JP6076071B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component in a storage portion of a storage tape on a substrate extracted from a component supply unit by a component extractor.

  As disclosed in, for example, Patent Document 1, a conventional electronic component mounting apparatus stores a new storage tape that stores the same type of electronic component before the electronic component stored in the storage tape runs out of components. It is connected to the end of the tape so that electronic components can be replenished without stopping the mounting operation. At this time, a connecting tape (so-called splicing tape) is used to connect the new storage tape to the current old storage tape. The carrier tape, which is the main body of the storage tape, and the cover tape are bonded to each other using a connecting tape. However, there is a storage part where the parts are not stored in the connected part of the storage tape (joint part). In some cases, the position of the storage pocket is shifted and the component suction becomes unstable. For this reason, before the cover tape is peeled off from the storage tape, the connecting tape is detected by using a dedicated detection sensor to cope with the absence of components and unstable adsorption of components.

JP 2011-9471 A

  However, a dedicated sensor is required to detect the connection tape, which increases the cost, and if the type of connection tape is different, the sensor may not be able to detect it.

  Therefore, an object of the present invention is to make it possible to easily detect a joint portion where old and new storage tapes are connected by a connecting tape.

For this reason, in the first invention, the cover tape covering the storage portion of the storage tape is peeled off from the storage tape, the electronic component is supplied to the component extraction position, and the component supply unit is supplied to the component extraction position. In addition, in the electronic component mounting apparatus for mounting the electronic component in the storage unit on the extraction board by the component extraction tool, an extraction error detection means for detecting a component extraction error by the component extraction tool after the component extraction,
A characteristic part detecting means for detecting a characteristic part of the component supply device located at a position where the cover tape peeled off from the storage tape passes when there is a part picking error of the picking error detection sensor; There is provided a connecting tape passage determining means for determining the passage of the connecting tape of the old and new storage tape based on the detection result of the means at the part take-out position.

  A second invention is characterized in that, in the first invention, when the characteristic part detecting means cannot detect the characteristic part, the passage determining means determines the passage of the connecting tape at the part removal position. .

  According to a third aspect of the present invention, in the second aspect of the present invention, the characteristic portion detected by the characteristic portion detecting means is a member of the component supply unit that suppresses the storage tape in the direction of the placement surface thereof, in the direction of travel of the storage tape of the holding member. It is an end part on the opposite side.

  According to a fourth invention, in the second or third invention, the characteristic part detection means is a board recognition camera for imaging a board recognition mark.

  According to a fifth invention, in any one of the first to fourth inventions, when the determination means determines that the connecting tape has passed, the electronic component extraction tool is not extracted at the component extraction position. Control means for controlling to perform a skip operation for feeding the storage tape is provided.

  According to a sixth invention, in the fourth or fifth invention, when the judgment means judges the passage of the connecting tape, the board recognition camera images the electronic component storage portion at the component take-out position. Control means for controlling the position to be recognized is provided.

  The present invention can easily detect a seam portion where old and new storage tapes are connected by a connecting tape.

It is a top view of an electronic component mounting apparatus. The bottom view of a mounting head. It is a schematic side view of a component supply unit. It is a schematic side view of the adsorption position of the electronic component of a component supply unit. It is a schematic top view of the adsorption position of the electronic component of a component supply unit. It is a control block diagram of an electronic component mounting apparatus and a component supply unit. . It is a figure of the display screen of a monitor. It is a figure explaining the state of a storage tape and the adsorption state of the electronic component in each adsorption nozzle. It is a figure explaining the state of a storage tape and the adsorption state of the electronic component in each adsorption nozzle. It is a figure explaining the state of a storage tape and the adsorption state of the electronic component in each adsorption nozzle. It is a flowchart figure. It is a flowchart figure. It is a flowchart figure. It is a flowchart figure. It is a schematic top view of the adsorption position of the electronic component of a component supply unit.

  Hereinafter, based on FIG. 1 which is a top view of the electronic component mounting apparatus 1, embodiment of this invention is described. First, a plurality of component supply devices 3A, 3B, 3C, and 3D are arranged in parallel on the front and rear portions of the electronic component mounting device 1 on the device main body 2 in four blocks.

  Each of the component supply devices 3A, 3B, 3C, and 3D includes a plurality of component supply units 5 arranged in parallel on a feeder base of a cart base that is a mounting base, and a printed circuit board having a tip on the component supply side as a substrate. When the cart base is properly attached to the apparatus main body 2, the power is supplied to the component supply unit 5 mounted on the cart base so as to face the conveyance path of P. When the connector is released and the handle is pulled, it can be moved by a caster provided on the lower surface.

  When the connection between the connectors connected to the power supply is released in order to remove the component supply unit 5 from the feeder base, the power supply to the component supply unit 5 is cut off, and this cut-off state will be described later. The control device 70 can detect this, and conversely, when the component supply unit 5 is inserted and attached to the feeder base and the connectors are connected to each other, power is supplied to the component supply unit 5 and this supply state This can be detected by the control device 70 described later.

  Each of the component supply devices 3A, 3B, 3C, and 3D is disposed such that the tip on the component supply side faces the component suction / extraction position PU that is the component extraction region of the mounting head 6.

  Between the front-side component supply devices 3B and 3D and the rear-side component supply devices 3A and 3C, a supply conveyor and a first positioning unit constituting the substrate transfer device 8 that transfers the printed circuit board P as a substrate An intermediate conveyor, a second positioning portion, and a discharge conveyor are provided.

  The supply conveyor conveys the printed circuit board P received from the upstream to the first positioning unit, and after mounting electronic components on the substrate P positioned by a positioning mechanism (not shown) in each positioning unit, conveys it to the intermediate conveyor, After the printed circuit board P received from the intermediate conveyor is positioned by the positioning mechanism in the second positioning portion and the electronic component is mounted, it is transported to the discharge conveyor and then transported to the downstream device.

  Each beam 10 that moves along the guide rail 9 by the Y-axis drive motor 11 in the Y direction is provided with a mounting head 6 that is moved by the X-axis drive motor 13 in the longitudinal direction, that is, in the X direction. The suction nozzles 7 which are a plurality of component take-out tools are provided in an annular shape at equal intervals (see FIG. 2). The mounting head 6 is equipped with a vertical axis drive motor 14 for moving the suction nozzle 7 up and down, and a θ-axis drive motor 15 for rotating around the vertical axis. Therefore, the suction nozzle 7 of the mounting head 6 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  Furthermore, the mounting head 6 is provided with a line sensor 40 that detects the state of the electronic component sucked by the suction nozzle 7. The line sensor 40 includes a light emitting unit 41 provided at the center of the mounting head 6 and a light receiving unit 42 provided outside the suction nozzle 7 at the peripheral edge of the mounting head 6.

  A substrate recognition camera 4 is provided on the mounting head 6 for recognizing the position of the printed circuit board P, and is fixed to the mounting head 6 to image a positioning mark or the like attached to the printed circuit board P. Reference numeral 12 denotes a component recognition camera that captures an image of the electronic component in order to recognize the position of the electronic component with respect to the suction nozzle 7 in terms of the XY direction and the rotation angle.

  Next, the mechanism of the component supply unit 5 will be described with reference to FIG. 3, which is a schematic side view, and FIG. 4 and FIG.

  The component supply unit 5 is a unit frame 21 which is a unit main body, and the storage tape C which is sequentially drawn out while being wound around a storage tape supply reel which is rotatably mounted on each of the component supply devices 3A, 3B, 3C and 3D. A tape feeding mechanism (tape feeding device) 22 that intermittently feeds to the component pickup position PU (component extraction position), and a cover tape peeling mechanism 20 for peeling the cover tape Ca of the storage tape C just before the electronic component pickup position. It consists of.

  As shown in FIG. 4, the storage tape C fed out from the storage tape supply reel has a suppressor 23 as a restraining member that holds the storage tape C disposed in the tape path in front of the pickup position PU toward the placement surface. It is sent to the pickup position PU so as to dive underneath. The suppressor 23 is formed with an opening 23A for pickup, and the cover tape Ca of the storage tape C is peeled from the carrier tape Cc by the operation of the cover tape peeling mechanism 20 through the opening 23A. The tape is collected and stored in the tape collection and storage unit 26. That is, in a state where the cover tape Ca is peeled off by the cover tape peeling mechanism, the electronic component D mounted on the component storage portion Cb of the carrier tape Cc is sent to the pickup position PU by the feed mechanism 22 and is sucked through the opening 23A. 7 will be picked up.

  The tape feed mechanism 22 is a drive motor (see FIG. 6) which is a drive motor capable of forward and reverse rotation, for example, and a feed hole Ce (see FIG. 5) formed in the storage tape C driven by the drive motor. The peripheral feed dog 27A meshes with the sprocket 27 for feeding it.

  Therefore, when the drive motor 25 is driven to rotate in order to supply electronic components in the storage tape C in the component supply unit 5, the sprocket 27 rotates intermittently by a predetermined angle in the feed direction, so that the feed of the storage tape C is performed. The storage tape C is intermittently fed through the holes.

  Further, the suppressor 23 has a substantially U-shaped cross section from both vertical pieces serving as support parts and a horizontal piece that holds the storage tape C engaged with the teeth of the sprocket 27 so that the feed holes are engaged with each other. When the locking is released and the locking is released, the vertical piece is rotatably supported with the rear pin 30 as a fulcrum. When the front portion of the suppressor 23 is locked, the suppressor 23 is urged downward, and the suppressor 23 constantly presses the carrier tape Cc after the storage tape C and the cover tape are peeled against the tape guide chute 24. It acts so that the feed hole of the carrier tape Cc is not detached from the tape feed teeth of the sprocket 27.

  In the state where the suppressor 23 serving as a peeling fulcrum of the cover tape Ca of the storage tape C is rotated and held upward, it is stored from the side of the component supply unit 5 through the loading opening formed in the unit frame 21. It is configured so that the tape can be loaded into the component supply unit 5.

  The peeling mechanism 20 includes a recovery drive motor (not shown) that feeds a cover tape Ca that can be rotated forward and backward, a gear 47 that is rotated by the recovery drive motor, and a gear 51 that is urged to mesh with the gear 47; The operation body 54 is urged so that the gear 47 and the gear 51 are engaged with each other, and a tension applying body 65 for applying tension to the cover tape Ca.

  When collecting the cover tape Ca, the gear 47 and the gear 51 are rotated when the above-described collection drive motor is driven, that is, the gear 47 and the gear 51 are rotated with the cover tape Ca interposed therebetween, and the cover tape Ca is Without being loosened (slack), it is housed in a cover tape collecting / housing portion 26 provided at the end of the component supply unit 5.

  When the component supply unit 5 is attached to the feeder base, the operator holds the handle 70 and guides the guided member 71 to the pair of guide members provided on the feeder base, thereby moving the component supply unit 5 to the depth. By moving in the direction, the roller 72 is locked to a locking member provided in the electronic component mounting apparatus main body 1. When the guided member 71 is guided by the pair of guide members and the component supply unit 5 is moved while the guided member 71 is slid (slid) on the feeder base, the depth of the feeder base is increased. A front / rear restricting member (not shown) that restricts the position of the component supply unit 5 in the front / rear direction by abutting the guided member 71 at the end is provided.

  Then, the lower end of the open / close door 73, which is a magnetic body that closes the external opening that forms the storage space S of the cover tape collecting and storing part 26, is attracted to the magnet provided in the external opening so as to wind the support shaft 74. It is comprised so that it can rotate and is supported.

  Next, a control block diagram of the electronic component mounting apparatus 1 in FIG. 6 will be described.

  The electronic component mounting apparatus 1 is connected to a control device 70 as a control means, a determination means, an execution means, an instruction means, etc. for overall control of the electronic component mounting apparatus 1, and to the control device 70 via a bus line. A storage device 71 is provided. Based on the data stored in the storage device 71, the control device 70 comprehensively controls operations related to the component mounting operation of the electronic component mounting device 1.

  That is, the control device 70 controls the drive of the Y-axis drive motor 11, the X-axis drive motor 13, the vertical axis drive motor 14, the θ-axis drive motor 15 and the like via the interface 74 and the drive circuit 77 and each component supply unit. 5 is controlled. In FIG. 6, for convenience of explanation, even though there are a plurality of them, for example, the mounting head 6 and the component supply unit 5 are omitted as one.

  In the storage device 71, mounting data (see FIG. 24) is stored for each type of printed circuit board P related to component mounting. For each mounting order (for each step number), the X direction (in the printed circuit board P) ( Information on X direction, Y direction (indicated by Y) and angle (indicated by Z), arrangement number information of each component supply unit 5 and the like are stored.

  The storage device 71 also stores information on the type (component ID) of each electronic component corresponding to the arrangement number (lane number) of each component supply unit 5 for each type of printed circuit board P, that is, component arrangement information (see FIG. 25). The component arrangement information is data relating to which component supply unit 5 is mounted at which position on the cart table. In addition, component library data (see FIG. 26) relating to the characteristics of the electronic components such as the X-direction and Y-direction dimensions of the electronic components is stored for each component ID. Further, the storage device 71 stores each component supply unit 5 on the feeder base on the cart base, that is, the number of times that an electronic component suction error has occurred in the component supply unit 5 placed for each lane. A storage device (hereinafter referred to as an adsorption miscount memory) is provided.

  Reference numeral 73 denotes a recognition processing device connected to the control device 70 via the interface 74. The recognition processing device recognizes an image captured by the component recognition camera 12 and an image captured by the board recognition camera 4 and captured. This is performed by the recognition processing device 73, and the processing result is sent to the control device 70. In other words, the control device 70 outputs an instruction to the recognition processing device 73 so as to perform recognition processing (such as calculation of a displacement amount) on the image picked up by the component recognition camera 12 or the image picked up by the board recognition camera 4. The recognition processing result is received from the recognition processing device 73.

  A monitor 75 displays a part image, a screen for setting various data, and the like. The monitor 75 is provided with various touch panel switches 76 as input means. Can be set.

  The component supply unit 5 that intermittently feeds the storage tape CX by the drive motor 25 includes a control device 79. A drive circuit 82 is connected to the control device 79 via the interface 81, and the control device 79 controls the drive motor 25 via the drive circuit 82. A control device 79 provided in the component supply unit 5 is connected to a control device 70 provided in the electronic component mounting device 1 via interfaces 81 and 74.

  Hereinafter, the operation | movement at the time of the driving | operation of the electronic component mounting apparatus 1 is demonstrated.

  First, the control device 70 controls the electronic component to be taken out. Further, the control device 70 controls the Y-axis drive motor 11 and the X-axis drive motor 13 via the drive circuit 74 to control the substrate recognition camera 4 to move.

  And after taking out an electronic component from this component supply unit 5, the component recognition camera 12 images the electronic component attracted and held by the suction nozzle 7, and the recognition processing device 73 recognizes this captured image. Control is performed so as to perform a necessary correction operation, and an electronic component is mounted on the printed circuit board P. In this case, the board recognition camera 4 images the positioning mark attached to the printed circuit board P, the recognition processing device 73 recognizes this captured image, performs the correction operation described above in consideration of the recognition result, Performs mounting of electronic components.

  Next, based on the mounting data, it is determined whether or not there are other electronic components to be mounted on the printed circuit board P. If there are, the same process is repeated until there are no other electronic components to be mounted. . Further, the printed circuit board P on which all electronic components to be mounted have been mounted is unloaded from the substrate transfer device 8, a new printed circuit board P is loaded, and electronic components are mounted in the same manner.

When the remaining number of parts of the storage tape C from which the part D is currently taken out decreases, a new storage tape Cc is connected by the connection tapes Cd and Cf. This work is performed by the operator. The connecting tape Cd connects the cover tape Ca, and the connecting tape Cf connects the carrier tape Cc. The connecting tape Cd is attached to the front and back at the same position, and the old and new storage tapes C are connected.
The component D is not stored in at least one of the storage portions Cb of the connected portions.

  When the storage tape C is fed by the sprocket 27 of the component supply unit 5, as shown in FIGS. 4 and 5, the joint portion connected by the connection tapes Cd and Cf is in front of the suction position where the suppressor 23 is the component extraction position. It is peeled off.

  At this time, as shown in FIG. 8, it is sucked by each suction nozzle 7 in the mounting head 6 in a normal state, but the storage portion Cb at the boundary of the joint between the old storage tape C and the new storage tape C In the front storage portion Cb (right end in FIG. 8), the mounting state of the component D is poor and is adsorbed in a so-called standing state as shown in FIG. 9 (second from the right) (the arrow pointing to the center of the head 6 in FIG. Position is suction position). Then, the standing state is detected by the line sensor 40 at the position indicated by the vertical broken line (the broken line portion in FIG. 2) as a suction error (because the lower end position is below normal), and the component supply unit from which the component has been taken out It is counted in the suction miscount memory 1 corresponding to 5 and is regarded as one miss.

  Since there is no part D in the next storage portion Cb, a suction error is detected as no part by detecting the line sensor 40 in the same manner. Since this is from the same component supply unit 5, two suction mistakes are counted in the suction miscount memory 1 stored in the storage device 71.

  The above operation is controlled by the control device 70 in accordance with the flowchart shown in FIG. 12, and if there is a part D to be sucked next in step 1 (S1) of FIG. 11, it is determined whether or not tape detection is performed in S2. ing. As shown in FIG. 7, since the tape recognition function at the time of a suction error is set to be used, it is determined whether the tape detection determination S4 of FIG. 12 is Yes and the suction miscount memory of the storage device 71 is 2 or more ( S5). As described above, since two consecutive suction mistakes from the same component supply unit 5 are set in the memory 1, after the rightmost component in FIG. 10 is sucked, the next component D is sucked. Detection execution (S6) is determined in S2 of FIG. Here, it is assumed that the parts D are continuously taken out from the same part supply unit 5 so far.

  Here, the tape detection flow from S2 in FIG. 11 to the flow in FIG. 13 is executed.

  When the suction of the rightmost component in FIG. 10 is completed (S8) and the tape feeding of the component supply unit 5 is completed (S9), it is determined again whether the tape detection is executed (S10), and the detection execution S6 is performed in FIG. Therefore, tape detection execution (S11) is performed.

  That is, since it is not pocket recognition execution S16 according to the flow of FIG. 13, the tape detection position movement from tape detection execution S19 to S20 is executed again, the mounting head 6 moves to the component supply unit 5, and the board recognition camera 4 moves to the broken line in FIG. Stop at the position indicated by. And the edge part 100 (edge part) as a characteristic part of the suppressor 23 is imaged (S21). The recognition processing device 73 recognizes whether or not it is an end, but the connection tape Cd is, for example, a yellow and opaque tape, and therefore cannot detect an edge from light to dark (see FIGS. 5 and 15A). , It is not recognized as the end portion 100 as a characteristic part. In S22, “is it a splicing tape?” Is Yes, and the control device 70 as the determination means determines that the connecting tape Cd covers the end 100, that is, the connecting tape Cf passes through the component suction position. The seam setting (S24) is executed.

“Decrement of management data”, that is, the adsorption miscount memory is cleared and becomes zero. Since the joint automatic skip is used, the controller 70 sets the joint skip (S26) of S26 to Yes, and skips the skip length (front) and skip length (rear) from the next component supply of this component supply unit 5. The drive motor 25 of the component supply unit 5, the X-axis drive motor 11, the Y-axis drive motor 13, the vertical axis drive motor 14, etc. are fed so as to feed the storage tape without taking out the component D for 40 mm of the total length. Control (seam skip S27).
Here, the case where the “seam” of the pocket recognition in FIG. 7 is “used” will be described. If the seam is to be used, it is determined that pocket recognition is to be executed in step S13 of FIG. 13, and pocket recognition execution S14 is executed. That is, the substrate recognition camera 4 moves to the position where the pocket recognition execution (S16) of S16 in FIG. 14 is Yes and moves to the position where the storage portion Cb of the suction position PU of the component supply unit 5 can be imaged (the movement of the pocket position (S17 )) Take an image (execute pocket recognition (S18)).

  As a result, the position of the storage portion Cb is recognized and the positional deviation is grasped, and the operation returns to S3 in FIG. The part D is taken out from the storage part Cb on the right side of the right end in FIG. If the “seam interval” is set to 5 times, this pocket recognition operation is executed every time the part D is taken out 5 times, for example, 40 mm set on the screen (not shown) according to the length of the connecting tape. Is done.

    In addition, even if the adsorption miscount memory counts twice, if the connecting tape is not in the opening 23A, the transparent cover tape Ca covers the end portion 100. In this case, the substrate recognition camera 4 is shown by a broken line in FIG. When the end 100 is imaged at the position, the edge of the end 100 from light to dark is detected as shown in FIG. 15B because it is a transparent cover tape Ca (No in S22 in FIG. 14). ). The seam release (S23) is not performed, but the skip operation and the pocket recognition are not performed. Here, the suction miscount memory is also cleared to zero.

  When the connecting tape is detected and the joint is determined as described above, the feeding of the storage tape C may be controlled to decelerate based on the setting instead of the skip operation, and at this time, pocket recognition may be used together. Good.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 4 Board | substrate recognition camera 5 Component supply unit 7 Suction nozzle 23 Suppressor 40 Line sensor 30 Cutter 65 Component extraction port 68 Information identification part 70 Control apparatus 71 Storage | storage device 100 End part C Storage tape Ca Cover tape Cd Connection tape Cf Connecting tape

Claims (4)

The cover tape for covering the housing portion of the storage tape and the component supply unit for supplying electronic components to the stripping component pickup City position from the storage tape, electronic of the component taking-shi supplied in the storage unit to the position of the component feeding unit in mounting apparatus of electronic components to be mounted on a taken out substrate by the component parts takeout City tool,
An extraction error detecting means for detecting an error in extracting the component by the component extraction tool after the component is extracted,
If component pickup miss is detected by the take-out error detecting means, a characteristic part detector means for detecting a feature portion of the component supply unit located in a location that cover tape peeled from the storage tape passes,
A connection tape passage judging means for judging the passage of the connection tape of the old and new storage tape when the feature part detection means cannot detect the feature part ;
The electronic component mounting apparatus according to claim 1, wherein the characteristic part detection means is a board recognition camera for imaging a board recognition mark . The characteristic portion detected by the characteristic portion detecting means is an end portion of the holding member that holds the storage tape in the direction of its placement surface in the component supply unit, on the opposite side of the moving direction of the storage tape. The electronic component mounting apparatus according to claim 1 . When the connecting tape passage determining means determines that the connecting tape has passed, there is provided a control means for controlling to perform a skip operation of feeding the storage tape without taking out the electronic component takeout tool at the component takeout position. electronic component mounting apparatus according to claim 1 or 2, characterized in. When the connecting tape passage determining means determines that the connecting tape has passed, there is provided control means for controlling the board recognition camera to take an image of the electronic component storage portion at the component take-out position and recognize the position. The electronic component mounting apparatus according to any one of claims 1 to 3 .

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