CN105934083A - PCB bonding pad and welding method - Google Patents
PCB bonding pad and welding method Download PDFInfo
- Publication number
- CN105934083A CN105934083A CN201610346352.1A CN201610346352A CN105934083A CN 105934083 A CN105934083 A CN 105934083A CN 201610346352 A CN201610346352 A CN 201610346352A CN 105934083 A CN105934083 A CN 105934083A
- Authority
- CN
- China
- Prior art keywords
- welding
- cross
- sectional area
- electronic component
- pcb pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
Abstract
The embodiment of the invention discloses a PCB (Printed Circuit Board) bonding pad and a welding method. The PCB bonding pad comprises a circuit board, and welding bodies located on the circuit board and used for welding electronic elements. Each electronic element comprises a welding foot welded to each welding body; the cross section areas of at least a portion of the welding bodies are greater than the cross section areas of the welding feet. The cross section area of each welding body is greater than the cross section areas of each welding foot. Relative to the fact that the cross section area of each welding body is equal to the cross section area of each welding foot in the prior art, the cross section area of the bonding pad is enlarged. Therefore, if tiny welding offset or tiny offset of the welding body occurs, a poor welding phenomenon in which the welding feet have no contact with the welding bodies cannot be resulted; the welding quality of the PCB is improved; and the PCB bonding pad and the welding method are particularly suitable for all kinds of electronic elements with welding feet small in cross section area.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of printed circuit board (PCB) (Print Circuit Board,
PCB) pad and welding method.
Background technology
Along with the development of electronic technology, occurring in that PCB, generally connecting on pcb board has various electronics
Element, such as, the electronic equipment such as inductance, electric capacity, integrated chip, transformator.Lead in the prior art
Weld on PCB pad frequently with surface mounting technology (Surface Mount Technology, SMT)
Connect various electronic component, form the PCB welded.Described PCB pad is not yet to weld electronic component,
But it is provided with the PCB motherboard of connection line.At described PCB pad at the corresponding electronic component of welding
It is both provided with pad；Variously-shaped welding body, such as, solder sphere it is provided with on described pad,
The materials such as the stable scolding tin electrically connected are formed etc. the various legs with electronic component；The pin of electronic component is just
It is welded on these pads.The generally bonding area of pad is consistent with the area of leg.But it is as
The development of electronic technology, occurs in that the electronic component that a lot of leg is the least, in practice it has proved that welding these yuan
During part, it will usually various failure welding problem occurs, causes the quality problem of PCB cisco unity malfunction.
Summary of the invention
In view of this, embodiment of the present invention expectation provides a kind of PCB pad and welding method, promotes welding product
Matter.
For reaching above-mentioned purpose, the technical scheme is that and be achieved in that:
Embodiment of the present invention first aspect provides a kind of printing board PCB pad, including:
Wiring board；
It is positioned on described wiring board the welding body for welding electronic component；Described electronic component includes with described
The leg of welding body welding；
Wherein, the cross-sectional area of at least part of described welding body is more than the cross-sectional area of described leg.
Based on such scheme, the Distances Between Neighboring Edge Points of adjacent two described welding bodies, less than phase on described electronic component
Distances Between Neighboring Edge Points between adjacent two legs.
Based on such scheme, described electronic component includes first kind element；The leg of described first kind element
Cross-sectional area is less than preset area；
For welding the cross-sectional area of the welding body of described first kind element, more than the weldering of described first kind element
The cross-sectional area of foot.
Based on such scheme, described first kind element includes the tuning capacity of specified type.
Based on such scheme, described preset area is the circle of a length of 0.16mm of diameter, or the length of side is 0.16mm
Rectangle.
Based on such scheme, described welding body is solder sphere, oval ball, cuboid or cube.
Based on such scheme, the cross-sectional area of described welding body the first length in a first direction, it is less than
The second length in second direction；Wherein, first direction is perpendicular to described second direction；
The line of adjacent two the described legs of same described electronic component is oriented parallel to described first direction.
Embodiment of the present invention second aspect provides a kind of welding method, including:
Select as above the most described printing board PCB pad；
On described PCB pad, carry out the welding of electronic component.
Based on such scheme, the printing board PCB pad that described selection is as above the most described, including:
Judge the cross-sectional area whether including leg in the electronic component to be welded electronics unit less than predetermined area
Part；
If element to be welded includes the cross-sectional area electronic component less than predetermined area of leg, in selection
The most described PCB pad.
Based on such scheme, described judge whether electronic component to be welded including, the cross-sectional area of leg is little
In the electronic component of predetermined area, including:
Judge whether electronic component to be welded includes the tuning capacity of specified type.
PCB pad and welding method described in the embodiment of the present invention, at least part of on the wiring board of PCB pad
The cross-sectional area of welding body is more than the cross-sectional area of described leg.I.e. weld the cross-sectional area of body more than leg
Cross-sectional area, is equal to the cross-sectional area of leg, is equivalent to relative to the cross-sectional area welding body in prior art
Increase bonding area；So, if small welding skew or the minor shifts of welding body occur, all without
The bad welding causing leg not contact with welding body manifests, and improves the welding quality of PCB, especially suitable
In the electronic component that various leg cross-sectional areas are the least.On the other hand, it is also possible to reduce PCB pad and make
Technique degree of accuracy and the precise requirements of welding.
Accompanying drawing explanation
The structural representation of a kind of PCB pad that Fig. 1 provides for the embodiment of the present invention；
The comparison schematic diagram of a kind of cross-sectional area welding body and leg that Fig. 2 provides for the embodiment of the present invention；
Fig. 3 A is the structural representation of a kind of PCB pad；
Fig. 3 B is the welding effect schematic diagram after PCB pad solder based on Fig. 3 A；
The structural representation of the PCB pad that Fig. 4 A provides for the embodiment of the present invention；
Fig. 4 B is the welding effect schematic diagram after PCB pad solder based on Fig. 4 A；
The structural representation having a kind of PCB pad that Fig. 5 provides for the embodiment of the present invention；
The schematic flow sheet of the welding method that Fig. 6 provides for the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with Figure of description and specific embodiment technical scheme done and further explain in detail
State.
Embodiment one:
As it is shown in figure 1, the present embodiment provides a kind of printing board PCB pad, including:
Wiring board 110；
It is positioned on described wiring board the welding body 120 for welding electronic component；Described electronic component include with
The leg of described welding body welding；
Wherein, the cross-sectional area of at least part of described welding body 120 is more than the cross-sectional area of described leg.
The area of the welding body on the PCB pad provided in the present embodiment is likely larger than the cross section of leg
Long-pending, if if less skew so occurs in welding process, being not result in welding between body and leg
Separate.Here leg is the pin of electronic component, contacts well if leg is formed with welding body 120,
Then achieve electronic component and the connection of the circuit of element on wiring board.Here electronic component can include electric capacity,
The various components and parts such as inductance, integrated chip or transformator.
In the present embodiment, the cross-sectional area of described welding body is more than the cross-sectional area of described leg, the most not
Bonding accuracy in reduction welding process that only can be suitable, but also reduction PCB pad that can be suitable
The degree of accuracy of processing technology.If PCB pad is in fabrication, welding body slightly has the skew of welding position,
Also will not immediately result in failure welding, thus cause the PCB produced to occur that various electrical resistances are bad.
In the present embodiment, if assuming the cross-sectional area S1 of described welding body, it is assumed that the cross section of described leg
Amass as S2, described S1=a*S2.Described a is the integer not less than 1, and the value of described a is preferably 1.2
Between 2.So on the one hand, can avoid, because the cross-sectional area of welding body is excessive, causing PCB pad
Area increases, and simultaneously further through the suitable space utilizing PCB pad originally to reserve, promotes the good of welding
Rate, reduces the defective products of welding.
In FIG, the cross-sectional area of Wei the welding body 120 that solid line circle is corresponding；What broken circle was corresponding is
The cross-sectional area of leg, it is clear that broken circle is positioned at solid line circle, the cross-sectional area of leg is less than welding body 120
Cross-sectional area.
Further, the Distances Between Neighboring Edge Points of adjacent two described welding bodies 120, less than phase on described electronic component
Distances Between Neighboring Edge Points between adjacent two legs.PCB pad described in the present embodiment is particularly suited for various small electricity
Sub-element.Like this, electronic component is slight skew or the welding that the skew of described welding body 120 causes
Bad phenomenon.As in figure 2 it is shown, the cross-sectional area for leg that broken circle represents；Solid line circle represent for weldering
The cross-sectional area of junctor 120.Edge Distance between the most adjacent two welding bodies 120, less than welding foot
Edge Distance, like this, welding foot all around deviates 0.01mm in welding position to be all possible,
Do not result in failure welding.
Further, described electronic component includes first kind element；The leg of described first kind element transversal
Area is less than preset area；For welding the cross-sectional area of the welding body 120 of described first kind element, it is more than
The cross-sectional area of the leg of described first kind element.
The cross-sectional area of the leg of different electronic components is different, if the cross-sectional area of a leg is sufficiently large,
The processing technology of existing PCB pad, solder technology (such as SMT) is to disclosure satisfy that making precision,
It is to ensure that welding yield, now in order to save the space of PCB pad, is the horizontal stroke without increasing welding body
Sectional area.
In the present embodiment, described first kind element includes the tuning capacity of specified type.Here appointment class
The tuning capacity of type, can be the electric capacity carrying out low frequency tuning process.Such as, low frequency here is for less than predetermined
The communication frequency of frequency.Before described tuning capacity can be used for antenna and the power amplifier of communication equipment, use
In mating, improve speech quality.Described tuning capacity can be STPTIC electric capacity.Described STPTIC
It it is a kind of model of tuning capacity.
The most such as, described preset area is the circle of a length of 0.16mm of diameter, or the length of side is 0.16mm's
Rectangle.Preset area described in the present embodiment is full of a citing, when implementing, the described length of side or described
Diameter length is not limited to 0.16mm.Generally when a length of 0.16mm of the described length of side or diameter, corresponding welding
The length of side of the cross-sectional area of body or diameter length can be 0.2mm or 0.21mm.
Described welding body 120 is for welding hemisphere, oval hemisphere, cuboid or cube.If described weldering
Junctor 120 is welding hemisphere or cube, then the cross-sectional area of this welding body 120 is in all directions
Length is the most consistent；If the oval hemisphere of described welding body 120 or cuboid, then this welding body is at different directions
The length of fool is inconsistent.During concrete implementation, can be according to welding skew or PCB pad
Offset on upper welding body, determine the welding offset direction the most often occurred, then select applicable welding body,
On the one hand promoting welding quality, on the one hand prior art as far as possible is the most compatible, it is to avoid because of welding body
Cross-sectional area increases the area of the PCB pad caused and increases.
Further, the cross-sectional area of described welding body 120 the first length in a first direction, it is less than
The second length in second direction；Wherein, first direction is perpendicular to described second direction；Same described electronics
The line of adjacent two the described legs of element is oriented parallel to described first direction.Such as, described first will be set
Direction is fore-and-aft direction, and the most described second direction is left and right directions.This layout of welding body 120, a side
Face can be avoided, because the cross-sectional area of welding body 120 increases, causing between the different legs of identity element,
The problem causing because scolding tin is excessive linking together, simultaneously on direction skew easily occur, extends weldering
The length of junctor, can solve the failure welding in the direction, promotes welding quality.
Fig. 3 A be the cross-sectional area of welding body 120 equal to the cross-sectional area of leg time, due to PCB pad work
Skill is unable to reach the welding body 120 that such degree of accuracy causes to be occurred welding the problems such as the irregular phenomenon of body 120.
Fig. 3 B be the cross-sectional area of welding body 120 equal to the cross-sectional area of leg time, the failure welding of appearance, aobvious
So leg does not the most weld with welding body 120, and the electrical resistance that so can cause PCB is bad.
Fig. 4 A be the cross-sectional area of welding body 120 equal to the cross-sectional area of leg time, the front of PCB pad
Schematic diagram, it is clear that welding body 120 occurs that irregular phenomenon is less.Fig. 4 B is for utilizing the embodiment of the present invention
There is provided PCB pad weld after tangent plane schematic diagram, it is clear that even if there is certain deviation in electronic component,
Obviously electronic component has the most well been welded on welding body, improves the reliability of welding.
The structural representation of a kind of PCB pad that Fig. 5 provides for the embodiment of the present invention.Shown in Fig. 5
PCB pad is three-back-shaped to be provided with multiple welding body, at least one of cross-sectional area in these welding bodies
It is greater than the cross-sectional area of the leg to electronic component.
Embodiment two:
As shown in Figure 6, the present embodiment provides a kind of welding method, including:
Step S110: select printing board PCB pad；At least part of welding on described PCB pad
The cross-sectional area of body is more than the cross-sectional area of the leg of to-be-welded elements；In this step, can select to implement
The PCB pad that in example one, any one technical scheme provides.
Step S120: on described PCB pad, carry out the welding of electronic component.
In the present embodiment, utilize the PCB pad that embodiment one provides, so can reduce because of welding process
Middle soldered elements deviation welding position, or welding body deviation welding position, the failure welding phenomenon caused.
Described step S110 comprises the steps that
Judge the cross-sectional area whether including leg in the electronic component to be welded electronics unit less than predetermined area
Part；
If element to be welded includes the cross-sectional area electronic component less than predetermined area of leg, select real
Execute the PCB pad described in example one Arbitrary Term.
Described further, described judge whether electronic component to be welded including, the cross-sectional area of leg is little
Electronic component in predetermined area comprises the steps that to judge whether include specified type in electronic component to be welded
Tuning capacity.
In several embodiments provided herein, it should be understood that disclosed equipment and method,
Can realize by another way.Apparatus embodiments described above is only schematically, such as,
The division of described unit, is only a kind of logic function and divides, and actual can have other division when realizing
Mode, such as: multiple unit or assembly can be in conjunction with, or are desirably integrated into another system, or some are special
Levy and can ignore, or do not perform.It addition, the coupling each other of shown or discussed each ingredient,
Or direct-coupling or communication connection can be the INDIRECT COUPLING by some interfaces, equipment or unit or logical
Letter connect, can be electrical, machinery or other form.
The above-mentioned unit illustrated as separating component can be or may not be physically separate, makees
The parts shown for unit can be or may not be physical location, i.e. may be located at a place,
Can also be distributed on multiple NE；Can select according to the actual needs therein partly or entirely
Unit realizes the purpose of the present embodiment scheme.
It addition, each functional unit in various embodiments of the present invention can be fully integrated into a processing module
In, it is also possible to it is that each unit is individually as a unit, it is also possible to two or more unit collection
Become in a unit；Above-mentioned integrated unit both can realize to use the form of hardware, it would however also be possible to employ
Hardware adds the form of SFU software functional unit and realizes.
One of ordinary skill in the art will appreciate that: realize all or part of step of said method embodiment
Can be completed by the hardware that programmed instruction is relevant, aforesaid program can be stored in a computer-readable
Taking in storage medium, this program upon execution, performs to include the step of said method embodiment；And it is aforementioned
Storage medium include: movable storage device, read only memory (ROM, Read-Only Memory),
Random access memory (RAM, Random Access Memory), magnetic disc or CD etc. are various
The medium of program code can be stored.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is not limited to
In this, any those familiar with the art, can be easily in the technical scope that the invention discloses
Expect change or replace, all should contain within protection scope of the present invention.Therefore, the protection of the present invention
Scope should be as the criterion with described scope of the claims.
Claims (10)
1. a printing board PCB pad, it is characterised in that including:
Wiring board；
It is positioned on described wiring board the welding body for welding electronic component；Described electronic component includes with described
The leg of welding body welding；
Wherein, the cross-sectional area of at least part of described welding body is more than the cross-sectional area of described leg.
PCB pad the most according to claim 1, it is characterised in that
The Distances Between Neighboring Edge Points of adjacent two described welding bodies, less than on described electronic component between adjacent two legs
Distances Between Neighboring Edge Points.
PCB pad the most according to claim 1 and 2, it is characterised in that
Described electronic component includes first kind element；The cross-sectional area of the leg of described first kind element is less than pre-
If area；
For welding the cross-sectional area of the welding body of described first kind element, more than the weldering of described first kind element
The cross-sectional area of foot.
PCB pad the most according to claim 3, it is characterised in that
Described first kind element includes the tuning capacity of specified type.
PCB pad the most according to claim 3, it is characterised in that
Described preset area is the circle of a length of 0.16mm of diameter, or the length of side is the rectangle of 0.16mm.
PCB pad the most according to claim 1 and 2, it is characterised in that
Described welding body is for welding hemisphere, oval hemisphere, cuboid or cube.
PCB pad the most according to claim 1 and 2, it is characterised in that
The cross-sectional area of described welding body the first length in a first direction, less than the in a second direction
Two length；Wherein, first direction is perpendicular to described second direction；
The line of adjacent two the described legs of same described electronic component is oriented parallel to described first direction.
8. a welding method, it is characterised in that including:
Select the printing board PCB pad as described in any one of claim 1 to 7；
On described PCB pad, carry out the welding of electronic component.
Welding method the most according to claim 8, it is characterised in that
Described selection printing board PCB pad as described in any one of claim 1 to 7, including:
Judge the cross-sectional area whether including leg in the electronic component to be welded electronics unit less than predetermined area
Part；
If element to be welded includes the cross-sectional area electronic component less than predetermined area of leg, select such as
PCB pad described in any one of claim 1 to 7.
Welding method the most according to claim 9, it is characterised in that
The described cross-sectional area electricity less than predetermined area judging whether to include in electronic component to be welded leg
Sub-element, including:
Judge whether electronic component to be welded includes the tuning capacity of specified type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610346352.1A CN105934083B (en) | 2016-05-23 | 2016-05-23 | PCB pad and welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610346352.1A CN105934083B (en) | 2016-05-23 | 2016-05-23 | PCB pad and welding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105934083A true CN105934083A (en) | 2016-09-07 |
| CN105934083B CN105934083B (en) | 2019-08-30 |
Family
ID=56841185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610346352.1A Active CN105934083B (en) | 2016-05-23 | 2016-05-23 | PCB pad and welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105934083B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107832514A (en) * | 2017-10-27 | 2018-03-23 | 盛科网络（苏州）有限公司 | A kind of detection method and device of Surface Mount pad |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203691749U (en) * | 2013-12-06 | 2014-07-02 | Tcl显示科技（惠州）有限公司 | Circuit board assembly |
| CN203912337U (en) * | 2014-05-26 | 2014-10-29 | Tcl显示科技（惠州）有限公司 | Circuit board assembly |
| CN105208775A (en) * | 2015-08-07 | 2015-12-30 | 深圳崇达多层线路板有限公司 | PCB design method for preventing BGA from solder bridge |
-
2016
- 2016-05-23 CN CN201610346352.1A patent/CN105934083B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203691749U (en) * | 2013-12-06 | 2014-07-02 | Tcl显示科技（惠州）有限公司 | Circuit board assembly |
| CN203912337U (en) * | 2014-05-26 | 2014-10-29 | Tcl显示科技（惠州）有限公司 | Circuit board assembly |
| CN105208775A (en) * | 2015-08-07 | 2015-12-30 | 深圳崇达多层线路板有限公司 | PCB design method for preventing BGA from solder bridge |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107832514A (en) * | 2017-10-27 | 2018-03-23 | 盛科网络（苏州）有限公司 | A kind of detection method and device of Surface Mount pad |
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| Publication number | Publication date |
|---|---|
| CN105934083B (en) | 2019-08-30 |
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