CN112840748A

CN112840748A - Circuit board structure, electronic product, and preparation method and maintenance method of circuit board structure

Info

Publication number: CN112840748A
Application number: CN202080005140.1A
Authority: CN
Inventors: 申中国; 胡正高; 张飞
Original assignee: SZ DJI Technology Co Ltd
Current assignee: SZ DJI Technology Co Ltd
Priority date: 2020-03-17
Filing date: 2020-03-17
Publication date: 2021-05-25
Also published as: WO2021184190A1

Abstract

The circuit board structure (10), the electronic product, the preparation method and the maintenance method of the circuit board structure (10), at least two substrates of the circuit board structure (10) are arranged in a stacking mode, and each substrate is provided with an electronic element (13); at least two substrates are arranged in a stacking mode at intervals through a connecting structure (11); before at least one electronic component (13) is soldered to a substrate, a solder body (12) having a connecting solder ball (121) and a solder paste layer (122) is provided on the electronic component (13).

Description

Circuit board structure, electronic product, and preparation method and maintenance method of circuit board structure

Technical Field

The present disclosure relates to circuit board technologies, and particularly to a circuit board structure, an electronic product, and a method for manufacturing and maintaining the circuit board structure.

Background

With the trend of miniaturization of electronic products, more and more high-density substrates and stacked substrates have been produced, and electronic components such as chips, diodes, capacitors, etc. are soldered on the substrates. Poor assembly or damage of various electronic components inevitably occurs during the manufacturing and use of the product. However, as the number of electronic components increases, the space remaining on the substrate becomes smaller and smaller, and the space available for repair becomes smaller and smaller. Therefore, the maintenance of the electronic elements such as the chip is not easy, and the maintenance yield is low.

Disclosure of Invention

Based on this, the application provides a circuit board structure, an electronic product, a manufacturing method and a maintenance method of the circuit board structure, and aims to reduce the requirement on the maintenance space of the substrate and improve the maintenance yield of the circuit board structure.

According to a first aspect of the present application, there is provided a circuit board structure comprising:

the electronic device comprises at least two substrates, a circuit board and a circuit board, wherein the at least two substrates are stacked, and each substrate is provided with at least one electronic element;

a connection structure having conductivity, electrically and mechanically connected to two adjacent substrates; and

a solder body connected to the electronic component and the substrate, the solder body including a connection solder ball and a solder paste layer;

at least part of the connecting structure is clamped between two adjacent substrates, so that the at least two substrates are arranged in a stacked mode at intervals; disposing the connecting solder balls and the solder paste layer on at least one of the electronic components before the at least one of the electronic components is soldered to the substrate.

According to a second aspect of the present application, there is provided a circuit board structure comprising: a substrate; at least one electronic component disposed on the substrate; and a solder body connected to the electronic component and the substrate, the solder body including a connection solder ball and a solder paste layer; wherein the connection solder balls and the solder paste layer are provided on the electronic component before at least one of the at least one electronic component is soldered to the substrate.

According to a third aspect of the present application, there is also provided an electronic product, including a housing; and the circuit board structure of any one of the first aspect of the present application, disposed on the housing.

According to a fourth aspect of the present application, there is also provided an electronic product, including a housing; and the circuit board structure of any one of the second aspect of the present application, disposed on the housing.

According to a fifth aspect of the present application, there is also provided a method of manufacturing a circuit board structure comprising a substrate, a soldered body and at least one electronic component provided on the substrate; the method comprises the following steps: providing a solder ball and a solder paste layer on at least one of said at least one electronic component to provide said solder body on said electronic component; and welding the electronic element provided with the welding body on the substrate.

According to a fifth aspect of the present application, there is also provided a method of repairing a circuit board structure, the circuit board structure comprising a substrate and an electronic device to be repaired; the method comprises the following steps: removing the electronic device to be repaired from the area to be repaired of the substrate; arranging a connecting solder ball and a solder paste layer on a target electronic device so as to arrange a solder body on the target electronic device; and welding the target electronic device provided with the welding body to the to-be-repaired area of the substrate.

The embodiment of the application provides a circuit board structure, an electronic product, a preparation method and a maintenance method of the circuit board structure, wherein the connection solder balls and the solder paste layer are arranged on at least one of the at least one electronic element before the at least one of the at least one electronic element is welded on the substrate. Then locate the electronic component who is equipped with connecting solder ball and tin cream layer on the base plate again, need not to reserve sufficient space in order to set up the tin cream layer on the base plate, therefore can the maximize reduced the requirement to the maintenance space of base plate, easy maintenance has improved the maintenance yield of circuit board structure.

In addition, compare with each electronic component locates on same base plate simultaneously, each electronic component sets up on two at least base plates that the range upon range of setting in this application embodiment, each electronic component's area of taking up is less than the sum of each electronic component's area, has reduced each electronic component's area of taking up greatly to realize the high-density integration of a plurality of electronic components in limited space, leave other spaces in the electronic product for the battery of electronic product or other electronic components etc. and then reduced electronic product's size, be favorable to electronic product miniaturization.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a circuit board structure according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application, in which an electronic component at a predetermined area is separated from a substrate;

fig. 3 is a schematic structural diagram of a portion of a circuit board structure according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

FIG. 5 is an angled view of the circuit board structure of FIG. 4, showing a second side of the second substrate;

fig. 6 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

FIG. 11 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 12 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 13 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 14 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 15 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 16 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 17 is a partial schematic view of a circuit board structure provided in accordance with an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 18 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 19 is a partial schematic view of a circuit board structure provided in accordance with an embodiment of the present application, showing an arrangement of rigid connectors and filler members;

FIG. 20 is a partial schematic view of a circuit board structure provided in accordance with an embodiment of the present application, showing an arrangement of rigid connectors and filler members;

FIG. 21 is a partial schematic view of a circuit board structure provided in accordance with an embodiment of the present application, showing an arrangement of rigid connectors and filler members;

FIG. 22 is a partial schematic view of a circuit board structure provided in accordance with an embodiment of the present application, showing an arrangement of rigid connectors and filler members;

FIG. 23 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 24 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 25 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 26 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 27 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 28 is a schematic view of the internal structure of a rigid connection provided by an embodiment of the present application;

fig. 29 is a flowchart illustrating a method for repairing a circuit board structure according to an embodiment of the present application;

FIG. 30 is a reference diagram illustrating a process for separating an electronic device to be repaired according to an embodiment of the present application;

FIG. 31 is a reference diagram illustrating a process for separating an electronic device to be repaired according to an embodiment of the present application;

fig. 32 is a schematic view of a target electronic device placed in a carrying fixture according to an embodiment of the present application;

FIG. 33 is a diagram illustrating a process for printing solder paste according to an embodiment of the present application;

FIG. 34 is a schematic view of a solder paste printed state provided by an embodiment of the present application;

fig. 35 is a reference diagram of a process for positioning an electronic device to be repaired by sucking a target electronic device provided in an embodiment of the present application;

fig. 36 is a flowchart illustrating a method for manufacturing a circuit board structure according to an embodiment of the present disclosure.

Description of reference numerals:

10. a circuit board structure;

11. a connecting structure; 111. spacing solder balls; 112. a rigid connection; 1121. a first connection portion; 1122. a spacer section; 1123. a second connecting portion; 1124. a first electrical conductor; 1125. an insulator; 1126. a second electrical conductor; 1127. a cladding body; 113. a first array; 1131. a first sub-array; 1132. a second sub-array; 114. a second array;

12. welding a body; 121. connecting a solder ball; 122. a solder paste layer; 13. an electronic component; 131. an electronic device to be repaired; 132. a target electronic device;

141. presetting an area; 142. a groove; 15. a first substrate; 16. a second substrate; 161. a receptacle portion;

171. a gap; 172. a filling member; 173. a void portion;

20. a blowing device; 30. carrying the jig; 31. a printing base; 32. a gland; 40. a steel mesh; 50. tin paste; 60. a scraper; 70. and (4) sucking the device.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It is also to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

The inventor of the present application finds that, in order to realize high performance of electronic products such as an unmanned aerial vehicle, a movable trolley, a mobile terminal, a motion camera, and an electronic toy, a plurality of electronic components such as chips are generally integrated in a substrate such as a main board for a flight control of the unmanned aerial vehicle, a main control board of the movable vehicle, and a main board for a mobile terminal that carries a System On Chip (SOC), and the remaining space on the substrate is becoming smaller. When a plurality of electronic components are integrated or disposed on a substrate at high density, poor assembly or damage of some or some electronic components, especially chips, inevitably occurs, and since the space available for repair on the substrate is limited, the repair of the electronic components such as chips becomes more and more challenging.

The following two main methods exist in the conventional chip maintenance method: the first repair method is to use a steel sheet to print solder paste locally on the substrate, and then perform chip repair after placement. The maintenance method is based on that a proper space is reserved around the chip for the steel sheet to print the tin paste on the substrate, and under the high-density design or high-integration design of the electronic element, the space around the chip on the substrate is not enough for the steel sheet to print the tin paste, so that the defective product cannot be maintained or a high maintenance challenge exists in the manufacturing process, and the maintenance yield is low.

The second maintenance method is to perform tin dotting on the substrate by using a tin dotting machine and perform maintenance after placing a chip. For the chip with small gap, the quality stability of the tin dropping amount is poor, the forming consistency of the tin amount is difficult to control, and the maintenance yield is low. For the chip designed in the groove of the substrate, the nozzle of the tin dispensing machine does not have enough space for tin dispensing, and the chip is easy to collide with the substrate or parts around the groove. In addition, the tin dotting machine is expensive, the maintenance cost is high, and the maintenance yield is low. Therefore, in a high-density substrate (i.e., a substrate integrated with a plurality of electronic components at high density), when a certain electronic component, especially a chip, is assembled poorly or damaged, how to repair or rework the electronic component such as the chip in a limited space and ensure the repair yield is one of the technical problems to be solved by those skilled in the art.

In view of the above, the inventors of the present application have improved the circuit board structure to reduce the requirement for the maintenance space of the substrate and improve the maintenance yield of the circuit board structure.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1 and fig. 2, an embodiment of the present application provides an electronic product, which includes a circuit board structure 10 and a housing, where the circuit board structure 10 is disposed on the housing. The electronic product may include at least one of a camera, an unmanned aerial vehicle, an electronic toy, a movable vehicle, a mobile terminal, and the like. The mobile terminal may include at least one of a mobile phone, a tablet computer, and the like.

Referring to fig. 1 and 2, in some embodiments, the circuit board structure 10 includes a connection structure 11, a solder body 12, and at least two substrates. Each substrate is provided with at least one electronic component 13. The connection structure 11 has conductivity. The connecting structure 11 is electrically and mechanically connected to two adjacent substrates.

Referring to fig. 2, the solder body 12 is connected to the electronic component 13 and the substrate, and the solder body 12 includes a connecting solder ball 121 and a solder paste layer 122. The connection solder balls 121 and the solder paste layer 122 are provided on at least one of the at least one electronic component 13 before the at least one of the at least one electronic component 13 is soldered to the substrate.

After at least one electronic component 13 is disposed on the substrate, if a defective or damaged electronic component 13 is mounted, the defective or damaged electronic component 13 is separated from the substrate. Then, after the connection solder balls 121 and the solder paste layer 122 are provided on the electronic component 13 of good quality, the electronic component 13 provided with the connection solder balls 121 and the solder paste layer 122 is soldered to the substrate via the connection solder balls 121 and the solder paste layer 122. Compared with the method that the electronic element 13 with good quality is arranged at the corresponding position of the solder paste layer 122 on the substrate after the solder paste layer 122 is arranged on the substrate, the circuit board structure 10 of the embodiment of the application is firstly provided with the solder paste layer 122 on the electronic element 13 with good quality, and then the electronic element 13 provided with the solder paste layer 122 is welded on the substrate, so that sufficient space for arranging the solder paste layer 122 is not required to be reserved on the substrate, the requirement on the maintenance space of the substrate is reduced, the maintenance is simple and convenient, the maintenance yield of the circuit board structure 10 is improved, the quality of the circuit board structure 10 can be correspondingly improved, and the manufacturing cost is saved.

It is understood that the electronic component 13 of good quality is the same type of component as the one of the electronic components 13 that is defective or damaged as described above.

The electronic component 13 may be a bare chip, a chip package, a passive electronic device, or other active electronic devices, such as at least one of a resistor, an inductor, a capacitor, a communication element, various sensors, and the like. Illustratively, the electronic component 13 includes a chip. At least one electronic component 13 among the electronic components 13 is solder-ball-mounted on the substrate by connecting solder balls 121 and solder paste layers 122. The other electronic components 13 in each electronic component 13 may be soldered to the substrate by solder balls and flux, and the other electronic components 13 in each electronic component 13 may be electrically connected to the substrate by any other suitable electrical connection structure 11, which is not limited herein.

When there are a plurality of electronic components 13, if the plurality of electronic components 13 are disposed on the same substrate, the area occupied by each electronic component 13 on the substrate is the sum of the areas of the plurality of electronic components 13. The larger the number of the electronic components 13, the larger the area of the substrate occupied by each electronic component 13, which increases the area of the electronic product and is not favorable for miniaturization of the electronic product.

In an embodiment of the present application, in order to reduce the size of the electronic product, each electronic component 13 is respectively disposed on at least two substrates, and the at least two substrates are stacked, so that the area of each electronic component 13 is smaller than the sum of the areas of each electronic component 13, the area of each electronic component 13 is greatly reduced, high-density integration of the plurality of electronic components 13 is achieved in a limited space, and the integration level of the electronic product is improved, so that other spaces inside the electronic product are reserved for batteries or other electronic components of the electronic product, and miniaturization of the electronic product is facilitated.

It is understood that the occupied area of each electronic component 13 refers to an area occupied by each electronic component 13 on the same substrate when each electronic component 13 is projected onto the same substrate along the stacking direction of at least two substrates.

It will be appreciated that, since at least two substrates are provided in a stacked arrangement, each substrate having electronic components 13 provided thereon, the electronic components 13 of different subsystems can be separately arranged on the at least two substrates, the number and order of the substrates being independent of the interconnection of a certain electronic component or components 13. The circuit board structure 10 according to the embodiment of the present application can reduce the cost of a certain part of the substrate, compared to the case where each electronic component 13 is provided on the same substrate or circuit board.

Referring to fig. 1, in some embodiments, at least a portion of the connecting structure 11 is sandwiched between two adjacent substrates, so that at least two substrates are stacked at an interval. The connection structure 11 can play a certain supporting role, so that a space for air to flow is formed between two adjacent substrates at a certain distance, and the circulation of the space and the outside is maintained. Under natural conditions or conditions such as an external fan, the air in the space has good fluidity, and the air flowing in the space can exchange heat with the electronic element 13 and at least one of the two adjacent substrates, so that the heat on the electronic element 13 is dissipated conveniently, the heat dissipation effect of the circuit board structure 10 is improved, and the influence of local temperature rise on the performance of the electronic product is avoided.

It will be appreciated that the number of substrates may be set according to actual requirements, for example two, three, four, five or more. The substrates are sequentially stacked, and a connecting structure 11 is provided between two adjacent substrates. The number of the connecting structures 11 arranged between two adjacent substrates can be set according to actual requirements.

It is understood that the material of each substrate may be designed according to actual requirements, for example, the substrate may be made of epoxy resin, ceramic, or High Density Interconnect (HDI) epoxy fiberglass cloth.

Referring to fig. 1 and 2, in some embodiments, at least one of the at least two substrates is provided with a predetermined area 141, and the electronic element 13 connecting the solder ball 121 and the solder paste layer 122 is soldered to the predetermined area 141. Specifically, the electronic component 13 is disposed on the predetermined area 141, and when the electronic component 13 in the predetermined area 141 is poorly assembled or damaged, the connecting solder balls 121 and the solder paste layer 122 are disposed on the electronic component 13 with good quality, and then the electronic component 13 with good quality is soldered to the predetermined area 141, so that the electronic component 13 is repaired easily and the repair yield is high.

Referring to fig. 1, in some embodiments, at least one of the at least two substrates is provided with a plurality of electronic components 13, and at least one of the plurality of electronic components 13 is connected to the soldering body 12 and then soldered to the predetermined area 141.

Referring to fig. 1 and 2, in some embodiments, at least one other of the electronic components 13 cooperates with the predetermined area 141 to form a recess 142. Alternatively, at least another one of the at least two substrates cooperates with the preset area 141 to form the groove 142.

Referring to fig. 3, in some embodiments, in order to improve the integration of the circuit board structure 10, at least two electronic components 13 may be disposed on the same substrate, and at least one of the at least two electronic components 13 is disposed in the predetermined area 141. At least one other of the at least two electronic components 13 cooperates with the predetermined area 141 to form a recess 142. Referring to fig. 1 and 2, in other embodiments, in order to improve the integration of the circuit board structure 10, at least one electronic component 13 may be disposed on at least one of the at least two substrates, and the at least one electronic component 13 is located in the predetermined area 141. At least one other substrate of the at least two substrates cooperates with the predetermined region 141 to form a groove 142.

Illustratively, when the electronic component 13 on the preset area 141 is poorly assembled or damaged and needs to be replaced or repaired, the poorly assembled or damaged electronic component 13 is detached from the preset area 141. At this time, if the solder paste layer 122 is disposed on the predetermined area 141 of the substrate and then another good electronic component 13 is connected to the soldering area, the groove 142 may interfere with the solder paste layer 122 disposed on the predetermined area 141, the maintenance operable space is insufficient, the auxiliary device disposed on the solder paste layer 122 may even easily hit the electronic component 13 or the substrate around the groove 142, the maintenance difficulty is large, and the maintenance yield is low. In some embodiments of the present invention, after the electronic component 13 that is not assembled or damaged is detached from the predetermined area 141, the connection solder balls 121 and the solder paste layer 122 are disposed on another good electronic component 13, and the disposition of the solder paste layer 122 is not affected by the grooves 142, so as to reduce the requirement for the repair space of the substrate and improve the repair yield of the circuit board structure 10.

Referring to fig. 1, 4, 5, 6-10, in some embodiments, the at least two substrates include a first substrate 15 and a second substrate 16. At least a portion of the connecting structure 11 is sandwiched between two adjacent substrates, such that at least two substrates are spaced apart to form a gap 171. The gap 171 can be used for flowing gas or air, and the gap 171 maintains the communication with the outside. Under natural conditions or conditions such as an external fan, the air in the gap 171 has good fluidity, the air flowing in the gap 171 can exchange heat with the electronic element 13 between the first substrate 15 and the second substrate 16, and the air flowing in the gap 171 can also exchange heat with the first substrate 15 and/or the second substrate 16, so that the heat dissipation of the electronic element 13 on the first substrate 15 and/or the second substrate 16 can be accelerated, the heat dissipation effect is improved, and the influence of the local temperature rise of the electronic product on the performance of the electronic product is avoided.

It is understood that the size and shape of each of the at least two substrates may be set according to actual requirements, as long as partial overlapping of the projection areas between the at least two substrates is allowed. Illustratively, the size and shape of the first substrate 15 and the second substrate 16 need not be identical, as long as the first substrate 15 and the second substrate 16 have a partial overlap in the projected area on the first substrate 15 or the second substrate 16 in the stacking direction of the two.

It is understood that the number of the first substrate 15 and the second substrate 16 can be designed according to the actual requirement, for example, one, two, three or more. Illustratively, the number of the first substrates 15 is one, the number of the second substrates 16 is two, and the two second substrates 16 are connected to the first substrate 15 side by side. The two second substrates 16 and the predetermined region 141 of the first substrate 15 cooperate to form the recess 142.

Specifically, the first substrate 15 and the second substrate 16 are disposed oppositely. The first substrate 15 has a front surface and a back surface opposite to the front surface. The second substrate 16 has a first surface facing the back surface of the first substrate 15 and a second surface disposed opposite to the first surface. Electronic components 13 are provided on the front and/or rear surface of the first substrate 15. The electronic component 13 is provided on the first surface and/or the second surface of the second substrate 16. A first bonding pad is disposed on the back surface of the first substrate 15, a second bonding pad corresponding to the first bonding pad is disposed on the first surface of the second substrate 16, and the first bonding pad is electrically connected to the second bonding pad through the connection structure 11. The connecting structure 11 may also serve as a structural support.

The number of the connecting structures 11 can be designed according to actual requirements. For example, the number of the connection structures 11 includes at least four. Illustratively, the number of connecting structures 11 includes at least four. Specifically, the number of the connection structures 11 disposed between two adjacent substrates includes at least four, for example, four, five, six, seven, eight, or more.

Referring to fig. 4, 11 to 18, in some embodiments, at least four connecting structures 11 are disposed at intervals. Specifically, two liang of intervals set up in each connection structure 11, or two adjacent connection structures 11 intervals set up, form the interval space that is used for supplying the air to flow between each connection structure 11 like this, this interval space can supply air or gaseous flow, has guaranteed this interval space and outside circulation, is favorable to speeding up the heat dissipation of at least one among first base plate 15, second base plate 16 or the electronic component 13 that is located on first base plate 15 and second base plate 16, improves the radiating effect, avoids electronic product local intensification too fast, provides the guarantee for electronic product's normal performance.

Referring to fig. 4, 11 to 18, in some embodiments, at least four connection structures 11 are regularly arranged in a predetermined arrangement. Specifically, at least four connection structures 11 are arranged on the first substrate 15 in a predetermined arrangement rule. Alternatively, at least four connection structures 11 are regularly arranged in a predetermined arrangement on the second substrate 16. The predetermined arrangement rule may be designed according to actual requirements, as long as the first substrate 15 can be electrically and mechanically connected to the second substrate 16 through each connection structure 11. In some embodiments, the plurality of connection structures 11 are arranged in an array to facilitate processing of the circuit board structure 10.

Referring to fig. 4 and 5, in some embodiments, the second substrate 16 is provided with a receiving portion 161 for receiving the electronic component 13. It can be understood that at least a portion of the electronic components 13 are located in the accommodating portion 161, so that the spatial interference of the electronic components 13 in the accommodating portion 161 can be reduced, the size of the circuit board structure 10 in the stacking direction of the substrates can be reduced, and the miniaturization of the electronic product is facilitated.

In some embodiments, the accommodating portion 161 is in communication with the gap 171, so that the air flowing in the gap 171 can exchange heat with the electronic component 13 at the accommodating portion 161, thereby accelerating heat dissipation of the electronic component 13 at the accommodating portion 161 and improving heat dissipation effect.

In some embodiments, the accommodating portion 161 penetrates the first surface of the second substrate 16 and the second surface of the second substrate 16, so that air on the side of the second surface of the second substrate 16 can exchange heat with the electronic component 13, thereby improving the heat dissipation effect. In other embodiments, the receptacles 161 are recessed structures.

In some embodiments, the number of receptacles 161 may be set according to actual needs. For example, the number of receptacles 161 is one. As another example, the number of receptacles 161 is multiple, e.g., two, three, or more. The plurality of accommodating portions 161 are provided at intervals on the second substrate 16. The electronic components 13 in each accommodating portion 161 may be the same type of components or different types of components.

The accommodating portions 161 may be arranged on the second substrate 16 in a predetermined rule. The accommodating portions 161 are arranged on the second substrate 16 at intervals along the longitudinal direction of the second substrate 16. For another example, the accommodating portions 161 are arranged on the second substrate 16 at intervals in the width direction of the second substrate 16. For another example, some of the accommodating portions 161 are arranged on the second substrate 16 at intervals along the length direction of the second substrate 16, and other of the accommodating portions 161 are arranged on the second substrate 16 at intervals along the width direction of the second substrate 16. Of course, the arrangement of the accommodating portions 161 is not limited to the above-described embodiment, and is not listed here.

In some embodiments, the accommodating portions 161 are arranged in an array on the second substrate 16 to facilitate the processing of the circuit board structure 10.

In some embodiments, the receptacle 161 houses at least one electronic component 13. That is, one electronic component 13 may be disposed in each accommodating portion 161, or at least two electronic components 13 may be disposed, which is not limited herein.

Referring to fig. 1 to 3, in some embodiments, the connection structure 11 includes spaced solder balls 111, and the spaced solder balls 111 are sandwiched between the first substrate 15 and the second substrate 16. Specifically, the spacer solder balls 111 are solder balls. The spaced solder ball can support the first substrate 15 and/or the second substrate 16 such that the first substrate 15 and the second substrate 16 are spaced apart by a distance to form a gap 171; and the processing is convenient.

In some embodiments, the second substrate 16 may be an interposer. The circuit board structure 10 may be connected to other circuit boards through the second substrate 16. The first substrate 15, the second substrate 16, and the other circuit boards are stacked in this order, and the area of the electronic components 13 is smaller than the sum of the areas of the electronic components 13, which is advantageous for downsizing the electronic product. Wherein, this other circuit boards can be unmanned aerial vehicle's the main control board that flies to control mainboard, portable vehicle, bear SOC's mainboard etc. in the mobile terminal.

Solder balls are respectively mounted on the first surface and the second surface of the second substrate 16 by using solder paste, and the solder balls formed on the first surface of the second substrate 16 are the spacing solder balls 111. Solder balls formed on the second side of the second substrate 16 can be used for connection to other circuit boards. Adopt the solder paste to plant the ball respectively at the first face and the second face of second base plate 16, specifically include: solder paste is adopted to plant balls on the first surface of the adapter plate, and flux residues are cleaned; and (4) planting balls on the second surface of the adapter plate by using solder paste, and cleaning flux residues. In some embodiments, the solder balls on the second surface of the second substrate 16 correspond to the positions of the spacing solder balls 111, i.e., the ball-planting areas on the first surface and the second surface of the second substrate 16 are substantially the same for easy processing.

Referring to fig. 6 to 10, in some embodiments, the connecting structure 11 includes a rigid connecting member 112, and two ends of the rigid connecting member 112 are respectively connected to the first substrate 15 and the second substrate 16.

The circuit board structure 10 manufactured by mechanically and electrically connecting at least two substrates through the frame plate increases the processing difficulty of the circuit board structure 10 because the frame plate is easily subjected to warping deformation. The rigid connecting member 112 of the embodiment of the application has rigidity and is not easy to warp, so that the processing difficulty of the circuit board structure 10 is reduced. Secondly, since the rigid connection member 112 has a certain rigidity, the rigid connection member 112 has a good height consistency, and is not easily collapsed, and the problem of short circuit of the circuit board structure 10 is not easily caused.

In addition, when the circuit board structure 10 of the embodiment of the present application is processed or manufactured, when two adjacent substrates and the rigid connecting member 112 are assembled, the rigid connecting member 112 is accurately positioned, and the connecting position between the rigid connecting member 112 and the substrates is not easy to shift or roll, which is beneficial to the assembly between the rigid connecting member 112 and the substrates and the improvement of the processing efficiency, and the process is simple and the processing cost is low.

It will be appreciated that each of the first and

second substrates

15, 16 may be connected to the rigid connector 112 by any suitable connection means. Referring to fig. 6, 9 and 10, the rigid connector 112 is mounted or inserted on the first substrate 15. And/or, the rigid connector 112 is mounted or inserted on the second substrate 16.

In some embodiments, referring to fig. 6, the first substrate 15 and the second substrate 16 can be attached to the rigid connector 112. Referring to fig. 9, in another embodiment, the first substrate 15 and the second substrate 16 can be connected to the rigid connection member 112 by inserting. Referring to fig. 10, in another embodiment, one of the first substrate 15 and the second substrate 16 is connected to the rigid connector 112 in a plug-in manner, and the other of the first substrate 15 and the second substrate 16 is connected to the rigid connector 112 in a mounting manner. For example, the first substrate 15 is attached to the rigid connectors 112, and the second substrate 16 is inserted to the rigid connectors 112. For another example, the first substrate 15 is connected to the rigid connector 112 by inserting, and the second substrate 16 is connected to the rigid connector 112 by mounting.

Referring to fig. 9 and 10, in some embodiments, a partially rigid connector 112 is inserted into the first substrate 15 and/or the second substrate 16. I.e., a portion of the rigid connector 112 is inserted into the first substrate 15 and/or the second substrate 16.

In some embodiments, the rigid connector 112 extends along the stacking direction of the first substrate 15 and the second substrate 16, so that the rigid connector 112 can connect the first substrate 15 and the second substrate 16 and can separate the first substrate 15 and the second substrate 16 to form a gap 171.

In some embodiments, the number of rigid connectors 112 includes at least four, and at least four rigid connectors 112 are disposed on the first substrate 15 and/or the second substrate 16 in a predetermined regular arrangement. Specifically, the plurality of rigid connectors 112 are arranged in an array on the first substrate 15 or the second substrate 16. For example, the rigid connection elements 112 may be arranged in a square, a field, an L, a double, other regular or irregular shapes, and the like, which is not limited herein. Illustratively, the arrangement shape of each rigid connector 112 is adapted to the contour of the first substrate 15 or the second substrate 16, and may be a regular shape or an irregular shape. The following explanation is provided by arranging a plurality of rigid connection members 112 in an array on the first substrate 15.

Referring to fig. 11 to 18, in some embodiments, at least some of the rigid connectors 112 in the plurality of rigid connectors 112 are disposed on the first substrate 15 in an array to form a first array 113. Specifically, at least some of the rigid connectors 112 in the plurality of rigid connectors 112 are arranged in an array to form a first array 113.

In some embodiments, at least some of the rigid connectors 112 in the plurality of rigid connectors 112 are spaced along the edge region of the first substrate 15 to form the first array 113, so as to improve the mechanical connection reliability of the first substrate 15 and the second substrate 16 and ensure the electrical connection reliability of the first substrate 15 and the second substrate 16. The distance between the first array 113 and the side circumference profile of the first substrate 15 may be set according to practical requirements, and is not limited herein. Referring to fig. 11, the rigid connectors 112 are spaced along the edge region of the first substrate 15 to form a first annular array 113.

In some embodiments, the first array 113 is distributed in a ring shape. The rigid connectors 112 in the first array 113 are disposed around the middle of the first substrate 15.

Referring to fig. 12 to 16, a plurality of rigid connectors 112 are disposed on the first substrate 15 in an array to form a first array 113 and a second array 114. Specifically, some of the rigid connectors 112 in each rigid connector 112 are arranged in an array to form a first array 113. Another portion of the rigid connectors 112 in each rigid connector 112 are arranged in an array to form a second array 114. More specifically, the first array 113 is disposed around the second array 114 to further increase the connection reliability of the first substrate 15 and the second substrate 16. The second array 114 may be in a shape of a straight line, a cross, an X, other regular or irregular array, etc., and is not limited herein.

Referring to fig. 17 and 18, the first array 113 is disposed on at least two sides of the first substrate 15. Specifically, the first arrays 113 are positioned at least at both sides of the middle portion of the first substrate 15. The first substrate 15 and the second substrate 16 may have a regular shape such as a rectangle or any suitable irregular shape, and are not limited thereto. The first substrate 15 is explained below as being rectangular. The first substrate 15 has two long sides and two short sides. The first array 113 is positioned on at least two sides of the two long sides and the two short sides of the first substrate 15. For example, as shown in fig. 17, a portion of the rigid connectors 112 in the first array 113 is disposed on one long side, and another portion of the rigid connectors 112 in the first array 113 is disposed on the other long side. For another example, as shown in fig. 18, a portion of the rigid connectors 112 in the first array 113 is disposed on one of the short sides, and another portion of the rigid connectors 112 in the first array 113 is disposed on the other short side.

In some embodiments, the first array 113 includes a first sub-array 1131 and a second sub-array 1132. The first sub-array 1131 is disposed opposite to the second sub-array 1132 with a space therebetween. Specifically, the second sub-array 1132 is spaced apart from and distributed opposite to the first sub-array 1131 in the edge region of the first substrate 15. More specifically, as shown in fig. 17, the first sub-array 1131 is provided on one long side of the first substrate 15, and the second sub-array 1132 is provided on the other long side of the first substrate 15. As shown in fig. 18, the first sub-array 1131 is provided on one short side of the first substrate 15, and the second sub-array 1132 is provided on the other short side of the first substrate 15.

Referring to fig. 19-22, in some embodiments, the circuit board further includes a filler 172. The filler member 172 is filled and coated on the exterior of at least one rigid connector 112 of the plurality of rigid connectors 112. The filling member 172 can improve the reliability of the circuit board structure 10; on the other hand, the rigid connecting piece 112 can be prevented from being directly contacted with air, so that a uniform transmission medium is provided for signals, and the high-speed signal transmission stability is ensured. The filling member 172 may be made of any suitable material according to actual requirements, such as a molding material or an underfill.

In some embodiments, the filling member 172 is filled and coated outside one portion of the rigid connecting members 112 in the plurality of rigid connecting members 112, the filling member 172 is not disposed outside another portion of the rigid connecting members 112 in the plurality of rigid connecting members 112, and the other portion of the rigid connecting members 112 not filled and coated with the filling member 172 still provides a space for air convection, so as to facilitate heat dissipation of the first substrate 15, the second substrate 16, or the electronic element 13, and achieve heat dissipation effect, signal transmission stability, and connection reliability. Referring to fig. 19, 21 and 22, specifically, a gap 173 is formed in another portion of the rigid connector 112 not filled with the covering filler 172, and the gap 173 can provide a space for air convection, so as to facilitate heat dissipation of the first substrate 15, the second substrate 16 or the electronic component 13, thereby improving the heat dissipation effect of the circuit board structure 10. For example, the gap 173 may be formed by a gap space between two adjacent rigid connectors 112, and the gap space is not filled with the filler 172, that is, the gap space between two adjacent rigid connectors 112 is not filled with the filler 172.

The shape of the rigid connection member 112 can be designed into any suitable shape according to actual requirements, such as a cylinder, a "T" shaped cylinder, an "i" shaped cylinder, other cylinders with different diameters, other regular shapes or irregular shapes, and the like.

Referring to fig. 23, in some embodiments, the rigid connection members 112 extend along the stacking direction of the first substrate 15 and the second substrate 16 in a manner having the same contour dimension. Specifically, the rigid connection member 112 has substantially the same size throughout the stacking direction of the first substrate 15 and the second substrate 16. The rigid connection member 112 of this structure may be inserted or attached to the first substrate 15 or inserted or attached to the second substrate 16.

In some embodiments, rigid connector 112 has a first connection portion 1121, a spacer portion 1122, and a second connection portion 1123. The first connection portion 1121 is connected to the first substrate 15. One end of the spacer 1122 is connected to the first connection portion 1121, and the spacer 1122 is interposed between the first substrate 15 and the second substrate 16 to form a gap 171 between the first substrate 15 and the second substrate 16 for air circulation, thereby improving the heat dissipation effect of the first substrate 15, the second substrate 16, or the electronic element 13. Second connection portion 1123 is connected to the other end of spacer 1122. The second connection portion 1123 is connected to the second substrate 16. Specifically, the first connection portion 1121, the spacer 1122, and the second connection portion 1123 are provided in this order in the stacking direction of the first substrate 15 and the second substrate 16.

Referring to fig. 24 and 25, the first connection portion 1121 has a contour size greater than or equal to that of the spacer 1122. The outline dimension of the second connection portion 1123 is greater than or equal to the outline dimension of the spacer 1122. For example, as shown in fig. 24, the outline size of the first connection portion 1121 is larger than the outline size of the spacer 1122, so as to increase the contact area between the first connection portion 1121 and the first substrate 15, improve the accuracy of mounting and positioning the first connection portion 1121, and facilitate the connection of the first connection portion 1121 with the first substrate 15 through mounting. The second connection portions 1123 have a contour size equal to that of the spacer portions 1122. For another example, as shown in fig. 25, the contour dimension of the first connection portion 1121 is greater than the contour dimension of the spacer 1122, and the contour dimension of the second connection portion 1123 is greater than the contour dimension of the spacer 1122, so as to increase the contact area between the rigid connection member 112 and the first substrate 15 and the second substrate 16, improve the accuracy of mounting and positioning of the rigid connection member 112, and facilitate the mounting and processing of the rigid connection member 112.

Referring to fig. 26 and 27, in some embodiments, the first connection portions 1121 have a smaller outline size than the spacing portions 1122. The second connection portions 1123 have a smaller outline size than the spacer portions 1122. For example, as shown in fig. 26, the first connection portion 1121 has a smaller contour dimension than the spacer portion 1122 so as to facilitate the insertion connection between the first connection portion 1121 and the first substrate 15. The second connection portions 1123 have a contour size equal to that of the spacer portions 1122. For another example, as shown in fig. 27, the outline dimension of the first connection portion 1121 is smaller than the outline dimension of the spacer 1122, and the outline dimension of the second connection portion 1123 is smaller than the outline dimension of the spacer 1122, so that the first connection member is easily inserted onto the first substrate 15 and the second substrate 16.

In some embodiments, the back surface of the first substrate 15 is provided with a first fitting portion for connection with the first connection portion 1121. The first surface of the second substrate 16 is provided with a second fitting portion for connection with the second connection portion 1123. The first and/or second fitting portion may be planar or have a hole-like structure or the like. In some embodiments, the first connection portion 1121 is attached to the back surface of the first substrate 15. In some embodiments, the first fitting portion is a hole-shaped structure, and the first connection portion 1121 is inserted into the first fitting portion.

In some embodiments, the first assembling portion penetrates through the front surface and the back surface of the first substrate 15, so that the connection area of the rigid connector 112 and the first substrate 15 can be increased, and the connection reliability of the rigid connector 112 and the first substrate 15 can be improved.

Likewise, in some embodiments, second connection 1123 is attached to the first surface of second substrate 16. In some embodiments, the second fitting portion is a hole-shaped structure, and the second connection portion 1123 is inserted into the second fitting portion. In some embodiments, the second mounting portion penetrates through the first surface and the second surface of the second substrate 16, so that the connection area between the rigid connector 112 and the second substrate 16 can be increased, and the connection reliability between the rigid connector 112 and the second substrate 16 can be improved.

Referring to fig. 28, in some embodiments, rigid connector 112 includes a first electrical conductor 1124, an insulator 1125, and a second electrical conductor 1126. The first conductor 1124 is electrically connected to two adjacent substrates. The insulator 1125 is disposed around the first conductor 1124. A second electrical conductor 1126 is electrically connected to two adjacent substrates. The second conductive body 1126 covers the insulator 1125. Second electrical conductor 1126 is insulated from first electrical conductor 1124 by an insulator 1125. The rigid connector 112 can improve signal transmission stability by using the first conductor 1124 and the second conductor 1126.

Referring to fig. 28, in some embodiments, the rigid connector 112 further includes a cover 1127. The cover 1127 is disposed outside the second conductive body 1126. Specifically, the cover 1127 includes at least one of an oxidation-resistant cover 1127, an insulating cover 1127, and the like, so as to achieve oxidation resistance or insulating performance of the rigid connector 112 and improve reliability of the circuit board structure 10.

In some embodiments, the coaxial arrangement of the first electrical conductor 1124, the insulator 1125, the second electrical conductor 1126 and the cladding 1127 further improves the signal transmission reliability of the circuit board structure 10.

In some embodiments, first and second

electrical conductors

1124, 1126 may be any suitable electrically conductive material depending on the actual requirements. Illustratively, each of the first and second

electrical conductors

1124 and 1126 includes at least one of a rigid connecting member 112 made of copper, a rigid connecting member 112 made of copper alloy, a rigid connecting member 112 made of aluminum alloy, a rigid connecting member 112 made of silver alloy, a rigid connecting member 112 made of gold alloy, and the like.

The embodiment of the present application further provides a circuit board structure 10, which includes a substrate, a soldering body 12 and at least one electronic component 13. At least one electronic component 13 is provided on the substrate. The solder body 12 is connected to the electronic component 13 and the substrate. The solder body 12 includes a connection solder ball 121 and a solder paste layer 122. Wherein the connection solder balls 121 and the solder paste layer 122 are provided on the electronic component 13 before at least one of the at least one electronic component 13 is soldered to the substrate.

After at least one electronic component 13 is disposed on the substrate, if a defective or damaged electronic component 13 is mounted, the defective or damaged electronic component 13 is separated from the substrate. Then, after the connection solder balls 121 and the solder paste layer 122 are provided on the electronic component 13 of good quality, the electronic component 13 provided with the connection solder balls 121 and the solder paste layer 122 is soldered to the substrate via the connection solder balls 121 and the solder paste layer 122. Compared with the case that the electronic element 13 with good quality is arranged at the corresponding position of the solder paste layer 122 on the substrate, where the solder paste layer 122 is arranged on the substrate firstly, the circuit board structure 10 of the embodiment of the application is provided with the solder paste layer 122 on the electronic element 13 with good quality, so that the circuit board structure does not need a sufficient space for arranging the solder paste layer 122 on the substrate, the requirement on the maintenance space of the substrate is reduced, the maintenance is easy, and the maintenance yield of the circuit board structure 10 is improved.

The number of the substrates can be designed according to actual requirements, such as one, two, three or more. In some embodiments, each electronic component 13 is disposed on the same substrate. In other embodiments, each electronic component 13 is disposed on at least two substrates.

In some embodiments, the substrate is provided with a predetermined area 141, and the electronic component 13 connecting the solder balls 121 and the solder paste layer 122 is soldered to the predetermined area 141. Specifically, the electronic component 13 is disposed on the predetermined area 141, and when the electronic component 13 in the predetermined area 141 is poorly assembled or damaged, the connecting solder balls 121 and the solder paste layer 122 are disposed on the electronic component 13 with good quality, and then the electronic component 13 with good quality is soldered to the predetermined area 141, so that the electronic component 13 is repaired easily and the repair yield is high.

In some embodiments, a plurality of electronic components 13 are disposed on the substrate, and at least one of the electronic components 13 is connected to the soldering body 12 and then soldered to the predetermined area 141.

In some embodiments, at least another one of the plurality of electronic components 13 cooperates with the predetermined area 141 to form the recess 142. In order to increase the integration of the circuit board structure 10, at least one of the electronic components 13 is disposed in the predetermined area 141, and at least another one of the electronic components 13 cooperates with the predetermined area 141 to form the recess 142.

The embodiment of the present application further provides an electronic product, which includes a housing and the circuit board structure 10. The circuit board structure 10 is disposed on the housing. The electronic product comprises at least one of a camera, an unmanned aerial vehicle, an electronic toy, a movable vehicle and a mobile terminal.

Referring to fig. 29, an embodiment of the present application further provides a method for repairing the circuit board structure 10, where the method is used for repairing the circuit board structure 10. The circuit board structure 10 may be the circuit board structure 10 in any of the above embodiments. The maintenance method includes steps S101 to S103.

Step S101, removing the electronic device to be maintained from the area to be maintained of the substrate.

And S102, arranging a connecting solder ball and a solder paste layer on the target electronic device so as to arrange a welding body on the target electronic device.

And step S103, welding the target electronic device provided with the welding body to the to-be-maintained area of the substrate.

In some embodiments, said removing said to-be-repaired electronic device 131 from said to-be-repaired area of said substrate comprises: and (3) introducing hot air to the connecting solder balls 121 between the electronic device 131 to be maintained and the substrate by using an air blowing device 20 so as to separate the substrate from the electronic device 131 to be maintained.

Referring to fig. 30 and 31, specifically, the blowing device 20 is used to blow hot air to the solder balls 121 to heat the solder balls 121 more quickly, so that the solder balls 121 are melted quickly, and the electronic device 131 to be maintained is separated from the substrate quickly, thereby facilitating maintenance and the maintenance method is simple and convenient. The electronic device 131 to be repaired is the electronic component 13 which is assembled poorly or damaged in the circuit board structure 10 of the above embodiment. Illustratively, the first substrate 15 has an area to be repaired. The area to be repaired is the predetermined area 141 in any of the above embodiments. The area to be serviced cooperates with other electronic components 13 to form a recess 142, as shown in fig. 30. Or the area to be repaired is mated with other substrates to form a recess 142, as shown in fig. 31. At least a portion of the electronic device 131 to be serviced is disposed within the recess 142. The following description will take the example of forming the recess 142 by matching the region to be repaired on the first substrate 15 with other substrates.

The blowing device 20 may be a repair station tuyere or the like, and the repair station is used to cover the to-be-repaired electronic device 131 in the groove 142 and call a preset heating curve to heat the connection solder balls 121 disposed between the to-be-repaired electronic device 131 and the first substrate 15, so that the to-be-repaired electronic device 131 is rapidly separated from the first substrate 15, and the to-be-repaired electronic device 131 is detached from the to-be-repaired area of the first substrate 15.

In some embodiments, the disposing the connection solder balls 121 and the solder paste layer 122 on the target electronic device 132 includes: disposing the connection solder balls 121 on the target electronic device 132; a solder paste layer 122 is disposed on the connection balls 121 of the target electronic device 132.

Specifically, the target electronic device 132 may be provided with the connection solder balls 121 during production, or the connection solder balls 121 may be provided before the solder paste layer 122 is provided, which is not limited herein. The type of the target electronic component 132 is the same as the type of the electronic component 13 to be repaired, and the target electronic component 132 is a well-performing electronic component 13.

After the solder balls 121 are disposed on the target electronic device 132, the solder paste layer 122 may be printed on the solder balls 121 of the target electronic device 132 by printing. Compared with the method of tin dispensing, the method of the embodiment of the application has the advantages that the cost of the maintenance equipment is low, and the tin paste is not easy to scatter at other positions to pollute the electronic element 13.

In some embodiments, the disposing of the solder paste layer 122 on the connection solder balls 121 of the target electronic device 132 includes: placing the target electronic device 132 provided with the connecting solder balls 121 on the bearing jig 30; placing a steel mesh 40 on the bearing jig 30 with the target electronic device 132, wherein small holes are formed in the steel mesh 40 and correspond to the positions of the solder balls 121 connected with the target electronic device 132; and coating solder paste on the steel mesh 40, filling the solder paste into the small holes and coating the solder paste on the positions of the connecting solder balls 121, taking down the steel mesh 40 after coating the solder paste, and taking out the target electronic device 132 from the bearing jig 30.

Specifically, referring to fig. 32 to 34, the carrying fixture 30 includes a printing base 31 and a pressing cover 32. Gland 32 and steel mesh 40 are provided on opposite sides of carrying jig 30. The steel net 40 may be previously provided at one side of the printing base 31. The press cover 32 is detachably connected to the printing base 31.

Illustratively, the target electronic device 132 is placed into the printing base 31, and the gland 32 is used to secure the target electronic device 132 only within the printing base 31. The printing base 31 is turned over, and solder paste 50 is printed on the surface of the steel mesh 40 on the back surface of the printing base 31. Specifically, referring to fig. 33, the solder paste 50 is scraped onto the steel mesh 40 by the scraper 60 to push the solder paste 50 into each of the small holes of the steel mesh 40, so as to ensure that the small holes can be sufficiently filled with the solder paste 50. Thus, the solder paste 50 is applied to the positions of the connection solder balls 121 on the target electronic device 132 through the small holes formed in the steel mesh 40.

In some embodiments, before soldering the target electronic device 132 provided with the soldering body 12 to the to-be-repaired area of the substrate, the method further includes: and carrying out detinning treatment on the area to be maintained of the substrate.

After the electronic device 131 to be repaired is removed, tin remains at the region to be repaired of the first substrate 15. In some embodiments, in order to ensure the connection reliability of the target electronic device 132 and the first substrate 15, before the target electronic device 132 provided with the soldering body 12 is soldered on the to-be-repaired area of the substrate, a soldering iron or other tool is used to perform a detinning process on the to-be-repaired area of the first substrate 15.

After the connection solder balls 121 and the solder paste layer 122 are disposed on the target electronic device 132, the target electronic device 132 is positioned on the substrate in the area to be repaired. Referring to fig. 35, for example, the target electronic device 132 provided with the connecting solder balls 121 and the solder paste layer 122 is sucked by the suction device 70, such as a suction nozzle of the repair station, and the target electronic device 132 is positioned at the position of the area to be repaired on the first substrate 15, so that the positions of the connecting solder balls 121 correspond to the positions of the pads at the area to be repaired one by one. The blowing device 20, such as a repairing table nozzle, heats the solder balls 121 and/or solder layers on the target electronic device 132 according to a preset temperature curve, so that the target electronic device 132 is soldered on the first substrate 15, thereby completing the repair of the circuit board structure 10.

According to the manufacturing method of the circuit board structure 10, enough space does not need to be reserved on the substrate for maintenance, the requirement for the maintenance space of the substrate is reduced, and the integration level of products and the design capability of the special circuit board structure 10 are improved. In addition, can maintain on high density design product and heap design product etc. and maintain the yield height, maintain simple and conveniently.

In the manufacturing process of the circuit board structure 10, after a certain electronic component 13 is assembled with the substrate, the electronic component 13 may be poorly assembled or damaged and need to be reworked, so as to ensure the quality of the circuit board structure 10 and improve the yield of the circuit board structure 10. Therefore, referring to fig. 36, an embodiment of the present application further provides a method for manufacturing the circuit board structure 10, which is used for manufacturing the circuit board structure 10. The circuit board structure 10 may be the circuit board structure 10 of any of the above embodiments. Specifically, the circuit board structure 10 includes a substrate, a solder body 12, and at least one electronic component 13 provided on the substrate. The preparation method includes steps S201 to S202.

S201, arranging a connecting solder ball and a solder paste layer on at least one of the at least one electronic element so as to arrange the welding body on the electronic element.

S202, welding the electronic element provided with the welding body on the substrate.

In some embodiments, the disposing of the connection solder balls 121 and the solder paste layer 122 on at least one of the at least one electronic element 13 includes: providing said connection solder balls 121 on at least one of said at least one electronic component 13; a solder paste layer 122 is provided on the connection solder balls 121 of the electronic component 13.

In some embodiments, the disposing of the solder paste layer 122 on the connection solder balls 121 of the electronic component 13 includes: placing the electronic component 13 provided with the connecting solder balls 121 on the bearing jig 30; placing a steel mesh 40 on the carrying jig 30 with the electronic component 13, wherein the steel mesh 40 is provided with small holes corresponding to the positions of the connecting solder balls 121 of the electronic component 13; and coating solder paste on the steel mesh 40, filling the solder paste into the small holes and coating the solder paste on the positions of the connecting solder balls 121, taking down the steel mesh 40 after coating the solder paste, and taking out the electronic component 13 from the bearing jig 30.

The method for manufacturing the circuit board structure 10 can refer to the method for maintaining the circuit board structure 10 in the above embodiments, and will not be described herein again.

According to the manufacturing method of the circuit board structure 10, enough space does not need to be reserved on the substrate for rework, the rework space requirement on the substrate is reduced, and the product integration level and the design capability of the special circuit board structure 10 are improved. In addition, the reworking maintenance can be carried out on high-density design products, stacked design products and the like, the reworking yield is high, and the reworking is simple and convenient.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention, and these modifications or substitutions are intended to be included in the scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A circuit board structure, comprising:

2. The circuit board structure according to claim 1, wherein at least one of the at least two substrates is provided with a predetermined area to which the electronic components connecting the solder balls and the solder paste layers are soldered.

3. The circuit board structure according to claim 2, wherein at least one of the at least two substrates is provided with a plurality of electronic components, and at least one of the plurality of electronic components is soldered to the predetermined area after being connected to the solder body.

4. The circuit board structure of claim 3, wherein at least another one of the plurality of electronic components cooperates with the predetermined area to form a recess; or at least one other of the at least two substrates is matched with the preset area to form a groove.

5. The circuit board structure of claim 1, wherein the at least two substrates comprise:

a first substrate;

and at least part of the connecting structure is clamped between two adjacent substrates, so that at least two substrates are arranged at intervals to form a gap.

6. Circuit-board structure according to claim 5, characterised in that the number of connection structures comprises at least four.

7. The circuit board structure of claim 6, wherein at least four of the connection structures are spaced apart.

8. The circuit board structure according to claim 7, wherein at least four of the connection structures are regularly arranged on the first substrate or the second substrate in a predetermined arrangement.

9. The circuit board structure according to claim 8, wherein a plurality of the connection structures are arranged in an array.

10. The circuit board structure according to claim 5, characterized in that the first substrate has a front side and a back side opposite to the front side; the second substrate has a first face facing the back face of the first substrate and a second face opposite to the first face.

11. The circuit board structure of claim 10, wherein the second substrate is provided with a receiving portion for receiving an electronic component.

12. The circuit board structure of claim 11, wherein the accommodating portion is in communication with the gap.

13. The circuit board structure according to claim 11, wherein the number of the accommodating portions is one; and/or the presence of a gas in the gas,

the number of the accommodating parts is multiple, and the accommodating parts are arranged on the second substrate at intervals.

14. The circuit board structure of claim 13, wherein the receiving portions are arranged in an array on the second substrate.

15. The circuit board structure of claim 11, wherein the accommodating portion accommodates at least one electronic component.

16. The circuit board structure of claim 11, wherein the receiving portion penetrates through the first surface of the second substrate and the second surface of the second substrate.

17. The circuit board structure of claim 10, wherein the connection structure comprises spaced solder balls interposed between the first substrate and the second substrate.

18. The circuit board structure according to claim 10, wherein the connection structure comprises a rigid connector, and both ends of the rigid connector are connected to the first substrate and the second substrate, respectively.

19. The circuit board structure according to claim 18, wherein the rigid connector is mounted or inserted on the first substrate; and/or the rigid connecting piece is mounted or inserted on the second substrate.

20. The circuit board structure according to claim 18, wherein the rigid connection member extends in a stacking direction of the first substrate and the second substrate.

21. The circuit board structure according to claim 18, wherein the rigid connectors extend in a stacking direction of the first substrate and the second substrate in a manner that profile dimensions are the same.

22. The circuit board structure of claim 18, wherein the number of rigid connectors includes at least four, and at least some of the rigid connectors are arranged in an array on the first substrate to form a first array.

23. The circuit board structure of claim 22, wherein at least some of the plurality of rigid connectors are spaced along an edge region of the first substrate to form the first array.

24. The circuit board structure of claim 22, wherein the first array is distributed in a ring shape, and the rigid connectors in the first array are arranged around the middle of the circuit board.

25. The circuit board structure of claim 22, wherein the first array comprises:

a first sub-array;

and the second sub-arrays are distributed in the edge area of the first substrate in a spaced and opposite mode with the first sub-arrays.

26. The circuit board structure of claim 18, wherein the number of rigid connectors includes at least four, and a plurality of rigid connectors are disposed on the first substrate in an array to form a first array and a second array, and the first array is disposed around the second array.

27. The circuit board structure according to claim 18, wherein the number of rigid connectors comprises at least four, the circuit board structure further comprising:

and the filling piece is wrapped outside at least one rigid connecting piece in the plurality of rigid connecting pieces.

28. The circuit board structure according to claim 18, wherein the rigid connector has:

a first connection part connected to the first substrate;

a spacer portion, one end of which is connected to the first connecting portion and is sandwiched between the first substrate and the second substrate;

and a second connection part connected to the other end of the spacer part and connected to the second substrate.

29. The circuit board structure according to claim 28, wherein the first connecting portion has a contour dimension greater than or equal to a contour dimension of the spacer portion; and/or the outline size of the second connecting part is larger than or equal to the outline size of the spacing part.

30. The circuit board structure according to claim 28, wherein the first connecting portion has a profile dimension smaller than a profile dimension of the spacer portion; and/or the outline size of the second connecting part is smaller than that of the spacing part.

31. The circuit board structure according to claim 28, wherein the back surface of the first substrate is provided with a first fitting portion for connection with the first connection portion, and the first surface of the second substrate is provided with a second fitting portion for connection with the second connection portion.

32. The circuit board structure according to claim 31, wherein the first fitting portion is a hole-like structure, and the first connecting portion is inserted in the first fitting portion; and/or the second assembling part is of a hole-shaped structure, and the second connecting part is inserted into the second assembling part.

33. The circuit board structure of claim 18, wherein the rigid connector comprises:

a first conductor electrically connected to the first substrate and the second substrate;

the insulator is sleeved outside the first conductor;

a second conductor electrically connected to the first substrate and the second substrate; the second conductor is sleeved outside the insulator and is arranged in an insulating way with the first conductor through the insulator;

and the cladding body is sleeved outside the second electric conductor.

34. The circuit board structure of claim 1, wherein the electronic component comprises at least one of an active electronic device and a passive electronic device; and/or the electronic component comprises a chip.

35. A circuit board structure, comprising:

a substrate;

at least one electronic component disposed on the substrate; and

wherein the connection solder balls and the solder paste layer are provided on the electronic component before at least one of the at least one electronic component is soldered to the substrate.

36. The circuit board structure of claim 35, wherein the substrate is provided with a predetermined area, and the electronic component connecting the solder balls and the solder paste layer is soldered to the predetermined area.

37. The circuit board structure according to claim 36, wherein a plurality of electronic components are disposed on the substrate, and at least one of the electronic components is connected to the solder body and then soldered to the predetermined area.

38. The circuit board structure of claim 37, wherein at least another of the plurality of electronic components cooperates with the predetermined area to form a recess.

39. An electronic product, comprising:

a housing; and

the circuit board structure of any of claims 1-34, disposed on the housing.

40. The electronic product of claim 39, wherein the electronic product comprises:

at least one of a camera, an unmanned aerial vehicle, an electronic toy, a movable vehicle, and a mobile terminal.

41. An electronic product, comprising:

a housing; and

the circuit board structure of any of claims 35-38, disposed on the housing.

42. The electronic product according to claim 41, wherein the electronic product comprises:

43. The preparation method of the circuit board structure is characterized in that the circuit board structure comprises a substrate, a welding body and at least one electronic element arranged on the substrate; the method comprises the following steps:

providing a solder ball and a solder paste layer on at least one of said at least one electronic component to provide said solder body on said electronic component;

and welding the electronic element provided with the welding body on the substrate.

44. The method of manufacturing a circuit board structure according to claim 43, wherein said providing a connection ball and a solder paste layer on at least one of said at least one electronic component comprises:

disposing the connection solder ball on at least one of the at least one electronic component;

and arranging a tin paste layer on the connecting solder balls of the electronic element.

45. The method of manufacturing a circuit board structure according to claim 44, wherein said disposing a solder paste layer on the connection solder balls of said electronic component comprises:

placing the electronic element provided with the connecting solder balls on the bearing jig;

placing a steel mesh on a bearing jig with electronic components, wherein the steel mesh is provided with small holes corresponding to the positions of connecting solder balls of the electronic components;

and coating the solder paste on the steel mesh, filling the solder paste into the small holes and coating the solder paste on the positions of the connecting solder balls, taking down the steel mesh after coating the solder paste and taking out the electronic element from the bearing jig.

46. A maintenance method of a circuit board structure is characterized in that the circuit board structure comprises a substrate and an electronic device to be maintained; the method comprises the following steps:

removing the electronic device to be repaired from the area to be repaired of the substrate;

arranging a connecting solder ball and a solder paste layer on a target electronic device so as to arrange a solder body on the target electronic device;

and welding the target electronic device provided with the welding body to the to-be-repaired area of the substrate.

47. The method of repairing a circuit board structure of claim 46, wherein said removing said electronic device to be repaired from said area of said substrate to be repaired comprises:

and introducing hot air to the connecting welding balls between the electronic device to be maintained and the substrate through an air blowing device so as to separate the substrate from the electronic device to be maintained.

48. A method of repairing a circuit board structure according to claim 46, wherein said disposing of connection balls and solder paste layers on a target electronic device comprises:

disposing the connection solder balls on the target electronic device;

and arranging a tin paste layer on the connecting solder balls of the target electronic device.

49. A method of repairing a circuit board structure according to claim 48, wherein said disposing a solder paste layer on said connection balls of said target electronic device comprises:

placing the target electronic device provided with the connecting solder balls on the bearing jig;

placing a steel mesh on a bearing jig with a target electronic device, wherein the steel mesh is provided with small holes corresponding to the positions of connecting solder balls of the target electronic device;

and coating the solder paste on the steel mesh, filling the solder paste into the small holes and coating the solder paste on the positions of the connecting solder balls, taking down the steel mesh after coating the solder paste, and taking out the target electronic device from the bearing jig.

50. The method for repairing a circuit board structure according to claim 49, wherein before soldering the target electronic device provided with the soldering body to the region to be repaired of the substrate, the method further comprises:

and carrying out detinning treatment on the area to be maintained of the substrate.