KR101747205B1 - A mounting device of PCB on the jig for manufacturing LED module - Google Patents

A mounting device of PCB on the jig for manufacturing LED module Download PDF

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Publication number
KR101747205B1
KR101747205B1 KR1020160028093A KR20160028093A KR101747205B1 KR 101747205 B1 KR101747205 B1 KR 101747205B1 KR 1020160028093 A KR1020160028093 A KR 1020160028093A KR 20160028093 A KR20160028093 A KR 20160028093A KR 101747205 B1 KR101747205 B1 KR 101747205B1
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KR
South Korea
Prior art keywords
reinforcing plate
pcb
pcb substrate
stacking
led module
Prior art date
Application number
KR1020160028093A
Other languages
Korean (ko)
Inventor
이승훈
Original Assignee
주식회사 태은솔루션
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Priority to KR1020160028093A priority Critical patent/KR101747205B1/en
Application granted granted Critical
Publication of KR101747205B1 publication Critical patent/KR101747205B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H05K13/0023—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to an apparatus for mounting a reinforcing plate of a PCB substrate for producing an LED module, which comprises a body formed of a plurality of frames and having an upper portion formed flat and having an opening corresponding to the reinforcing plate, A conveying part formed on one side of the upper part of the body and pushing the reinforcing plate supplied from the supplying part toward the body side, And a mounting portion for mounting the PCB substrate on the reinforcing plate moved in the conveying portion by pressing the stacked PCB substrate downward so that the PCB substrate for producing the PCB can be stacked.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a PCB mounting apparatus,

The present invention relates to an apparatus for mounting a reinforcing plate on a PCB substrate for manufacturing an LED module, and more particularly, to a reinforcing plate mounting apparatus for mounting a PCB substrate on a reinforcing plate formed at regular intervals so as to attach a plurality of LED modules to a PCB substrate. And a reinforcing plate mounting apparatus for PCB module for module production.

Generally, the LED module attaches the light emitting diode device to the PCB board and emits light of various wavelengths when an electrical signal is applied. It is almost semi-permanent lifetime and it is almost unnecessary to replace and maintain it, and the light conversion efficiency is high, And it is characterized by the fact that it can be downsized, thinned, and lightened because there are few light sources.

Unlike other light sources, LED modules are environmentally friendly light sources that do not contain mercury. They are widely used as backlight for mobile phones, backlight for LCD TVs, automotive lamps, and general lighting.

In order to produce such an LED module, an operator must manually mount the PCB substrate on the reinforcing plate 10 having the insertion grooves 11 formed at regular intervals so that the PCB substrate can be inserted therein as shown in FIG. 1, The PCB substrate must be mounted by pushing the pressing pin 12 formed with the spring 13 so as to be protruded in the direction of the insertion groove 11 of the reinforcing plate 10 or inserted in the opposite direction in order to fix the PCB substrate, The operation time is long.

Korean Patent Registration No. 10-1541332 for solving this problem relates to a device for mounting a printed circuit board on a jig, and is a device for picking up and transferring a printed circuit board (PCB) on which marks provided by trays are formed 1 PCB feeder, PCB provided by the first PCB feeder, PCB aligning table marking, PCB aligning table and PCB aligning the PCB image on the PCB aligning table And a controller for calculating a difference between a mark formed on the PCB alignment table and a mark formed on the PCB from the image photographed by the camera and the PCB alignment camera and calculating a movement amount for correcting the calculated difference, When the PCB is placed by the first PCB feeder, the PCB alignment camera moves to the position where the PCB alignment camera is located. The second PCB feeder moves to the position where the second PCB feeder is located and moves by the amount of movement calculated by the control unit at a position where the PCB mounted on the PCB alignment table is set to be adsorbed while the second PCB feeder is aligned The present invention relates to an apparatus for mounting a printed circuit board on a jig.

However, in the above-described related art, since the PCB and the jig are moved through the transporter and the PCB or the jig is aligned through the vision camera, the process time is lengthened and the equipment is complicated and maintenance is difficult.

In addition, in the above-described conventional technique, since one PCB is mounted on one jig, it takes a long time to arrange each PCB substrate in order to mount a plurality of PCBs on one jig.

Korean Patent Registration No. 10-1541332

In order to solve the above problems, it is an object of the present invention to provide an apparatus for mounting a reinforcing plate of a PCB substrate for producing an LED module capable of automatically mounting a PCB substrate on a reinforcing plate to produce an LED module.

It is another object of the present invention to provide an apparatus for mounting a reinforcing plate of a PCB substrate for producing an LED module in which a PCB substrate and a reinforcing plate can be stacked,

Another object of the present invention is to provide an apparatus for mounting a reinforcing plate of a PCB substrate for producing an LED module mounted while pushing a pressing pin formed on a reinforcing plate when the PCB substrate is mounted on the reinforcing plate.

According to an aspect of the present invention, there is provided an apparatus for mounting a reinforcing plate of a PCB substrate for manufacturing an LED module, the body including a plurality of frames, an upper portion formed to be flat and having an opening corresponding to the reinforcing plate, A conveying part formed at one side of the upper part of the body and pushing the reinforcing plate supplied from the supplying part to the side of the body, And a mounting portion for mounting the PCB substrate for producing the LED module, and a mounting portion for pressing the mounted PCB substrate downward to insert the PCB substrate into the reinforcing plate moved in the transporting portion.

Further, the mounting portion of the reinforcing plate mounting apparatus for PCB module for producing the LED module of the present invention includes a mounting device formed with upper and lower openings for mounting a PCB substrate, a mounting device and a reinforcing plate And a pressurizing device which is formed on the stacking device and presses the PCB substrate loaded on the stacking device through the cylinder at a constant pressure. .

In addition, a plurality of stacking devices for stacking the PCB substrates are formed in the mounting portion of the reinforcing plate mounting device of the PCB substrate for producing the LED module of the present invention. When the PCB substrates stacked on the stacking device are discharged, And a moving device for moving the loading device so that the loaded PCB substrate can be discharged.

In addition, the mounting portion of the reinforcing plate mounting apparatus of the PCB substrate for producing the LED module of the present invention is configured such that when the PCB substrate is mounted on the reinforcing plate, the PCB substrate is obliquely discharged at an angle of 5 to 45 degrees to fix the PCB substrate to the reinforcing plate And pressing the formed pressure pin while pushing it.

In addition, the supply part of the reinforcing plate mounting apparatus for the PCB module for producing the LED module of the present invention includes a plurality of fixing plates which are open at the front so that the reinforcing plate can be loaded, And a lift device for supporting the reinforcing plate mounted between the fixing plates and raising the reinforcing plate located on the upper side of the reinforcing plates on the upper side of the body and feeding the reinforcing plates to be conveyed by the conveying unit.

As described above, according to the apparatus for mounting a reinforcing plate of a PCB substrate for producing an LED module according to the present invention, a PCB substrate can be automatically mounted on a reinforcing plate in order to produce an LED module.

In addition, according to the apparatus for mounting a reinforcing plate of a PCB substrate for producing an LED module according to the present invention, the PCB substrate and the reinforcing plate can be stacked and can be mounted automatically by the amount of stacking.

According to another aspect of the present invention, there is provided an apparatus for mounting a reinforcing plate on a PCB substrate for manufacturing an LED module, wherein the PCB is mounted while pushing a pressing pin formed on a reinforcing plate when the PCB is mounted on the reinforcing plate.

1 is a perspective view showing a reinforcing plate on which a PCB substrate is mounted to produce an LED module;
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED module,
3 is a perspective view illustrating a supply unit for supplying a reinforcing plate of a PCB mounting apparatus for producing LED modules according to the present invention.
4 is a perspective view illustrating a transfer unit for transferring a reinforcing plate of a reinforcing plate mounting apparatus for a PCB substrate for producing an LED module according to the present invention.
FIG. 5 is a perspective view illustrating a mounting portion on which a PCB substrate is mounted in an apparatus for mounting a reinforcing plate of a PCB substrate for producing an LED module according to the present invention. FIG.
6 is a cross-sectional view illustrating a PCB substrate mounted on a reinforcing plate by a mounting portion of a reinforcing plate mounting apparatus for PCB assembly for producing an LED module according to the present invention.

Specific features and advantages of the present invention will be described in detail below with reference to the accompanying drawings. The detailed description of the functions and configurations of the present invention will be omitted if it is determined that the gist of the present invention may be unnecessarily blurred.

The present invention relates to an apparatus for mounting a reinforcing plate on a PCB substrate for manufacturing an LED module, and more particularly, to a reinforcing plate mounting apparatus for mounting a PCB substrate on a reinforcing plate formed at regular intervals so as to attach a plurality of LED modules to a PCB substrate. And a reinforcing plate mounting apparatus for PCB module for module production.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a perspective view illustrating the overall structure of a PCB reinforcement plate mounting apparatus for producing LED modules according to the present invention.

2, the reinforcing plate mounting apparatus for a PCB substrate for producing an LED module according to the present invention comprises a plurality of frames, an upper portion of which is flat and has a size corresponding to that of the reinforcing plate 10 A supply part 200 formed at the lower part of the opening formed in the body 100 and having a reinforcing plate 10 mounted thereon and raising the reinforcing plate 10 one by one to the upper part of the body 100, A transfer part 300 formed at one side of the upper part of the body 100 and pushing the reinforcing plate 10 supplied from the supplying part 200 toward the other side of the body 100, The PCB board 20 is formed so that the PCB board 20 for production can be stacked and the PCB board 20 is pressed downward to insert the PCB board 20 into the reinforcing board 10, (400).

The body 100 is formed as a flat plate so that the transfer part 300 and the mounting part 400 can be installed on the upper part of the body 100. The opening part 110 of FIG. 3, corresponding to the size of the reinforcing plate 10, And the reinforcing plate 10 is supplied to the upper portion of the body 100 through the opening 110.

The supplying unit 200 is disposed below the opening 110 of FIG. 3 formed in the body 100 and is capable of stacking a plurality of reinforcing plates 10, And the reinforcing plates 10 are supplied one by one through the openings 110 of Fig.

The transfer unit 300 is formed at one side of the body 100 and is movable toward the other side of the body 100. The transfer unit 300 pushes the reinforcing plate 10 supplied from the supply unit 200 toward the other side of the body 100 The PCB substrate 20 mounted on the mounting portion 400 is inserted into the reinforcing plate 10 and then discharged to the other side of the body 100. [

The conveying unit 300 is formed to reciprocate from one side of the body 100 to the other side of the body 100. The feeding unit 200 is configured such that the conveying unit 300 is completely moved to one side of the body 100, 100). ≪ / RTI >

The mounting portion 400 is formed on the body 100 so that a plurality of PCB boards 20 can be stacked. When the reinforcing board 10 is transported toward the other side of the body 100 by the transporting portion 300, The upper portion of the substrate 20 is pressed so that the PCB substrate 20 is inserted into the insertion groove 11 of the reinforcing plate 10 (see FIG. 1).

Therefore, the reinforcing plate 10 transferred to the other side of the body 100 by the transfer unit 300 is coupled with the PCB substrate 20 by the mounting unit 400 during the transfer.

The feeding unit 200, the feeding unit 300, and the mounting unit 400 will now be described in detail with reference to FIGS. 3 to 6. FIG.

3 is a perspective view illustrating a supply part 200 for supplying a reinforcing plate 10 of a PCB mounting apparatus for producing LED modules according to the present invention.

As shown in FIG. 3, the supply part 200 of the PCB mounting apparatus for producing the LED module according to the present invention has a front surface opened to allow the reinforcing plate 10 to be loaded, and both sides and rear surfaces are reinforced A plurality of fixing plates 210 formed to fix the position of the plate 10 and a reinforcing plate 10 mounted on the upper side of the reinforcing plate 10 supported on the reinforcing plate 10 mounted between the fixing plate 210 And a lifting and lowering device 220 for lifting the upper part of the body 100 to be conveyed by the conveying part 300.

The fixing plate 210 is disposed on the lower side of the opening 110 and is formed on both sides and rear sides of the reinforcing plate 10 so that the reinforcing plate 10 does not move. When the reinforcing plate 10 is loaded, The reinforcing plate 10 can pass through the opening 110 formed in the body 100 when the reinforcing plate 10 is lifted up to the top of the body 100 so that the position of the reinforcing plate 10 is not changed.

Also, it is preferable that the fixing plate 210 is not formed on the front surface of the lower part of the body 100 so that the operator can insert and load the reinforcing plate 10 from the front side.

The elevating device 220 is a device for elevating the stacked reinforcing plate 10 to the upper side of the body 100 and is formed to support the reinforcing plate 10 fixed by the fixing plate 210, A first drive motor 221 for generating a rotational force to supply power and a first power transmission device 221 formed of a poly-belt for transmitting the power generated by the first drive motor 221, A first ball screw 224 coupled to the first power transmission device 222 and connected to the pedestal 225 to vertically move the pedestal 225 and a second ball screw 224 coupled to the pedestal 225, And a first guide rail 223 for reducing frictional force generated when vertically moving.

The pedestal 225 is formed inside the fixing plate 210 for fixing the position of the reinforcing plate 10 to support the reinforcing plate 10 and includes a first guide rail 223 and a first ball screw 224 So that they can move in the vertical direction.

The first ball screw 224 is formed on both sides of the reinforcing plate 10 so that the load is not applied to one side due to the weight of the reinforcing plate 10 when the reinforcing plate 10 is lifted And the first guide rails 223 are formed on both sides and the rear surface of the reinforcing plate 10 to assist the tilting of the pedestal 225 rising through the first ball screw 224.

The first driving motor 221 is composed of any one of a servo motor, a step motor and an inverter. When the stacked reinforcing plate 10 is lifted up to the top of the body 100, only one reinforcing plate 10 is fixed to the body 100, It must be controllable to ascend to the top.

The rotational force generated by the first drive motor 221 is transmitted by the first power transmission device 222 and the first power transmission device 222 transmits the first ball screw 224 formed on both sides of the reinforcing plate 10 It is possible to connect the poly and the belt so as to be able to rotate in the same direction so that the rotational force can be transmitted in the same direction.

The supply unit 200 lifts the pedestal 225 and moves the stacked reinforcing plate 10 to the opening 110 of the body 100 one by one and the reinforcing plate 10 raised by the conveying unit 300 of FIG. The first driving motor 221 is operated and the reinforcing plate 10 mounted on the upper part of the body 100 is operated after the conveying unit 300 is moved to one side of the body 100. [ .

The first driving motor 221 of the elevating device 220 is rotated in a reverse direction so that the operator can load the reinforcing plate 10 on the pedestal 225 when all of the reinforcing plate 10 loaded on the pedestal 225 is discharged, So that the pedestal 225 is vertically moved toward the lower side of the body 100.

A proximity sensor (not shown) is formed on the upper part of the body 100 where the opening 110 is formed so that the reinforcing plate 10 passes through the opening 110 to form a proximity sensor The proximity sensor (not shown) senses the operation state of the conveyance unit 300 shown in FIG. 2 to operate the first drive motor 221, (Not shown).

4 is a perspective view showing a transfer unit 300 for transferring a reinforcing plate 10 of a PCB mounting apparatus for producing an LED module according to the present invention.

4, the transfer unit 300 of the PCB mounting apparatus for producing the LED module according to the present invention includes a transfer unit 300 for transferring the reinforcing plate 10 to a side of the body 100, And a transfer device 320 for transferring power to move the transfer plate 310 to one side or the other side of the body 100.

The conveying plate 310 has a size corresponding to that of the reinforcing plate 10 so that the reinforcing plate 10 raised to the upper portion of the body 100 by the supplying unit 200 of FIG. 2 can be pushed toward the other side of the body 100 And is formed so as to move reciprocally between one side and the other side of the body 100 by the transfer device 320.

The transfer device 320 includes a coupling 325 formed on the front and rear surfaces of the body 100 and coupled to the transfer plate 310, a second drive motor 321 generating rotational force to generate power, A second power transmission device 322 formed of poly and belt for transmitting rotational force generated by the second drive motor 321 and a second power transmission device 322 for converting the rotational motion transmitted from the second power transmission device 322 into a linear motion, A second ball screw 324 for moving the ball 325 in the other direction of the body 100 and a second guide rail formed between the transfer plate 310 and the second ball screw 324 for reducing frictional force 323).

The second driving motor 321 transmits rotational force to the second ball screw 324 and the second guide rail 323 formed on the front and rear surfaces of the body 100 through the second power transmission device 322, The coupling hole 325 coupled with the coupling hole 310 can move in the other direction of the body 100.

The coupling ball 325 is coupled to the end of the opened portion of the conveyance plate 310 formed of a letter C so that the length of the conveyance plate 310 and the length of the second ball screw 324 and the second guide rail 323, It is possible to move the transfer plate 310 by the length of the transfer plate 310. [

A spacing 120 is formed on the body 100 so that the conveying plate 310 does not move in the front or back direction of the body 100 when the reinforcing plate 10 is conveyed. And a discharge plate 420 through which the PCB substrate 20 is discharged from the mounting portion 400 of FIG. 2 is coupled to the upper portion.

The reinforcing plate 10 conveyed by the conveying plate 310 can be conveyed to the other side of the body 100 in a state in which the reinforcing plate 10 is not tilted to any one side so that the reinforcing plate 10 passes through the backing plate 420 The discharge groove 421 of the discharge plate 420 and the insertion groove 11 of the reinforcing plate 10 coincide with the PCB substrate 20 discharged from the mounting portion 400 of FIG. .

5 is a perspective view illustrating a mounting portion 400 on which a PCB substrate 20 of a PCB mounting apparatus for producing LED modules according to the present invention is mounted.

5, a mounting part 400 of a PCB mounting apparatus for producing an LED module according to the present invention includes a loading unit 400 having upper and lower openings, And the stacking unit 410 and the stacking unit 410 are separated from each other so that the PCB substrate 20 stacked on the stacking unit 410 is discharged to the stiffening plate 10 A discharge plate 420 having a discharge groove 421 formed therein; And a pressing device 430 which is formed on the loading device 410 and presses the PCB 20 mounted on the loading device 410 through the cylinder 431 at a constant pressure.

The upper and lower portions of the loading device 410 are open so that the PCB substrate 20 can be inserted and loaded through the upper portion and the lower opened portion is formed to coincide with the discharge groove 421 formed in the discharge plate 420 So that the PCB substrate 20 can be mounted on the reinforcing plate 10 moving under the backing plate 420.

A fixing table 411 for pressing the stacked PCB substrate 20 and fixing the PCB substrate 20 to the lower portion of the stacking apparatus 410 is formed in the stacking apparatus 410, (Not shown) to be protruded or inserted from the loading device 410 according to the length of the PCB 20.

The pressurizing device 430 is formed on the open upper portion of the loading device 410 and the pressurizing device 430 is constituted of the cylinder 431 so as to move vertically into or out of the loading device 410, And a pressing bar 432 for pressing the PCB mounted on the end.

The cylinder 431 of the pressurizing device 430 moves the pressurizing bar 432 to place the pressurizing bar 432 in the loading device 410 when the reinforcing plate 10 is conveyed by the conveying part 300 in Fig. The PCB substrate 20 can be mounted on the reinforcing plate 10 through the discharge groove 421 of the discharge plate 420. [

A plurality of stacking units 410 for stacking the PCBs 20 are formed in the stacking unit 410. When the PCBs 20 stacked on the stacking units 410 are discharged and empty, And a moving device (450) for moving the loading device (410) so that the substrate (20) can be discharged.

A plurality of stacking units 410 on which the PCBs 20 are stacked may be formed so that a large number of PCBs 20 may be stacked and used. When all the PCBs 20 are discharged from one stacking unit 410 A moving device 450 for moving the loading device 410 to the discharge groove 421 of the discharge plate 420 is formed so that the PCB substrate 20 can be discharged from the next loading device 410.

The moving device 450 includes an engaging plate 455 coupled to enclose the loading device 410, a third ball screw 454 formed at a lower portion of the engaging plate 455 to convert rotational motion into rectilinear motion, A third guide rail 453 which is formed between the back plate 420 of the plate 455 and reduces frictional force when the engaging plate 455 is moved and a second guide rail 453 formed on one side of the engaging plate 455, And a third power transmission device 452 for transmitting the rotational force generated by the third drive motor 451 to the third ball screw 454. [

The pressure bar 432 moved by the cylinder 431 of the pressure device 430 can be moved to the lower portion of the loading device 410. Using this point, the piston rod of the cylinder 431 is protruded, It is possible to operate the cylinder 431 sensor (not shown) to recognize that there is no PCB substrate 20 in the loading device 410. [

When the cylinder 431 sensor (not shown) is detected, the cylinder 431 inserts the piston rod into the cylinder 431 to move the pressure bar 432 to the outside of the loading device 410, The third driving motor 451 is operated to transmit the rotational force to the third ball screw 454 through the third power transmitting device 452 so that the coupling plate 455 coupled with the loading device 410 is rotated by the third guide rail 452. [ (453) toward the other side.

The third drive motor 451 may be any one of a servo motor, a step motor and an inverter. When the load device 410 is moved, the lower portion of the next load device 410 is moved to the discharge groove Lt; RTI ID = 0.0 > 421 < / RTI >

The third driving motor 451 can be set to move by a predetermined amount of rotation at all times when the third driving motor 451 is rotated. And when the PCB board 20 is discharged from all the stacking apparatuses 410, an alarm is outputted so that the operator can load the PCB substrate 20. [

6 is a cross-sectional view illustrating a PCB substrate 20 mounted on a reinforcing plate 10 by a mounting portion 400 of a reinforcing plate mounting apparatus for PCB assembly for producing LED modules according to the present invention.

6, a mounting portion 400 of a PCB mounting apparatus for producing an LED module according to the present invention includes a mounting portion 400 for mounting a PCB substrate 20 on a PCB substrate 20 when mounting the PCB substrate 20 on a reinforcing plate 10, And the pressing pin 12 formed to fix the PCB substrate 20 to the reinforcing plate 10 is pushed and mounted while being slanted at an angle of 5 to 45 degrees.

The PCB substrate 20 mounted on the loading device 410 is pressed by the pressing bar 432 of the pressing device 430 and passes through the backing plate 420 one by one to the insertion groove 11 of the reinforcing plate 10, Respectively.

At this time, in the upper part of the PCB substrate 20, the insertion groove 11 of the reinforcing plate 10, which one side of the PCB substrate 20 is moved, is first drawn in the state where the pressurizing device 430 is pressed, And the reinforcing plate 10 on which the insertion groove 11 is not formed, so that the PCB substrate 20 is maintained in a state of being inclined at an angle of 5 to 45 degrees.

At this time, when the reinforcing plate 10 moves, one side of the PCB substrate 20 pulled into the insertion groove 11 pushes the pressing pin 12 of Fig. 1 and the insertion groove 11 is pushed out of the discharging plate 420 The other side of the PCB substrate 20 is lowered by the pressurizing device 430 and mounted on the insertion groove 11.

When the reinforcing plate 10 is moved, the PCB substrate 20 mounted on the stacking device 410 located above the reinforcing plate 10 is pressed by the pressing device 430 and inserted into the insertion grooves 11 of the reinforcing plate 10 And the PCB 20 can be mounted automatically even if the pressing pin 12 of FIG. 1 protruded to fix the PCB 20 is present.

As described above, according to the apparatus for mounting the reinforcing plate of the PCB substrate for producing the LED module according to the present invention, the PCB substrate can be automatically mounted on the reinforcing plate to supply the LED module, and the PCB substrate and the reinforcing plate can be stacked And the pushing pins formed on the reinforcing plate are pushed out while the PCB substrate is mounted on the reinforcing plate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken as a limitation of the scope of the present invention. Or modify it. The scope of the invention should, therefore, be construed in light of the claims set forth to cover many of such variations.

10: reinforcing plate 11: insertion groove
12: pressing pin 13: spring
20: PCB substrate 100: Body
110: opening 120:
200: supply part 210: fixed plate
220: lifting device 221: first driving motor
222: first power transmission device 223: first guide rail
224: first ball screw 225: pedestal
300: transfer unit 310: transfer plate
320: transfer device 321: second drive motor
322: second power transmission device 323: second guide rail
324: second ball screw 325:
400: mounting part 410: loading device
411: Fixture 420: Boat Publishing
421: discharge groove 430: pressure device
431: cylinder 432: pressure bar
450: Moving device 451: Third drive motor
452: Third power transmission device 453: Third guide rail
454: Third ball screw 455: Coupling plate

Claims (5)

A body having a plurality of frames and having an upper portion formed to be flat and having an opening corresponding to the reinforcing plate;
A supply part formed below the opening formed in the body and having the reinforcing plate stacked thereon and raising the reinforcing plate one by one to the upper part of the body;
A conveying part formed at one side of the upper part of the body and pushing the reinforcing plate supplied from the supplying part toward the body side;
And a mounting unit disposed on the body and configured to mount a PCB substrate for producing the LED module and to press the PCB substrate downward to insert the PCB substrate into the reinforcing plate moved in the transporting unit Characterized by comprising
Reinforcing plate mounting device for PCB module for LED module production.
The method according to claim 1,
The mounting portion
A stacking apparatus having an upper portion and a lower portion opened to allow the PCB substrate to be stacked;
A discharge plate formed at a lower portion of the stacking apparatus and separating the stacking apparatus from the stacking plate and having a discharge groove for discharging the PCB substrate loaded on the stacking apparatus to the reinforcing plate;
And a pressing device which is formed on the stacking device and presses the PCB substrate loaded on the stacking device through a cylinder at a constant pressure.
Reinforcing plate mounting device for PCB module for LED module production.
The method according to claim 1,
The mounting portion
A plurality of stacking units for stacking the PCB substrates are formed, and when the PCB substrates stacked on the stacking units are discharged and empty, the stacking unit is moved so that the PCB boards stacked on the stacking units are discharged Characterized in that it further comprises a mobile device
Reinforcing plate mounting device for PCB module for LED module production.
The method according to claim 1,
Wherein the mounting portion slidably mounts the PCB substrate at an angle of 5 to 45 degrees when the PCB substrate is mounted on the reinforcing plate and pushes the pressing pin formed to fix the PCB substrate to the reinforcing plate, doing
Reinforcing plate mounting device for PCB module for LED module production.
The method according to claim 1,
The supply part
A plurality of fixing plates each having a front surface opened to allow the reinforcing plate to be stacked, both sides and a rear surface being fixed to fix the position of the reinforcing plate;
And a lifting device that supports the reinforcing plate to be mounted between the fixing plates and lifts up only one reinforcing plate located on the upper side of the reinforcing plates so as to be transported by the transporting unit.
Reinforcing plate mounting device for PCB module for LED module production.
KR1020160028093A 2016-03-09 2016-03-09 A mounting device of PCB on the jig for manufacturing LED module KR101747205B1 (en)

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Application Number Priority Date Filing Date Title
KR1020160028093A KR101747205B1 (en) 2016-03-09 2016-03-09 A mounting device of PCB on the jig for manufacturing LED module

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Application Number Priority Date Filing Date Title
KR1020160028093A KR101747205B1 (en) 2016-03-09 2016-03-09 A mounting device of PCB on the jig for manufacturing LED module

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KR101747205B1 true KR101747205B1 (en) 2017-06-14

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3578851B2 (en) 1995-12-05 2004-10-20 アピックヤマダ株式会社 Resin molding device with dummy frame supply and storage mechanism
JP2005506538A (en) 2001-10-19 2005-03-03 モノジェン インコーポレイテッド Article handling system and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3578851B2 (en) 1995-12-05 2004-10-20 アピックヤマダ株式会社 Resin molding device with dummy frame supply and storage mechanism
JP2005506538A (en) 2001-10-19 2005-03-03 モノジェン インコーポレイテッド Article handling system and method

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