 16 of the work head 15 shown in FIG. 2 is the component supply port of the tape reel type component supply 11 shown in FIG. 3 (a) or the tray type component supply device 25 (25a, 25b) shown in FIG. 3 (b). The component supplied from the suction point of the component transport device 26 is sucked to the suction nozzle 17 and image-recognized by the component recognition camera 19, and the component after the image recognition is mounted at a predetermined mounting position of the substrate 8.

  FIG. 4 is a diagram illustrating the configuration and functions of the tray type electronic component supply device 25a (25b is basically the same) as an example. As shown in the figure, the tray-type electronic component supply device 25 has a door 27 of the main body portion opened, and a tray shelf 29 is detachably mounted on an internal elevating stand 28, and is fastened to a hole 31 to the bottom. 32, the tray shelf 29 is fixed on the lift table 28.

  As shown in FIG. 3 (b), the tray-type component supply device 25 connected to the component mounting device 1 is a component extraction stage that protrudes from the main body toward the center of the production line as shown in FIG. The desired tray 34 accommodated in the tray shelf 29 is pulled out on the component supply stage 33 together with the pallet (not shown).

  On the tray 34, a large number of components 35 are placed and accommodated. The components 35 on the tray 34 are adsorbed by the adsorbing nozzles of the component transfer head of the uniaxial robot 36 (in the figure, they are on the opposite side of the main body device 25 (obliquely left upper direction) and are not visible because they are shaded), The sample is transferred to a component conveyance table (shuttle) 37 on the component conveyance device 26.

  On the component conveying device 26, a conveying path 26-1 is formed in which two component conveying tables 37 (37a, 37b) reciprocate while crossing each other by a drive mechanism (not shown). The component transport table 37 to which the component 35 is transferred transports the component 35 to the suction point 38 at the tip of the component transport device 26.

  FIG. 5 is a block diagram showing a system configuration of the component mounting apparatus 1 configured as described above. As shown in the figure, the system of the component mounting apparatus 1 includes a CPU 40 and a control unit including an i / o (input / output) control unit 42 and an image processing unit 43 connected to the CPU 40 via a bus 41. . A memory 44 is connected to the CPU 40. The memory 44 includes a program area and a data area (not shown).

Further, the i / o control unit 42 includes an illumination device 45 for illuminating the component mounting position of the substrate 8 (see FIG. 1B) and the suction nozzle 17 of the mounting head 16 (FIGS. 1B and 2). An illumination device 46 for illuminating the component 35 adsorbed to the reference) from below is connected.
Further, the i / o control unit 42 includes four X-axis motors 47, four Y-axis motors 48, eight Z-axis motors 49, and eight θ-axes via respective amplifiers (AMP). A motor 51 is connected. The X-axis motor 47 drives the work head 15 in the X-axis direction via the X-axis rail 14, and the Y-axis motor 48 drives the X-axis rail, that is, the work head 15 in the Y-axis direction via the Y-axis rail 13. To do. The Z-axis motor 49 drives the mounting head 16 of the work head 15 up and down, and the θ-axis motor 51 rotates the mounting head 16, that is, the suction nozzle 17 by 360 degrees.

  Each of the amplifiers is provided with an encoder (not shown), and the motors (X-axis motor 47, Y-axis motor 48, Z-axis motor 49, θ-axis motor 51) are provided by these encoders. An encoder value corresponding to the rotation is input to the CPU 40 via the i / o control unit 42. Thereby, the CPU 40 can recognize the front and rear, the left and right, the current position of the top and bottom, and the rotation angle of each mounting head 16.

  Further, a vacuum unit 52 is connected to the i / o control unit 42. The vacuum unit 52 is pneumatically connected to the suction nozzle 17 of the mounting head 16 via a vacuum tube 53. The vacuum tube 53 is provided with a pneumatic sensor 54. The vacuum unit 52 causes the suction nozzle 17 to suck the component 54 by vacuum, or releases suction by vacuum release, air blow, and vacuum break (vacuum break).

  At this time, the air pressure data in the vacuum tube 53 is output from the air pressure sensor 54 to the CPU 40 as an electrical signal via the i / o control unit 42. As a result, the CPU 40 knows the state of the air pressure in the vacuum tube 53 and can recognize whether or not the component 35 is ready to be sucked by the suction nozzle 17 and whether or not the component 35 is sucked. It is possible to recognize the component suction state such as whether the sucked component 35 is normally sucked.

  Further, the i / o control unit 42 is connected to a positioning device, a belt drive motor, a substrate sensor, an abnormality display lamp, and the like via respective drivers. As described above, the positioning device is disposed below the substrate guide rail 7 in the base 6 of the component mounting device 1 and positions the substrate 8 guided into the device. The belt drive motor circulates and drives the conveyor belt that is integrally disposed on the guide rail 7. The substrate sensor detects the loading and unloading of the substrate 8. The abnormality display lamp (alarm lamp 3 in FIG. 1 (a)) is lit or blinks when the operation of the component mounting apparatus 1 or an abnormality such as entry of a foreign object in the work area is detected to notify the on-site worker of the occurrence of the abnormality.

  Further, the i / o control unit 42 is connected with a communication i / o interface 55, a recording device 56, and the operation input display device 5 shown in FIG. The communication i / o interface 55 is connected to these processing devices in a wired or wireless manner so that communication with the CPU 40 is possible when, for example, teaching processing or the like is performed by another processing device such as a personal computer. To do.

  The recording device 56 can be mounted with various recording media such as hard disk, MO, FD, CD-ROM / RW, flash memory device, etc., and component mounting processing of the component mounting device 1 and setup work performed in advance thereof. Various types of data such as component master creation processing, component mounting teaching processing, component library data, and NC data from CAD are recorded and held in the memory 44 by the CPU 40. It is loaded into the program area and used to control each part. The data is also read into the data area of the memory 44, subjected to a predetermined process, and the processed and updated data is stored and stored in a predetermined data area of a predetermined recording medium.

  The image processing unit 43 includes a substrate recognition camera shown in FIG. 2 that is integrated with the illumination device 45 that images the component mounting position of the substrate 8 disposed on the work head 15 and illuminated by the illumination device 45. 22 and the component recognition camera 19 shown in FIG. 1B, which is also integrated with the illumination device 46, is connected.

  On the display screen of the operation input display device 5 described above, the component mounting position of the substrate 8 captured by the image processing unit 43 by the substrate recognition camera 22 on the work head 15 side when executing the component mounting operation during the production of the substrate unit. And a recognition image of the component 35 captured by the image processing unit 43 by the component recognition camera 19 on the main body apparatus side. The same message is displayed when an error occurs.

In the above configuration, the component mounting apparatus 1 performs an error determination process and a predetermined number of retry processes described below by the CPU 40 shown in FIG.
FIG. 6 is a flowchart showing the component discharge processing when a recognition error occurs in the image recognition processing of the component 35 (that is, the component is defective). In this process, the work head 15 moves to a defective part discarding unit (not shown in FIG. 1B), and discharges the defective part in which a recognition error has occurred in the defective part discarding unit.

In FIG. 6, when a recognition error occurs in the image recognition process of the component 35, the CPU 40 first clears the built-in counter N to “0” (S601).
Next, the CPU 40 performs discharge processing of the recognition error component 35 (S602). In this process, the CPU 40 drives the X-axis motor 47 and the Y-axis motor 48 corresponding to the work head 15 holding the component 35 to move the work head 15 to the defective component discarding section, and causes the Z-axis motor 49 to move. By driving, the mounting head 16 is lowered to a predetermined position, and the vacuum unit 52 is driven to release the suction of the component 35 by the suction nozzle 17 by vacuum release, air blow, and vacuum break.

  Subsequently, the CPU 40 determines whether or not the recognition error component 35 is discharged (S603). In this process, the CPU 40 refers to the output of the air pressure sensor 54 of the vacuum tube 53 connected to the mounting head 16 of the work head 15 and releases the suction of the component 35 from the suction nozzle 17 of the mounting head 16. It is determined whether it has been discharged to the defective part disposal unit.

When the output of the air pressure sensor 54 indicates that the air pressure is lower than the reference value when there is no suction, the CPU 40 has not completely released the suction from the suction nozzle 17. Therefore, it is determined that there is a possibility of take-away (No in S603).
In this case, it is next determined whether or not the value N of the counter N has exceeded a preset number of retries (S604). As the preset number of retries, an appropriate value (for example, “3”) is empirically set in advance.

In this determination, if the value N of the counter N has not yet exceeded the preset number of retries (No in S604), the value N of the counter N is incremented by “1” (S605), and the above processing procedure S602 is performed. Returning to step S602, the processes in and after S602 are repeated.
If the discharge of the component 35 is completed in the determination in the above processing procedure S603 (S603: Yes), the component discharge process is terminated (S606).

On the other hand, when it is determined in the processing procedure S603 that discharging of the component 35 is not completed, and the determination in the next processing procedure S604 indicates that the value N of the counter N exceeds the preset number of retries ( An error display is performed (S607).
In this process, the CPU 40 not only displays an error on the operation input display device 5, but also causes an error to occur to a worker who may be far away from the device body by, for example, blinking the alarm lamp 3 or the like. Notify and stop the main body.

  In this way, when a defective part that causes a recognition error occurs and this part is discarded, it is monitored whether the part has been completely discharged to the defective part disposal section. By performing the discharge retry within a predetermined number of times (for example, 3 times), the components are completely discharged. Then, only when the discharge is not completed even after the predetermined number of discharge retries, the apparatus main body is stopped and maintenance work is started.

  This eliminates the time and labor required to stop the main body of the device and complete the discharge manually by the operator if the discharge is light enough that the discharge is completed within a predetermined number of discharge retries. Since the discharging is automatically and completely performed, the work efficiency of the component mounting process is improved.

This component discharge process is similarly performed in the component discharge process when skipping a component when a component take-out error described later occurs.
FIG. 7 is a flowchart for explaining the processing operation when a component drop error occurs in which a component falls off from the suction nozzle.

FIGS. 8A, 8B and 9A, 9B, 9C are diagrams showing examples of display screens displayed on the operation input display device 5 in the above processing operations. .
In FIG. 7, when the component 35 falls off the suction nozzle between the suction of the component 35 by the mounting head 16 and the mounting process on the substrate 8, the CPU 40 first drops the component onto the operation input display device 5. An error screen is displayed (S701).

  Here, for example, a component drop error screen as shown in FIG. 8A is displayed. In the example shown in FIG. 8A, the part drop error screen 57 is displayed with large characters “2” and “REAR” below the small “stage” in the upper center, and corresponds to the work head 15-4. This shows that a component drop error has occurred in the rear stage 2 which is the work area to be operated.

  Below that, a supply package number, a part code, and a part name are displayed, a “mounting position confirmation” button 58 is displayed, and a message display area 59 below that indicates “a vacuum tube 53 before mounting a part on a board”. A message informing that “the degree of vacuum inside is abnormal and the component is not sucked by the suction nozzle” is displayed.

On the left side of the center display, four square frames indicating the respective work areas of the four work heads 15 are displayed. Of these, the left square frame of the upper two square frames representing the rear stage 2 is displayed. The color is changed.
Further, a “buzzer OFF” button 61, an “changer open” button 62, and a “recovery” button 63 are displayed on the right side of the central display.

  Thereafter, in FIG. 7, the CPU 40 waits for the operator to input a button on the component drop error screen 57 (S702). When any button is input, the input operation is performed first. It is determined whether or not the button is the “recovery” button 63 (S703).

  If the pressed button is not the “recovery” button 63 (No in S703), then it is determined whether or not the “mounting position confirmation” button 58 has been pressed (S704). If S704 is No), the process returns to S702, and if it is pressed (Yes in S704), the teaching screen 68 shown in FIG. 9A is displayed (S705).

  In this case, the displayed screen is a teaching screen, but teaching is not performed. In the teaching screen 68 shown in FIG. 9 (a), an imaging screen in the vicinity of the mounting position of the component 35 causing the component drop error of the substrate 8 is displayed in the large substrate surface display region 69 in the center, and above the display region. Is a small instruction message “Please check the vicinity of the mounting position”. In addition, on the lower right side of the central substrate surface display area 69, six cursor buttons 70 for instructing up / down, left / right, right rotation, and left rotation are displayed.

The operator operates these six cursor buttons 70 to check whether or not a part has fallen in the vicinity of the mounting position, and presses a “return” button 71 when the confirmation is completed.
During this time, the CPU 40 waits for a button input operation (S706). When the button is input, the CPU 40 determines whether the input operation button is the “return” button 71 (S707). If it is not the “button” 71 (No in S707), the processing steps S706 and S707 are repeated until the “return” button 71 is pressed.

When the “return” button 71 is pressed (S707: Yes), the confirmation screen 72 shown in FIG. 9B is displayed (S708).
If the “recovery” button 63 is pressed on the first part drop error screen 57 (S703: Yes), a confirmation screen 64 shown in FIG. 8B is displayed (S709).

On this confirmation screen 64, an inquiry message “A component drop error has occurred, will you confirm the mounting position?”, Followed by a “Yes (Y)” button 65 and a “No (N)” button. Three buttons 66 and a “cancel” button 67 are displayed.
Thereafter, in FIG. 7, the CPU 40 waits for a button input from the operator to the confirmation screen 64 (S710). When any button is input, first, the input button is displayed. It is determined whether or not it is the “Cancel” button 67 (S711).

  If the “Cancel” button 67 is pressed (S711 is Yes), the process returns to the first processing procedure S701. If it is not the “Cancel” button 67 (S711 is No), then the “Yes (Y)” button is displayed. It is determined whether or not 65 has been pressed (S712), and if the "Yes (Y)" button 65 has been pressed (S712 is Yes), the process proceeds to the above-described processing procedure S705, and in this case as well, FIG. The teaching screen 68 shown in FIG.

  If the pressed button is neither the “Cancel” button 67 (No in S711) nor the “Yes (Y)” button 65 (No in S712), the pressed button remains “No (N)”. In this case, it is determined that the button 66 is selected, and the process proceeds to the above-described processing step S708 to display the confirmation screen 72 shown in FIG.

On this confirmation screen 72, a message “Do you want to remount? Select“ No ”to skip“ Yes ”when remounting this part” ”and a“ Yes (Y) ”button 73. In addition, a “No (N)” button 74 is displayed.
Here, the CPU 40 waits for a button input from the operator to the confirmation screen 72 (S713). When any button is input, the input button is first displayed as “No (N ) ”Button 74 or not (S714). If the pressed button is not the “No (N)” button 74, it is the “Yes (Y)” button 73 that has been pressed, and in this case, the remounting process is executed (S 715).

On the other hand, if the pressed button is the “No (N)” button 74 (S714 is Yes) in the determination of the processing procedure S714, the confirmation screen 75 shown in FIG. 9C is displayed (S716).
On the confirmation screen 75, an inquiry message “Do you want to skip this part?” And a “Yes (Y)” button 76 and a “No (N)” button 77 are displayed below the message.

  Here, the CPU 40 waits for the operator to input a button on the confirmation screen 75 (S717). When any button is input, the input button is first displayed as “No (N ) ”Button 77 or not (S718). When the pressed button is the “No (N)” button 77 (Yes in S718), the process returns to the first processing procedure S701, and the pressed button is the “No (N)” button. If it is not 77 (No in S718), it is the “Yes (Y)” button 76 that has been pressed. In this case, the part skip is performed and the process proceeds to the next part (S719).

  In this way, when a component drop error occurs, the possibility of misjudgment is taken into consideration, and in the case of misjudgment, there is a possibility that the component is normally mounted on the board. The board is moved to the vicinity of the mounting point, and the board recognition camera 22 images the board 8 so that the part mounting position of the board 8 can be confirmed on the screen. Or allows the operator to select whether to skip and proceed to the next component mounting process.

FIG. 10 is a flowchart for explaining the processing operation when the mounting head 16 causes a component take-back error to be taken without mounting the component on the board.
11 (a), 11 (b) and 12 (a), 12 (b), 12 (c) are diagrams showing examples of display screens displayed on the operation input display device 5 in the above processing operations. .

  In FIG. 10, when a component take-out error occurs in which the component 35 remains sucked by the suction nozzle after the mounting process of mounting the component 35 on the substrate 8 by the mounting head 16 is completed, the CPU 40 first performs the operation A part take-out error screen is displayed on the input display device 5 (S1001).

  Here, for example, a component take-out error screen 78 as shown in FIG. 11A is displayed. In the example shown in FIG. 11 (a), the part take-out error screen 78 has large “2” and “REAR” characters displayed below the small “stage” in the upper center, and corresponds to the work head 15-4. This shows that a part take-out error has occurred in the rear stage 2 which is a work area to be performed.

  Below that, a supply package number, a part code, and a part name are displayed, and a “mounting position confirmation” button 79 is displayed. In the message display area 80 below, a “vacuum judgment value after place is abnormal”. (Head No. 2, Nozzle No. 2) ", that is, the value of the air pressure detected by the air pressure sensor 54 in the vacuum tube 53 after the component mounting process on the board is abnormal. This is because the part 35 sucked by the suction nozzle 17 of the right mounting head 16 out of the two mounting heads 16 of the working head 15-4 is informed that it is still sucked. A message is displayed.

To the left of the central display, a rear side square frame display 89 indicating the mounting head 16 on the right side of the work head 15-4 is displayed in a dark color so that it can be seen at a glance.
Further, a “buzzer OFF” button 81, a “head retract” button 82, an “changer open” button 83, and a “recovery” button 84 are displayed on the right side of the central display.

  Thereafter, in FIG. 10, the CPU 40 waits for a button input from the operator to the part take-out error screen 78 (S1002). When any button is input, the input operation is performed first. It is determined whether or not the button is the “recovery” button 84 (S1003).

  If the pressed button is not the “recovery” button 84 (No in S1003), then it is determined whether or not the “loading position confirmation” button 79 is pressed (S1004). If S1004 is No), the process returns to the processing procedure S1002, and if pressed (S1004 is Yes), the teaching screen 90 shown in FIG. 12A is displayed (S1005).

  In this case as well, the displayed screen is a teaching screen, but teaching is not performed. In the teaching screen 90 shown in FIG. 12 (a), an imaging screen in the vicinity of the mounting position of the component 35 causing the component take-back error of the substrate 8 is displayed in the large substrate surface display region 91 in the center, and above the display region. Is displayed with a small instruction message “Check the vicinity of the mounting position and select whether to reload or skip.”

  Also, two selection tabs, a “skip” tab 92 and a “reload” tab 93, are displayed below the central substrate surface display area 91, and a “return” button 94 is displayed on the upper right side of the screen. Six cursor buttons 92 for instructing up / down, left / right, right rotation, and left rotation are displayed below the right side of the central substrate surface display area 91.

The operator operates these six cursor buttons 92 to check whether or not a component is mounted at the mounting position. When the confirmation is completed, either the “Skip” tab 92 or the “Reload” tab 93 is selected. After selecting, the “return” button 94 is pressed.
During this time, the CPU 40 waits for a button input operation (S1006). When the button is input, the CPU 40 determines whether or not the input operation button is the “return” button 94 (S1007). If it is not the “button” 94 (No in S1007), the processing steps S1006 and S1007 are repeated until the “return” button 94 is pressed.

When the “return” button 94 is pressed (S1007 is Yes), it is further determined whether or not the “skip” tab 92 is selected (S1008). If it is not selected (S1008 is No). Then, the confirmation screen 96 shown in FIG. 12B is displayed (S1009).
If the “recovery” button 84 is pressed on the first part take-out error screen 78 (S1003 is Yes), a confirmation screen 85 shown in FIG. 11B is displayed (S1009).

On this confirmation screen 85, a message “A part take-out error has occurred in head 2. Do you want to confirm the mounting position?”, Followed by a “Yes (Y)” button 86, “No (N)” Three buttons, a button 87 and a “cancel” button 88, are displayed.
Thereafter, in FIG. 10, the CPU 40 waits for a button input from the worker to the confirmation screen 85 (S1011). When any button is input, first, the input button is displayed. It is determined whether or not it is the “Cancel” button 88 (S1012).

  If the “Cancel” button 88 is pressed (S1012 is Yes), the process returns to the first processing procedure S1001. If it is not the “Cancel” button 88 (S1012 is No), then the “Yes (Y)” button is displayed. It is determined whether or not 86 has been pressed (S1013). If the “Yes (Y)” button 86 is pressed (S1013 is Yes), the process proceeds to the above-described processing step S1005, and in this case, the teaching screen 90 shown in FIG.

  If the pressed button is neither the “Cancel” button 88 (No in S1012) nor the “Yes (Y)” button 86 (No in S1013), the pressed button remains “No (N)”. It is determined that the button 87 is selected, and in this case as well, the process proceeds to the above-described processing procedure S1009 and the confirmation screen 96 shown in FIG.

In this confirmation screen 96, a message “A part take-out error has occurred in Head 2, but can I recover without skipping?”, A “Yes (Y)” button 97 and a “No (N)” button 98 is displayed.
Here, the CPU 40 waits for the operator to input a button on the confirmation screen 96 (S1014). When any button is input, the input button is first displayed as “No (N ) ”Button 98 is determined (S1015). When the pressed button is not the “No (N)” button 98, it is the “Yes (Y)” button 97 that has been pressed, and in this case, the recovery process, that is, the remounting process is executed ( S1016).

On the other hand, if the pressed button is the “No (N)” button 98 (Yes in S1015) in the determination of the processing procedure S1015, the process returns to the first processing procedure S1001.
If the “skip” tab 92 is selected in the determination of the processing procedure S1008 (S1008 is Yes), the confirmation screen 100 shown in FIG. 12C is displayed (S1017).

On this confirmation screen 100, an inquiry message “Do you want to skip one part in head 2?” And a “Yes (Y)” button 101 and a “No (N)” button 102 are displayed below.
Here, the CPU 40 waits for a button input from the operator to the confirmation screen 100 (S1018). When any button is input, the input button is first displayed as “No (N ) ”Button 102 or not (S1019). When the pressed button is the “No (N)” button 102 (S1019 is Yes), the process returns to the first processing procedure S1001, and when the pressed button is not the “No (N)” button 102 ( Since S1019 is No), the “Yes (Y)” button 101 is pressed, and in this case, the part skip is performed and the process proceeds to the next part (S1020).

  In this way, when a part take-out error occurs, the possibility of misjudgment is taken into consideration, and in the case of misjudgment, there is a possibility that the component is normally mounted on the board. The board is moved to the vicinity of the mounting point, and the board recognition camera 22 images the board 8 so that the part mounting position of the board 8 can be confirmed on the screen. Or allows the operator to select whether to skip and proceed to the next component mounting process.

FIG. 13 is a flowchart for explaining the processing operation when the tray type component supply device 25 is connected to the component mounting device 1 and a component suction error occurs.
FIGS. 14 (a), (b), (c) and FIGS. 15 (a), (b) are diagrams showing examples of display screens displayed on the operation input display device 5 in the above processing operations. .

In FIG. 13, when a suction error that prevents the component 35 from being picked up by the mounting head 16 from the component transport table 37 of the tray-type component supply device 25 occurs, the CPU 40 first displays a suction error screen on the operation input display device 5. (S1301).
Here, for example, a suction error screen 103 as shown in FIG. 14A is displayed. In the example shown in FIG. 14 (a), the adsorption error screen 103 has large “2” and “REAR” characters displayed under the small “stage” in the upper center, a pale palette number “1”. Is displayed.

  Below that, a supply package number, a part code, and a part name are displayed, and a “TF40 part confirmation” button 104 (TF40 is a 40th tray feeder) is displayed. , The message “Select head and press TF40 component confirmation button” is displayed.

The leftmost square frame 106 on the rear side indicating the first mounting head 16 of the work head 15-4 is selected and displayed in a dark color in the left-side release selection display area of the central display. Yes.
On the right side of the central display, a “buzzer OFF” button 107, a “head retract” button 108, a “changer open” button 109, a “remaining number setting” button 110, a “NEXT RAY” button 111, and A “recovery” button 112 is displayed, the operation valid button here is clearly displayed, and the operation invalid button is lightly displayed.

  Thereafter, in FIG. 13, the CPU 40 waits for a button input from the operator to the adsorption error screen 103 (S 1302), and when any button is input, the input button is “ It is confirmed whether or not it is the “TF40 component confirmation” button 104 (S1303).

When the pressed button is not the “TF40 component confirmation” button 104 (No in S1303), the process returns to the processing procedure S1302, and the processing of the processing procedures S1302 and S1303 is repeated until the “TF40 component confirmation” button 104 is pressed.
When the “TF40 component confirmation” button 104 is pressed (S1303 is Yes), the confirmation screen 113 shown in FIG. 14B is displayed (S1304). On this confirmation screen 113, a message “Vacuum OFF” and an “OK” button 114 are displayed.

  Thereafter, the CPU 40 waits for a button input operation (S1305), and determines whether or not the input operation button is the “OK” button 114 (S1306). The “OK” button 114 is pressed. When the “OK” button 114 is pressed (Yes in S1306), the confirmation screen 115 shown in FIG. 14C is displayed (S1307).

  On this confirmation screen 115, a message “Vacuum OFF. Please remove parts of stock 6” and an “OK” button 116 are displayed. The stock 6 shows a component transport table 37 at an adsorption point 38 at the tip of the component transport device 26 of the tray type component supply device 25.

  Here again, the CPU 40 waits for the button input operation (S1308), and determines whether or not the input operation button is the “OK” button 116 (S1309). The “OK” button 116 is pressed. When the “OK” button 116 is pressed (S1309: Yes), the CPU 40 determines whether or not the component 35 is still held in the stock 6 (S1310).

  In this processing, although not particularly illustrated, the vacuum value in the vacuum tube communicating with the suction port opened on the component placement surface of the component transport table 37 (stock 6) is detected by the pneumatic sensor, and based on the detection result. Thus, the CPU 40 determines whether or not the component 35 is held on the component carrying table 37.

  When it is determined that the component 35 is still held on the component conveying table 37 (S1310 is Yes), the confirmation screen 117 shown in FIG. 15A is displayed (S1311). On this confirmation screen 117, a message “There are parts in stock 6”, an “OK” button 118 and a “Cancel” button 119 are displayed.

Here, if the operator presses the “OK” button 116 on the confirmation screen 115 in FIG. 14 without removing the component 35 in which the suction error has occurred from the component transport base 37, the confirmation screen in FIG. At 117, after removing the part 35, the “OK” button 118 is pressed.
The CPU 40 waits for a button input operation on the confirmation screen 117 shown in FIG. 15 (S1312). When the CPU 40 detects the button input operation, the CPU 40 determines whether the input operation button is the “OK” button 118 (S1313). ).

  If it is the “OK” button 118 (Yes in S1313), the process returns to the processing procedure S1310 to determine again whether or not the component 35 is still held on the component transport table 37, and that there is no component. After confirmation (No in S1310), the suction error screen 120 shown in FIG. 15B is displayed (S1314).

  The suction error screen 120 has the same display format as the suction error screen 103 in FIG. 14. In this case, for example, the message content in the message display area 105 is slightly different, and the “recovery” button 112 is used as an operation valid button. It is different in that it is clearly displayed.

  In addition, the confirmation screen 117 shown in FIG. 15A is displayed even though the operator presses the “OK” button 116 after removing the part 35 from the parts transport table 37 on the confirmation screen 115 shown in FIG. In some cases, the determination of the processing procedure S1310 is wrong, that is, the vacuum device or the pneumatic sensor is broken.

  In this case, since the maintenance work for repairing and restoring the failure of the vacuum device or the air pressure sensor takes time, the productivity is improved by continuing the production rather than stopping the board unit production line during that time. Therefore, the operator determines that the repair and restoration of the failure may be after the production is completed, and presses the “cancel” button 119 to exit the part holding determination loop.

  If it is determined in the processing procedure S1313 that the input button is not the “OK” button 118, the input button is the “cancel” button 119. In this case, the CPU 40 also performs the processing in the processing procedure S1314. The process proceeds to the display process of the suction error screen 120.

  Then, the CPU 40 waits for a button input operation (S1315), and determines whether or not the input operation button is the “recovery” button 112 (S1316) until the “recovery” button 112 is pressed. When the “recovery” button 112 is repeatedly pressed (S1316 is Yes), a retry process (remounting process) is performed (S1317).

  In this way, when a component suction error occurs in the tray-type component supply device, taking into account the possibility of erroneous determination due to a failure of the vacuum device or the pneumatic sensor even after removing the suction error component In the case of an erroneous determination, the part holding determination loop can be exited by a cancel button, and a retry can be executed by the suction error screen 120. Thereby, production can be continued without stopping the apparatus due to erroneous determination.

  The component mounting apparatus and the error recovery method of the present invention can be used in all industries that efficiently deal with chip-type electronic component adsorption errors, take-out errors, or erroneous error judgments, and efficiently produce board units using the component mounting apparatus. Available.

(a) is an external perspective view of a component mounting apparatus according to an embodiment, and (b) is a perspective view schematically showing an internal configuration by removing upper and lower protective covers. It is a perspective view of the working head of the component mounting apparatus concerning one Embodiment. (a), (b) is a figure which shows the various forms of the component supply apparatus set on the component supply stage of the component mounting apparatus concerning one Embodiment. It is a figure explaining the structure and function of a tray type | mold electronic component supply apparatus connected with the component mounting apparatus in connection with one embodiment. It is a block diagram which shows the system configuration | structure of the component mounting apparatus concerning one Embodiment. It is a flowchart which shows the components discharge | emission processing when the recognition error generate | occur | produced in the components image recognition process in the components mounting process in the components mounting apparatus concerning one embodiment. It is a flowchart explaining the processing operation | movement when the component fall error which a component falls from a suction nozzle occurs in the component mounting apparatus concerning one embodiment. (a), (b) is a figure (the 1 and the 2) which shows the example of the display screen displayed on the display device for operation input in the processing operation when a component fall error has occurred. (a), (b), (c) are diagrams (No. 3, No. 4, and No. 5) showing examples of display screens displayed on the operation input display device in the processing operation when a component drop error occurs. is there. It is a flowchart explaining the processing operation | movement when the component take-out error which takes home without mounting components in a board | substrate in the component mounting apparatus concerning one Embodiment is raised. (a), (b) is a figure (the 1 and the 2) which shows the example of the display screen displayed on the display device for operation input in the processing operation when a part take-out error has occurred. (a), (b), (c) are diagrams (No. 3, No. 4, and No. 5) showing examples of display screens displayed on the operation input display device in the processing operation when a part take-out error occurs. is there. It is a flowchart explaining processing operation | movement when a tray type | mold component supply apparatus is connected with a component mounting apparatus, and the component adsorption | suction error generate | occur | produced. (a), (b), (c) are diagrams (No. 1, No. 2, and No. 3) showing examples of display screens displayed on the operation input display device in the processing operation when a component adsorption error occurs. is there. (a), (b) is a figure (the 4th, the 5th) which shows the example of the display screen displayed on the display apparatus for operation input in the processing operation when components adsorption | suction error generate | occur | produces.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Monitor apparatus 3 Alarm lamp 4 Upper protective cover 5 Display apparatus for operation input 6 Base 7 Board guide rail 8 Board (printed circuit board)
DESCRIPTION OF SYMBOLS 9 Component supply stage 11 Tape reel type component supply apparatus 12 Tape reel 13 Y-axis rail 14 X-axis rail 15 (15-1, 15-2, 15-3, 15-4) Work head 16 Mounting head 17 Adsorption nozzle 17- DESCRIPTION OF SYMBOLS 1 Light diffusing plate 17-2 Nozzle 18 Chain body 19 Component recognition camera 21 Support part 22 Substrate recognition camera 23 Illumination device 25 (25a, 25b) Tray type component supply device 26 Component conveyance device 27 Door 28 Lifting table 29 Tray shelf 31 hole 32 retaining rod 33 component extraction stage 34 tray 35 component (chip-shaped electronic component)
36 Single-axis robot 37 Parts carrier 38 Adsorption point 40 CPU
41 Bus 42 i / o control unit 43 Image processing unit 44 Memory 45 Illumination device 46 Illumination device 47 X-axis motor 48 Y-axis motor 49 Z motor 51 θ-axis motor 52 Vacuum unit 53 Vacuum tube 54 Air pressure sensor 55 Communication i / o Interface 56 Recording device 57 Parts drop error screen 58 Mounting position confirmation button 59 Message display area 61 Buzzer OFF button 62 Changer open button 63 Recovery button 64 Confirmation screen 65 Yes (Y) button 66 No (N) button 67 Cancel button 68 Teaching screen 69 Board surface display area 70 Cursor button 71 Return button 72 Confirmation screen 73 Yes (Y) button 74 No (N) button 75 Confirmation screen 76 Yes (Y) button 77 No (N) button 78 Parts take-out error screen 79 Mounting position confirmation button 80 Message display area 81 Buzzer OFF button 82 Head retract button 83 Changer open button 84 Recovery button 85 Confirmation screen 86 Yes (Y) button 87 No (N) button 88 Cancel button 89 Parts Square frame display indicating the mounting head that caused the take-away error 90 Teaching screen 91 Board surface display area 92 Skip tab 93 Remount tab 94 Back button 96 Confirmation screen 97 Yes (Y) button 98 No (N) button 100 Confirmation screen 101 Yes (Y) button 102 No (N) button 103 Suction error screen 104 TF40 component confirmation button 105 Message display area 106 Square frame display indicating the mounting head that caused the suction error 107 Buzzer OF Button 108 opens head retraction button 109 changer button 110 remaining number setting button 111 NEXT_TRAY button 112 recovery button confirmation screen 113
OK button 114
Confirmation screen 115
OK button 116
Confirmation screen 117
OK button 118
Cancel button 119

Claims (4)

A chip-shaped electronic component supplied from a component supply device is sucked by a suction nozzle of a mounting head held by the work head and movable in a three-dimensional working space of X, Y, and Z, and the chip-shaped electronic component is sucked. The state is imaged with a component recognition camera, the image is recognized, the mounting posture is corrected based on the image recognition, and the chip-shaped electronic component is loaded on the printed circuit board carried into the apparatus based on the correction. In a component mounting device that performs mounting processing at a position,
A suction determination means for determining whether or not the chip-shaped electronic component is sucked by the suction nozzle between the mounting of the chip-shaped electronic component by the mounting head and the mounting process on the printed circuit board;
A mounting determination means for determining whether the chip-shaped electronic component is mounted on the printed circuit board or remains sucked by the suction nozzle of the mounting head after the mounting process;
It is determined when the chip-like electronic component is determined not to be sucked by the suction nozzle by the suction determination unit, or when the chip-like electronic component is still sucked by the suction nozzle by the mounting determination unit. When an error screen is displayed on the display device, an image of the vicinity of the position where the component of the board is to be mounted is picked up by the error screen, and the imaging screen is displayed on the display device to indicate a state near the mounting position of the board. An error screen display means for displaying whether to confirm, to immediately perform the remounting process, or to skip the mounting process for one component;
A component mounting device characterized by comprising: The chip-shaped electronic component is held by a transport device, the held chip-shaped electronic component is transported to a component suction position of a component mounting device, and the chip-shaped electronic component is supplied to the component mounting device. Holding determination means for determining whether or not the chip-shaped electronic component is held on the transfer device after supplying the chip-shaped electronic component from the apparatus to the component mounting apparatus; and a determination result by the holding determination means A determination result notification means for notifying the control unit of the component mounting device; and a tray-type component supply device comprising:
An error screen for instructing to manually remove the chip-shaped electronic component from the transport device when the determination result notification means receives a notification that the chip-shaped electronic component is held on the transport device; When the notification that the chip-shaped electronic component is held on the transfer device is further received by the determination result notification means, whether to remove the component again or immediately remount A component mounting apparatus, further comprising a suction error screen display means for displaying an error screen that can be selectively input. A chip-shaped electronic component supplied from a component supply device is sucked by a suction nozzle of a mounting head held by the work head and movable in a three-dimensional working space of X, Y, and Z, and the chip-shaped electronic component is sucked. The state is imaged with a component recognition camera, the image is recognized, the mounting posture is corrected based on the image recognition, and the chip-shaped electronic component is loaded on the printed circuit board carried into the apparatus based on the correction. An error recovery method in a component mounting apparatus that performs mounting processing at a position,
A suction determination step of determining whether or not the chip-like electronic component is sucked by the suction nozzle between the suction of the chip-like electronic component by the mounting head and the mounting process on the printed circuit board;
A mounting determination step for determining whether the chip-shaped electronic component is mounted on the printed circuit board after the mounting processing or remains sucked by the suction nozzle of the mounting head;
Determined when it is determined that the chip-shaped electronic component is not sucked by the suction nozzle by the suction determination step, or when the chip-shaped electronic component is still sucked by the suction nozzle by the mounting determination step. When an error screen is displayed on the display device, an image of the vicinity of the position where the component of the board is to be mounted is picked up by the error screen, and the imaging screen is displayed on the display device to indicate a state near the mounting position of the board. An error screen display step for displaying whether it is possible to confirm, to immediately perform the remounting process, or to skip the mounting process for one part;
An error recovery method for a component mounting apparatus, comprising: The chip-shaped electronic component is held by a transport device, the held chip-shaped electronic component is transported to a component suction position of a component mounting device, and the chip-shaped electronic component is supplied to the component mounting device. A holding determination step for determining whether or not the chip-shaped electronic component is held on the transfer device after supplying the chip-shaped electronic component from the apparatus to the component mounting device, and a determination result by the holding determination step A determination result notification step for notifying the control unit of the component mounting device; and a tray-type component supply device comprising:
When receiving the notification that the chip-shaped electronic component is held on the transport device by the determination result notifying step, an error screen instructing to manually remove the chip-shaped electronic component from the transport device is displayed. When the notification that the chip-like electronic component is held on the transfer device is received in the determination result notification step after that, whether to remove the component again or immediately re-mount An error recovery method for a component mounting apparatus, further comprising a suction error screen display step for displaying a selection input.

Images