JP3434004B2 - Component recognition device and component mounting device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognizing device for recognizing the position of a component such as an electronic component or the like on the basis of capturing an image of the component, and a component which is transported by a transport head and mounted. The present invention relates to a component mounting device that is mounted on an object.

[0002]

2. Description of the Related Art In recent years, electronic parts such as ICs (QFP
In a component mounting apparatus that automatically mounts (components) on a board or the like, a component recognition device that recognizes the position of an electronic component based on image data of the electronic component may be incorporated in order to improve mounting accuracy. Has been done. Conventionally, as a component recognition device of this type, there has been one using a two-dimensional area sensor such as a CCD camera.

As an example of the component recognizing device, as shown in FIG. 8, the component 2 sucked by the suction nozzle 1 provided on the transfer head is stopped above the CCD camera 3,
There is a configuration in which the illumination device 4 illuminates light from above and the CCD camera 3 captures an image of the component 2 from below. The image at this time is, for example, as shown in FIG. 9, and the image B of the component 2 is photographed with respect to the visual field A of the CCD camera 3 (in the figure, the black level portion is shown by hatching). . Then, the center position of the component 2 is detected from this image data, and then the mounting work of the component 2 is performed based on the detected center position.

[0004]

However, in the above-mentioned prior art, the component 2 (transfer head) must be temporarily stopped above the CCD camera 3 in order to capture an image of the component 2, so that the component 2 must be stopped. There is a problem that the time required for transfer becomes long and the tact time becomes long. In particular, in recent years, the size of the component 2 tends to increase and the number of pins increases. Therefore, in a two-dimensional area sensor such as the CCD camera 3, generally, the number of pixels is about 512 pixels vertically and horizontally, and the pixels are arranged in one direction. Since the number is not so large, the detection accuracy is not so good that the component 2 is out of the field of view of the CCD camera 3 and the necessary resolution cannot be ensured.

The applicant of the present invention employs a line sensor having a number of pixels in one direction of several thousand or more in place of the two-dimensional area sensor such as the CCD camera 3 so that the component 2
During the transfer of the component 2 in the Y-axis direction (see FIG. 9), an elongated image of the component 2 in the X-axis direction is captured by a constant trigger in the Y-axis direction, and the suction position of the component 2 is detected from the image data. As a result, we are developing a product that shortens the moving time of the component 2. However, with this device, the number of pixels is large, the amount of data is large, and there is a situation in which image processing takes time.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a component recognition apparatus capable of recognizing the position of a component in a short time and with high accuracy. Further, it is a secondary object to provide a component mounting apparatus capable of recognizing the position of a component in a short time and with high accuracy, and improving the mounting precision and shortening the tact time.

[0007]

The present invention according to claim 1 is a device for recognizing the position of a component acquired and transferred by a transfer head during the transfer, wherein A recognition mark that is fixedly provided near the acquisition position of the component and has a pattern in which bright portions and dark portions are alternately arranged, and extends in a direction orthogonal to the arrangement direction of the pattern of the recognition marks. A line sensor that takes in the image of the component and the recognition mark, and the recognition timing of the component based on the image data of the recognition mark obtained by the line sensor, and the component and the recognition obtained by the line sensor A recognition means for recognizing the position of the component based on the recognition mark based on the image data of the mark is provided.

[0008]

According to a second aspect of the present invention, the transfer head for acquiring the component is moved while moving between the component supply unit for supplying the component and the component mounting unit for disposing the mounting object. A component recognizing device according to claim 1, wherein the component recognizing device recognizes the position of the component with respect to the transfer head in the middle of the transfer head moving from the component supply part to the component mounting part in a component mounting device for mounting work. And a mounting position control means for controlling the mounting position of the component based on the recognition.

[0010]

According to the present invention, the image of the component acquired by the transfer head is captured by the line sensor during the transfer. The position of the component with respect to the transfer head is recognized by the recognition means based on the image data of the component and the recognition mark obtained by the line sensor. At this time, the recognition mark fixedly provided on the transfer head. The image of the component is captured at the component recognition timing obtained based on the detection value of the pattern in which the bright and dark portions are alternately arranged.

[0011]

[0012]

[0013]

[0014]

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a component mounting apparatus in which electronic components such as ICs (QFP components) are automatically mounted on a substrate will be described below with reference to FIGS. 1 to 6. To do. First, although not shown, the schematic configuration of the component mounting apparatus according to the present embodiment will be described.

This component mounting apparatus is broadly divided into a substrate, a substrate transfer mechanism for loading and unloading a substrate, which is an object to be mounted, to a mounting work position, and a component 11 (see FIGS. 1, 2, 5, etc.). And a component mounting mechanism for supplying the component 11 to the board, and a microcomputer for controlling each mechanism based on a mounting program, mounting data, and the like. And the like.

Among them, the substrate transfer mechanism is constituted by a belt conveyor mechanism along a transfer path extending in the left-right direction (X-axis direction) on the base, whereby the substrate is moved from the carry-in position to the transfer position. It is carried to a board backup unit as a component mounting unit provided at an intermediate portion of the carrying path, and is carried out from the board backup unit to a carry-out position after the component mounting work. On the other hand, the component supply mechanism is
For example, a component supply device such as a plurality of component supply units having different component types, for example, a tape feeder is removably provided on mounting bases provided on both front and rear sides of the transport path.

The component mounting mechanism is based on a transfer head as a component transfer means having a suction nozzle 12 (only a part of which is shown in FIG. 1 and the like) at the tip, and the transfer head based on a unique XY coordinate system. It is composed of a well-known XY transfer mechanism or the like that moves it to an arbitrary position. The transfer head can move the suction nozzle 12 up and down freely. Thus, the transfer head acquires the predetermined component 11 of the component supply mechanism by suction, conveys it to the substrate on the substrate backup unit, and mounts it on the predetermined mounting position of the substrate is repeatedly executed. It is like this. As will be described later in detail, the transfer head (suction nozzle 12) is provided with a reflection plate 13 and a recognition mark 14 that function as a part of the component recognition device.

Now, in the component mounting apparatus configured as described above, the image of the component 11 is taken in during transfer of the component 11 in the Y-axis direction by the transfer head. A component recognition device 15 for detecting the center position (suction position of the suction nozzle 12) is incorporated. Hereinafter, the component recognition device 15 according to the present embodiment will be described.

The component recognition device 15 includes a line sensor 16 as an image pickup means, a light source 17 attached to the line sensor 16, a reflection plate 13 and a recognition mark 14 provided on the transfer head side, and an image processing device as a recognition means. It is composed of 18 and the like. Of these, as shown in FIGS. 1 and 2, the reflection plate 13 has a rectangular plate shape that is sufficiently larger than the component 11, and the suction nozzle 12 is inserted through the central portion of the transfer head. Is fixed as. At the time of transferring the component 11, the reflection plate 13 serves as a suction nozzle 1.
It is designed to be located in the middle of 2 (above the component 11).

The line sensor 16 is located at a predetermined component recognition position between the board backup unit and the component supply mechanism, and is fixedly provided upward on the base of the component mounting apparatus. The transfer head is the component 1 of the component supply unit.
It is configured to move in the Y-axis direction above the line sensor 16 in the course of acquiring 1 and transferring it to the substrate (component mounting portion). An elongated image V (see FIG. 2) extending transversely in the axial direction is captured by a constant trigger in the Y-axis direction.

At this time, the light source 17 illuminates upward, and the line sensor 16 is operated by the reflector 1
The light reflected from the plate surface of No. 3 is detected, and the field of view at that time is substantially long in the lateral direction (X-axis direction) of the reflecting plate 13, as shown in FIG. ing.

Then, as shown in FIGS. 1 and 2, a recognition mark 14 is attached to the reflection plate 13. The recognition mark 14 is formed on the left side portion of the reflection plate 13 in FIG.
It is provided so as to extend fully in the axial direction, and in this case, as shown in FIG.
As shown in FIG. 3, the checkered pattern is arranged in two rows. As a result, the recognition mark 14 has stripes having light portions 14a and dark portions 14b alternately arranged in the transfer direction (Y-axis direction) in two rows with the positions of the light portions 14a and the dark portions 14b being shifted. It is provided in the state of having. Further, as shown in FIG.
Is provided so as to hang downward from the reflection plate 13 so that the height becomes substantially the same as the lower surface of the component 11 when the component 11 is transferred.

The image processing device 18 is composed of a microcomputer or the like, and based on the image data from the line sensor 16, the component 1 is based on the recognition mark 14.
Position 1 (suction position of component 11 by suction nozzle 12)
Functioning as a recognition means for recognizing, but at this time, as will be described later in the description of the operation, the hardware and software configurations thereof are configured to realize the respective functions as shown in FIG. .

That is, the image processing device 18 includes an A / D converter 19 for converting the image signal from the line sensor 16 into 8-bit grayscale data, and an AG of the digital image data.
C and a correction processing unit 20 that performs shading correction processing,
A line buffer 2 for storing the corrected image data
1. An edge detection unit 22 that detects the image of the recognition mark 14 from the image data, an image memory 23 in which the image data of the component 11 is developed, a component recognition unit 24 that detects the position of the component 11 from the image data, a control and C to execute processing
The PU 25, the timing controller 26 that controls the image capture timing of the line sensor 16, and the component data storage unit 2 in which data such as the size of the component 11 is stored in advance.
7. Matching circuit 2 for density conversion and matching
8. A correction data calculation unit 29 that calculates and transmits the correction data of the deviation amount of the component 11 is configured.

Next, the operation of the above configuration will be described. When performing the component mounting operation on the substrate set in the component mounting unit, the transfer head sucks and acquires the predetermined component 11 from the predetermined tape feeder of the component supply unit by the suction nozzle 12. At this time, the mounting data and the like are set such that the suction nozzle 12 has sucked the center O of the component 11 (shown by a chain double-dashed line in FIG. 2). However, in reality, when the component 11 is sucked, as shown in FIG. 2, a slight deviation (ΔX, ΔY) occurs between the center of the suction nozzle 12 and the center O of the component 11.

Next, the transfer head transfers the component 11 toward the substrate of the component mounting portion. During the transfer, the component 11, the suction nozzle 12 and the reflection plate 13 are provided.
And the recognition mark 14 (these are collectively referred to as recognition targets)
However, as a unit, it moves above the line sensor 16 (a component recognition position) in the Y-axis direction. The line sensor 16 is adapted to capture the elongated image V (see FIG. 2) of the recognition target, which extends in the X-axis direction, at a constant trigger in the Y-axis direction. FIG. 5 shows a model of how the recognition target passes over the line sensor 16 in order.
(A), (b), and (c).

In FIG. 5A, the recognition target is the line sensor 1.
6 shows a state when entering the visual field of No. 6, and at this time, the image captured by the line sensor 16 still shows the component 1
Since 1 is not shown, the image data is as shown in FIG. Here, the dark portion 14 of the recognition mark 14
A region M having a low lightness level is generated corresponding to b. However, the data at this time is the image data which is A / D converted from the image signal from the line sensor 16, is subjected to AGC and shading correction processing, and is transferred to the line buffer 21. At this point, the data is stored in the image memory 23. Is not expanded.

In FIG. 5B, the component 11 is the line sensor 1.
6A and 6B, the region M corresponding to the dark portion 14b of the recognition mark 14 and the region W corresponding to the component 11 have low brightness levels, as shown in FIG. 6B. The image data appears as a region.

When the component 11 passes the visual field of the line sensor 16 as shown in FIG. 5C, a region M corresponding to the dark portion 14b of the recognition mark 14 is obtained as shown in FIG. 6C.
Is image data that appears as a region of low brightness level. At this time, the positions where the region M appears differ due to the dark portions 14b that are alternately positioned on the right and left sides of the recognition mark 14, and the change in the region M can be recognized as a pulse.

In the present embodiment, the image processing device 18 predicts the position where the component 11 appears in the visual field of the line sensor 16 from the data of the size of the component 11 given in advance, and the pulse number at that position is predicted. Is calculated in advance, and the parts are recognized according to the calculated value. In the example shown in FIG. 2, when the recognition mark 14 appears in the field of view and then P pulses pass, the component 11 appears over the Q pulse,
After that, it can be predicted that only the recognition mark 14 appears only for the R pulse.

Here, when a wide range of image data is expanded in the image memory 23, the number of days increases correspondingly and the processing takes time. In the present embodiment, when the position of the component 11 approaches after the recognition mark 14 appears in the field of view, the data is first developed in the image memory 23 and the component 11 is read.
When is out of the visual field, the expansion to the image memory 23 is completed. As a result, the image processing can be performed only at the position where the component 11 appears, and the time required for the image processing can be shortened. Moreover, the position of the component 11 can be recognized without the need for a synchronization signal from the outside.

Then, the recognition of the position of the part is performed by the recognition mark 1
It is carried out based on 4. In this case as well, the position of the recognition mark 14 in the X-axis direction, the relationship between the number of pulses and the Y-axis direction position, and the position of the suction nozzle 12 with respect to the recognition mark 14 are known in advance. The position of can be accurately recognized. As a result, the shift amounts ΔX and ΔY in the X-axis and Y-axis directions with respect to the regular suction position of the component 11 sucked by the suction nozzle 12 are calculated.

Thereafter, the transfer head stops above the component mounting point on the substrate, and descends from that point to pick up the suction nozzle 12.
The component 11 is mounted on the board by releasing the suction of. At this time, the component 11 is mounted by the image processing apparatus 1
Since it is performed while correcting the displacement amounts ΔX and ΔY of the suction position detected by 8, the highly accurate component mounting work is executed.

As described above, according to the present embodiment, by using the line sensor 16 as the image pickup means, unlike the conventional CCD camera 3, the component 11 is used.
The position of the component 11 can be recognized with high accuracy even if there are circumstances such as an increase in the size and the increase in the number of pins. Since the stripe-shaped recognition mark 14 is provided, even if the line sensor 16 is used, the time required for image processing can be shortened, so that the position of the component 11 can be recognized in a short time. As a result, the tact time of component mounting work can be shortened.

FIG. 7 shows another embodiment of the present invention.
The difference from the above embodiment is the configuration of the recognition mark 31. Although the recognition mark 31 is provided on the left side portion of the reflection plate 13 extending in the Y-axis direction, it is alternately formed by forming the dark portion 31a in a so-called comb-shaped pattern. It has a stripe shape having a bright portion 31b and a dark portion 31a. Even with this configuration, it is possible to obtain the same operational effects as those of the above embodiment.

In addition, the present invention is not limited to the above-described embodiments. For example, the recognition marks are not limited to those of the above-mentioned two embodiments, and various kinds of marks can be used as long as they have a discontinuous shape in the transfer direction. Can be modified, and the invention can be applied to not only the component recognizing device incorporated in the component mounting device but also all devices for recognizing components, and various modifications can be made without departing from the scope of the invention. It is a thing.

[0038]

According to the present invention, parts can be recognized in a short time and with high accuracy.

[0039]

[0040]

[0041]

[0042]

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention and is a front view of a main part.

FIG. 2 is a bottom view of a suction nozzle portion in a state where components are suctioned.

FIG. 3 is a functional block diagram showing a configuration of an image processing apparatus.

FIG. 4 is a front view of a main part showing a field of view of a CCD camera.

FIG. 5 is a side view sequentially showing how the recognition target passes over the line sensor.

FIG. 6 is a diagram showing image data corresponding to FIG.

FIG. 7 is a view corresponding to FIG. 2 showing another embodiment of the present invention.

FIG. 8 is a front view of a main part when an image is captured showing a conventional example.

FIG. 9 is a diagram showing a photographed image.

[Explanation of symbols]

In the drawing, 11 is a component, 12 is a suction nozzle, 13 is a reflector, 14 and 31 are recognition marks, 14a and 31b are bright parts,
Reference numerals 14b and 31a denote dark areas, 15 a component recognition device, 16 a line sensor (imaging means), 17 a light source, and 18 an image processing device.

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H05K 13/04 H05K 13/08

Claims (2)

(57) [Claims] 1. A device for recognizing the position of a component acquired and transferred by a transfer head during the transfer, the device being fixedly provided on the transfer head in the vicinity of the acquisition position of the component. Mark having a pattern in which dark portions and dark portions are alternately arranged, and a line sensor extending in a direction orthogonal to the pattern arranging direction of the recognition mark and capturing images of the component and the recognition mark And the recognition timing of the component is obtained based on the image data of the recognition mark obtained by the line sensor, and the recognition mark is used as a reference based on the image data of the component and the recognition mark obtained by the line sensor. A component recognition device comprising: a recognition unit that recognizes the position of the component. 2. A component mounting apparatus for mounting a component while moving a transfer head for acquiring the component between a component supply unit for supplying the component and a component mounting unit for disposing a mounting object. The component recognition apparatus according to claim 1, wherein the position of the component with respect to the transfer head is recognized on the way of the transfer head from the component supply unit to the component mounting unit, and the component based on the recognition of the component recognition device. And a mounting position control means for controlling the mounting position of the electronic component mounting apparatus.