CN101742899B - Component installation device and component installation method - Google Patents
Component installation device and component installation method Download PDFInfo
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- CN101742899B CN101742899B CN200910252628.XA CN200910252628A CN101742899B CN 101742899 B CN101742899 B CN 101742899B CN 200910252628 A CN200910252628 A CN 200910252628A CN 101742899 B CN101742899 B CN 101742899B
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Abstract
The present invention relates to a technique which can prevent the inferior product generated by stacking an upper component to a lower component that is installed inferiorly and effectively stack the component to each unit substrate when the component is stacked on each unit substrate of a plurality of substrates. Particularly, after a lower component (24) for stacking is installed on each unit substrate (22) of the plurality of substrates (21), the lower component (24) is shot through a camera used for shooting the mark, and whether the installation state of the lower component (24) is good is determined based on the image processing result. As a result, when inferior installation of the lower component (24) of a random unit substrate (22) is detected, the installation of other componetns is allowed except for the stacking of the upper component to be stacked on the inferiorly installed lower component (24) of the unit substrate (22). Alternatively, when the inferior installation of the lower component (24) of the random unit substate (22) is detected, the installation of all components, which comprises the installation of the upper component and is after the installation of the unit substrate (22), is stopped.
Description
Technical field
The present invention relates to multiple cell substrates (block) arrange integratedly and on each cell substrate of many substrates (multiple substrate) of forming by least a portion parts apparatus for mounting component and the component mounting method with more than 2 layers mode closed assemblies (stacking).
Background technology
In recent years,, in order to meet the miniaturization of electronic equipment, highly integrated requirement, on the parts that are installed on substrate, the mounting technique that is referred to as closed assembly (or POP:Package OnPackage) of stacked other parts of installation obtains practical.In this closed assembly, as recorded in TOHKEMY 2007-158213 communique, in order to solve the problem of component mounting error (miss), when upper strata parts are installed in lower part, if upper strata parts occur not to be had normal mounting and is adsorbed the component mounting error that the state of nozzle (nozzle) absorption takes back, with regard to the position of image recognition lower part, be determined with the position skew without lower part, if there is no the position skew of lower part, carry out again the installation of upper strata parts, if there is the position skew of lower part, stop component erecting device and notify abnormal.
But, in the technology of above-mentioned communique, while carrying out closed assembly, if upper strata parts occur not to be had normal mounting and is adsorbed the component mounting error that the state of nozzle absorption takes back, just carry out the location recognition of lower part, be determined with the position skew without lower part, the occasion of the component mounting error of therefore taking back at the state that upper strata parts do not occur is adsorbed nozzle absorption, even if there is the position skew of lower part, also cannot detect its position skew, in the lower part that meeting offset in place moves, upper strata parts are installed, finally can be produced substandard products.
In addition, in order to improve generation, well-known such method, the method is, parts are installed on by multiple cell substrates and are arranged integratedly and on each cell substrate of many substrates of forming, all cell substrates are installed after whole parts, (disconnect groove etc.) along the boundary line between each cell substrate and block this many substrates, be divided into the installation method of all parts installation substrate.The technology that has adopted above-mentioned communique at this installation method, if the position skew of lower part detected on any one cell substrate, apparatus for mounting component will stop,, there is the problem producing under property in all installations of other cell substrate of parts that therefore also can stop normal mounting so far.
Summary of the invention
The problem that the present invention will solve is to provide a kind of apparatus for mounting component and component mounting method, during with closed assembly parts on each cell substrate of many substrates, prevent in advance the generation of the substandard products that upper strata parts closed assembly is produced to bad lower part is installed, and can carry out efficiently the closed assembly to each cell substrate.
In order to solve this problem, in the present invention, on each cell substrate of many substrates that at least a portion parts are formed in being arranged integratedly by multiple cell substrates with 2 layers of above mode closed assembly, whether the installment state of the lower part for judging described each cell substrate after the lower part of closed assembly being installed at described each cell substrate is good, its result, in the time that the installation of lower part that detects any cell substrate is bad, at least skips (skip) and want the closed assembly of closed assembly to the upper strata parts in the bad lower part of the installation of this this cell substrate.
So just in the time that the installation of lower part that detects any cell substrate from each cell substrate of many substrates is bad, skip and want the closed assembly of closed assembly to the upper strata parts in the bad lower part of the installation of this cell substrate, can continuation closed assembly operation as usual and other bad cell substrate is not installed.Thereby, in the time that parts closed assembly is arrived to each cell substrate of many substrates, can prevent in advance the generation of the substandard products that upper strata parts closed assembly is produced to bad lower part is installed, and remove the bad cell substrate of installation that detects lower part, and can carry out efficiently the closed assembly to other cell substrate.
This occasion, whether the installment state of this lower part of spectral discrimination of lower part that can be based on photographing with the camera that is equipped on apparatus for mounting component is good.For example, also can carry out image recognition and judge that lower part has or not position skew the position of conductive pattern, pad (pad) etc. of the component locations mark, the given shape that are arranged on lower part upper surface, or the outer shape of image recognition lower part and judge that lower part has or not position skew.
In addition, also can be in the time that the installation of lower part that detects any cell substrate from each cell substrate of many substrates be bad, including the parts of upper strata, skip this cell substrate after the installation of all parts.
Or, also can be in the time that the installation of lower part that detects any cell substrate be bad, only skip and want the closed assembly of closed assembly to the upper strata parts in the bad lower part of the installation of this cell substrate, and other parts are installed.This occasion, for the cell substrate of closed assembly of skipping upper strata parts, if recover to install unloading after bad lower part is installed, just can normally carry out closed assembly, even if detect that the bad cell substrate of the installation of lower part also can produce qualified product.
Or, also can be configured to and possess: first skips unit, in the time that the installation of lower part that detects any cell substrate is bad, only skip the installation of wanting closed assembly to the closed assembly of the upper strata parts in the bad lower part of the installation of this cell substrate and allow other parts; Second skips unit, in the time that the installation of lower part that detects any cell substrate is bad, skip this cell substrate after the installation of all parts; And selected cell, select described first to skip unit and described second and skip any in unit.For example, can carry out, in the time unloading the correction (repair) that recovers after bad lower part is installed to install, selecting first to skip unit, and cannot correcting when bad lower part is installed, select second to skip unit and also can.
Brief description of the drawings
Fig. 1 is the perspective view that represents the structure of the modular type apparatus for mounting component using in the embodiment of the present invention 1,2.
Fig. 2 is the front elevation that represents routine many substrates.
Fig. 3 is illustrated in the state for the lower part of closed assembly is installed on each cell substrate of many substrates.
Fig. 4 be pattern represent the local amplification view of the component installation state of 1 cell substrate of an example.
Fig. 5 is the flow chart that represents the handling process of the installation control program of embodiment 1.
Fig. 6 is the flow chart that represents the handling process of the installation control program of embodiment 2.
Embodiment
Below, application implementation best mode of the present invention on modular type apparatus for mounting component is described and specific two embodiment 1,2.
(embodiment 1)
According to Fig. 1 to Fig. 5, embodiments of the invention 1 are described.
First, according to Fig. 1, the structure of specification module type apparatus for mounting component.
On the pedestal 11 of modular type component installation system, with many fitting machine modules 12 of removable mode alignment arrangements on the throughput direction of circuit substrate.Each fitting machine module 12 is carried loader (feeder) 14, circuit substrate conveying device 15, parts filming apparatus 16, apparatus for mounting component 17 etc. and is formed on main body base 13, is provided with operating surface board 19 in the previous section of top framework 18.By the circuit substrate conveying device 15 of each fitting machine module 12, delivery circuit substrate or many substrates 21 (with reference to Fig. 2), be installed to parts on each substrate by apparatus for mounting component 17 successively.
Then, the modular type apparatus for mounting component that uses said structure is described, the method by parts closed assembly to many substrates 21.
As shown in Figure 2, many substrates 21 are 1 large substrates that multiple cell substrates 22 are formed with chessboard lattice shape, and after parts are installed, finally the boundary line along each cell substrate 22 (disconnecting groove etc.) cut apart and used.Multiple positions (for example 4 bights) in cell substrate 22 outsides on this cell substrate 22, be formed with substrate position mark 23 (overall datum mark mark (global fiducial mark)), make the camera for shot mark (not shown) of the XY mechanical arm (not shown) that apparatus for mounting component 17 moves along XY direction take substrate position mark 23 by being installed on, thus position that can the many substrates 21 of image recognition.
As shown in Figure 3, Figure 4, multiple positions (for example, to position, 2 of angular direction) above lower part 24 at closed assembly on each cell substrate 22 of many substrates 21, be formed with component locations mark 27 (local loop is mark on schedule), by take this component locations mark 27, the position of image recognition lower part 24 for the camera of shot mark.
As shown in Figure 4, in the lower part 24 on the each cell substrate 22 that is installed on many substrates 21, the one or more upper stratas of closed assembly parts 25.On each cell substrate 22, except installing for the parts 24,25 of closed assembly, the not normal elements 26 of closed assembly is also installed.Closed assembly is not limited to one group to the parts 24,25 of each cell substrate 22, can organize parts by closed assembly more.In addition, one or more groups the parts for closed assembly also can be only installed on each cell substrate 22, and other normal elements is not installed.
In addition on each cell substrate 22, also can for the parts of closed assembly with more than 3 layers mode closed assemblies.At this moment, the occasion of the 2nd layer of parts of closed assembly on the 1st layer of parts, the 1st layer of parts are equivalent to " lower part ", and the 2nd layer of parts are equivalent to " upper strata parts ", the occasion of the 3rd layer of parts of closed assembly on the 2nd layer of parts, the 2nd layer of parts are equivalent to " lower part ", and the 3rd layer of parts are equivalent to " upper strata parts ".
The control device (not shown) of modular type apparatus for mounting component is installed for after the lower part 24 of closed assembly on each cell substrate 22 of many substrates 21, take lower part 24 by the camera for shot mark, judge whether well (this function is equivalent to the lower part installment state identifying unit in claim) of installment state of lower part 24 based on its processing result image.At this moment, for example, take the component locations mark 27 of lower part 24, judge that based on its processing result image lower part 24 has or not position skew, or take whole lower part 24, judge that based on its processing result image whether the mounting position of lower part 24 is good.
Moreover, in the time that the installation of lower part 24 that detects any cell substrate 22 is bad, the control device of modular type apparatus for mounting component makes to skip wants the closed assembly of closed assembly to the upper strata parts 25 in the bad lower part 24 of the installation of this cell substrate 22, and allows the installation (this function is equivalent to the unit of skipping in claim) of other parts.
Installation control described above is to carry out according to the installation control program of Fig. 5 by the control device of modular type apparatus for mounting component.Once the installation control program of Fig. 5 starts, first, in step 101, by taking the substrate position mark 23 of many substrates 21 for the camera of shot mark and image recognition being carried out in the position of many substrates 21.Then, enter step 102, on the preposition of each cell substrate 22 of many substrates 21, lower part 24 is installed.
, enter step 103, take the component locations mark 27 of the lower part 24 that is installed on each cell substrate 22 by the camera for shot mark, the position of image recognition lower part 24 thereafter.
Moreover.Also can on whole cell substrates 22 of many substrates 21, install after lower part 24, the component locations mark 27 of the lower part 24 to each cell substrate 22 carries out image recognition successively, also can in the time lower part 24 being installed on to a cell substrate 22, carry out image recognition to the component locations mark 27 of this lower part 24 at every turn.
Then, enter step 104, determine whether that by each of each cell substrate 22 image has occurred processes mistake.Here, it is the occasion (for example, lower part 24 is brought back and occasion that occasion that can not normal mounting or lower part 24 are mounted with the posture of inclination etc.) that normal picture identification occurs to carry out the component locations mark of lower part 24 27 that image is processed mistake.
In the time having there is this image processing mistake, the possibility that lower part 24 is not installed with normal state is high, therefore enter step 107, process wrong cell substrate 22 for having there is image, be judged as lower part 24 and with normal state, (installing bad) be not installed, thereby skip the closed assembly of upper strata parts 25.
There is not image and process wrong cell substrate 22, enter step 105 from step 104, the processing result image of the component locations mark 27 based on lower part 24, by each cell substrate 22, whether each position offset of judging lower part 24 is in allowed band, if on cell substrate 22, the position offset of its lower part 24 exceedes allowed band arbitrarily, the installation of lower part 24 that is just judged as this cell substrate 22 is bad, enter step 107, exceed the cell substrate 22 of allowed band for the position offset of lower part 24, skip the closed assembly of upper strata parts 25.
On the other hand, the position offset of lower part 24 converges on the cell substrate 22 in allowed band, enters step 106, closed assembly upper strata parts 25 in lower part 24., enter step 108, other normal elements 26 is installed on each cell substrate 22 of many substrates 21 thereafter.At this moment, for the cell substrate 22 of the closed assembly of skipping upper strata parts 25, normal elements 26 is also installed.
Moreover, in the installation control program of above-mentioned Fig. 5, for after the parts 24,25 of closed assembly, normal elements 26 to be installed at closed assembly, but also can in contrast, to install after normal elements 26, closed assembly has the parts 24,25 in closed assembly.
In addition, in the present embodiment 1, by taking the component locations mark 27 of lower part 24 for the camera of shot mark and image recognition being carried out in the position of lower part 24, but the occasion of parts position mark is not set in lower part, also can carry out image recognition to the position of conductive pattern, the pad etc. of the given shape of lower part, thereby judge that lower part has or not position skew, or the outer shape of lower part is carried out image recognition and judged that lower part has or not position skew.
According to the present embodiment 1 described above, from each cell substrate 22 of many substrates 21, detect the installation of lower part 24 of any cell substrate 22 when bad, skip and want the closed assembly of closed assembly to the upper strata parts 25 in the bad lower part 24 of the installation of this cell substrate 22, other bad cell substrate 22 is not installed can continuation closed assembly as usual.Thereby, closed assembly parts 24,25 o'clock on each cell substrate 22 of many substrates 21, can prevent in advance the generation of upper strata parts 25 closed assemblies substandard products of generation to bad lower part 24 is installed, and remove the bad cell substrate 22 of installation that is detected lower part 25, can carry out closed assembly to other cell substrate 22 efficiently.
In addition, in the present embodiment 1, in the time that the installation of lower part 24 that detects any cell substrate 22 is bad, only skip and want the closed assembly of closed assembly to the upper strata parts 25 in the bad lower part 24 of the installation of this cell substrate 22, other parts 26 are installed, therefore for the cell substrate 22 of closed assembly of skipping upper strata parts 25, by unloading, the rear recovery installation of bad lower part 24 (correction) is installed, thereby can normally carry out closed assembly, even if detect the bad cell substrate of the installation of lower part 24 22, also produce qualified product.
Moreover, in the present embodiment 1, the position skew of lower part 24 is taking the position of many substrates 21 as benchmark is obtained according to the identification of substrate position mark 23, but also can on each cell substrate 22, reference mark be set, and obtains the position skew of lower part 24 according to this reference mark.
(embodiment 2)
In above-described embodiment 1, in the time that the installation of lower part 24 that detects any cell substrate 22 from each cell substrate 22 of many substrates 21 is bad, only skip and want the closed assembly of closed assembly to the upper strata parts 25 in the bad lower part 24 of the installation of this cell substrate 22, and other parts 26 are installed, but in embodiments of the invention 2, by the installation control program of execution graph 6, in the time that the installation of lower part 24 that detects any cell substrate 22 from each cell substrate 22 of many substrates 21 is bad, including upper strata parts 25, skip the installation (step 107a) of all parts afterwards of this cell substrate 22.The processing of other each step is identical with above-described embodiment 1 (Fig. 5).
The present embodiment 2 for example can not correct detect the occasion of bad lower part 24 is installed or entangle in the situations such as occasion that positively related cost is large, implement all right.Its reason is to install bad lower part 24 in the case of correcting, even if it is also all useless that this cell substrate 22 is installed to other parts.
In addition, the present invention combines above-mentioned two embodiment 1,2 and implements also can.
Specifically, can be configured to and possess: first skips unit, in the time that the installation of lower part 24 that detects any cell substrate 22 is bad, only skip the closed assembly of wanting the upper strata parts 25 in the closed assembly lower part 24 bad to the installation of this cell substrate 22 and the installation that allows other parts; Second skips unit, in the time that the installation of lower part 24 that detects any cell substrate 22 is bad, skip this cell substrate 22 after the installation of all parts; And selected cell, select described first to skip unit and described second and skip any in unit.For example, select first to skip unit in the occasion that can correct the bad lower part 24 of installation, and cannot correct the occasion that bad lower part 24 is installed, select second to skip unit.
Moreover in the present invention, skipping of the location recognition of lower part and the installation of parts need not only limit to carry out in same fitting machine module, can carry out between different erecting devices or fitting machine module.This occasion, judges that by erecting device or the fitting machine module of upstream whether the installation of lower part is good, and according to its result, the erecting device in downstream or fitting machine module are understood installation and skipped.
In addition, the present invention is not limited to the modular type apparatus for mounting component shown in Fig. 1, can be applied to the apparatus for mounting component of the various structures of closed assembly parts on each cell substrate of many substrates and be implemented.
Claims (5)
1. an apparatus for mounting component, on each cell substrate of many substrates that at least a portion parts are formed in being arranged integratedly by multiple cell substrates with 2 layers of above mode closed assembly, is characterized in that possessing:
Lower part installment state identifying unit, whether the installment state of the lower part for judging described each cell substrate after the lower part of closed assembly being installed at described each cell substrate is good; And
Skip unit, in the time that the installation of lower part that detects any cell substrate by described lower part installment state identifying unit is bad, at least skips and want the closed assembly of closed assembly to the upper strata parts in the bad lower part of the installation of this cell substrate.
2. apparatus for mounting component as claimed in claim 1, is characterized in that:
Possess the camera that the parts to being installed on described each cell substrate are taken,
Whether the installment state of this lower part of spectral discrimination of the described lower part of described lower part installment state identifying unit based on photographing with described camera is good.
3. apparatus for mounting component as claimed in claim 1, is characterized in that:
The described unit of skipping in the time that the installation of lower part that detects any cell substrate by described lower part installment state identifying unit is bad, including the parts of described upper strata, skip this cell substrate after the installation of all parts.
4. apparatus for mounting component as claimed any one in claims 1 to 3, is characterized in that:
The described unit of skipping possesses: first skips unit, only skips and want closed assembly to allow the installation of other parts to the closed assembly of the upper strata parts in the bad lower part of the installation of this cell substrate in the time that the installation of lower part that detects any cell substrate by described lower part installment state identifying unit is bad; Second skips unit, in the time that the installation of lower part that detects any cell substrate by described lower part installment state identifying unit is bad, skip this cell substrate after the installation of all parts; And selected cell, select described first to skip unit and described second and skip any in unit.
5. a component mounting method, on each cell substrate of many substrates that at least a portion parts are formed in being arranged integratedly by multiple cell substrates with 2 layers of above mode closed assembly, is characterized in that carrying out following processing:
Lower part installment state determination processing, whether the installment state of the lower part for judging described each cell substrate after the lower part of closed assembly being installed at described each cell substrate is good; And
Skip processing, in the time that the installation of lower part that detects any cell substrate by described lower part installment state determination processing is bad, at least skips and want the closed assembly of closed assembly to the upper strata parts in the bad lower part of the installation of this cell substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008298892A JP5158800B2 (en) | 2008-11-24 | 2008-11-24 | Component mounting apparatus and component mounting method |
| JP2008-298892 | 2008-11-24 |
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| Publication Number | Publication Date |
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| CN101742899A CN101742899A (en) | 2010-06-16 |
| CN101742899B true CN101742899B (en) | 2014-06-25 |
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| CN200910252628.XA Active CN101742899B (en) | 2008-11-24 | 2009-11-24 | Component installation device and component installation method |
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| CN (1) | CN101742899B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5661527B2 (en) * | 2011-03-29 | 2015-01-28 | 富士機械製造株式会社 | Production management apparatus and production management method for component mounting line |
| JP5981996B2 (en) * | 2012-07-26 | 2016-08-31 | 富士機械製造株式会社 | Mounting system |
| EP3236729B1 (en) * | 2014-12-16 | 2021-03-03 | FUJI Corporation | Component mounting device and component mounting system |
| WO2019053897A1 (en) * | 2017-09-15 | 2019-03-21 | 株式会社Ｆｕｊｉ | Mounting system |
| CN109526149B (en) * | 2018-11-08 | 2021-04-06 | 东莞市华庄电子有限公司 | Processing method and system for identifying and shielding defective products |
| CN109961067B (en) * | 2019-03-19 | 2021-05-28 | 上海望友信息科技有限公司 | Method and system for selecting optical reference point, computer storage medium and equipment |
| JP7016846B2 (en) * | 2019-09-19 | 2022-02-07 | 株式会社Fuji | Component mounting device |
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| CN1582107A (en) * | 2003-08-12 | 2005-02-16 | 重机公司 | Device-mounting apparatus |
| CN1713810A (en) * | 2004-06-24 | 2005-12-28 | 重机公司 | Electronic component mounting apparatus |
| CN1818542A (en) * | 2005-02-08 | 2006-08-16 | 富士机械制造株式会社 | Inspection method and apparatus for mounted electronic components |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4196529B2 (en) * | 2000-08-29 | 2008-12-17 | パナソニック株式会社 | Electronic component mounting apparatus and method |
| JP3947386B2 (en) * | 2001-11-01 | 2007-07-18 | Ｊｕｋｉ株式会社 | Electronic component mounting method and control device for electronic component mounting apparatus |
| JP2005064366A (en) * | 2003-08-19 | 2005-03-10 | Yamagata Casio Co Ltd | Component mounting apparatus and error recovering method |
| JP4650216B2 (en) * | 2005-11-07 | 2011-03-16 | パナソニック株式会社 | Component mounting apparatus and component mounting method |
| JP4458034B2 (en) * | 2005-12-08 | 2010-04-28 | パナソニック株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP2006319332A (en) * | 2006-05-08 | 2006-11-24 | Fuji Mach Mfg Co Ltd | Apparatus for installing electronic components provided with device for inspecting installed electronic components |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1582107A (en) * | 2003-08-12 | 2005-02-16 | 重机公司 | Device-mounting apparatus |
| CN1713810A (en) * | 2004-06-24 | 2005-12-28 | 重机公司 | Electronic component mounting apparatus |
| CN1818542A (en) * | 2005-02-08 | 2006-08-16 | 富士机械制造株式会社 | Inspection method and apparatus for mounted electronic components |
Non-Patent Citations (1)
| Title |
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| JP特开2007-158213A 2007.06.21 |
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| JP5158800B2 (en) | 2013-03-06 |
| CN101742899A (en) | 2010-06-16 |
| JP2010123906A (en) | 2010-06-03 |
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