JP3947386B2 - Electronic component mounting method and control device for electronic component mounting apparatus - Google Patents

Description

【００３０】
ここで、ｘ_ijは基準マークの画像の各画素の濃度であり、ｘ_avは基準マークの画素濃度の平均である。ｙ_ijは認識した回路マーク９２の各画素の濃度であり、ｙ_avは認識した回路マーク９２の画素濃度の平均である。γは、相関値であり、０以上１以下の値をとり得る。
【００３１】
さて、メインプログラムに従った制御部３５の処理として、各回路９１，９１，…について、回路マーク９２が付されているか、回路マーク９２が付されているが基準形状とは異なっているのか、それとも回路マーク９２が付されていないのか、という判断処理がある。このような判断は、算出された相関値に基づいて行われる。ここで、相関値が１である場合、認識した回路マーク９２と基準形状が完全一致している。相関値がゼロに近づくにつれて、認識した回路マーク９２と基準形状と異なり具合が大きくなる。
【００３２】
相関値が所与の閾値（第二閾値）α（０＜α＜１）より大きい場合、回路９１に回路マーク９２が付されていると制御部３５によって判断され、その回路９１は正常回路と判断される。相関値が所与の閾値（第一閾値）β（０＜β＜α＜１）より小さい場合、回路９１に回路マーク９２が付されていないと制御部３５によって判断され、その回路９１はスキップ回路と判断される。更に、相関値が閾値β以上閾値α以下である場合、回路９１に回路マーク９２が付されているが、回路マーク９２が基準形状とは異なっていると制御部３５によって判断され、その回路９１は不良回路と判断される。
【００３３】
つまり、閾値αは、回路マーク９２の形状と基準形状がほとんど一致していない状態と、回路マーク９２の形状と基準形状が一致している状態とに仕切る閾値である。閾値βは、回路マーク９２が付されていない状態と、回路マーク９２の形状と基準形状がほとんど一致していない状態とに仕切る閾値である。制御部３５は、各回路マーク９２の相関値と閾値α，βを比較することで、各回路マーク９２の状態を判断できる。
【００３４】
次に、制御プログラムに従った制御部３５の処理の流れ、電子部品実装装置１の動作、及び、電子部品実装装置１で電子部品を実装する実装方法について説明する。図５は、制御部３５の処理の流れが示されたフローチャートである。
【００３５】
まず、作業者等によって設定された場合（ステップＳ１）、制御部３５の処理はステップＳ２に移行する。ステップＳ１では、作業者等は入力装置３９を操作して、電子部品実装装置１にデータ入力することができる。設定内容としては、閾値αの値、閾値βの値、回路個数Ｎ（一連番号、一つの基板あたりの単位回路の個数）、回路マーク個数Ｍ（一つの回路あたりの回路マークの個数）がある。
その他のティーチングの内容として、回路９１に付された回路マーク９２が基準形状と異なる場合に、電子部品実装装置１が停止するタイミングもある。ティーチングできるタイミングとしては、電子部品実装装置１が電子部品を搭載する前（回路９１の回路マーク９２を認識した時点）、又は、電子部品実装装置１が電子部品を搭載した後（正常な基板のみ）の何れかである。
【００３６】
作業者等が、閾値α、閾値β、回路個数Ｎ、回路マーク個数Ｍ及び停止タイミングを決めたら、作業者は決めた内容を入力装置３９へ入力し、制御部３５がその入力内容を記憶する（ステップＳ１：Ｙｅｓ）。次いで、制御部３５が基板搬送位置決装置２２を制御することによって、基板搬送位置決装置２２が電子部品実装装置１内に基板９０搬送して位置決めする。以下、搬送された基板９０が、複数の回路９１，９１，…が連続してＮ個配列されているものとして説明する。つまり、基板９０は、Ｎ個の回路を有する多面取り基板である。
【００３７】
制御部３５は、搬送された基板９０の各回路９１，９１，…について、撮像装置２８及び認識部３８で回路マーク９２の認識を行う。このとき、図２において、最初には、最も右後ろの回路９１（以下、基準回路と述べる。）から順次認識を行い、最後には、最も左上の回路９１（以下、原点回路と述べる。）について回路マーク９２の認識を行う。つまり、まず、制御部３５は、ＸＹ移動装置２７を制御することによりヘッド部２６を基準回路上に移動させて、基準回路について回路マーク９２（付されていない場合もある。）を認識する（ステップＳ５）。制御部３５が基準回路９１上の回路マーク９２を全て認識した後に（ステップＳ４：Ｎｏ）、回路マーク９２の認識が全て正常ならば（つまり、ステップＳ７の判断が全てＹｅｓである。ステップＳ６及びステップＳ７については後述する。）、制御部３５は、認識した回路マーク９２の位置に基づいて基準回路９１の位置と基準位置との誤差を算出し、回路番号とともに算出した誤差データを記憶する（ステップＳ１６）。
【００３８】
ステップＳ６では、制御部３５は、認識した一つの回路マーク９２の形状についての相関値を算出する。但し、基準回路に回路マーク９２が付されていない場合には、回路マーク９２が認識されていないので、制御部３５は相関値として極めて低い値として算出する。
【００３９】
ステップＳ７では、制御部３５は、算出した相関値が閾値αより大きいか否かを判断する。算出した相関値が閾値αより大きい場合（ステップＳ７：Ｙｅｓ）、制御部３５は、基準回路９１の次の回路マーク９２について認識を行う（ステップＳ１５、ステップＳ４：Ｙｅｓ）。ステップＳ４、ステップＳ５、ステップＳ６、ステップＳ７、ステップＳ１５が繰り返され、基準回路９１の全ての回路マーク９２を認識して、上述したように基準回路９１の全ての回路マーク９２についての相関値全てが閾値αより大きい場合には、制御部３５は、基準回路９１を正常回路として判断し、回路番号とともに算出した誤差データを記憶する（ステップＳ１６）。そして、制御部３５は、基準回路９１の次の回路について、回路マーク９２の認識を行う（ステップＳ１７、ステップＳ１８、ステップＳ３：Ｙｅｓ、ステップＳ４：Ｙｅｓ）。
【００４０】
算出した相関値が閾値α以下である場合（ステップＳ７：Ｎｏ）、制御部３５は、算出した相関値が閾値β未満か否かを判断する（ステップＳ８）。算出した相関値が閾値β未満の場合（ステップＳ８：Ｙｅｓ）、制御部３５は、その基準回路９１をスキップ回路として判断して、その基準回路９１を電子部品の搭載をスキップすべき回路としてＲＡＭに記憶する。そして、制御部３５は、次の回路マーク９２を認識する（ステップＳ１５、ステップＳ４：Ｙｅｓ）。ただし、基準回路９１について、全ての回路マーク９２について認識されている場合、基準回路９１の次の回路について回路マーク９２の認識を行う。
【００４１】
算出した相関値が閾値β以上の場合（ステップＳ８：Ｎｏ）、つまり、算出した相関値が閾値β以上閾値α以下である場合、制御部３５の処理はステップＳ９に移行する。ステップＳ９では、制御部３５は、停止タイミングが搭載前であるか否かを判断する。つまり、初期設定の際に（つまり、ステップＳ１）、作業者等が電子部品搭載後の停止を設定した場合、基準回路９１に対して回路マーク９２の認識にエラーがあったとしてＲＡＭに記憶する（ステップＳ１２）。そして、制御部３５は、次の回路マーク９２を認識する（ステップＳ１５、ステップＳ４：Ｙｅｓ）。ただし、基準回路９１について、全ての回路マーク９２について認識されている場合、基準回路９１の次の回路について回路マーク９２の認識を行う。
【００４２】
一方、初期設定の際に、作業者等が電子部品搭載前の停止を設定した場合、制御部３５の処理は一時停止し（ステップＳ１０）、電子部品実装装置１の動作が停止する。この際、制御部３５が表示信号を表示装置４０に出力することにより、回路に付された回路マークの形状が基準形状と異なる旨（つまり、回路マーク９２の認識にエラーがあった旨）の画面が表示装置４０に表示される。表示装置４０にエラーの旨が表示されることで、作業者等は電子部品実装装置１の停止を把握し、エラー解除を行う（ステップＳ１４）。つまり、作業者等は基準回路を見て、基準回路がスキップ回路であるか否かを検査したり、回路マーク９２が基準回路に付されているか否かを調べたりする。そして、基準回路がスキップ回路である場合（又は基準回路に回路マーク９２が正常に付されていない場合）、作業者等は、基準回路に対しての電子部品の搭載をスキップすべき旨を判断する。これにより、作業者等は判断した内容を入力装置３９を介して制御部３５へ入力し、基準回路９１に対しての電子部品の搭載をスキップすべきとしてＲＡＭに記憶する（ステップＳ１３）。これにより、電子部品実装装置１のエラー解除がなされる。一方、基準回路９１が良好な回路である場合、作業者等は、基準回路９１に対して電子部品を搭載すべき旨を判断し、判断内容を入力装置３９を介して制御部へ入力する。これにより、電子部品実装装置１のエラー解除がなされる。エラー解除後、制御部３５は、次の回路マーク９２を認識する（ステップＳ１５、ステップＳ４：Ｙｅｓ）。ただし、基準回路９１について、全ての回路マーク９２について認識されている場合、基準回路９１の次の回路について回路マーク９２の認識を行う。
【００４３】
以上のように、認識した回路マーク９２の相関値の値によって、基準回路についてＲＡＭに記憶される内容が異なる。つまり、相関値が閾値αより大きい場合には、基準回路について何もＲＡＭに記憶されない。一方、相関値が閾値β未満の場合には、基準回路に対しての電子部品の搭載をスキップすべきとしてＲＡＭに記憶される。相関値が閾値β以上閾値α以下である場合、基準回路に対して回路マークの認識にエラーがあったとしてＲＡＭに記憶される。但し、相関値が閾値β以上閾値α以下である場合、作業者等が電子部品搭載前の停止を設定していたら、「基準回路に対しての電子部品の搭載をスキップすべきとしてＲＡＭに記憶される」、又は、「基準回路について何もＲＡＭに記憶されない」の何れか一方が作業者等によって選択される。
【００４４】
基準回路について一つの回路マーク９２の認識が終了したら、制御部３５は、基準回路と同一の列の各回路の回路マーク９２を順次認識していき、各回路マーク９２について、回路マーク９２の相関値に基づいた判断及び処理記憶を行っていく（ステップＳ４〜ステップＳ１５）。
【００４５】
基準回路の全ての回路マーク９２について認識が終了したら（ステップＳ４：Ｎｏ）、制御部３５は、基準回路の次の回路についても各回路マーク９２を順次認識していき、回路マーク９２の相関値に基づいた判断及び記憶処理を行っていく（ステップＳ５〜ステップＳ１５、ステップＳ４：Ｙｅｓ）。このように、制御部３５は、各回路の認識を行うことを順次行うことによって、基板９０の全回路について、認識、判断及び記憶処理を行う（ステップＳ３〜ステップＳ１８）。
【００４６】
基板９０の全回路について、認識、判断及び記憶処理が終了した時点では、例えば図６に模式的に示されたデータがＲＡＭに記憶されている。図６に示すように、ＲＡＭに格納されるデータは、「回路の位置」の項目に対して、「回路に対しての処置」の項目が対応づけられている。「回路の位置」の項目の値としては、「（ｎ1）」、「（ｎ2）」、「（ｎ3）」等のようなものがある。「（ｎ3）」は、原点回路から右へ３番目である回路ということを意味する。「回路に対しての処置」の項目の値としては、「スキップ」、「認識エラー」、「補正用データ」がある。「スキップ」は、電子部品の搭載をスキップすることを意味し、その回路がスキップ回路であることを意味する。「認識エラー」は、回路マークの認識にエラーがあったことを意味し、その回路が不良回路であることを意味する。
【００４７】
従って、例えば、図６のデータでは、ｎ3の回路に、つまり原点回路から右へ３番目である回路に電子部品の搭載しないことを意味し、その回路はスキップ回路であり、その回路の回路マークの相関値が閾値β未満であったこととなる。一方、ｎ2の回路に、つまり原点回路から右へ２番目である回路について回路マークの認識にエラーがあったことを意味し、その回路は不良回路であり、その回路の回路マークの相関値が閾値β以上閾値α以下であったこととなる。ｎ1の回路について、つまり原点回路から右へ１番目である回路（つまり、原点回路）について回路マークが正常であったことを意味し、その回路は正常回路であり、補正用データが記憶されている。
【００４８】
基板９０の全回路について、認識、判断及び記憶処理が終了した後、制御部３５は、電子部品を各回路に順次実装するように、ＸＹ移動装置２７、真空発生装置３４（吸着ノズル２５）及びヘッド部２５を制御する（ステップＳ１９）。
【００４９】
実装の際、制御部３５は、基板の実際の位置と基準位置との誤差に基づき電子部品の実装位置を補正して、補正した実装位置に電子部品を実装するようにＸＹ移動装置２７を制御する。更に、実装の際、制御部３５は、「回路に対しての処置」の項目の値が「スキップ」又は「認識エラー」となる回路の位置を、ＲＡＭに記憶したデータから判断する。そして、制御部３５は、その位置の回路への電子部品実装をスキップするようにＸＹ移動装置２７、真空発生装置３４及びヘッド部２５を制御する。これによって、電子部品実装装置１によって種々の電子部品が基板９０に実装されるが、基板９０の不良回路及びスキップ回路には電子部品が実装されない。
【００５０】
次いで、制御部３５は、停止タイミングが搭載前であるか否かを判断する（ステップＳ２０）。つまり、初期設定の際に（つまり、ステップＳ１）、作業者等が電子部品搭載前の停止を設定した場合、一枚の基板に対しての制御部３５の処理は終了する。そして、制御部３５の処理は再びステップＳ２に戻り、電子部品実装装置１が電子部品を次の基板９０に同様に実装する。一方、初期設定の際に（つまり、ステップＳ１）、作業者等が電子部品搭載後の停止を設定した場合、制御部３５の処理はステップＳ２１に移行する。
【００５１】
ステップＳ２１では、制御部３５は、「回路に対しての処置」の項目に「認識エラー」となる回路があるか否かを、ＲＡＭに記憶したデータから判断する。ＲＡＭに記憶したデータに「認識エラー」がない場合（ステップＳ２１：Ｎｏ）、一枚の基板９０に対しての制御部３５の処理は終了する。そして、制御部３５の処理は再びステップＳ２に戻り、電子部品実装装置１が電子部品を次の基板９０に同様に実装する。
【００５２】
一方、ＲＡＭに記憶したデータに「認識エラー」がある場合（ステップＳ２１：Ｙｅｓ）、制御部３５の処理は一時停止し（ステップＳ２２）、電子部品実装装置１の動作が停止する。この際、制御部３５が表示信号を表示装置４０に出力することにより、回路に付された回路マークの形状が基準形状と異なる旨（つまり、回路マークの認識にエラーがあった旨）の画面が表示装置４０に表示される。表示装置４０にエラーの旨が表示されることで、作業者等は電子部品実装装置１の停止を把握し、エラー解除を行う（ステップＳ２３）。つまり、作業者等は認識エラーとなった各回路を見て、認識エラーとなった各回路がスキップ回路であるか否かを検査したり、認識エラーとなった各回路に回路マーク９２が付されているか否かを調べたりする。認識エラーとなった各回路のうちスキップ回路でないものがある場合（又は認識エラーとなった各回路のうち回路マーク９２が付されているものがある場合）、作業者等は、スキップ回路でない回路に対して電子部品を搭載すべき旨を入力装置３９を介して制御部３５に設定したり、不良回路に対しての電子部品の搭載をスキップすべき旨を制御部３５に設定したりする。これにより、エラー解除がなされる（ステップＳ２３）。
【００５３】
次いで、制御部３５は、認識エラーとなった回路のうちスキップ回路でない回路に電子部品を順次実装するように、ＸＹ移動装置２７、真空発生装置３４（吸着ノズル２５）及びヘッド部２５を制御する（ステップＳ２４）。そして、一枚の基板に対しての制御部３５の処理は終了して、制御部３５の処理は再びステップＳ２に戻り、電子部品実装装置１が電子部品を次の基板９０に同様に実装する。
【００５４】
以上のように、本実施の形態によれば、回路マーク９２と基準マークとの比較した結果算出された一致度（相関値）に応じて、電子部品実装装置１は、電子部品を実装すること、電子部品の実装をスキップすること及び動作を停止することを行う。つまり、各回路９１に付された回路マーク９２を認識するだけで、三つの動作が選択される。従って、本発明では、スキップ回路に対してバッドマークを付さなくても済むし、電子部品実装装置１にはスポットセンサを設けなくても済むし、更に、各回路にバッドマークが付されているか否かの認識も行わなくて済む。こうした結果、一つの基板９０に電子部品を実装するのに要する時間の短縮が図られる。
【００５５】
更に、撮像装置２８によって回路マーク９２を撮像して、回路マーク９２を認識し、認識した結果に応じて電子部品の実装のスキップをするか否かの判断がなされている。つまり、本発明では、回路マーク９２が従来のバッドマークの機能を兼ねている。撮像装置２８により、バッドマークの機能を具備する回路マーク９２を認識しているため、従来のようにスポットセンサでバッドマークを認識するより、その認識感度が非常に良い。
【００５６】
なお、本発明は、上記実施の形態に限定されることなく、本発明の趣旨を逸脱しない範囲において、種々の改良並びに設計の変更を行っても良い。
例えば、上記実施の形態では、いわゆる多面取り基板９０に電子部品を実装する場合を例に説明したが、図７のように、いわゆる一面取り基板８０が複数配列されている場合にも適用できる。この場合、いわゆる治具基板（基板トレイ）８１を用いる。治具基板８１上には、複数の収納部８２，８２，…がマトリクス状に配列されている。収納部８２内には、治具８３が設けられており、収納部８２内に収納された一面取り基板８０は治具８３によって治具基板８１に固定されている。そして、各一面取り基板８０には、一つの単位回路が構成されている。更に、各一面取り基板８０，８０，…には、多面取り基板９０の回路９１と同様に、回路マーク９２，９２が付されている。もちろん、回路マーク９２，９２が付されていない一面取り基板８０も収納部８２に収納される。符号９３，９４は、電子部品が実装されるべき位置である。このような場合、多面取り基板９０に代えて、治具基板８１が基板搬送位置決装置２２によって電子部品実装装置１内に搬送されて、多面取り基板９０の各回路９１，９１，…場合と同様に各一面取り基板８０，８０，…に対して電子部品の実装、或いは実装のスキップがなされる。
【００５７】
上記ステップＳ１０において、電子部品実装装置１の動作が停止した場合に、判定を行っているが、作業者等が電子部品実装装置１から基板９０を取り出しても良い。この場合、基板９０が取り出された後、作業者等が電子部品実装装置１（制御部３５）のエラー解除を行うことで、制御部３５は再びステップＳ１の処理から行う。
【００５８】
【発明の効果】
以上のように、本発明によれば、各回路に付されているマークの種類が一種類であっても、回路を三態様に判断しているため、各回路毎に一種類のマークの認識で済む。そして、三態様の判断の結果に基づいて基板に電子部品が実装されるため、一つの基板に電子部品を実装するのに要する時間の短縮が図られる。
また、付されているマークと基準マークとの一致レベルが第二閾値を越えている正常回路については、電子部品が実装され、一致レベルが第一閾値未満であるスキップ回路については、電子部品の実装がスキップされて電子部品が実装されない。更に、一致レベルが第一閾値以上でありかつ第二閾値以下である不良回路がある場合には、電子部品実装装置の動作が停止する。以上のように、各回路に付されているマークの種類が一種類であっても、三態様の動作、つまり、電子部品を実装すること、電子部品の実装をスキップすること及び電子部品実装装置の動作を停止することを行うことができる。従って、各回路毎に一種類のマークの認識で済むため、一つの基板に電子部品を実装するのに要する時間の短縮が図られる。
【図面の簡単な説明】
【図１】本発明の適用された電子部品実装装置が示される概略図である。
【図２】電子部品の実装される基板が示される図面である。
【図３】前記電子部品実装装置の制御系が示されるブロック図である。
【図４】相関値を求める手段を説明するための図面である。
【図５】前記電子部品実装装置の制御部の処理の流れが示されるフローチャートである。
【図６】前記制御部のＲＡＭに記憶されるデータのデータ構成が模式的に示された図面である。
【図７】電子部品の実装される治具基板が示される図面である。
【符号の説明】
１ 電子部品実装装置
２８ 撮像装置
３５ 制御部（制御装置）
３８ 認識部
３９ 入力装置
４０ 表示装置
９０ 基板
９１ 回路
９２ 回路マーク[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate on which one or a plurality of circuits are arranged, and a control device for an electronic component mounting apparatus for mounting the electronic component.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an electronic component mounting apparatus that mounts an electronic component on a substrate is known. In addition, a circuit mark for position correction is attached to each circuit on a substrate on which a plurality of circuits are arranged, which is called a so-called multi-sided substrate. On the other hand, a position correction mark called a substrate mark is attached to a substrate on which one circuit, which is called a one-sided substrate, is arranged, instead of a circuit mark.
[0003]
When the electronic component mounting apparatus mounts the electronic component on each circuit, the control device of the electronic component mounting apparatus recognizes the circuit mark of each circuit with the imaging device, and acquires the position correction data of the substrate by the recognized circuit mark. . As a result, the electronic component mounting apparatus accurately mounts the electronic component at a position to be mounted on the circuit. By the way, when the circuit mark is defective (for example, when the circuit mark is not attached, when the circuit mark is thin, when a part of the circuit mark is missing, the position of the circuit mark is shifted from the recognition range). The circuit mark is not recognized correctly, and the electronic component mounting apparatus is temporarily stopped. When the electronic component mounting apparatus is temporarily stopped, an operator or the like takes a measure such as removing the board from the electronic component mounting apparatus, and restarts the electronic component mounting apparatus so that the electronic component mounting apparatus becomes a new board. Mount electronic components.
[0004]
Also, a bad mark is attached to a defective circuit or a defective substrate among the plurality of circuits. When an electronic component mounting apparatus mounts an electronic component on a board, the control device recognizes whether or not a bad mark is attached to each circuit with a spot sensor, and thereby the electronic component mounting apparatus is attached with a bad mark. The electronic components are not mounted on the circuit or board skipped.
[0005]
[Problems to be solved by the invention]
However, conventionally, since both bad mark recognition and circuit mark recognition are performed for each circuit, it may take a long time to finish mounting electronic components on one substrate.
[0006]
Therefore, the problem to be solved by the present invention is to reduce the time required for mounting.
[0007]
[Means for Solving the Problems]
  In order to solve the above problems, the invention according to claim 1 is an electronic component mounting apparatus in which an electronic component is mounted on a substrate on which one or a plurality of circuits are arranged as shown in FIG. 1, FIG. 4, or FIG. In an electronic component mounting method for mounting with (for example, electronic component mounting apparatus 1),
  A recognition step (step S5) for recognizing a mark attached to each circuit;
  A calculation step (step S6) for calculating a matching level between the recognized mark and the reference mark for each circuit;
  Among the circuits, a circuit having a matching level equal to or higher than the first threshold and having a level higher than the first threshold and equal to or lower than the second threshold is determined as a defective circuit. A determination step (step S7, step S8) for determining a circuit exceeding two threshold values as a normal circuit and determining a circuit having a matching level less than the first threshold value as a skip circuit among the circuits;
  A mounting step (step S19) of mounting electronic components on a normal circuit among the circuits, and further skipping mounting on a skip circuit among the circuits,
  A step of stopping the operation of the electronic component mounting apparatus (for example, step S10 or step S22) when it is determined as a defective circuit;
  It is characterized by including.
[0008]
  Claim2The described invention is an electronic component mounting apparatus (for example, an electronic component mounting apparatus) for mounting an electronic component on a substrate on which one or a plurality of circuits are arranged as shown in FIG. 1, FIG. 3, FIG. 4, or FIG. 1) In a control device (for example, the control unit 35) that controls
  A recognition process (step S5) for recognizing a mark attached to each circuit;
A calculation process (step S6) for calculating a matching level between the recognized mark and the reference mark for each circuit;
  Among the circuits, a circuit having a matching level equal to or higher than the first threshold and having a level higher than the first threshold and equal to or lower than the second threshold is determined as a defective circuit. A determination process (step S7, step S8) for determining a circuit exceeding two threshold values as a normal circuit, and determining a circuit having a matching level less than the first threshold value among the circuits as a skip circuit;
  A mounting process (step S19) for controlling the electronic component mounting apparatus so as to mount an electronic component on a normal circuit among the circuits, and to skip mounting on a skip circuit among the circuits;
  A process of stopping the operation of the electronic component mounting apparatus (for example, step S10 or step S22) when it is determined as a defective circuit;
  It is characterized by performing.
[0009]
  Claim 1 or2In the described invention, even if there is only one type of mark attached to each circuit, the circuit is determined in three modes, and therefore one type of mark can be recognized for each circuit. And since an electronic component is mounted on a board | substrate based on the result of judgment of three aspects, shortening of the time required to mount an electronic component on one board | substrate is achieved.
[0012]
  In the invention according to claim 1 or 2, an electronic component is mounted on a normal circuit in which the matching level between the attached mark and the reference mark exceeds the second threshold value, and the matching level exceeds the first threshold value. For the skip circuit that is not present, the mounting of the electronic component is skipped and the electronic component is not mounted. Furthermore, the match level is the first thresholdThat's itAnd the second thresholdIsWhen there is a defective circuit, the operation of the electronic component mounting apparatus stops. As described above, even if there is only one kind of mark attached to each circuit, three modes of operation, that is, mounting electronic components, skipping mounting electronic components, and electronic component mounting apparatus Can be stopped. Therefore, since only one type of mark needs to be recognized for each circuit, the time required for mounting the electronic component on one substrate can be shortened.
  Note that the second threshold value is a threshold value that divides into a matching state in which the mark attached to the circuit and the reference mark match, and a state in which the mark attached to the circuit and the reference mark hardly match. The first threshold value is a threshold value that divides a state in which the mark attached to the circuit and the reference mark are almost inconsistent with the state in which the circuit is not marked.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples.
[0014]
FIG. 1 shows an electronic component mounting apparatus to which the present invention is applied. The electronic component mounting apparatus 1 is configured to sequentially transfer the substrates 90 to the own device and mount the electronic components on the substrate 90 transferred to the own device.
[0015]
As shown in FIG. 2, the substrate 90 is a “multiple substrate”. In the multi-sided board, a plurality of unit circuits are configured for one board. Each circuit on one multi-sided board has a similar circuit configuration. For the sake of convenience, the following description will be given with the transport direction as the left-right direction (or the X direction).
[0016]
A total of six circuits 91, 91,... Are arranged in a matrix on the multi-sided substrate in three rows in the left-right direction and two rows in the front-rear direction. Each circuit 91, 91,... Is provided with the same pattern of printed wiring. A circuit mark 92 may be attached to the left front corner and the right rear corner on each circuit 91, 91,. The circuit mark 92 is used for correcting the mounting position of the electronic component when the electronic component is mounted by the electronic component mounting apparatus 1.
[0017]
Reference numerals 93 and 94 represent positions where electronic components are to be mounted. That is, when the circuit marks 92, 92 attached to the board 90 conveyed to the electronic component mounting apparatus 1 match the reference mark set in the electronic component mounting apparatus 1, the electronic component mounting apparatus 1 selects the electronic component. The operation of mounting on the substrate is performed, and the electronic components are mounted at the positions 93 and 94 to be mounted. In addition, mounting of electronic components is skipped for the circuit 91 without the circuit marks 92, 92.
[0018]
Note that the substrate 90 is not limited to the one in which the circuits are arranged in two rows and three columns as shown in FIG. 2, and may be one that is freely arranged on the substrate as long as the circuits are the same. Here, “row” is the number of circuits in the front-rear direction, and “column” is the number of circuits in the left-right direction.
[0019]
As shown in FIG. 1, the electronic component mounting apparatus 1 includes a base 21, a board transport positioning apparatus 22 that is provided on the base 21 and transports the board 90 in the left-right direction to position the board 90. The feeder 23 (only one is shown in the figure. Each feeder 23 contains a plurality of electronic components) can be mounted, and the feeder 23 supplies the electronic components from the feeder 23. The suction nozzle 25 that sucks the supplied electronic component and releases the suction on the substrate 90 to mount the electronic component on the substrate 90, and the head portion that is provided with the suction nozzle 25 and moves the suction nozzle 25 up and down. 26, an XY moving device 27 that horizontally moves the head unit 26 between the positioned substrate 90 and the supply device 24, and a vacuum generator that generates a vacuum for the suction nozzle 25 Includes 4 (shown in FIG. 3), and a control unit 35 for controlling the whole electronic component mounting apparatus 1.
[0020]
The XY moving device 27 includes two support beams 30 and 30, a beam 31, an X-axis motor 32, and a Y-axis motor 33. The two support beams 30 and 30 are provided on the table 21 so as to be substantially perpendicular to the transport direction of the substrate transport position determining device 22 and straddle the substrate transport position determining device 22. The beam 31 is bridged between the two support beams 30 and 30 so as to be movable in the front-rear direction. A head portion 26 is attached to the beam 31, and the head portion 26 is movable in the left-right direction with respect to the beam 31. The X-axis motor 32 drives the head unit 26 left and right via a timing belt or the like. The Y-axis motor 33 moves the head portion 26 back and forth by driving the beam 31 back and forth via a timing belt or the like.
[0021]
The head unit 26 includes an imaging device 28, a component recognition unit 29, a Z-axis motor 36 (shown in FIG. 3), a θ-axis motor 37 (shown in FIG. 3), and a recognition unit 38 (shown in FIG. 3). Yes. The imaging device 28 images the circuit mark 92 of the substrate 90 that has been transported. The recognition unit 38 performs feature extraction processing (for example, edge detection processing for detecting the outline of the circuit mark 92 that is an object in the image, and collectively reading out pixels when the imaging device 28 images the circuit mark 92. The circuit mark 92 is recognized by a variable resolution process, a process for extracting the circuit mark 92 as an object from the image, a random access process for detecting only an arbitrary part in the image, and the like. The component recognition unit 29 includes a light projecting unit, a light receiving unit, and the like, and recognizes an electronic component sucked by the suction nozzle 25 and detects its posture. The Z-axis motor 36 is a drive source for driving the suction nozzle 25 up and down. The θ-axis motor 37 serves as a drive source for rotating the suction nozzle 25 about the θ-axis (vertical axis) of the head unit 26.
[0022]
The control unit 35 serving as a control device is a CPU that performs various arithmetic processes, a ROM that stores a control program for causing the CPU to perform a given calculation and a given process, and a work area for the CPU. An arithmetic processing unit having a RAM and a system bus connecting them is a basic configuration. As shown in FIG. 3, the vacuum generator 34, the X-axis motor 32, the Y-axis motor 33, the Z-axis motor 36, the θ-axis motor 37, the component recognition unit 29, and the recognition unit 38 input / output signals to / from the control unit 35. It is connected to the control unit 35 so as to be possible.
[0023]
An input device 39 such as a keyboard, mouse, or other controller is connected to the control unit 35 so as to be able to input and output signals. The input device 39 detects that the input device 39 itself has been operated and outputs a message to that effect to the control unit 35. Thereby, the operator or the like can input various data to the control unit 35 by operating the input device 39.
[0024]
A display device 40 is connected to the control unit 35 so as to be able to input and output signals. When the control unit 35 outputs a signal to the display device 40 according to the control program, the display device 40 displays a given screen.
[0025]
The control program includes various production programs (mainly, reference mounting position data relating to the reference mounting position where each electronic component is mounted on the board) corresponding to each type of board. By processing according to the production program, the control unit 35 can output a signal to the vacuum generator 34, the X-axis motor 32, the Y-axis motor 33, the Z-axis motor 36, or the θ-axis motor 37 at a given timing. . Accordingly, the head unit 26 (that is, the Z-axis motor 36 and the θ-axis motor 37), the XY moving device 27 (that is, the X-axis motor 32 and the Y-axis motor 33), or the vacuum generator 34 is placed on the substrate 90. An operation for mounting an electronic component at a given position can be performed. Since the mounting operation of the electronic component mounting apparatus 1 by the production program is well known, detailed description is omitted.
[0026]
Further, the control program includes a main program. The main program causes the control unit 35 to perform processing for accurately mounting electronic components when the control unit 35 controls the entire electronic component mounting apparatus 1 mainly according to the production program. . Specifically, the processing of the control unit 35 according to the main program includes processing for recognizing the circuit mark 92 using the recognition unit 38, and the actual position of the substrate 90 and the reference position from the recognized position of the circuit mark 92. A process of calculating an error (for example, an error in the X direction (left and right direction) and an error in the Y direction (front and rear direction)), a process of calculating the degree of coincidence of the reference mark with respect to the reference shape for the recognized shape of the circuit mark 92 There is a process of calculating an attitude error between the attitude of the electronic component sucked by the suction nozzle 25 and the reference attitude based on a signal from the component recognition unit 29. By the processing according to the main program, the control unit 35 can recognize the error between the actual position of the substrate 90 that has been transported and the reference position, or mount electronic components based on the error between the actual position and the reference position. Correct the position (that is, shift the mounting position from the reference mounting position by the amount of error), recognize the posture error between the posture of the electronic component sucked by the suction nozzle 25 and the reference posture, By controlling to rotate, the posture of the electronic component sucked by the suction nozzle 25 can be corrected to the reference posture.
[0027]
By correcting the mounting position, the mounting position of each electronic component mounted by the production program is shifted from the reference mounting position by an error. That is, by correcting the mounting position, the electronic component mounting apparatus 1 mounts the electronic components at the positions 93 and 94 to be mounted even when the conveyed board is displaced from the reference position.
[0028]
The degree of coincidence will be described with reference to FIG. FIG. 4A is an image of the circuit mark 92 recognized by the control unit 35. FIG. 4B is an image of the reference mark stored in the control unit 35. 4A and 4B, one square cell is one pixel, a black pixel corresponds to the circuit mark 92 or the reference mark, and a white pixel is the circuit mark 92 or Around the fiducial mark. As described above, the control unit 35 recognizes the circuit mark 92 using the recognition unit 38 as shown in FIG. Now, the control unit 35 calculates a correlation value as a degree of coincidence by comparing the image in FIG. 4A and the image in FIG. That is, the control unit 35 calculates the following from the density (so-called gradation value) of each pixel in FIG. 4A and the density (gradation value) of the pixel in FIG. The correlation value can be calculated using an equation.
[0029]
[Expression 1]

[0030]
Where x_ijIs the density of each pixel in the image of the reference mark, and x_avIs the average pixel density of the reference mark. y_ijIs the density of each pixel of the recognized circuit mark 92, y_avIs the average pixel density of the recognized circuit mark 92. γ is a correlation value, and can take a value of 0 or more and 1 or less.
[0031]
As a process of the control unit 35 in accordance with the main program, whether each circuit 91, 91,... Has a circuit mark 92 or a circuit mark 92 but is different from the reference shape, Alternatively, there is a process of determining whether the circuit mark 92 is attached. Such a determination is made based on the calculated correlation value. Here, when the correlation value is 1, the recognized circuit mark 92 and the reference shape completely match. As the correlation value approaches zero, the degree of difference increases with the recognized circuit mark 92 and the reference shape.
[0032]
When the correlation value is larger than a given threshold value (second threshold value) α (0 <α <1), the control unit 35 determines that the circuit mark 92 is attached to the circuit 91, and the circuit 91 is a normal circuit. To be judged. If the correlation value is smaller than a given threshold value (first threshold value) β (0 <β <α <1), the control unit 35 determines that the circuit mark 92 is not attached to the circuit 91, and the circuit 91 is skipped. It is determined as a circuit. Further, when the correlation value is greater than or equal to the threshold value β and less than or equal to the threshold value α, the circuit mark 92 is attached to the circuit 91, but the control unit 35 determines that the circuit mark 92 is different from the reference shape. Is determined to be a defective circuit.
[0033]
In other words, the threshold value α is a threshold value that divides the circuit mark 92 into a state in which the shape of the circuit mark 92 and the reference shape are almost the same and a state in which the shape of the circuit mark 92 and the reference shape are the same. The threshold value β is a threshold value that divides a state in which the circuit mark 92 is not attached and a state in which the shape of the circuit mark 92 and the reference shape hardly coincide with each other. The control unit 35 can determine the state of each circuit mark 92 by comparing the correlation value of each circuit mark 92 with the threshold values α and β.
[0034]
Next, the flow of processing of the control unit 35 according to the control program, the operation of the electronic component mounting apparatus 1, and the mounting method for mounting the electronic component by the electronic component mounting apparatus 1 will be described. FIG. 5 is a flowchart showing the flow of processing of the control unit 35.
[0035]
First, when set by an operator or the like (step S1), the process of the control unit 35 proceeds to step S2. In step S <b> 1, an operator or the like can input data to the electronic component mounting apparatus 1 by operating the input device 39. The setting contents include a threshold value α, a threshold value β, a circuit number N (serial number, the number of unit circuits per substrate), and a circuit mark number M (the number of circuit marks per circuit). .
As other teaching contents, there is a timing when the electronic component mounting apparatus 1 stops when the circuit mark 92 attached to the circuit 91 is different from the reference shape. Teaching can be performed before the electronic component mounting apparatus 1 mounts the electronic component (when the circuit mark 92 of the circuit 91 is recognized) or after the electronic component mounting apparatus 1 mounts the electronic component (only a normal substrate). )
[0036]
When an operator or the like determines the threshold value α, threshold value β, circuit number N, circuit mark number M, and stop timing, the operator inputs the determined content to the input device 39, and the control unit 35 stores the input content. (Step S1: Yes). Next, the control unit 35 controls the substrate transport position determining device 22 so that the substrate transport position determining device 22 transports and positions the substrate 90 in the electronic component mounting apparatus 1. In the following description, it is assumed that the transported substrate 90 has a plurality of N circuits 91, 91,. That is, the substrate 90 is a multi-sided substrate having N circuits.
[0037]
The control unit 35 recognizes the circuit mark 92 by the imaging device 28 and the recognition unit 38 for each circuit 91, 91,. At this time, in FIG. 2, first, recognition is performed sequentially from the rightmost rear circuit 91 (hereinafter referred to as a reference circuit), and finally, the uppermost circuit 91 (hereinafter referred to as an origin circuit). The circuit mark 92 is recognized. That is, first, the control unit 35 controls the XY moving device 27 to move the head unit 26 onto the reference circuit, and recognizes a circuit mark 92 (which may not be attached) for the reference circuit (which may not be attached). Step S5). After the controller 35 recognizes all the circuit marks 92 on the reference circuit 91 (step S4: No), if the recognition of the circuit marks 92 is all normal (that is, all the determinations in step S7 are Yes. Steps S6 and S6). The control unit 35 calculates an error between the position of the reference circuit 91 and the reference position based on the recognized position of the circuit mark 92 and stores the calculated error data together with the circuit number (step S7 will be described later). Step S16).
[0038]
In step S <b> 6, the control unit 35 calculates a correlation value for the shape of one recognized circuit mark 92. However, when the circuit mark 92 is not attached to the reference circuit, the circuit mark 92 is not recognized, so the control unit 35 calculates the correlation value as an extremely low value.
[0039]
In step S7, the control unit 35 determines whether or not the calculated correlation value is greater than the threshold value α. When the calculated correlation value is larger than the threshold value α (step S7: Yes), the control unit 35 recognizes the circuit mark 92 next to the reference circuit 91 (step S15, step S4: Yes). Steps S4, S5, S6, S7, and S15 are repeated to recognize all the circuit marks 92 of the reference circuit 91, and all the correlation values for all the circuit marks 92 of the reference circuit 91 as described above. Is larger than the threshold value α, the control unit 35 determines that the reference circuit 91 is a normal circuit, and stores the error data calculated together with the circuit number (step S16). And the control part 35 recognizes the circuit mark 92 about the circuit following the reference | standard circuit 91 (step S17, step S18, step S3: Yes, step S4: Yes).
[0040]
  When the calculated correlation value is equal to or smaller than the threshold value α (step S7: No), the control unit 35 determines that the calculated correlation value is equal to the threshold value β.Less thanWhether or not (step S8). The calculated correlation value is the threshold βLess thanIn the case (step S8: Yes), the control unit 35 determines that the reference circuit 91 is a skip circuit, and stores the reference circuit 91 in the RAM as a circuit to which electronic components are to be skipped. Then, the control unit 35 recognizes the next circuit mark 92 (step S15, step S4: Yes). However, when all the circuit marks 92 are recognized for the reference circuit 91, the circuit mark 92 is recognized for the circuit next to the reference circuit 91.
[0041]
  When the calculated correlation value is greater than or equal to the threshold value β (step S8:No), That is, when the calculated correlation value is not less than the threshold value β and not more than the threshold value α, the process of the control unit 35 proceeds to step S9. In step S9, the control unit 35 determines whether or not the stop timing is before mounting. That is, at the time of initial setting (that is, step S1), when an operator or the like sets a stop after mounting an electronic component, the reference circuit 91 is stored in the RAM as having an error in recognizing the circuit mark 92. (Step S12). Then, the control unit 35 recognizes the next circuit mark 92 (step S15, step S4: Yes). However, when all the circuit marks 92 are recognized for the reference circuit 91, the circuit mark 92 is recognized for the circuit next to the reference circuit 91.
[0042]
On the other hand, when the operator or the like sets a stop before mounting the electronic component during the initial setting, the process of the control unit 35 is temporarily stopped (step S10), and the operation of the electronic component mounting apparatus 1 is stopped. At this time, the control unit 35 outputs a display signal to the display device 40 to indicate that the shape of the circuit mark attached to the circuit is different from the reference shape (that is, there is an error in the recognition of the circuit mark 92). A screen is displayed on the display device 40. When an error message is displayed on the display device 40, the operator or the like grasps the stop of the electronic component mounting apparatus 1 and cancels the error (step S14). That is, the operator looks at the reference circuit to check whether the reference circuit is a skip circuit or to check whether the circuit mark 92 is attached to the reference circuit. When the reference circuit is a skip circuit (or when the circuit mark 92 is not properly attached to the reference circuit), the operator determines that mounting of electronic components on the reference circuit should be skipped. To do. As a result, the operator or the like inputs the determined content to the control unit 35 via the input device 39, and stores it in the RAM as the mounting of the electronic component on the reference circuit 91 should be skipped (step S13). Thereby, error cancellation of the electronic component mounting apparatus 1 is performed. On the other hand, when the reference circuit 91 is a good circuit, the operator or the like determines that an electronic component should be mounted on the reference circuit 91 and inputs the determination content to the control unit via the input device 39. Thereby, error cancellation of the electronic component mounting apparatus 1 is performed. After canceling the error, the control unit 35 recognizes the next circuit mark 92 (step S15, step S4: Yes). However, when all the circuit marks 92 are recognized for the reference circuit 91, the circuit mark 92 is recognized for the circuit next to the reference circuit 91.
[0043]
  As described above, the content stored in the RAM for the reference circuit differs depending on the recognized correlation value of the circuit mark 92. That is, if the correlation value is greater than the threshold value α, nothing is stored in the RAM for the reference circuit. On the other hand, the correlation value is the threshold βLess thanIn this case, the electronic component is stored in the RAM as skipping the mounting of the electronic component on the reference circuit. When the correlation value is not less than the threshold value β and not more than the threshold value α, it is stored in the RAM as an error in recognition of the circuit mark with respect to the reference circuit. However, if the correlation value is greater than or equal to the threshold β and less than or equal to the threshold α, if an operator or the like has set a stop before mounting the electronic component, “store in the RAM that electronic component mounting on the reference circuit should be skipped. "Either" or "Nothing is stored in the RAM for the reference circuit" is selected by the operator or the like.
[0044]
When the recognition of one circuit mark 92 for the reference circuit is completed, the control unit 35 sequentially recognizes the circuit mark 92 of each circuit in the same column as the reference circuit, and the correlation of the circuit mark 92 for each circuit mark 92. Determination based on the value and processing storage are performed (steps S4 to S15).
[0045]
When the recognition is completed for all the circuit marks 92 of the reference circuit (step S4: No), the control unit 35 sequentially recognizes each circuit mark 92 for the next circuit of the reference circuit, and the correlation value of the circuit mark 92. Judgment and storage processing based on the above are performed (step S5 to step S15, step S4: Yes). As described above, the control unit 35 performs recognition, determination, and storage processing for all the circuits on the substrate 90 by sequentially performing recognition of each circuit (step S3 to step S18).
[0046]
For example, the data schematically shown in FIG. 6 is stored in the RAM when the recognition, determination, and storage processes are completed for all the circuits on the substrate 90. As shown in FIG. 6, in the data stored in the RAM, the item “treatment for the circuit” is associated with the item “circuit position”. The value of the item of “circuit position” includes “(n1)”, “(n2)”, “(n3)”, and the like. “(N3)” means a circuit that is third from the origin circuit to the right. The value of the item “treatment for circuit” includes “skip”, “recognition error”, and “correction data”. “Skip” means that mounting of an electronic component is skipped, and that the circuit is a skip circuit. “Recognition error” means that there is an error in the recognition of the circuit mark, and that the circuit is a defective circuit.
[0047]
  Therefore, for example, in the data of FIG. 6, this means that no electronic component is mounted on the circuit n3, that is, the third circuit to the right from the origin circuit, and the circuit is a skip circuit, and the circuit mark of the circuit Is the threshold value βWas less thanIt will be. On the other hand, this means that there is an error in the recognition of the circuit mark for the circuit of n2, that is, the second circuit to the right from the origin circuit. The circuit is a defective circuit, and the correlation value of the circuit mark of that circuit is That is, the threshold value β is equal to or greater than the threshold value α. This means that the circuit mark is normal for the n1 circuit, that is, the circuit that is the first to the right from the origin circuit (that is, the origin circuit), the circuit is a normal circuit, and correction data is stored. Yes.
[0048]
After the recognition, determination, and storage processing is completed for all the circuits on the substrate 90, the control unit 35 includes the XY moving device 27, the vacuum generating device 34 (the suction nozzle 25), and the electronic component so that the electronic components are sequentially mounted on each circuit. The head unit 25 is controlled (step S19).
[0049]
At the time of mounting, the control unit 35 corrects the mounting position of the electronic component based on the error between the actual position of the substrate and the reference position, and controls the XY moving device 27 so that the electronic component is mounted at the corrected mounting position. To do. Further, at the time of mounting, the control unit 35 determines, from the data stored in the RAM, the position of the circuit where the value of the item “treatment for circuit” is “skip” or “recognition error”. Then, the control unit 35 controls the XY moving device 27, the vacuum generating device 34, and the head unit 25 so as to skip the electronic component mounting on the circuit at the position. As a result, various electronic components are mounted on the substrate 90 by the electronic component mounting apparatus 1, but the electronic components are not mounted on the defective circuit and the skip circuit of the substrate 90.
[0050]
Next, the control unit 35 determines whether or not the stop timing is before mounting (step S20). That is, at the time of initial setting (that is, step S1), when an operator or the like sets a stop before mounting an electronic component, the processing of the control unit 35 for one board is ended. Then, the process of the control unit 35 returns to step S2 again, and the electronic component mounting apparatus 1 mounts the electronic component on the next board 90 in the same manner. On the other hand, in the case of the initial setting (that is, step S1), when the operator or the like sets the stop after mounting the electronic component, the process of the control unit 35 proceeds to step S21.
[0051]
In step S <b> 21, the control unit 35 determines whether or not there is a circuit that becomes “recognition error” in the item “treatment for circuit” from the data stored in the RAM. If there is no “recognition error” in the data stored in the RAM (step S21: No), the processing of the control unit 35 for one substrate 90 is completed. Then, the process of the control unit 35 returns to step S2 again, and the electronic component mounting apparatus 1 mounts the electronic component on the next board 90 in the same manner.
[0052]
On the other hand, when there is a “recognition error” in the data stored in the RAM (step S21: Yes), the process of the control unit 35 is temporarily stopped (step S22), and the operation of the electronic component mounting apparatus 1 is stopped. At this time, the control unit 35 outputs a display signal to the display device 40, thereby indicating that the shape of the circuit mark attached to the circuit is different from the reference shape (that is, there is an error in recognition of the circuit mark). Is displayed on the display device 40. When an error message is displayed on the display device 40, the operator or the like grasps that the electronic component mounting apparatus 1 is stopped and cancels the error (step S23). In other words, an operator, etc., looks at each circuit that has caused a recognition error to check whether each circuit that has caused a recognition error is a skip circuit, or a circuit mark 92 is attached to each circuit that has caused a recognition error. Check whether it is done or not. When there is a circuit that is not a skip circuit among the circuits that are recognized errors (or when there is a circuit that is marked with the circuit mark 92 among the circuits that are recognized errors), the operator or the like On the other hand, it is set in the control unit 35 via the input device 39 that electronic components should be mounted, or the control unit 35 is set such that mounting electronic components on defective circuits should be skipped. Thereby, the error is canceled (step S23).
[0053]
Next, the control unit 35 controls the XY moving device 27, the vacuum generation device 34 (suction nozzle 25), and the head unit 25 so that electronic components are sequentially mounted on a circuit that is not a skip circuit among the circuits that have caused recognition errors. (Step S24). And the process of the control part 35 with respect to one board | substrate is complete | finished, the process of the control part 35 returns to step S2 again, and the electronic component mounting apparatus 1 mounts an electronic component on the next board | substrate 90 similarly. .
[0054]
As described above, according to the present embodiment, the electronic component mounting apparatus 1 mounts an electronic component according to the degree of coincidence (correlation value) calculated as a result of comparison between the circuit mark 92 and the reference mark. The electronic component mounting is skipped and the operation is stopped. That is, only by recognizing the circuit mark 92 attached to each circuit 91, three operations are selected. Therefore, in the present invention, it is not necessary to attach a bad mark to the skip circuit, the electronic component mounting apparatus 1 need not be provided with a spot sensor, and each circuit is provided with a bad mark. There is no need to recognize whether or not it exists. As a result, the time required for mounting electronic components on one substrate 90 can be shortened.
[0055]
Further, the circuit mark 92 is imaged by the imaging device 28, the circuit mark 92 is recognized, and a determination is made as to whether or not to skip mounting of the electronic component according to the recognized result. That is, in the present invention, the circuit mark 92 also functions as a conventional bad mark. Since the imaging device 28 recognizes the circuit mark 92 having a bad mark function, the recognition sensitivity is much better than the conventional method of recognizing a bad mark with a spot sensor.
[0056]
The present invention is not limited to the above embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the case where electronic components are mounted on the so-called multi-sided substrate 90 has been described as an example. However, the present invention can also be applied to a case where a plurality of so-called single-sided substrates 80 are arranged as shown in FIG. In this case, a so-called jig substrate (substrate tray) 81 is used. On the jig substrate 81, a plurality of storage portions 82, 82,... Are arranged in a matrix. A jig 83 is provided in the storage portion 82, and the one-sided substrate 80 stored in the storage portion 82 is fixed to the jig substrate 81 by the jig 83. Each single-sided substrate 80 is configured with one unit circuit. Further, each single-sided board 80, 80,. Of course, the single-sided board 80 to which the circuit marks 92 and 92 are not attached is also stored in the storage portion 82. Reference numerals 93 and 94 are positions where electronic components are to be mounted. In such a case, the jig substrate 81 is transferred into the electronic component mounting apparatus 1 by the substrate transfer positioning device 22 instead of the multi-sided substrate 90, and each circuit 91, 91,. Similarly, electronic components are mounted on each single-sided board 80, 80,... Or mounting is skipped.
[0057]
In step S <b> 10, the determination is performed when the operation of the electronic component mounting apparatus 1 stops. However, an operator or the like may take out the substrate 90 from the electronic component mounting apparatus 1. In this case, after the substrate 90 is taken out, the operator or the like cancels the error of the electronic component mounting apparatus 1 (control unit 35), so that the control unit 35 performs the process from step S1 again.
[0058]
【The invention's effect】
  As described above, according to the present invention, even if there is only one type of mark attached to each circuit, the circuit is determined in three modes, so that one type of mark is recognized for each circuit. Just do it. And since an electronic component is mounted on a board | substrate based on the result of judgment of three aspects, shortening of the time required to mount an electronic component on one board | substrate is achieved.
  For a normal circuit in which the matching level between the attached mark and the reference mark exceeds the second threshold, an electronic component is mounted and the matching level is the first threshold.Is less thanWith respect to the skip circuit, the mounting of the electronic component is skipped and the electronic component is not mounted. Furthermore, the match level is the first thresholdThat's itAnd the second thresholdIsWhen there is a defective circuit, the operation of the electronic component mounting apparatus stops. As described above, even if there is only one kind of mark attached to each circuit, three modes of operation, that is, mounting electronic components, skipping mounting electronic components, and electronic component mounting apparatus Can be stopped. Therefore, since only one type of mark needs to be recognized for each circuit, the time required for mounting the electronic component on one substrate can be shortened.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an electronic component mounting apparatus to which the present invention is applied.
FIG. 2 is a view showing a substrate on which electronic components are mounted.
FIG. 3 is a block diagram showing a control system of the electronic component mounting apparatus.
FIG. 4 is a diagram for explaining a means for obtaining a correlation value.
FIG. 5 is a flowchart showing a processing flow of a control unit of the electronic component mounting apparatus.
FIG. 6 is a diagram schematically illustrating a data configuration of data stored in a RAM of the control unit.
FIG. 7 is a drawing showing a jig substrate on which electronic components are mounted.
[Explanation of symbols]
1 Electronic component mounting equipment
28 Imaging device
35 Control unit (control device)
38 recognition unit
39 Input device
40 Display device
90 substrates
91 circuit
92 Circuit mark

Claims (2)

In an electronic component mounting method for mounting an electronic component on an electronic component mounting apparatus on a substrate on which one or more circuits are arranged,
A recognition step for recognizing the mark attached to each circuit;
A calculation step of calculating a matching level between the recognized mark and the reference mark for each circuit;
Among the circuits, a circuit having a matching level equal to or higher than a first threshold and having a level higher than the first threshold and equal to or lower than a second threshold is determined as a defective circuit. A determination step of determining a circuit exceeding two threshold values as a normal circuit, and determining a circuit having a matching level less than the first threshold value as a skip circuit among the circuits,
A mounting step of mounting electronic components on a normal circuit among the circuits, and skipping mounting on a skip circuit among the circuits,
A step of stopping the operation of the electronic component mounting apparatus when it is determined as a defective circuit;
An electronic component mounting method comprising: In a control device for controlling an electronic component mounting apparatus for mounting an electronic component on a substrate on which one or a plurality of circuits are arranged,
A recognition process for recognizing the mark attached to each circuit;
A calculation process for calculating a matching level between the recognized mark and the reference mark for each circuit;
Among the circuits, a circuit having a matching level equal to or higher than a first threshold and having a level higher than the first threshold and equal to or lower than a second threshold is determined as a defective circuit. A determination process for determining a circuit exceeding two threshold values as a normal circuit, and determining a circuit having a matching level less than the first threshold value as a skip circuit among the circuits,
A mounting process for controlling the electronic component mounting apparatus so as to mount an electronic component on a normal circuit among the circuits, and to skip mounting on a skip circuit among the circuits,
When it is determined as a defective circuit, a process of stopping the operation of the electronic component mounting apparatus;
The control apparatus of the electronic component mounting apparatus characterized by performing this.

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