CN101742899A - Component installation device and component installation method - Google Patents
Component installation device and component installation method Download PDFInfo
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- CN101742899A CN101742899A CN200910252628A CN200910252628A CN101742899A CN 101742899 A CN101742899 A CN 101742899A CN 200910252628 A CN200910252628 A CN 200910252628A CN 200910252628 A CN200910252628 A CN 200910252628A CN 101742899 A CN101742899 A CN 101742899A
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- cell substrate
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Abstract
The present invention relates to a technique which can prevent the inferior product generated by stacking an upper component to a lower component that is installed inferiorly and effectively stack the component to each unit substrate when the component is stacked on each unit substrate of a plurality of substrates. Particularly, after a lower component (24) for stacking is installed on each unit substrate (22) of the plurality of substrates (21), the lower component (24) is shot through a camera used for shooting the mark, and whether the installation state of the lower component (24) is good is determined based on the image processing result. As a result, when inferior installation of the lower component (24) of a random unit substrate (22) is detected, the installation of other componetns is allowed except for the stacking of the upper component to be stacked on the inferiorly installed lower component (24) of the unit substrate (22). Alternatively, when the inferior installation of the lower component (24) of the random unit substate (22) is detected, the installation of all components, which comprises the installation of the upper component and is after the installation of the unit substrate (22), is stopped.
Description
Technical field
The present invention relates to a plurality of cell substrates (block) arrange integratedly and on each cell substrates of many substrates (multiple substrate) of forming with apparatus for mounting component and the component mounting method of at least a portion parts with the mode closed assembly (stacking) more than 2 layers.
Background technology
In recent years, for the miniaturization of satisfying electronic equipment, highly integrated requirement, the mounting technique that is referred to as closed assembly (or POP:Package OnPackage) of stacked other parts of installation obtains practicability on the parts of substrate being installed on.In this closed assembly, as putting down in writing in the TOHKEMY 2007-158213 communique, in order to solve the problem of component mounting error (miss), when on lower part, the upper strata parts being installed, be adsorbed the component mounting error that the state of nozzle (nozzle) absorption takes back if take place the upper strata parts not have normal mounting, position with regard to the image recognition lower part, judge the offset that has or not lower part, if there is not the offset of lower part, then carry out the installation of upper strata parts again, if the offset of lower part is arranged, stop component erecting device and notify unusual then.
But, in the technology of above-mentioned communique, when carrying out closed assembly, be adsorbed the component mounting error that the state of nozzle absorption takes back if take place the upper strata parts not have normal mounting, just carry out the location recognition of lower part, judge the offset that has or not lower part, therefore in the occasion that the component mounting error that state that the upper strata parts are adsorbed nozzle absorption takes back does not take place, even the offset of lower part is arranged, also can't detect its offset, can the upper strata parts be installed on the lower part of offset, finally can produce substandard products.
In addition, in order to improve generation, well-known such method, this method is, parts are installed on by a plurality of cell substrates arrange integratedly and on each cell substrates of many substrates of forming, after all cell substrates are installed whole parts, (disconnect groove etc.) along the boundary line between each cell substrate and block this many substrates, be divided into the installation method of each parts installation substrate.Adopted at this installation method under the situation of technology of above-mentioned communique, if on any one cell substrate, detect the offset of lower part, then apparatus for mounting component will stop, therefore also can stop normal mounting so far all of other cell substrate of parts install, have the problem that produces under the property.
Summary of the invention
The problem that the present invention will solve provides a kind of apparatus for mounting component and component mounting method, during with closed assembly parts on each cell substrate of many substrates, prevent the generation of substandard products that upper strata parts closed assembly is produced to bad lower part is installed in advance, and can carry out closed assembly efficiently each cell substrate.
In order to solve this problem, among the present invention, on each cell substrate of many substrates that at least a portion parts are formed in being arranged integratedly by a plurality of cell substrates with the mode closed assembly more than 2 layers, whether the installment state of the lower part of described each cell substrate of judgement is good after described each cell substrate is installed the lower part that is used for closed assembly, its result, when the installation of the lower part that detects any cell substrate is bad, skip the closed assembly that (skip) wants the upper strata parts of closed assembly on the bad lower part of the installation of this this cell substrate at least.
So just when the installation of the lower part that detects any cell substrate from each cell substrate of many substrates is bad, skip the closed assembly of wanting the upper strata parts of closed assembly on the bad lower part of the installation of this cell substrate, can continuation closed assembly operation as usual and other bad cell substrate is installed.Thereby, when the parts closed assembly is arrived each cell substrate of many substrates, can prevent the generation of substandard products that upper strata parts closed assembly is produced to bad lower part is installed in advance, and remove the bad cell substrate of installation that detects lower part, and can carry out closed assembly efficiently other cell substrate.
Whether this occasion can good based on the installment state of this lower part of spectral discrimination of the lower part that photographs with the camera that is equipped on apparatus for mounting component.For example, also can carry out image recognition and judge that lower part has or not offset, the outer shape of perhaps image recognition lower part and judge that lower part has or not offset the position of the conductive pattern of the component locations mark that is arranged on the lower part upper surface, given shape, pad (pad) etc.
In addition, also can when the installation of the lower part that detects any cell substrate from each cell substrate of many substrates is bad, comprise the upper strata parts, skip the installation of all parts afterwards of this cell substrate.
Perhaps, also can be when the installation of the lower part that detects any cell substrate be bad, only skip the closed assembly of wanting the upper strata parts of closed assembly on the bad lower part of the installation of this cell substrate, and other parts are installed.This occasion for the cell substrate of the closed assembly of skipping the upper strata parts, if recover to install, just can normally be carried out closed assembly after unloading the bad lower part of installation, also can produce qualified product even detect the bad cell substrate of the installation of lower part.
Perhaps, also can constitute and possess: first skips the unit, only skips the closed assembly of wanting the upper strata parts of closed assembly on the bad lower part of the installation of this cell substrate and the installation that allows other parts when the installation of the lower part that detects any cell substrate is bad; Second skips the unit, skips the installation of all parts afterwards of this cell substrate when the installation of the lower part that detects any cell substrate is bad; And selected cell, select described first to skip unit and described second any that skip in the unit.For example, can carry out when unloading the correction (repair) that recovers after bad lower part is installed to install, selecting first to skip the unit, and can't correcting when bad lower part is installed, select second to skip the unit and also can.
Description of drawings
Fig. 1 is the perspective view of the structure of the modular type apparatus for mounting component of use in the expression embodiment of the invention 1,2.
Fig. 2 is the front elevation of expression one routine many substrates.
Fig. 3 is illustrated in the state that the lower part that is used for closed assembly is installed on each cell substrates of many substrates.
Fig. 4 is the local amplification view of the component installation state of 1 cell substrate of pattern ground expression one example.
Fig. 5 is the flow chart of handling process of the installation and control program of expression embodiment 1.
Fig. 6 is the flow chart of handling process of the installation and control program of expression embodiment 2.
Embodiment
Below, application implementation best mode of the present invention on the modular type apparatus for mounting component is described and specific two embodiment 1,2.
(embodiment 1)
According to Fig. 1 to Fig. 5, embodiments of the invention 1 are described.
At first, according to Fig. 1, the structure of specification module type apparatus for mounting component.
On the pedestal 11 of modular type component installation system, with many fitting machine modules 12 of removable mode alignment arrangements on the throughput direction of circuit substrate.Each fitting machine module 12 is carried loader (feeder) 14, circuit substrate conveying device 15, parts filming apparatus 16, apparatus for mounting component 17 etc. and is constituted on main body base 13, be provided with operating surface board 19 in the previous section of top framework 18.By the circuit substrate conveying device 15 of each fitting machine module 12, delivery circuit substrate or many substrates 21 (with reference to Fig. 2) are installed to parts on each substrate by apparatus for mounting component 17 successively.
Then, the modular type apparatus for mounting component that uses said structure is described, with the method for parts closed assembly to many substrates 21.
As shown in Figure 2, many substrates 21 are 1 big type substrates that a plurality of cell substrates 22 are formed with the chessboard lattice shape, and final boundary line along each cell substrate 22 after parts are installed (disconnecting groove etc.) cut apart and used.A plurality of positions (for example 4 bights) in these cell substrate 22 outsides in above cell substrate 22, be formed with substrate position mark 23 (overall datum mark mark (global fiducial mark)), make the camera that is used for shot mark (not shown) of the XY mechanical arm (not shown) that apparatus for mounting component 17 moves along the XY direction take substrate position mark 23 by being installed on, thus position that can the many substrates 21 of image recognition.
As shown in Figure 3, Figure 4, a plurality of positions on the lower part 24 of closed assembly on each cell substrate 22 of many substrates 21 (for example to 2 positions, angular direction), be formed with component locations mark 27 (local loop is mark on schedule), take this component locations mark 27, the position of image recognition lower part 24 by the camera that is used for shot mark.
As shown in Figure 4, on the lower part 24 that is installed on each cell substrate 22 of many substrates 21, the one or more upper stratas of closed assembly parts 25.The parts 24,25 that are used for closed assembly on each cell substrate 22 except installation, the not normal elements 26 of closed assembly is installed also.Closed assembly is not limited to one group to the parts 24,25 of each cell substrate 22, can organize parts by closed assembly more.In addition, also one or more groups the parts that are used for closed assembly can only be installed on each cell substrate 22, and other normal elements is not installed.
In addition, the parts that are used for closed assembly with the mode closed assembly more than 3 layers on each cell substrate 22 also can.At this moment, the occasion of the 2nd layer of parts of closed assembly on the 1st layer of parts, the 1st layer of parts are equivalent to " lower part ", and the 2nd layer of parts are equivalent to " upper strata parts ", the occasion of the 3rd layer of parts of closed assembly on the 2nd layer of parts, the 2nd layer of parts are equivalent to " lower part ", and the 3rd layer of parts are equivalent to " upper strata parts ".
The control device of modular type apparatus for mounting component (not shown) is after installation on each cell substrate 22 of many substrates 21 is used for the lower part 24 of closed assembly, take lower part 24 by the camera that is used for shot mark, whether the installment state of judging lower part 24 based on its processing result image good (this function is equivalent to the lower part installment state identifying unit in the claim).At this moment, for example, take the component locations mark 27 of lower part 24, judge that based on its processing result image lower part 24 has or not offset, perhaps take whole lower part 24, judge based on its processing result image whether the mounting position of lower part 24 is good.
Moreover, when the installation of the lower part 24 that detects any cell substrate 22 is bad, the control device of modular type apparatus for mounting component makes skips the closed assembly of wanting the upper strata parts 25 of closed assembly on the bad lower part 24 of the installation of this cell substrate 22, and allows the installation (this function is equivalent to the unit of skipping in the claim) of other parts.
More than Shuo Ming installation and control is to carry out according to the installation and control program of Fig. 5 by the control device of modular type apparatus for mounting component.In a single day the installation and control program of Fig. 5 starts, and at first, in step 101, takes the substrate position mark 23 of many substrates 21 and image recognition is carried out in the position of many substrates 21 by the camera that is used for shot mark.Then, enter step 102, lower part 24 is installed on the preposition of each cell substrate 22 of many substrates 21.
, enter step 103, take the component locations mark 27 of the lower part 24 that is installed on each cell substrate 22, the position of image recognition lower part 24 by the camera that is used for shot mark thereafter.
Moreover.Also can be after on whole cell substrates 22 of many substrates 21 lower part 24 being installed, component locations mark 27 to the lower part 24 of each cell substrate 22 carries out image recognition successively, also can each when lower part 24 is installed on a cell substrate 22 the component locations mark 27 to this lower part 24 carry out image recognition.
Then, enter step 104, judge by each of each cell substrate 22 whether the image processing mistake has taken place.Here, the image processing mistake is the occasion (for example, lower part 24 is taken back and occasion that can not normal mounting or the occasion that lower part 24 is mounted with the posture that tilts etc.) that component locations mark 27 to lower part 24 carries out normal picture identification of failing.
When this image processing mistake has taken place when, the possibility height that lower part 24 is not installed with normal state, therefore enter step 107, for the cell substrate 22 that the image processing mistake has taken place, be judged as lower part 24 and (installing bad) be not installed, thereby skip the closed assembly of upper strata parts 25 with normal state.
The cell substrate 22 of image processing mistake does not take place, enter step 105 from step 104, processing result image based on the component locations mark 27 of lower part 24, each judges that the position offset of lower part 24 is whether in allowed band by each cell substrate 22, if the position offset of its lower part 24 surpasses allowed band on the cell substrate 22 arbitrarily, the installation of lower part 24 that just is judged as this cell substrate 22 is bad, enter step 107, surpass the cell substrate 22 of allowed band for the position offset of lower part 24, skip the closed assembly of upper strata parts 25.
On the other hand, the position offset of lower part 24 converges on the cell substrate 22 in the allowed band, enters step 106, closed assembly upper strata parts 25 on lower part 24., enter step 108, other normal elements 26 is installed on each cell substrate 22 of many substrates 21 thereafter.At this moment, for the cell substrate 22 of the closed assembly of skipping upper strata parts 25 normal elements 26 is installed also.
Moreover, in the installation and control program of above-mentioned Fig. 5, be used for the parts 24,25 of closed assembly at closed assembly after, normal elements 26 is installed, but also can be in contrast, after normal elements 26 was installed, closed assembly had the parts 24,25 in closed assembly.
In addition, in present embodiment 1, take the component locations mark 27 of lower part 24 and image recognition is carried out in the position of lower part 24 by the camera that is used for shot mark, but the occasion of component locations mark is not set in lower part, also can carry out image recognition to the position of the conductive pattern of the given shape of lower part, pad etc., thereby judge that lower part has or not offset, perhaps the outer shape of lower part is carried out image recognition and judged that lower part has or not offset.
Present embodiment 1 according to above explanation, from each cell substrate 22 of many substrates 21, detect the installation of lower part 24 of any cell substrate 22 when bad, skip the closed assembly of wanting the upper strata parts 25 of closed assembly on the bad lower part 24 of the installation of this cell substrate 22, other bad cell substrate 22 is not installed can continuation closed assembly as usual.Thereby, the closed assembly parts are 24,25 o'clock on each cell substrate 22 of many substrates 21, can prevent the generation of the substandard products that parts 25 closed assemblies in upper strata produce to bad lower part 24 is installed in advance, and remove the bad cell substrate 22 of installation that is detected lower part 25, can carry out closed assembly to other cell substrate 22 efficiently.
In addition, in present embodiment 1, when the installation of the lower part 24 that detects any cell substrate 22 is bad, only skip the closed assembly of wanting the upper strata parts 25 of closed assembly on the bad lower part 24 of the installation of this cell substrate 22, other parts 26 are installed, therefore for the cell substrate 22 of the closed assembly of skipping upper strata parts 25, by unloading the 24 back recovery installations (correction) of bad lower part are installed, thereby can normally carry out closed assembly, even detect the bad cell substrate of the installation of lower part 24 22, also produce qualified product.
Moreover, in present embodiment 1, the offset of lower part 24 is that the position with many substrates 21 is that benchmark is obtained according to the identification of substrate position mark 23, but also can on each cell substrate 22 reference mark be set, and obtains the offset of lower part 24 according to this reference mark.
(embodiment 2)
In the foregoing description 1, when the installation of the lower part 24 that detects any cell substrate 22 from each cell substrate 22 of many substrates 21 is bad, only skip the closed assembly of wanting the upper strata parts 25 of closed assembly on the bad lower part 24 of the installation of this cell substrate 22, and other parts 26 are installed, but in embodiments of the invention 2, installation and control program by execution graph 6, when the installation of the lower part 24 that detects any cell substrate 22 from each cell substrate 22 of many substrates 21 is bad, comprise upper strata parts 25, skip the installation (step 107a) of all parts afterwards of this cell substrate 22.The processing of other each step is identical with the foregoing description 1 (Fig. 5).
Present embodiment 2 for example can not correct detect the occasion that bad lower part 24 is installed or correct implement under the big situations such as occasion of relevant cost all right.Its reason is can't correct under the situation that bad lower part 24 is installed, even it is also all useless that this cell substrate 22 is installed other parts.
In addition, the present invention makes up above-mentioned two embodiment 1,2 and implements also can.
Specifically, can constitute and possess: first skips the unit, only skips the closed assembly of wanting the upper strata parts 25 on the closed assembly lower part 24 bad to the installation of this cell substrate 22 and the installation that allows other parts when the installation of the lower part 24 that detects any cell substrate 22 is bad; Second skips the unit, skips the installation of all parts afterwards of this cell substrate 22 when the installation of the lower part 24 that detects any cell substrate 22 is bad; And selected cell, select described first to skip unit and described second any that skip in the unit.For example, select first to skip the unit in the occasion that can correct the bad lower part 24 of installation, and can't correct the occasion that bad lower part 24 is installed, selection second is skipped the unit and is got final product.
Moreover among the present invention, skipping of the location recognition of lower part and the installation of parts need not only limit to carry out in same fitting machine module, can carry out between different erecting devices or fitting machine module.This occasion, whether good by the installation that the erecting device or the fitting machine module of upstream are judged lower part, and according to its result, the erecting device in downstream or fitting machine module are understood installation and are skipped.
In addition, the present invention is not limited to the modular type apparatus for mounting component shown in Fig. 1, can be applied to the apparatus for mounting component of the various structures of closed assembly parts on each cell substrate of many substrates and is implemented.
Claims (5)
1. apparatus for mounting component on each cell substrate of many substrates that at least a portion parts are formed in being arranged integratedly by a plurality of cell substrates with the mode closed assembly more than 2 layers, is characterized in that possessing:
Lower part installment state identifying unit, whether the installment state of the lower part of described each cell substrate of judgement is good after described each cell substrate is installed the lower part that is used for closed assembly; And
Skip the unit, when the installation of the lower part that detects any cell substrate by described lower part installment state identifying unit is bad, skip the closed assembly of wanting the upper strata parts of closed assembly on the bad lower part of the installation of this this cell substrate at least.
2. apparatus for mounting component as claimed in claim 1 is characterized in that:
Possess the camera that the parts that are installed on described each cell substrate are taken,
Whether described lower part installment state identifying unit is good based on the installment state of this lower part of spectral discrimination of the described lower part that photographs with described camera.
3. apparatus for mounting component as claimed in claim 1 is characterized in that:
The described unit of skipping comprises described upper strata parts when the installation of the lower part that detects any cell substrate by described lower part installment state identifying unit is bad, skip the installation of all parts afterwards of this cell substrate.
4. as each described apparatus for mounting component in the claim 1 to 3, it is characterized in that:
The described unit of skipping possesses: first skips the unit, only skips the installation that the closed assembly of wanting the upper strata parts of closed assembly on the bad lower part of the installation of this cell substrate allows other parts when the installation of the lower part that detects any cell substrate by described lower part installment state identifying unit is bad; Second skips the unit, skips the installation of all parts afterwards of this cell substrate when the installation of the lower part that detects any cell substrate by described lower part installment state identifying unit is bad; And selected cell, select described first to skip unit and described second any that skip in the unit.
5. component mounting method on each cell substrate of many substrates that at least a portion parts are formed in being arranged integratedly by a plurality of cell substrates with the mode closed assembly more than 2 layers, is characterized in that carrying out following processing:
Lower part installment state determination processing, whether the installment state of the lower part of described each cell substrate of judgement is good after described each cell substrate is installed the lower part that is used for closed assembly; And
Skip processing, when the installation of the lower part that detects any cell substrate by described lower part installment state determination processing is bad, skip the closed assembly of wanting the upper strata parts of closed assembly on the bad lower part of the installation of this cell substrate at least.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008298892A JP5158800B2 (en) | 2008-11-24 | 2008-11-24 | Component mounting apparatus and component mounting method |
| JP2008-298892 | 2008-11-24 |
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| Publication Number | Publication Date |
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| CN101742899A true CN101742899A (en) | 2010-06-16 |
| CN101742899B CN101742899B (en) | 2014-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910252628.XA Active CN101742899B (en) | 2008-11-24 | 2009-11-24 | Component installation device and component installation method |
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| JP (1) | JP5158800B2 (en) |
| CN (1) | CN101742899B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107006148A (en) * | 2014-12-16 | 2017-08-01 | 富士机械制造株式会社 | Element fixing apparatus and element assemble mounting system |
| CN109526149A (en) * | 2018-11-08 | 2019-03-26 | 东莞市华庄电子有限公司 | A kind of processing method and system identified and shield defective products |
| CN109961067A (en) * | 2019-03-19 | 2019-07-02 | 上海望友信息科技有限公司 | Choosing method, system, computer storage medium and the equipment of optical reference point |
| CN111096099A (en) * | 2017-09-15 | 2020-05-01 | 株式会社富士 | Mounting system |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5661527B2 (en) * | 2011-03-29 | 2015-01-28 | 富士機械製造株式会社 | Production management apparatus and production management method for component mounting line |
| JP5981996B2 (en) * | 2012-07-26 | 2016-08-31 | 富士機械製造株式会社 | Mounting system |
| JP7016846B2 (en) * | 2019-09-19 | 2022-02-07 | 株式会社Fuji | Component mounting device |
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| CN107006148A (en) * | 2014-12-16 | 2017-08-01 | 富士机械制造株式会社 | Element fixing apparatus and element assemble mounting system |
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| CN111096099B (en) * | 2017-09-15 | 2022-03-01 | 株式会社富士 | Mounting system |
| CN109526149A (en) * | 2018-11-08 | 2019-03-26 | 东莞市华庄电子有限公司 | A kind of processing method and system identified and shield defective products |
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| CN109961067A (en) * | 2019-03-19 | 2019-07-02 | 上海望友信息科技有限公司 | Choosing method, system, computer storage medium and the equipment of optical reference point |
| CN109961067B (en) * | 2019-03-19 | 2021-05-28 | 上海望友信息科技有限公司 | Method and system for selecting optical reference point, computer storage medium and equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5158800B2 (en) | 2013-03-06 |
| CN101742899B (en) | 2014-06-25 |
| JP2010123906A (en) | 2010-06-03 |
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