KR101383195B1 - Bonding device of camera module and fpcb using only fpcb tray - Google Patents

Abstract

The present invention relates to a device for bonding a camera module to an FPCB using only the FPCB tray and, more particularly, to a device for bonding a camera module to an FPCB using only the FPCB tray, capable of reducing manufacturing costs and processing time by using a tray established in a module manufacturing process for the camera module and the FPCB tray without separately manufacturing the tray for the camera module and the tray for the FPCB and using the FPCB tray when mounting the FPCB and a bonding product on which the FPCB is bonded to the camera module.

Description

Camera module and FPCB bonding device using only FPCB tray {BONDING DEVICE OF CAMERA MODULE AND FPCB USING ONLY FPCB TRAY}

The present invention relates to a bonding device in which a bonding process is performed using only an FPCB tray in a device for bonding a camera module and an FPCB to each other, without manufacturing a separate tray for the camera module and a tray for the FPCB, respectively.

Recently, with the development of communication technology, the use of portable terminals such as mobile phones and PDAs is rapidly increasing. These technologies have been developed not only by simple telephone functions but also by various functions such as music, movies, TV, And a camera module plays a role in providing such various functions.

Such a camera module has been changed from a conventional 300,000 pixel (VGA class) to a center of a high-resolution pixel more than 8 million pixels, and various additional functions such as auto focusing (AF) and optical zoom can be implemented . In addition, video telephony has become possible due to the development of file transfer systems including wireless Internet, and two or more camera modules for video telephony and video imaging are mounted on a single printed circuit board, camera) is being produced.

In general, in implementing such a dual camera, a high-pixel camera of 1.3 mega or more is used for shooting a general image, and a low-pixel camera of VGA or lower is used for video communication. Since two or more camera modules are required to be precisely bonded between the printed circuit boards, it is difficult to fabricate them. Should be done. That is, the FPCB with the connector for connecting the camera module to the external device must be accurately bonded to the printed circuit board (hereinafter referred to as "camera module") at the bottom of the camera module.

Techniques related to the apparatus for bonding the camera module and the FPCB include the prior arts 1 and 2.

These include a loading section for supplying the FPCB tray and the housing tray to the guide rails, respectively; An FPC feeding unit feeding the FPCB tray supplied to the FPCB guide rail; A housing feeding part for feeding a tray supplied to the guide rail; An ACF part for attaching an ACF to the housing pattern part of the housing tray supplied to the housing guide rail; A pressing portion including a pressing device for aligning and pressing the camera with the housing pattern portion of the housing; A heating unit which maintains a curing temperature of the housing pattern unit and the FPC pattern unit when the housing pattern unit and the FPCB pattern unit are pressed by the pressing apparatus in a pitch unit through the secondary feeding unit; A main compression part having three heads for simultaneously pressing the three pairs of the pressurized housing pattern part and the FPCB pattern part when the housing tray passed through the heating part is supplied by the secondary feeding part; A housing unloading unit for stacking the housing trays passed through the main pressing unit up and down by a predetermined pitch value and sequentially stacking the housing trays; And an FPCB unloading unit for picking up the FPCB, moving the empty FPCB tray by a predetermined pitch value, and lifting the empty FPCB tray up and down by a cylinder, and sequentially loading the FPCB tray. The automatic loading of the housing, Automatic loading, FPC alignment with housing, primary bonding, heating (maintaining curing condition), secondary bonding, and product unloading process.

In the apparatus or method for bonding the conventional camera module and the FPCB composed of the above components and the above process, the camera module and the FPCB are made in each process, and each worker is carried in the camera module tray and the FPCB tray, After moving the camera module and FPCB to the carrier, the assembly work is performed on the assembly line. Since the camera module and the FPCB are separated from the tray and moved to the carrier by the operator, the worker needs to carry out a separate manpower, time, and space. There was a problem losing.

[Prior Art Literature]

[Patent Literature]

1. Korea Patent No. 0958323

2. Korean Patent Registration No. 0949537

The present invention has been made to solve the above problems, an object of the present invention is to ensure that the bonding process between the camera module and the FPCB to be carried out continuously on the transfer rail of the closed loop form, the deterioration and continuous operation of the process In the camera module and the FPCB, which are the object of the bonding operation, the camera module tray and the FPCB tray are not manufactured and used separately, but the tray of the camera module is used so that the tray containing the camera module for the first time is used as it is. The bonding work to be bonded is to be processed using only the FPCB tray containing the FPCB, to provide a camera module and FPCB bonding apparatus using only the PCB tray that does not need to manufacture each tray of each bonding object.

Other objects and advantages of the present invention will be described hereinafter and will be understood by the embodiments of the present invention. Further, objects and advantages of the present invention can be realized by the means and the combination shown in the claims.

The present invention as a means for solving the above problems, in the bonding apparatus for bonding the substrate of the camera module (A) and the flexible printed circuits board (FPCB), the camera module (A) and FPCB (B) The work tray 100 has a structure that is bonded to each other continuously on the transfer rail 10 is circulated in the form of a closed loop, the work tray 100 is circulated on the transfer rail (10); The FPCB (B) is contained so that the FPCB (B) is supplied to the work tray 100, after the FPCB (B) is supplied to the bonding workpiece bonded to the substrate of the camera module (A) FPCB (B) (C) is mounted FPCB tray 300 to be discharged to the outside; .

As described above, in the bonding process of the camera module and the FPCB, there is an effect that the process can be carried out using only the FPCB tray, without separately producing a tray for the camera module.

In addition, the present invention does not have to manufacture all the trays of each of the camera module and FPCB, there is an effect of manufacturing cost and cost reduction.

In addition, the present invention does not need to be transferred to a separately manufactured tray in order to use the most recently supplied camera module, it has the effect of reducing the manpower, shortening the process time and process efficiency.

1 is an operation of an embodiment showing a camera module and FPCB bonding apparatus using only the FPCB tray according to the present invention.

Before describing in detail several embodiments of the invention, it will be appreciated that the application is not limited to the details of construction and arrangement of components set forth in the following detailed description or illustrated in the drawings. The invention may be embodied and carried out in other embodiments and carried out in various ways. It should also be noted that the device or element orientation (e.g., "front,""back,""up,""down,""top,""bottom, Expressions and predicates used herein for terms such as "left,"" right, "" lateral, " and the like are used merely to simplify the description of the present invention, Or that the element has to have a particular orientation.

The present invention has the following features in order to achieve the above object.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be interpreted in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

According to one embodiment of the present invention,

In the bonding device for bonding the substrate of the camera module (A) and the flexible printed circuits board (FPCB), the camera module (A) and FPCB (B) is a plurality on the transfer rail 10 is circulated in a closed circuit form A work tray 100 having a structure that is continuously bonded to each other and circulated on the transport rail 10; The FPCB (B) is contained so that the FPCB (B) is supplied to the work tray 100, after the FPCB (B) is supplied to the bonding workpiece bonded to the substrate of the camera module (A) FPCB (B) (C) is mounted FPCB tray 300 to be discharged to the outside; .

In addition, the camera module A is a camera module tray 200 to which the camera module A is initially manufactured and supplied without making a separate tray for mounting the supplied camera module A to the work tray 100. It is characterized by being used as it is.

In addition, the first loading unit 20 is installed on one side of the conveying rail 10 to supply the camera module A to the work tray 100; A module inspection unit 30 which checks an alignment form and a mounting form of the camera module A mounted on the work tray 100; A film attachment part 40 attaching the anisotropic conductive film to the camera module A of the work tray 100; A film checking unit 50 for checking an adhesive form of the anisotropic conductive film attached to the camera module A; A second loading unit 60 installed close to the transfer rail 10 and supplying the FPCB B of the FPCB tray 300 to the work tray 100; The FPCB (B) supplied from the second loading part 60 is attached to the anisotropic conductive film attached to the substrate of the camera module A, but the prebonding part 70 allows the corresponding contact to be temporarily fixed to the substrate. ); A main bonding portion 80 which pressurizes and heats the substrate of the temporarily fixed camera module A and the FPCB B so that the contacts are joined; A third loading unit (90) for mounting the bonding work (C) of the work tray (100) to the FPCB tray (300) that is empty in the work tray (100); .

In addition, a process confirmation monitoring device is installed in the first loading unit 20, the work tray 100, the film checking unit 50, the second loading unit 60, and the prebonding unit 70, respectively. It is characterized in that each process can be checked.

In addition, the module inspection unit 30 is mounted on the work tray 100 by pressing the camera module (A) to move, it is characterized in that the installation failure warning is generated when a pressure of a predetermined pressure or more.

Hereinafter, a camera module and an FPCB bonding apparatus using only an FPCB tray according to a preferred embodiment of the present invention will be described in detail with reference to FIG. 1.

As shown, the camera module and the FPCB bonding apparatus using only the FPCB tray according to the present invention does not separately manufacture a tray (Tray) for holding the camera module (A) and FPCB (B) in the bonding process, respectively, FPCB By only manufacturing and using the FPCB tray 300 for (B), while reducing the manufacturing cost and cost, the process of separately transferring the camera module (A) to the carrier is to simplify the process.

As described above, the camera module A and the FPCB bonding apparatus of the present invention using only the FPCB tray 300 include a transfer rail 10, a work tray 100, an FPCB tray 300, a first loading part 20, Module inspection unit 30, film attachment unit 40, film confirmation unit 50, the second loading unit 60, pre bonding unit (Pre Bonder, 70), main bonding unit (Main Bonder, 80), third A loading unit 90 is included.

The transfer rail 10 is a camera module (A) and the FPCB (B) in the present invention is a bonding operation, the conveyor can be used in the form of a closed loop forming a circle can be used.

On this conveyor, a plurality of work trays 100 for bonding work between the camera module A and the FPCB B are mounted or placed, and are conveyed in one direction by the conveyor, while performing a plurality of processes. (A) and FPCB (B) can be bonded to each other.

That is, the working tray 100 is formed so that a plurality of working grooves 110 are formed in a row or horizontally at a predetermined interval, and each of the working grooves 110, the portion in which the camera module (A) is mounted, The FPCB (B) mounting portion, which is bonded to each other by bonding the FPCB (B) to the portion where the camera module A is mounted, is overlapped and formed integrally. The groove 310 also has the same shape.)

The first loading unit 20 supplies and mounts the camera module A, which is one of the objects of the bonding process, to the work tray 100 of the transfer rail 10 described above. In the case of the camera module tray 200 in which the camera module A is contained and the camera module A is supplied to the task tray 100, the camera module A is manufactured during the manufacturing process in the manufacturing process. Use the tray containing the module (A) as it is.

That is, after the camera module A is manufactured and transferred to a separately manufactured tray, the camera module A is not mounted on the work tray 100 through the first loading unit 20, instead of being mounted on the work tray 100. The tray containing the camera module (A) produced at the time of manufacturing (A) was used as it is, and the first loading unit 20 is a work tray 100 in the tray of the production stage itself in which the camera module (A) is contained. (A) was attached.

In addition, a plurality of stacked trays provided with the camera module A through the first loading unit 20 may be stacked at one side of the first loading unit 20. Is transported to the other side of the stack to be stacked in an empty tray 210. (Of course, the device for transporting the tray provided with both the camera module A is to push the tray to the other side to the one side of the first loading portion 20 by using a press, or to be automatically transported through another transport rail (10) It may be implemented in various ways by the user's embodiment.

As described above, the module inspecting unit 30 includes a camera module A mounted on the work tray 100 through the first loading unit 20 in a plurality of work grooves 110 formed in the work tray 100. Correspondingly, a device for confirming whether or not it is properly mounted, the plurality of camera modules (A) and the alignment form of each of the plurality of working grooves (110) are correctly aligned with a predetermined interval and are properly installed in the working groove (110). This is to confirm whether or not the corresponding mounting type is installed.

At this time, in the present invention to press the camera module (A) mounted on the working groove 110 of the work tray 100 through a pressing means (ex: press, etc.) from the top, in this case measured by the pressing means When the pressure is relatively higher than the predetermined pressure, it is determined that the camera module (A) is not properly mounted in the working groove 110 to cause a mounting failure warning (ex: alarm, etc.).

Here, the predetermined pressure is a pressure value measured by the pressure of the pressing means when the camera module A is reliably mounted in the working groove 110 of the working tray 100, and the working tray 100. If the camera module (A) is not properly mounted (not fully mounted or inserted at an angle), the camera module (A) thus inserted is inserted into the working groove 110 of the work tray 100. In order to require more pressing force, the difference in pressure can confirm whether the mounting of the camera module (A) is correct.

The film attachment portion 40 is transferred through the transfer rail 10, the anisotropic conductive film (ACF, on the camera module (A) of the work tray 100 on the transfer rail 10 passed through the module inspection unit 30, Anisotropic Conductive Film) That is, the anisotropic conductive film for the FPCB (B) is attached to the substrate portion of the camera module (A). In addition, the film check unit 50 is located at the rear end of the film attachment unit 40 described above, whether the anisotropic conductive film attached to the camera module (A) through the film attachment unit 40 is properly attached, Or check whether it is attached.

The second loading unit 60 is a device that can be mounted by supplying the FPCB (B), which is a bonding target to be bonded with the camera module A, to the pre-bonding unit 70 to be described later.

The FPCB (B) supplied from the second loading unit 60 is manufactured in advance, and the FPCB tray 300 having the mounting groove 310 formed in a plurality of rows in the horizontal and vertical directions is used. The FPCB tray 300 is provided with a plurality of FPCBs (B) mounted.

That is, the second loading unit 60 provides the FPCB (B) to the free bonding unit 70 to be described later in the FPCB tray 300.

In addition, a plurality of FPCB trays 300 are stacked on one side of the second loading unit 60 to supply the FPCB (B), similar to the tray of the first loading unit 20 described above, the FPCB (B) After supplying all, the empty tray 320 of the FPCB tray 300 is transferred to the other side of the first loading unit 20 to be stacked.

The pre-bonding unit 70 applies the FPCB (B) supplied from the second loading unit 60 described above to the camera module A mounted on the work tray 100 of the transfer rail 10. It is a device to fix).

That is, the FPCB (B) is attached to the anisotropic conductive film attached to the substrate of the camera module A mounted on the moving work tray 100 so that the contact is temporarily fixed to the substrate. Of course, it is natural that the contacts of the substrate and the FPCB (B) should be temporarily fixed in a form corresponding to each other. In addition, the main bonding portion 80 is installed at the rear end of the above-described pre-bonding portion 70, and presses and heats the contacts of the camera module A substrate and the contacts of the FPCB B so that the contacts are joined.

Bonding work of the camera module (A) and FPCB (B), the third loading portion 90 is bonded to each other in the work tray 100 on the transfer rail 10 through the main bonding portion 80 described above (C) is to discharge from the work tray 100 of the transfer rail (10).

At this time, the bonding work (C) after the bonding operation is completed through the third loading unit 90, the empty tray of the FPCB tray 300, which supplied all of the FPCB (B) from the second loading unit 60 described above ( 320, respectively, to be discharged to the outside.

In addition, the present invention, the first loading unit 20, the work tray 100, the film checking unit 50, the second loading unit 60, the pre-bonding unit 70, the process confirmation monitoring device (ex: monitoring 11, the camera and the like are installed, so that each process can be checked in real time, and according to the embodiment of the user, a process confirmation monitoring device may be further installed at the process part desired by the user as well as the above-described position. Yes.

In addition, each component used in the above-described bonding process may be installed at one side of the transfer rail 10 or an upper portion of the transfer rail 10 at predetermined intervals, and the installation position thereof may be changed according to the embodiment of the user. It will be possible.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It is to be understood that various changes and modifications may be made without departing from the scope of the appended claims.

10: transfer rail 11: process confirmation monitoring device
20: first loading unit 30: module inspection unit
40: film attachment portion 50: film confirmation portion
60: second loading portion 70: free bonding portion
80: main bonding portion 90: third loading portion
100: work tray 110: work groove
200: camera module tray 210, 320: empty tray
300: FPCB tray 310: mounting groove
A: Camera Module B: FPCB

Claims (5)

In the bonding apparatus for bonding the substrate of the camera module (A) and the FPCB (flexible printed circuits board, B),
The camera module (A) and the FPCB (B) has a structure that is continuously bonded to each other on the transfer rail 10 is circulated in the form of a closed loop,
A first loading unit 20 installed at one side of the transfer rail 10 to supply the camera module A to the work tray 100;
A module inspection unit 30 which checks an alignment form and a mounting form of the camera module A mounted on the work tray 100;
A film attachment part 40 attaching the anisotropic conductive film to the camera module A of the work tray 100;
A film checking unit 50 for checking an adhesive form of the anisotropic conductive film attached to the camera module A;
A second loading unit 60 installed close to the transfer rail 10 and supplying the FPCB B of the FPCB tray 300 to the work tray 100;
The FPCB (B) supplied from the second loading part 60 is attached to the anisotropic conductive film attached to the substrate of the camera module A, but the prebonding part 70 allows the corresponding contact to be temporarily fixed to the substrate. );
A main bonding portion 80 which pressurizes and heats the substrate of the temporarily fixed camera module A and the FPCB B so that the contacts are joined;
And a third loading part 90 for mounting the bonding work C of the work tray 100 to the FPCB tray 300 that is empty in the work tray 100.
A work tray 100 circulated on the transfer rail 10;
The FPCB (B) is contained so that the FPCB (B) is supplied to the work tray 100, after the FPCB (B) is supplied to the bonding workpiece bonded to the substrate of the camera module (A) FPCB (B) (C) is mounted FPCB tray 300 to be discharged to the outside;
Camera module and FPCB bonding apparatus using only the FPCB tray, characterized in that consisting of.
The method according to claim 1,
The camera module (A) is
FPCB tray, characterized in that the camera module tray 200 to which the camera module A is initially manufactured and supplied is used as it is, without making a separate tray for mounting the supplied camera module A to the work tray 100. Only camera module and FPCB bonding device.
The method according to claim 1,
Process checking and monitoring devices are respectively installed in the first loading unit 20, the work tray 100, the film checking unit 50, the second loading unit 60, and the pre-bonding unit 70, respectively. Camera module and FPCB bonding device using only an FPCB tray, characterized in that the process can be checked.
The method according to claim 1,
The module inspection unit 30
By pressing the camera module (A) mounted and moved to the work tray 100,
The camera module and the FPCB bonding apparatus using only the FPCB tray, characterized in that the mounting failure warning is generated when a pressure above the preset pressure is detected.
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