CN107832514A - A kind of detection method and device of Surface Mount pad - Google Patents
A kind of detection method and device of Surface Mount pad Download PDFInfo
- Publication number
- CN107832514A CN107832514A CN201711056884.2A CN201711056884A CN107832514A CN 107832514 A CN107832514 A CN 107832514A CN 201711056884 A CN201711056884 A CN 201711056884A CN 107832514 A CN107832514 A CN 107832514A
- Authority
- CN
- China
- Prior art keywords
- surface mount
- mount pad
- width value
- detection method
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/06—Structured ASICs
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of detection method of Surface Mount pad, comprises the following steps：The first width value, the second width value of the line being connected with the Surface Mount pad of Surface Mount pad are obtained from the design document of printed circuit board (PCB)；When it is determined that the second width value and the first width value do not meet preparatory condition, the Surface Mount pad can't pass detection.The detection method can all detect to all Surface Mount pads, and so as to the position of fast positioning to problem, can greatly be shortened modification time with automatic running, improved operating efficiency, and avoid the risk of failure welding, lift production yield.
Description
Technical field
The present invention relates to printed-board technology field, more particularly to a kind of detection method and device of Surface Mount pad.
Background technology
Generally, PCB（Printed Circuit Board, printed circuit board (PCB)）Can be provided with plate pad with for connecting
The line of multiple pads, wherein pad are possible to as Surface Mount pad.In welding electronic component, in order to prevent radiating too fast,
Scolding tin cooling is too fast, causes rosin joint；And also to prevent that solder mask precision is inadequate, scolding tin is caused to flow, it is possible to increasing
Add the risk of short circuit；The width of Surface Mount pad is just needed to be more than the width of the line communicated therewith.Therefore, in the design of pcb board
Stage, therefore, to assure that the width of all Surface Mount pads is both greater than the width of the line communicated therewith（For example, as shown in figure 1, first
The width of line 11 is less than the width of the first Surface Mount pad 12, then meets the requirements；And the width of the second line 21 is then more than second
The width of Surface Mount pad 22, it is undesirable）, it is typically to be examined by designer by artificial mode in the prior art
Survey, because the quantity of Surface Mount pad is typically bigger, occurs it is therefore possible to the situation for causing missing inspection and efficiency is also low.
Therefore, design is a kind of in the pcb board design phase, efficiently can comprehensively detect the width between Surface Mount pad and line
Degree whether satisfactory method, just turn into a urgent problem to be solved.
The content of the invention
The mesh of the present invention is to provide a kind of detection method and device of Surface Mount pad.
In order to realize the foregoing invention first purpose, an embodiment of the present invention provides a kind of detection side of Surface Mount pad
Method, comprise the following steps：The first width value of Surface Mount pad is obtained from the design document of printed circuit board (PCB), is welded with the Surface Mount
Second width value of the line that disk is connected；It is described when it is determined that the second width value and the first width value do not meet preparatory condition
Surface Mount pad can't pass detection.
As the further improvement of an embodiment of the present invention, the detection method of the Surface Mount pad also includes following step
Suddenly：When the Surface Mount pad can't pass detection, the attribute information of the Surface Mount pad and line is shown.
As the further improvement of an embodiment of the present invention, the second width value of the determination and the first width value are not met
Preparatory condition, including：When the second width value is more than or equal to the first width value, preparatory condition is not met.
As the further improvement of an embodiment of the present invention, the second width value of the determination and the first width value are not met
Preparatory condition, including：When the second width value is more than or equal to the half of the first width value, preparatory condition is not met.
As the further improvement of an embodiment of the present invention, the second width value of the determination and the first width value are not met
Preparatory condition, including：When the second width value is more than or equal to 0.4 millimeter or more than or equal to preset value, preparatory condition is not met.
As the further improvement of an embodiment of the present invention, second width value, including：In the line with institute
State the width value for the straightway that Surface Mount pad is connected.
As the further improvement of an embodiment of the present invention, second width value, including：In the line with institute
Surface Mount pad is stated to be connected the width value at place.
As the further improvement of an embodiment of the present invention, Surface Mount is obtained in the design document from printed circuit board (PCB)
The width value of pad, including：The width of Surface Mount pad is obtained in the Gerber files generated from Cadence Allegro softwares
Value.
As the further improvement of an embodiment of the present invention, the Surface Mount pad, it is specially：Positioned at the printed circuit
The top surface of plate or the Surface Mount pad of bottom surface.
An embodiment of the present invention additionally provides a kind of detection means of Surface Mount pad, including with lower module：Acquisition module,
For the first width value that Surface Mount pad is obtained from the design document of printed circuit board (PCB), the company being connected with the Surface Mount pad
Second width value of line；Processing module, it is described for when it is determined that the second width value and the first width value do not meet preparatory condition
Surface Mount pad can't pass detection.
Relative to prior art, the technical effects of the invention are that：The Surface Mount pad that the embodiment of the present invention is provided is somebody's turn to do
Detection method can all detect to all Surface Mount pads, and can be with automatic running, so as to the position of fast positioning to problem
Put, greatly shorten modification time, improve operating efficiency, and avoid the risk of failure welding, lift production yield.
Brief description of the drawings
Fig. 1 is the structural representation of the part comprising patch pad and line in PCB；
Fig. 2 is the schematic flow sheet of the detection method for the Surface Mount pad that the embodiment of the present invention one is provided；
Fig. 3 is the structural representation of the detection means for the Surface Mount pad that the embodiment of the present invention two is provided；
Fig. 4 is the testing process schematic diagram of the detection means for the Surface Mount pad that the embodiment of the present invention three is provided.
Embodiment
Below with reference to each embodiment shown in the drawings, the present invention will be described in detail.But these embodiments are not
The limitation present invention, structure that one of ordinary skill in the art is made according to these embodiments, method or change functionally
Change and be all contained in protection scope of the present invention.
The embodiments of the invention provide a kind of detection method of Surface Mount pad, as shown in Fig. 2 comprising the following steps：
Step 201：From the design document of printed circuit board (PCB) obtain Surface Mount pad the first width value, with the Surface Mount pad phase
Second width value of the line of connection；
Here, the Surface Mount pad can be positioned at top surface（That is TOP faces）Or bottom surface（That is Bottom faces）.When line starting point or
When terminal is identical with the coordinate of the Surface Mount pad, then the line connects with the Surface Mount pad.
In practice, the manufacturing process of printed circuit board (PCB) is usually：Design circuit theory diagramsAccording to the electric circuit diagram design
Go out the design document of pcb boardDesign document is submitted into factory, factory produces qualified pcb board according to the design document,
So pcb board is just produced and finished, and welds corresponding electronic component on the pcb board afterwards, so as to obtain having default work(
The electronic product of energy.For example, when carrying out Design PCB plate using Cadence Allegro softwares, resulting design document is
Gerber files, the Gerber files include the number of plies of pcb board, top surface（That is TOP faces）, bottom surface（That is Bottom faces）And PCB
The installation scenarios in plate intermediate layer, the positions and dimensions of some Surface Mount pads etc., the letter such as position, trend and size of different lines
Breath.
In practice, line may be what multiple straightways was formed by connecting, because welding is only concerned pad locations, therefore
Only check the width for a straightway for being directly connected to the Surface Mount pad.And generally Surface Mount pad has well-regulated shape（For example,
Circular, square, oval, rectangle or octagon etc.）, such as：（1）When Surface Mount pad is circular, the width of the Surface Mount pad
Value can be the circular diameter；（2）When Surface Mount pad is square, the width value of the Surface Mount pad can be the side of party's shape
It is long；（3）When Surface Mount pad is oval, the width value of the Surface Mount pad can be the oval short axle；（4）When Surface Mount welds
When disk is rectangle, the width value of the Surface Mount pad can be the length perpendicular to the side of the line；（5）When Surface Mount pad is eight sides
During shape, the width value of the Surface Mount pad can be the farthest value that the octagonal edge be taken up an official post between 1 point.And Surface Mount pad
For irregular shape when, the width value of the Surface Mount pad can be understood as：Between any two points at the edge in the shape
Line then meets the maximum of all distance between two points of this condition, can be the shape if normal to the line
Width value.
Step 202：When it is determined that the second width value and the first width value do not meet preparatory condition, the Surface Mount pad is logical not
Cross detection.Here it is possible to preparatory condition is preset, for example, the second width value is less than first width value etc..
Here, Surface Mount pad can be any one in all Surface Mount pads in the design document, so as to can
The detection method is carried out to all Surface Mount pads.In actual applications, the inspection can be realized using a computer program
Survey method, for example, the detection method can be realized based on the SKILL platforms of Cadence Allegro softwares, so as to certainly
It is dynamic to perform the detection method, it is possible to the position of fast positioning to problem, greatly shorten modification time, improve operating efficiency, and
The risk of failure welding is avoided, lifts production yield.
Preferably, the detection method is further comprising the steps of：When the Surface Mount pad can't pass detection, described in displaying
The attribute information of Surface Mount pad and line.Here it is possible to the attribute information of the Surface Mount pad and line is shown using display screen（Example
Such as, the Surface Mount pad and line not by detection can be set to specific color, so as to remind user；It can also shield
An error listing is shown with a window on curtain, if Surface Mount pad can't pass detection, by the Surface Mount pad and line
Attribute information is shown in the error listing）, can also be printed by printer；Attribute information includes：The width of Surface Mount pad
Angle value, position, affiliated device position number and numbering etc., and the width value of line, position and numbering etc.；The Surface Mount is shown to user
The attribute information of pad and line, then user's can know that the width value of which Surface Mount pad and line does not meet default bar
Part, so as to timely handle the problem（Adjust the width value of the Surface Mount pad and line）, so as to keep away
The bad risk of no-welding, lift production yield.
Preferably, the second width value of the determination and the first width value do not meet preparatory condition, including：In the second width value
During more than or equal to the first width value, preparatory condition is not met.If the width value of line is more than or equal to the width value of Surface Mount pad
When, easily in welding, radiating is too fast, and scolding tin cooling is too fast, causes rosin joint；Scolding tin flowing, increase short circuit are will also result in simultaneously
Risk.Preferably, the second width value of the determination and the first width value do not meet preparatory condition, including：In the second width value
More than or equal to the first width value half when, do not meet preparatory condition.If the width value of line is more than or equal to Surface Mount pad
During the half of width value, easily in welding, radiating is too fast, and scolding tin cooling is too fast, causes rosin joint；It will also result in scolding tin stream simultaneously
It is dynamic, increase the risk of short circuit.Here, under some occasions limited by factors such as charge capacity, manufacturing limits, the width of line
Angle value can suitably widen, but cannot be more than the first width value.
Preferably, the second width value of the determination and the first width value do not meet preparatory condition, including：In the second width value
During more than or equal to 0.4 millimeter or more than or equal to preset value, preparatory condition is not met.If the width value of line is more than or equal to 0.4
Millimeter or during more than or equal to preset value, easily in welding, radiating is too fast, and scolding tin cooling is too fast, causes rosin joint；It can also make simultaneously
Flowed into scolding tin, increase the risk of short circuit.
Preferably, second width value, including：The straightway being connected with the Surface Mount pad in the line
Width value.In practice, line may be formed by connecting by multiple straightways, and the width of these straightways is possible to different,
It is thereby possible to select the width value of the straightway directly connected with the Surface Mount pad is the second width value.When rising for straightway
When point or terminal are identical with the coordinate of the Surface Mount pad, then it is considered that the straightway connects with the Surface Mount pad.
Preferably, second width value, including：The width at the place that is connected with the Surface Mount pad in the line
Value.
Preferably, the width value of Surface Mount pad is obtained in the design document from printed circuit board (PCB), including：From
The width value of Surface Mount pad is obtained in the Gerber files that Cadence Allegro softwares are generated.
Preferably, the Surface Mount pad, it is specially：Positioned at the top surface of the printed circuit board (PCB) or the Surface Mount pad of bottom surface.
Optionally, the Surface Mount pad, it is specially：It is positioned at the top surface of the printed circuit board (PCB) or the type of bottom surface
REGULAR PAD and shape are not empty Surface Mount pad.
The embodiment of the present invention two provides a kind of detection means of Surface Mount pad, including with lower module：
Acquisition module 1, for the first width value that Surface Mount pad is obtained from the design document of printed circuit board (PCB) and the Surface Mount
Second width value of the line that pad is connected；
Processing module 2, for when it is determined that the second width value and the first width value do not meet preparatory condition, the Surface Mount pad to lead to
But detect.
The embodiment of the present invention three provides a kind of detection means of Surface Mount pad, and the device is a software module, and this is soft
Part module is obtained from carrying out secondary development based on the SKILL platforms in Cadence Allegro softwares, as shown in figure 4, should
The step of detection means detects to Surface Mount pad includes：
Step 401：The design document of the printed circuit board (PCB) is read, because the design document is to have the binary system of set form literary
Part, therefore, all pads and its attribute information can be therefrom read out, that is, read out all pads, and generate a pad row
Table；
Step 402：A pad not detected is read from pad list, here, it is necessary to be carried out to the pad crossed after testing
Mark, so as to be detected to each pad；Here, if all pads in the pad list are all detected
Cross, then the detection method terminates operation.
Step 403：Judge whether the welding is Surface Mount pad, if it is, performing step 404, otherwise, perform step
402；
Step 404：Obtain the line being connected with this Surface Mount pad；
Step 405：The width value of the Surface Mount pad is obtained, such as：（1）When Surface Mount pad is circular, the width of the Surface Mount pad
Angle value can be the circular diameter；（2）When Surface Mount pad is square, the width value of the Surface Mount pad can be party's shape
The length of side；（3）When Surface Mount pad is oval, the width value of the Surface Mount pad can be the oval short axle；（4）Work as Surface Mount
When pad is rectangle, the width value of the Surface Mount pad can be the length perpendicular to the side of the line；（5）When Surface Mount pad is eight
During the shape of side, the width value of the Surface Mount pad can be the farthest value that the octagonal edge be taken up an official post between 1 point.And Surface Mount welds
When disk is irregular shape, the width value of the Surface Mount pad can be understood as：Between any two points at the edge in the shape
Line if normal to the line, then meet the maximum of all distance between two points of this condition, can be the shape
Width value；Here, can also be using the direction of line as laterally, the direction perpendicular to line is vertical, the then horizontal stroke of Surface Mount pad
To with vertical size, a less width is pad width；
Step 406：The line is divided into multiple straightways, then can be next to spliting by the plurality of straightway, so as to can
Obtain the straightway list for including the plurality of straightway composition；
Step 407：A straightway not detected is obtained from the straightway list, it is necessary to enter to the straightway crossed after testing
Line flag, if all line segments in the list have all been crossed after testing, operating procedure 402；
Step 408：Judge whether the straightway not detected directly connects with Surface Mount pad, if the starting point of the straightway or end
Point is identical with the coordinate of the Surface Mount pad, then the straightway is connected with Surface Mount pad；When the straightway and the Surface Mount pad phase
During connection, step 409 is performed, otherwise performs step 407；
Step 409：Judge that the width of straightway meets preparatory condition with the width of Surface Mount pad；The preparatory condition can be should
The width of straightway is less than the width of Surface Mount pad；If met, step 402 is performed, otherwise performs step 410；
Step 410：Show the Surface Mount pad and the attribute information of line（Such as the aspect of the straightway, pad width, pad
Device position number described in position, pad and pad numbering etc.）, so as to which user is it is known that the width of the Surface Mount pad and line goes out
Problem is showed, can timely have been adjusted；After the step has been performed, step 402 is performed.In this step, may be used also
To count the quantity of Surface Mount pad, so as to allow user to obtain the quantity for the Surface Mount pad for not meeting preparatory condition in real time.
It should be appreciated that although the present specification is described in terms of embodiments, not each embodiment only includes one
Individual independent technical scheme, this narrating mode of specification is only that those skilled in the art will should say for clarity
For bright book as an entirety, the technical scheme in each embodiment may also be suitably combined to form those skilled in the art can
With the other embodiment of understanding.
Those listed above is a series of to be described in detail only for feasibility embodiment of the invention specifically
Bright, they simultaneously are not used to limit the scope of the invention, all equivalent implementations made without departing from skill spirit of the present invention
Or change should be included in the scope of the protection.
Claims (10)
1. a kind of detection method of Surface Mount pad, it is characterised in that comprise the following steps：
The first width value of Surface Mount pad, the company being connected with the Surface Mount pad are obtained from the design document of printed circuit board (PCB)
Second width value of line；
When it is determined that the second width value and the first width value do not meet preparatory condition, the Surface Mount pad can't pass detection.
2. the detection method of Surface Mount pad according to claim 1, it is characterised in that further comprising the steps of：
When the Surface Mount pad can't pass detection, the attribute information of the Surface Mount pad and line is shown.
3. the detection method of Surface Mount pad according to claim 1, it is characterised in that the second width value of the determination and the
One width value does not meet preparatory condition, including：
When the second width value is more than or equal to the first width value, preparatory condition is not met.
4. the detection method of Surface Mount pad according to claim 1, it is characterised in that the second width value of the determination and the
One width value does not meet preparatory condition, including：
When the second width value is more than or equal to the half of the first width value, preparatory condition is not met.
5. the detection method of Surface Mount pad according to claim 1, it is characterised in that the second width value of the determination and the
One width value does not meet preparatory condition, including：
When the second width value is more than or equal to 0.4 millimeter or more than or equal to preset value, preparatory condition is not met.
6. the detection method of Surface Mount pad according to claim 1, it is characterised in that second width value, including：Institute
State the width value of the straightway being connected with the Surface Mount pad in line.
7. the detection method of Surface Mount pad according to claim 1, it is characterised in that second width value, including：Institute
State the width value at the place that is connected with the Surface Mount pad in line.
8. the detection method of Surface Mount pad according to claim 1, it is characterised in that the design from printed circuit board (PCB)
The width value of Surface Mount pad is obtained in file, including：
The width value of Surface Mount pad is obtained in the Gerber files generated from Cadence Allegro softwares.
9. the detection method of Surface Mount pad according to claim 1, it is characterised in that the Surface Mount pad, be specially：Position
In the top surface of the printed circuit board (PCB) or the Surface Mount pad of bottom surface.
10. a kind of detection means of Surface Mount pad, it is characterised in that including with lower module：
Acquisition module, for the first width value that Surface Mount pad is obtained from the design document of printed circuit board (PCB) and the Surface Mount
Second width value of the line that pad is connected；
Processing module, for when it is determined that the second width value and the first width value do not meet preparatory condition, the Surface Mount pad to lead to
But detect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711056884.2A CN107832514A (en) | 2017-10-27 | 2017-10-27 | A kind of detection method and device of Surface Mount pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711056884.2A CN107832514A (en) | 2017-10-27 | 2017-10-27 | A kind of detection method and device of Surface Mount pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107832514A true CN107832514A (en) | 2018-03-23 |
Family
ID=61650395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711056884.2A Withdrawn CN107832514A (en) | 2017-10-27 | 2017-10-27 | A kind of detection method and device of Surface Mount pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107832514A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108681646A (en) * | 2018-05-23 | 2018-10-19 | 郑州云海信息技术有限公司 | In a kind of inspection PCB design in pad short broken line method and device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI230348B (en) * | 2003-12-23 | 2005-04-01 | Inventec Corp | Method for preventing short circuit during circuit layout |
| US7361988B2 (en) * | 2003-12-17 | 2008-04-22 | Intel Corporation | Apparatuses and methods to route line to line |
| CN201491379U (en) * | 2009-07-29 | 2010-05-26 | 中兴通讯股份有限公司 | Printed circuit board comprising LCD bonding pads |
| CN102479274A (en) * | 2010-11-30 | 2012-05-30 | 英业达股份有限公司 | Method for setting routing line width of printed circuit board |
| CN105934083A (en) * | 2016-05-23 | 2016-09-07 | 努比亚技术有限公司 | PCB bonding pad and welding method |
| CN206164967U (en) * | 2016-10-13 | 2017-05-10 | 广州视源电子科技股份有限公司 | Packaging structure of PCB board |
-
2017
- 2017-10-27 CN CN201711056884.2A patent/CN107832514A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7361988B2 (en) * | 2003-12-17 | 2008-04-22 | Intel Corporation | Apparatuses and methods to route line to line |
| TWI230348B (en) * | 2003-12-23 | 2005-04-01 | Inventec Corp | Method for preventing short circuit during circuit layout |
| CN201491379U (en) * | 2009-07-29 | 2010-05-26 | 中兴通讯股份有限公司 | Printed circuit board comprising LCD bonding pads |
| CN102479274A (en) * | 2010-11-30 | 2012-05-30 | 英业达股份有限公司 | Method for setting routing line width of printed circuit board |
| CN105934083A (en) * | 2016-05-23 | 2016-09-07 | 努比亚技术有限公司 | PCB bonding pad and welding method |
| CN206164967U (en) * | 2016-10-13 | 2017-05-10 | 广州视源电子科技股份有限公司 | Packaging structure of PCB board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108681646A (en) * | 2018-05-23 | 2018-10-19 | 郑州云海信息技术有限公司 | In a kind of inspection PCB design in pad short broken line method and device |
| CN108681646B (en) * | 2018-05-23 | 2022-02-18 | 郑州云海信息技术有限公司 | Method and device for checking short broken line in bonding pad in PCB design |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1115093C (en) | Method for determining operation accuracy of circuit assembling and machine using said method | |
| CN107087388A (en) | Base board checking device system and substrate inspecting method | |
| CN103687315B (en) | Designing method of punching alignment target | |
| CN105466951A (en) | Automatic optical detection apparatus and detection method thereof | |
| CN104535587A (en) | PCBA solder joint inspection method based on machine vision | |
| WO2016006076A1 (en) | Method for producing component placement coordinates and device for producing component placement coordinates | |
| US20140326486A1 (en) | Printed circuit board | |
| CN110164789A (en) | Crystal round test approach and wafer tester | |
| CN102256442B (en) | Welding pad structure for ball grid array packaging chip and multilayer printed circuit board for mobile phone | |
| CN103517575A (en) | Method for transplant grafting of printed circuit board | |
| CN107832514A (en) | A kind of detection method and device of Surface Mount pad | |
| CN101742899A (en) | Component installation device and component installation method | |
| CN103796417A (en) | Circuit board and manufacture method thereof | |
| CN202873193U (en) | Technological edge of PCB board and PCB jointed board | |
| CN104470248A (en) | Steel mesh optimizing method | |
| CN114880853B (en) | Method and system for determining thickness of steel mesh in tin brushing process | |
| CN104765931A (en) | PCB design method and system | |
| CN205912323U (en) | Printed circuit board | |
| CN108377326A (en) | A kind of camera module and electronic equipment | |
| CN104582307A (en) | Device packaging method and system | |
| CN201563294U (en) | Welding structure of circuit board | |
| JP2010147322A (en) | Method of creating 3d mounting data of component mounting machine | |
| CN110188463B (en) | Sawtooth smoothing method of via hole array | |
| CN206517662U (en) | Edges of boards wad cutter error-proof structure | |
| CN208462128U (en) | A kind of pcb board convenient for pressing harmomegathus identification |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180323 |
|
| WW01 | Invention patent application withdrawn after publication |