CN107509319A - The module of welding end is arranged at a kind of bottom - Google Patents
The module of welding end is arranged at a kind of bottom Download PDFInfo
- Publication number
- CN107509319A CN107509319A CN201610415245.XA CN201610415245A CN107509319A CN 107509319 A CN107509319 A CN 107509319A CN 201610415245 A CN201610415245 A CN 201610415245A CN 107509319 A CN107509319 A CN 107509319A
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- CN
- China
- Prior art keywords
- welding end
- module
- boss
- welding
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention, which provides a kind of bottom, the module of welding end, including：Module bodies, and multiple welding ends of the module bodies lower surface are arranged on, and the solder mask around the multiple welding end；Boss is set in the multiple welding end, and the height of the welding end with boss is higher than the height of the solder mask.Welding end is raised by increasing boss in the welding end of module, reduces the welding end with boss and the contact gap of interface board pad, advantageously account for rosin joint caused by module warpage by the present invention；Simultaneously, the height of welding end with boss is higher than the height of solder mask, so that the gap between the solder mask and interface board of module bodies lower surface increases, be advantageous to module scaling powder in reflow process to volatilize, and the top clearance that solves welding resistance between module and interface board it is too small when, tin sweat(ing) caused by tin cream can not retract pad in Reflow Soldering and Lian Xi problems.
Description
Technical field
The present invention relates to microelectric technique, more particularly to a kind of module of bottom belt welding end.
Background technology
With the rapid development of microelectric technique, printed circuit board (PCB) (Printed Circuit Board, PCB
Plate) also use more and more.The modular arrangement of PCB product is also more and more, module portability compared with
It is good, substantial amounts of time of product development can be not only saved, the development cost of product can also be saved.At present
The module of main flow is encapsulated as LCC (Leadless Chip Carriers) and LGA (Land Grid Array)
Two kinds, the secondary assembling mode of module also has the schemes such as connector, welding, crimping.
At present using welded type as in the LGA modules of assembling mode, the bottom welding end of LGA modules designs
Scheme, the non-welding end positions of LGA module bottoms are cabling and solder mask (solder mask), or non-weldering
End position is covered by solder mask.As shown in figure 1, the height h of LGA module bottoms welding end 102 compares surrounding
The height H of solder mask 103 it is low.
When LGA modules and interface board are welded with Reflow Soldering, the welding end 102 and interface board of LGA modules
Pad 104 between gap it is larger, easily cause rosin joint；Also, the solder mask 103 of LGA modules
Gap between the solder mask 106 of interface board is smaller, causes LGA modules welding end to be welded with interface board pad
When connecing, scaling powder is difficult to volatilize in tin cream, easily causes part to emit tin sweat(ing)；Interface board pad, which holds tin amount, to be had
Limit, tin cream can not retract pad, easily cause part to connect tin.
PCB is due to by heat expansion after the surface mounting technology SMT device solder reflows of LGA modules in itself
Contracting causes generally existing warpage issues, and warpage is big and further obvious with the change of LGA module sizes.LGA
Module is in use, need to carry out angularity test to the LGA modules of warpage, and selected；Therefore increase
Add extra process and cost, and reprocess difficulty；Even if adding relevant cost, also can not thoroughly solve
Certainly problem of faulty soldering.
LGA module weights are heavier or when module gravity centre distribution itself is uniform, cause to print when welding on interface board
The tin cream of brush is pressed in the heavier local location of LGA modules itself to cave in seriously, tin cream extrusion interface board
Pad, therefore LGA modules are easily caused LGA modules welding even tin when being welded on interface board.
The content of the invention
The problem of existing for prior art, the application, which provides a kind of bottom, the module of welding end.
The application first aspect, which provides a kind of bottom, the module of welding end, including：Module bodies, and
It is arranged on multiple welding ends of the module bodies lower surface, and the solder mask around the multiple welding end；
Boss is set in the multiple welding end, and the height of the welding end with boss is higher than the solder mask
Highly.
In first aspect in the first possible implementation, boss is set in the multiple welding end, can
Boss is set in the multiple welding end by way of parcel plating copper；And the boss in horizontal plane
Interior size is less than the size of the welding end.Increased boss causes module welding end to be formed with interface board pad
The solder joint of tin is climbed in side, accommodates more tin amounts, solves rosin joint caused by the warpage of module and local gravity center
Connect tin caused by uneven and emit tin sweat(ing) problem.
With reference to first aspect or first aspect the first possible implementation, may be realized at second
Mode in, the shape of the boss includes circular or square.
In first aspect in the third possible implementation, the module bodies include Background Grid array packages
LGA module bodies or printing board PCB module bodies.
It is described that boss is set in the multiple welding end in the 4th kind of possible implementation of first aspect
Specially：Boss is set in the welding end positioned at the surrounding of the module bodies lower surface.Under module bodies
Boss is set in the welding end of the surrounding on surface, the problem of to alleviate warpage；In module bodies lower surface
Between welding end can be set boss, boss can also be not provided with.
The application is raised welding end by increasing boss in the welding end of module, make the welding end with boss with
The contact gap of interface board pad is reduced, and advantageously accounts for rosin joint caused by module warpage；Meanwhile with convex
The height of the welding end of platform is higher than the height of solder mask so that the solder mask and interface board of module bodies lower surface
Between gap increase, be advantageous to module scaling powder in reflow process and volatilize, and solve module with connecing
When the top clearance of welding resistance is too small between oralia, tin sweat(ing) caused by tin cream can not retract pad in Reflow Soldering
With even tin problem.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be in the embodiment of the present invention
The required accompanying drawing used is briefly described, it should be apparent that, drawings described below is only this
Some embodiments of invention, for those of ordinary skill in the art, are not paying creative work
Under the premise of, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the modular structure schematic diagram that welding end is arranged at a kind of bottom of the prior art；
Fig. 2 is the modular structure schematic diagram that welding end is arranged at a kind of bottom of the prior art；
Fig. 3 is the modular structure schematic diagram that welding end is arranged at a kind of bottom provided in an embodiment of the present invention；
Fig. 4 is the modular structure schematic diagram that welding end is arranged at a kind of bottom provided in an embodiment of the present invention；
Fig. 5 is the schematic cross-section of a kind of welding end provided in an embodiment of the present invention and square boss；
Fig. 6 is the schematic cross-section of a kind of welding end provided in an embodiment of the present invention and round boss.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describing, it is clear that described embodiment is the part of the embodiment of the present invention, without
It is whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making wound
The every other embodiment that the property made is obtained on the premise of working, should all belong to the scope of protection of the invention.
Below by taking Fig. 1 and Fig. 2 as an example, the height of height and solder mask to the welding end of module in the prior art
Degree illustrates.
Fig. 1 is the modular structure schematic diagram that welding end is arranged at a kind of bottom of the prior art, as shown in figure 1,
The module that welding end is arranged at bottom includes module bodies 101, welding end 102, solder mask 103；The pad of interface board
104th, solder mask 106 and interface board main body 105.The height H of solder mask 103 is higher than welding end 102
Height h.When warpage occurs for the module, i.e. top warpage in circumferential Fig. 1 of the four of module, due to solder mask
103 height H is higher than the height h of welding end 102, causes the welding end of the lower surface surrounding of module bodies 101
102 increase with the contact gap of interface board pad 104, therefore the ratio rise of rosin joint, the fraction defective of welding
Rise.
Simultaneously as the height of solder mask 103 is higher than the height of welding end 102, solder mask 103 can be caused
Gap between the solder mask 106 of interface board reduces, and when welding end 102 is welded, scaling powder is difficult in tin cream
With volatilization, tin cream emits tin sweat(ing) problem caused by pad can not be retracted in Reflow Soldering；Interface board pad 104
Appearance tin amount it is limited, the problem of easily causing to connect tin between different pads.
Fig. 2 is the modular structure schematic diagram that welding end is arranged at a kind of bottom of the prior art, as shown in Fig. 2
The module that welding end is arranged at bottom includes module bodies 201, welding end 202, circuit 203, solder mask 204；Connect
Oralia main body 206, interface board welding end 205 and interface board solder mask 207.The height H of solder mask 204
Higher than the height h of welding end 202.Fig. 2 compares Fig. 1, has circuit 203 in solder mask 204.
Below by taking Fig. 3 as an example, the module for having welding end to the bottom of the present invention illustrates.
Fig. 3 is the modular structure schematic diagram that welding end is arranged at a kind of bottom provided in an embodiment of the present invention；Such as figure
Shown in 3, module includes：Module bodies 301, and it is arranged on the more of the lower surface of module bodies 301
Individual welding end 302, and the solder mask 303 around the multiple welding end 302；In the module bodies 301
Boss 304 is set in the welding end of lower surface, forms the welding end 302 with boss 304, and it is described with boss
The height h1 of welding end is higher than the height H1 of the solder mask 303.In Fig. 3 also have interface board main body 306,
The solder mask 307 of interface board pad 305 and interface board.
In above-mentioned module, boss 304 is set in the multiple welding end 302, parcel plating copper can be passed through
Mode boss 304 is set in the multiple welding end 302；And the boss 304 in the horizontal plane
Size is less than the size of the welding end.Increased boss causes module bottom welding end to be formed with interface board pad
The solder joint of tin is climbed in side (boss side surfaces A in such as figure), accommodates more tin amounts, module bottom welding end and interface
The welding of plate is more firm.
It should be noted that parcel plating copper is the preferred embodiment of increase boss of the embodiment of the present invention, remove
Outside this, other modes for increasing boss 304 in welding end 302 are readily apparent that, such as：Welded with tin cream
Connect to form boss；The embodiment of the present invention is not construed as limiting to this.
In above-mentioned module, the module bodies include Background Grid array packages (Land Grid Array-LGA)
Module bodies or printed circuit board (PCB) (Printed circuit board-PCB) module bodies.The embodiment of the present invention
There are the module bodies of welding end for bottom and be not construed as limiting, skilled person will appreciate that, as long as bottom
There is the module of welding end, the problem of boss is to alleviate module warpage can increased in the welding end.
In above-mentioned module, the setting boss 304 in the multiple welding end 302 is specially：In place
In setting boss 304 in the welding end 302 of the surrounding of the lower surface of module bodies 301.Module bodies 301
Boss 304 is set in the welding end 302 of the surrounding of lower surface, to alleviate problem of faulty soldering caused by warpage；In mould
Boss 304 can be set in the welding end 302 of the centre of the lower surface of block main body 301, can also be not provided with boss 304.
It should be noted that local boss refers to that the size of boss 304 in the horizontal plane is less than welding end 302
Size.Therefore, increased local boss causes module welding end 302 to form side with interface board pad and climb
The solder joint of tin, more tin amounts are accommodated, therefore module welding end 302 and interface plate weld are more firm；And
It is heavier or when module gravity centre distribution itself is uniform to solve LGA module weights, causes to print when welding on interface board
The tin cream of brush is pressed in the heavier local location of LGA modules itself to cave in seriously, tin cream extrusion interface board
The problem of pad.
In above-mentioned module, the shape of the boss 302 can be circular or square.
Surface of the embodiment of the present invention for boss size in the horizontal plane, the shape of boss and boss
Processing mode is all not construed as limiting.
Boss relative size in the horizontal plane and shape are illustrated by taking Fig. 5 and Fig. 6 as an example below.
Fig. 5 is the scale diagrams of a kind of welding end provided in an embodiment of the present invention and square boss；Such as Fig. 5 institutes
Showing, boss 501 is square boss, and the diameter of welding end 502 is more than the length and width of boss 501,
I.e. the size of boss 501 in the horizontal plane is less than the size of welding end 502.
Fig. 6 is the scale diagrams of a kind of welding end provided in an embodiment of the present invention and round boss.Such as figure
Shown in 6, boss 601 is round boss, and the diameter of welding end 602 is more than the diameter of boss 601, i.e.,
The size of boss 601 in the horizontal plane is less than the size of welding end 602.
Below by taking Fig. 4 as an example, the module for having welding end to the bottom of the present invention illustrates.
Fig. 4 is the modular structure schematic diagram that welding end is arranged at a kind of bottom provided in an embodiment of the present invention；Such as figure
Shown in 4, module bodies 401, welding end 402, boss 405, circuit 403, solder mask 404；With module
The solder mask 408 of the interface board main body 407, interface board pad 406 and the interface board that are welded.
Boss 405 raises the height of welding end 402 so that the height h1 of the welding end with boss is higher than welding resistance
The height H1 of layer 404.
Due to when module and interface board are welded, because the warpage of module bodies 401 causes module master
The both ends of body are tilted upward, and are caused the welding end of module bodies lower surface to increase with the gap of interface board pad, are held
It is easily caused rosin joint.Therefore, increase boss 405 in the welding end 402 of module, welding end is raised, made with convex
The welding end 402 of platform is reduced with the contact gap of interface board pad 406, and advantageously accounting for module warpage causes
Rosin joint.
In addition, the height h1 of the welding end with boss is higher than the height H1 of solder mask 404 so that module master
Gap between the solder mask 404 and interface board of the lower surface of body 401 increases, and is advantageous to module in Reflow Soldering
During scaling powder volatilize, and when the top clearance that solves welding resistance between module and interface board is too small, tin cream
It can not be retracted in Reflow Soldering and emit tin sweat(ing) and Lian Xi problems caused by pad.
As a kind of specifically implementation, boss 405 is increased by parcel plating copper, to module following table
The welding end 402 and circuit 403 in face do not influence.
The embodiment of the present invention can improve the welding yield of the welding assembly module of bottom belt welding end, be advantageous to
Module is promoted the use of.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited to
In this, any one skilled in the art the invention discloses technical scope in, it is contemplated that
Various equivalent modifications or substitutions, these modifications or substitutions should be all included within the scope of the present invention.
Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (5)
1. the module of welding end is arranged at a kind of bottom, it is characterised in that including：
Module bodies, and multiple welding ends of the module bodies lower surface are arranged on, and it is the multiple
Solder mask around welding end；
Boss is set in the multiple welding end, and the height of the welding end with boss is higher than the welding resistance
The height of layer.
2. module according to claim 1, it is characterised in that set in the multiple welding end convex
Platform, boss can be set in the multiple welding end by way of parcel plating copper；And the boss
Size in horizontal plane is less than the size of the welding end.
3. module according to claim 1 or 2, it is characterised in that the shape of the boss includes
It is circular or square.
4. module according to claim 1, it is characterised in that the module bodies include grid battle array
Row encapsulation LGA module bodies or printing board PCB module bodies.
5. module according to claim 1, it is characterised in that described to be set in the multiple welding end
Putting boss is specially：
Boss is set in the welding end positioned at the surrounding of the module bodies lower surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610415245.XA CN107509319A (en) | 2016-06-14 | 2016-06-14 | The module of welding end is arranged at a kind of bottom |
| PCT/CN2017/087267 WO2017215488A1 (en) | 2016-06-14 | 2017-06-06 | Module with solder ends at bottom thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610415245.XA CN107509319A (en) | 2016-06-14 | 2016-06-14 | The module of welding end is arranged at a kind of bottom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107509319A true CN107509319A (en) | 2017-12-22 |
Family
ID=60662961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610415245.XA Pending CN107509319A (en) | 2016-06-14 | 2016-06-14 | The module of welding end is arranged at a kind of bottom |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107509319A (en) |
| WO (1) | WO2017215488A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423489A (en) * | 2020-10-14 | 2021-02-26 | 湖北亿咖通科技有限公司 | Printed circuit board, packaging substrate and vehicle mainboard |
| CN113131713A (en) * | 2021-05-17 | 2021-07-16 | 苏州昀冢电子科技股份有限公司 | Base of voice coil motor and combination thereof |
| CN113381565A (en) * | 2021-06-24 | 2021-09-10 | 苏州昀冢电子科技股份有限公司 | Base assembly and manufacturing method thereof |
| CN114501792A (en) * | 2021-07-09 | 2022-05-13 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
| WO2023174251A1 (en) * | 2022-03-18 | 2023-09-21 | 华为技术有限公司 | Circuit board assembly and processing method therefor, and electronic device |
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| CN2922382Y (en) * | 2006-04-13 | 2007-07-11 | 中兴通讯股份有限公司 | Surface installation printed-circuit board circuit module |
| CN102142411A (en) * | 2010-02-01 | 2011-08-03 | 华为终端有限公司 | Chip packaging component of printed circuit board assembly (PCBA) and welding component |
| CN103416108A (en) * | 2010-12-24 | 2013-11-27 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008210993A (en) * | 2007-02-26 | 2008-09-11 | Nec Corp | Printed wiring board and method of manufacturing the same |
| WO2012087072A2 (en) * | 2010-12-24 | 2012-06-28 | 엘지이노텍주식회사 | Printed circuit board and method for manufacturing same |
-
2016
- 2016-06-14 CN CN201610415245.XA patent/CN107509319A/en active Pending
-
2017
- 2017-06-06 WO PCT/CN2017/087267 patent/WO2017215488A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922382Y (en) * | 2006-04-13 | 2007-07-11 | 中兴通讯股份有限公司 | Surface installation printed-circuit board circuit module |
| CN102142411A (en) * | 2010-02-01 | 2011-08-03 | 华为终端有限公司 | Chip packaging component of printed circuit board assembly (PCBA) and welding component |
| CN103416108A (en) * | 2010-12-24 | 2013-11-27 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing same |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423489A (en) * | 2020-10-14 | 2021-02-26 | 湖北亿咖通科技有限公司 | Printed circuit board, packaging substrate and vehicle mainboard |
| CN113131713A (en) * | 2021-05-17 | 2021-07-16 | 苏州昀冢电子科技股份有限公司 | Base of voice coil motor and combination thereof |
| CN113131713B (en) * | 2021-05-17 | 2022-06-07 | 苏州昀冢电子科技股份有限公司 | Base of voice coil motor and combination thereof |
| CN113381565A (en) * | 2021-06-24 | 2021-09-10 | 苏州昀冢电子科技股份有限公司 | Base assembly and manufacturing method thereof |
| CN113381565B (en) * | 2021-06-24 | 2024-02-09 | 苏州昀冢电子科技股份有限公司 | Base assembly and manufacturing method thereof |
| CN114501792A (en) * | 2021-07-09 | 2022-05-13 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
| CN114501792B (en) * | 2021-07-09 | 2023-07-21 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
| WO2023174251A1 (en) * | 2022-03-18 | 2023-09-21 | 华为技术有限公司 | Circuit board assembly and processing method therefor, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017215488A1 (en) | 2017-12-21 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Applicant after: Huawei Device Co., Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Applicant before: HUAWEI terminal (Dongguan) Co., Ltd. |
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Application publication date: 20171222 |
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| RJ01 | Rejection of invention patent application after publication |