WO2021184189A1

WO2021184189A1 - Circuit board structure, electronic product, and preparation method for circuit board structure

Info

Publication number: WO2021184189A1
Application number: PCT/CN2020/079642
Authority: WO
Inventors: 申中国; 巨涛; 胡正高; 程功
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2020-03-17
Filing date: 2020-03-17
Publication date: 2021-09-23
Also published as: CN112753288A

Abstract

Disclosed are a circuit board structure (10), an electronic product, and a preparation method for the circuit board structure. The circuit board structure (10) comprises rigid connecting members (11) and at least two substrates, wherein each substrate is provided with an electronic element (14); the rigid connecting members (11) have electrical conductivity and are electrically and mechanically connected to the two adjacent substrates; and at least some of the rigid connecting members (11) are sandwiched between the two adjacent substrates, such that the at least two substrates are stacked with a space therebetween.

Description

Circuit board structure, electronic product and preparation method of circuit board structure

Technical field

This application relates to the technical field of electronic products, in particular to a circuit board structure, an electronic product, and a method for manufacturing the circuit board structure.

Background technique

In order to achieve high performance of electronic products such as sports cameras or unmanned aerial vehicles, such electronic products usually need to integrate electronic components with different functions, such as integrated circuit chips and/or passive components. However, in existing electronic products, with the increase in the number of electronic components, different electronic components are usually arranged side by side on the product mainboard. Larger, it is difficult to adapt to people's miniaturization demand for electronic products.

Summary of the invention

Based on this, the present application provides a circuit board structure, an electronic product, and a manufacturing method of the circuit board structure, aiming at reducing the size of the electronic product and miniaturizing the electronic product.

According to the first aspect of this application, this application provides a circuit board structure, including:

At least two substrates, at least two of the substrates are stacked in sequence, and electronic components are provided on each of the substrates;

A rigid connector, which has conductivity, is electrically and mechanically connected to two adjacent substrates;

Wherein, at least part of the rigid connecting member is sandwiched between two adjacent substrates, so that at least two substrates are stacked and arranged at intervals.

According to the second aspect of the present application, the present application provides an electronic product, including: a housing; the circuit board structure as described in any one of the above, arranged on the housing.

According to the third aspect of the present application, the present application provides a method for manufacturing a circuit board structure, the circuit board structure includes a first substrate, a second substrate and a rigid connector, and the manufacturing method includes: connecting the first electronic component to The first substrate; the second electronic component is connected to the second substrate; the first substrate is electrically and mechanically connected to the second substrate through the rigid connector, and the first substrate is connected to the second substrate. The two substrates are stacked and arranged at intervals.

The embodiments of the application provide a circuit board structure, an electronic product, and a preparation method of the circuit board structure, and the board area of each electronic component is smaller than the sum of the area of each electronic component, which greatly reduces the board area of each electronic component , So as to achieve high-density integration of multiple electronic components in a limited space, leaving other space inside the electronic product for the battery or other electronic components of the electronic product, thereby reducing the size of the electronic product, which is beneficial to the electronics Product miniaturization.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following will briefly introduce the drawings used in the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. Ordinary technicians can obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application;

2 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application;

4 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present application;

6 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;

FIG. 7 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;

8 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;

9 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;

10 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;

11 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;

12 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;

13 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors;

14 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors and fillers;

15 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors and fillers;

16 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors and fillers;

FIG. 17 is a partial schematic diagram of a circuit board structure provided by an embodiment of the present application, which shows the arrangement of rigid connectors and fillers;

18 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application;

Figure 19 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application;

20 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application;

Figure 21 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application;

Figure 22 is a schematic structural diagram of a rigid connector provided by an embodiment of the present application;

Figure 23 is a schematic diagram of the internal structure of a rigid connector provided by an embodiment of the present application;

FIG. 24 is a schematic flowchart of a method for manufacturing a circuit board structure provided by an embodiment of the present application.

Description of reference signs:

10. Circuit board structure;

11. Rigid connector; 111, first connection part; 112, spacer part; 113, second connection part; 114, first electrical conductor; 115, insulator; 116, second electrical conductor; 117, cladding;

12. The first substrate; 13. The second substrate; 14. Electronic components;

15. Gap;

16. The first array; 161, the first sub-array; 162, the second sub-array;

17. The second array;

18. Filling pieces;

19. The void part.

Detailed ways

The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

It should also be understood that the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in the specification of this application and the appended claims, unless the context clearly indicates other circumstances, the singular forms "a", "an" and "the" are intended to include plural forms.

It should be further understood that the term "and/or" used in the specification and appended claims of this application refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations .

The inventor of this application found that in order to achieve high performance of electronic products such as drones, movable vehicles, mobile terminals, sports cameras, electronic toys, etc., the flight control main board of the drone, the main control board of the movable vehicle, and the In the terminal, a number of electronic components such as chips are usually integrated in the motherboards of products such as motherboards that carry system-on-chips (SOC). As the demand for "light, thin, short, and small" electronic products continues to increase, the space occupied by the product motherboard has also been further compressed. However, when there are multiple electronic components, the multiple electronic components are usually designed side by side, and the area occupied by each electronic component is the total area of the multiple electronic components. The greater the number of electronic components, the larger the area occupied by each electronic component on the product motherboard, which will increase the area of the electronic product, which is not conducive to the miniaturization of the electronic product. Therefore, how to achieve high-density integration of multiple electronic components in a limited space is one of the technical problems to be solved urgently by those skilled in the art.

In response to this discovery, the inventor of the present application has improved the structure of the circuit board to reduce the footprint of each electronic component, thereby reducing the size of the electronic product and miniaturizing the electronic product. Specifically, the present application provides a circuit board structure, including: at least two substrates, at least two of the substrates are stacked in sequence, and each of the substrates is provided with electronic components; a rigid connector, which has conductivity, and is electrically conductive It is connected and mechanically connected to two adjacent substrates; wherein at least part of the rigid connecting member is sandwiched between two adjacent substrates, so that at least two substrates are stacked and arranged at intervals.

The present application also provides an electronic product, including: a housing; the circuit board structure as described above is arranged on the housing.

The present application also provides a method for preparing a circuit board structure, the circuit board structure includes a first substrate, a second substrate, and a rigid connector, and the preparation method includes: connecting a first electronic component to the first substrate; The second electronic component is connected to the second substrate; the first substrate is electrically and mechanically connected to the second substrate through the rigid connector, and the first substrate and the second substrate are laminated and arranged at intervals.

Hereinafter, some embodiments of the present application will be described in detail with reference to the accompanying drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

1 to 5, the embodiment of the present application provides an electronic product, the electronic product includes a circuit board structure 10 and a housing, and the circuit board structure 10 is disposed on the housing. Among them, the electronic product may include at least one of a camera, an unmanned aerial vehicle, an electronic toy, a movable vehicle, a mobile terminal, and the like. The mobile terminal may include at least one of a mobile phone, a tablet computer, and the like.

Referring to FIGS. 1 to 5, in some embodiments, the circuit board structure 10 includes a rigid connector 11 and at least two substrates. The at least two substrates are stacked in sequence, and each substrate is provided with an electronic component 14. The rigid connector 11 has conductivity, and the rigid connector 11 is electrically and mechanically connected to two adjacent substrates. Wherein, at least part of the rigid connecting member 11 is sandwiched between two adjacent substrates, so that at least two substrates are stacked and arranged at intervals.

When the electronic components 14 are arranged on the same circuit board, the area occupied by each electronic component 14 is the sum of the area of each electronic component 14. In the circuit board structure 10 of the embodiment of the present application, since each electronic component 14 is separately provided on at least two substrates, and at least two substrates are stacked, the area occupied by each electronic component 14 is smaller than the sum of the area of each electronic component 14. , Greatly reducing the footprint of each electronic component 14, thereby achieving high-density integration of multiple electronic components 14 in a limited space, improving the integration of electronic products, and leaving other spaces inside the electronic products The battery or other electronic components of the electronic product further reduce the size of the electronic product, which is conducive to the miniaturization of the electronic product, and improves the battery life of the electronic product or enriches the functions of the electronic product.

Understandably, in some embodiments of the present application, the area occupied by each electronic component 14 refers to that when each electronic component 14 is projected onto the same substrate along the stacking direction of at least two substrates, each electronic component 14 is located there. The area occupied on the same substrate.

Exemplarily, in the circuit board structure 10 of the embodiment of the present application, since at least two substrates are stacked and each substrate is provided with an electronic component 14, the electronic components 14 of different subsystems can be separately arranged on at least two substrates. Above, the number of layers and orders of the substrate is not restricted by the interconnection of a certain electronic component 14. Compared with the electronic components 14 being arranged on the same circuit board, the circuit board structure 10 of the embodiment of the present application can reduce the cost of a certain part of the substrate.

Understandably, a circuit board structure made by mechanically connecting and electrically connecting at least two substrates through a frame plate has a poor heat dissipation effect on the one hand, which is not conducive to the heat dissipation of electronic components, and ultimately leads to the performance of electronic products. Decrease; on the other hand, the frame plate is prone to warpage and deformation, which makes the process more difficult. To this end, the embodiment of the present application is provided with a rigid connector 11 between two adjacent substrates. Specifically, two adjacent substrates are stacked and arranged at intervals by the rigid connecting member 11, and the rigid connecting member 11 can play a supporting role, so that the two adjacent substrates are separated by a certain distance to form a space for air flow, The circulation between the space and the outside is maintained. Under natural conditions or with the addition of a fan, the air in the space has good fluidity, and the air flowing in the space can exchange heat with the electronic component 14 and at least one of the two adjacent substrates, thereby It is convenient for the heat on the electronic component 14 to be dissipated, which improves the heat dissipation effect of the circuit board structure 10, and prevents the electronic product from affecting the performance of the electronic product due to local heating up too fast. At the same time, the rigid connector 11 has rigidity and is not prone to warping deformation, thereby reducing the difficulty of the processing technology of the circuit board structure 10.

Due to the circuit board structure made by mechanically connecting and electrically connecting at least two substrates with solder paste, once the solder paste collapses, the circuit board structure is extremely prone to short-circuit problems; in addition, the height consistency of the solder paste is poor. For this reason, the embodiment of the present application realizes the spaced stacking arrangement of two adjacent substrates through the rigid connector 11. Because the rigid connector 11 has certain rigidity, the rigid connector 11 has good height consistency, is not easy to collapse, and is not easy to appear in the circuit. The board structure 10 is short-circuited.

In addition, when processing or preparing the circuit board structure 10 of the embodiment of the present application, when assembling two adjacent substrates and the rigid connector 11, the positioning of the rigid connector 11 is accurate, and the connection position of the rigid connector 11 and the substrate is different. It is easy to deviate or roll, which is beneficial to the assembly of the rigid connector 11 and the base plate and the improvement of processing efficiency. The process is simple and the processing cost is low.

Understandably, the number of substrates can be set according to actual requirements, for example, two, three, four, five or more. The substrates are stacked in sequence, and a rigid connector 11 is provided between two adjacent substrates. The number of rigid connectors 11 arranged between two adjacent substrates can be set according to actual requirements. Illustratively, the number of rigid connectors 11 includes at least four. Specifically, the number of rigid connectors 11 disposed between two adjacent substrates includes at least four, for example, four, five, six, seven, eight or more.

It is understandable that the material of each substrate can be designed according to actual needs. For example, the substrate can be made of epoxy resin, ceramic, or HDI (High Density Interconnect, HDI) epoxy fiberglass cloth.

Please refer to FIGS. 1 to 5. In some embodiments, the at least two substrates include a first substrate 12 and a second substrate 13. The first substrate 12 is connected to one end of the rigid connector 11. The second substrate 13 is connected to the other end of the rigid connector 11. The second substrate 13 is spaced apart from the first substrate 12 by the rigid connector 11 to form a gap 15. The gap 15 can be used for the flow of gas or air, and the communication between the gap 15 and the outside is maintained. Under natural conditions or with the addition of a fan, the air in the gap 15 has good fluidity, and the air flowing in the gap 15 can generate heat with the electronic components 14 located between the first substrate 12 and the second substrate 13 Exchange, the air flowing in the gap 15 can also exchange heat with the first substrate 12 and/or the second substrate 13, thereby accelerating the heat dissipation of the electronic components 14 on the first substrate 12 and/or the second substrate 13 , Improve the heat dissipation effect, avoid the electronic products from affecting the performance of the electronic products due to local heating up too fast.

Specifically, the first substrate 12 and the second substrate 13 are opposed to each other. The first substrate 12 has a front surface and a back surface opposite to the front surface. The second substrate 13 has a first surface and a second surface. The first surface faces the back surface of the first substrate 12 and the second surface is opposite to the first surface. Electronic components 14 are provided on the front and/or back of the first substrate 12. Electronic components 14 are provided on the first surface and/or the second surface of the second substrate 13. A first pad is provided on the back surface of the first substrate 12, a second pad corresponding to the first pad is provided on the first surface of the second substrate 13, and the first pad is connected to the first pad through the rigid connector 11 The two pads are electrically connected. The rigid connecting member 11 can also play a role of structural support. Specifically, the number and types of electronic components 14 can be designed according to actual requirements, for example, they can include at least one of active electronic devices and passive electronic devices, which are not limited here.

It is understandable that the size and shape of each of the at least two substrates can be set according to actual requirements, as long as a partial overlap of the projected area between the at least two substrates is allowed. Exemplarily, the size and shape of the first substrate 12 and the second substrate 13 need not be exactly the same, as long as the projection of the first substrate 12 and the second substrate 13 on the first substrate 12 or the second substrate 13 in the direction in which they are stacked It is enough if the area overlaps partially.

Understandably, both the first substrate 12 and the second substrate 13 can be connected to the rigid connector 11 by any suitable connection manner. Illustratively, referring to FIG. 1, FIG. 4 and FIG. 5, the rigid connector 11 is attached or inserted on the first substrate 12. The rigid connector 11 is attached or inserted on the second substrate 13.

In some embodiments, referring to FIG. 1, both the first substrate 12 and the second substrate 13 may be connected to the rigid connector 11 in a mounting manner. Referring to FIG. 4, in another embodiment, both the first substrate 12 and the second substrate 13 can be connected to the rigid connector 11 in a plug-in manner. Referring to FIG. 5, in another embodiment, one of the first substrate 12 and the second substrate 13 is connected to the rigid connector 11 in a plug-in manner, and the other of the first substrate 12 and the second substrate 13 One is connected to the rigid connector 11 by means of mounting. For example, the first substrate 12 is connected to the rigid connector 11 in a pasting manner, and the second substrate 13 is connected to the rigid connector 11 in a plug-in manner. For another example, the first substrate 12 is connected to the rigid connector 11 in a plug-in manner, and the second substrate 13 is connected to the rigid connector 11 in a pasting manner.

Please refer to FIGS. 4 and 5. In some embodiments, part of the rigid connector 11 is inserted into the first substrate 12 and/or the second substrate 13. That is, a part of the rigid connector 11 is inserted into the first substrate 12 and/or the second substrate 13.

In some embodiments, the rigid connector 11 extends along the stacking direction of the first substrate 12 and the second substrate 13, so that the rigid connector 11 can not only connect the first substrate 12 and the second substrate 13, but also connect the first substrate A gap 15 is formed between 12 and the second substrate 13 at a certain distance.

Understandably, the number of the rigid connectors 11 provided between the first substrate 12 and the second substrate 13 includes at least four, for example, four, five, six, seven, eight or more.

In some embodiments, at least four rigid connectors 11 are arranged at intervals. In some embodiments, each rigid connecting member 11 is arranged at intervals, or two adjacent rigid connecting members 11 are arranged at intervals, so that an interval space for air flow is formed between the connecting pieces, and the interval space can be The supply of air or gas ensures the communication between the space and the outside, which is beneficial to speed up at least one of the first substrate 12, the second substrate 13, or the electronic components 14 on the first substrate 12 and the second substrate 13 Heat dissipation, improve the heat dissipation effect, avoid local heating up of electronic products too fast, and provide a guarantee for the normal performance of electronic products.

In some embodiments, at least four rigid connectors 11 are arranged in a preset arrangement rule. Specifically, at least four rigid connectors 11 are arranged on the first substrate 12 in a preset arrangement rule. Alternatively, at least four rigid connectors 11 are arranged on the second substrate 13 according to a preset arrangement rule. Hereinafter, an explanation will be given by taking at least four rigid connectors 11 arranged on the first substrate 12 according to a preset arrangement rule as an example. The preset arrangement rule arrangement can be designed according to actual needs, as long as the first substrate 12 can be electrically and mechanically connected to the second substrate 13 through the rigid connectors 11. In some embodiments, the plurality of rigid connectors 11 are arranged in an array to facilitate the processing of the circuit board structure 10. Specifically, the plurality of rigid connectors 11 are arranged in an array on the first substrate 12 or the second substrate 13. For example, the arrangement pattern of each rigid connector 11 can be in the shape of "口", "日", "Tian", "L", "two", other regular or irregular shapes, etc., which are not used here. limited. Exemplarily, the arrangement shape of each rigid connector 11 is adapted to the contour of the first substrate 12 or the first substrate 12, and may be a regular shape or an irregular shape.

Referring to FIGS. 6 to 13, in some embodiments, at least part of the rigid connecting members 11 of the plurality of rigid connecting members 11 are arranged in an array on the first substrate 12 to form a first array 16. Specifically, at least part of the rigid connectors 11 of the plurality of rigid connectors 11 are arranged in an array to form the first array 16.

In some embodiments, at least part of the rigid connectors 11 of the plurality of rigid connectors 11 are arranged at intervals along the edge area of the first substrate 12 to form the first array 16, so as to improve the mechanical performance of the first substrate 12 and the second substrate 13. The reliability of the connection and the reliability of the electrical connection between the first substrate 12 and the second substrate 13 are ensured. The distance between the first array 16 and the side contour of the first substrate 12 can be set according to actual requirements, and is not limited here. Please refer to FIG. 6, the rigid connectors 11 are spaced along the edge area of the first substrate 12 to form a first array 16 in a ring shape.

In some embodiments, the first array 16 is distributed in a ring shape. The rigid connectors 11 in the first array 16 are arranged around the middle of the first substrate 12.

Referring to FIGS. 7 to 11, a plurality of rigid connectors 11 are arranged on the first substrate 12 in an array to form a first array 16 and a second array 17. Specifically, some of the rigid connectors 11 are arranged in an array to form the first array 16. Another part of the rigid connectors 11 is arranged in an array to form a second array 17. More specifically, the first array 16 is arranged around the second array 17 to further increase the connection reliability of the first substrate 12 and the second substrate 13. The second array 17 may be in the shape of a "one", a "cross", an "X", other regular array arrangements or irregular array arrangements, etc., which are not limited herein.

Referring to FIGS. 12 and 13, the first array 16 is located on at least two sides of the first substrate 12. Specifically, the first array 16 is located on at least two sides of the middle of the first substrate 12. The first substrate 12 and the second substrate 13 may have regular shapes such as rectangles or any suitable irregular shapes, which are not limited herein. The explanation will be given below by taking the first substrate 12 as a rectangle. The first substrate 12 has two long sides and two short sides. The first array 16 is located on at least two sides of the two long sides and the two short sides of the first substrate 12. For example, as shown in FIG. 12, a part of the rigid connectors 11 in the first array 16 is provided on one of the long sides, and another part of the rigid connectors 11 in the first array 16 is provided on the other long side. As another example, as shown in FIG. 13, a part of the rigid connectors 11 in the first array 16 is provided on one of the short sides, and another part of the rigid connectors 11 in the first array 16 is provided on the other short side.

In some embodiments, the first array 16 includes a first sub-array 161 and a second sub-array 162. The first sub-array 161 and the second sub-array 162 are arranged opposite to each other at intervals. Specifically, the second sub-array 162 and the first sub-array 161 are spaced and oppositely distributed on the edge area of the first substrate 12. More specifically, as shown in FIG. 12, the first sub-array 161 is provided on one long side of the first substrate 12, and the second sub-array 162 is provided on the other long side of the first substrate 12. As shown in FIG. 13, the first sub-array 161 is provided on one short side of the first substrate 12, and the second sub-array 162 is provided on the other short side of the first substrate 12.

Please refer to FIGS. 14 to 17. In some embodiments, the circuit board structure 10 further includes a filler 18. The filler 18 fills and wraps the exterior of at least one rigid connector 11 among the plurality of rigid connectors 11. The arrangement of the filler 18 can improve the reliability of the circuit board structure 10 on the one hand; on the other hand, it can prevent the rigid connector 11 from directly contacting the air, thereby providing a uniform transmission medium for signals and ensuring the stability of high-speed signal transmission. The filler 18 can be made of any suitable material according to actual needs, such as a molding material or an underfill.

In some embodiments, a part of the rigid connectors 11 of the plurality of rigid connectors 11 is filled with a filler 18 on the outside, and another part of the rigid connectors 11 is not provided with a filler 18 on the outside. The other part of the rigid connector 11 that is not filled with the cladding filler 18 can still provide space for air convection, which facilitates the heat dissipation of the first substrate 12, the second substrate 13 or the electronic components 14, and takes into account the heat dissipation effect and stable signal transmission. And connection reliability. Please refer to FIGS. 14, 16 and 17, specifically, another part of the rigid connecting member 11 of the unfilled cladding filler 18 is formed with a gap 19, which can provide a space for air convection to facilitate the first substrate 12, The heat dissipation of the second substrate 13 or the electronic components 14 improves the heat dissipation effect of the circuit board structure 10. Exemplarily, the void portion 19 may be formed by the void space between two adjacent rigid connectors 11, and the void space is not filled with the filler 18, that is, there is no gap between the two adjacent rigid connectors 11 Fill the filler 18.

The shape of the rigid connecting member 11 can be designed in any suitable shape according to actual needs, such as a cylinder, a "T"-shaped cylinder, an "I"-shaped cylinder, other cylinders with different diameters, other regular shapes or irregular shapes, and so on.

Referring to FIG. 18, in some embodiments, the rigid connector 11 extends along the stacking direction of the first substrate 12 and the second substrate 13 with the same outline size. Specifically, in the stacking direction of the first substrate 12 and the second substrate 13, the dimensions of the rigid connectors 11 are substantially the same everywhere. The rigid connector 11 with this structure can be inserted or attached to the first substrate 12, and can also be inserted or attached to the second substrate 13.

In some embodiments, the rigid connection member 11 has a first connection portion 111, a spacer portion 112 and a second connection portion 113. The first connection portion 111 is connected to the first substrate 12. One end of the spacer 112 is connected to the first connecting part 111. The spacer 112 is sandwiched between the first substrate 12 and the second substrate 13 so that the first substrate 12 and the second substrate 13 form a gap 15 for air circulation and improve The heat dissipation effect of the first substrate 12, the second substrate 13 or the electronic component 14. The second connecting portion 113 is connected to the other end of the spacer 112. The second connection portion 113 is connected to the second substrate 13. Specifically, the first connection portion 111, the spacer portion 112 and the second connection portion 113 are sequentially arranged along the stacking direction of the first substrate 12 and the second substrate 13.

Please refer to FIG. 19 and FIG. 20, the outline size of the first connecting portion 111 is greater than or equal to the outline size of the spacer portion 112. The outline size of the second connecting portion 113 is greater than or equal to the outline size of the spacer 112. For example, as shown in FIG. 19, the outline size of the first connecting portion 111 is larger than the outline size of the spacer portion 112, so as to increase the contact area between the first connecting portion 111 and the first substrate 12, and improve the placement and positioning of the first connecting portion 111. The accuracy of this facilitates the connection of the first connecting portion 111 with the first substrate 12 through mounting. The outline size of the second connecting portion 113 is equal to the outline size of the spacer 112. For another example, as shown in FIG. 20, the outline size of the first connecting portion 111 is larger than the outline size of the spacer portion 112, and the outline size of the second connecting portion 113 is larger than the outline size of the spacer portion 112, so as to increase the rigid connecting piece 11 and the second connecting portion. The contact area between the first substrate 12 and the second substrate 13 improves the accuracy of the mounting and positioning of the rigid connector 11 and facilitates the mounting and processing of the rigid connector 11.

Please refer to FIG. 21 and FIG. 22. In some embodiments, the outline size of the first connecting portion 111 is smaller than the outline size of the spacer portion 112. The outline size of the second connecting portion 113 is smaller than the outline size of the spacer 112. For example, as shown in FIG. 21, the outline size of the first connecting portion 111 is smaller than the outline size of the spacer portion 112 to facilitate the plug-in connection between the first connecting portion 111 and the first substrate 12. The outline size of the second connecting portion 113 is equal to the outline size of the spacer 112. For another example, as shown in FIG. 22, the outline size of the first connecting portion 111 is smaller than the outline size of the spacer portion 112, and the outline size of the second connecting portion 113 is smaller than the outline size of the spacer portion 112, which facilitates the insertion of the first connecting piece. On the first substrate 12 and the second substrate 13.

In some embodiments, the back surface of the first substrate 12 is provided with a first assembling part for connecting with the first connecting part 111. The first surface of the second substrate 13 is provided with a second assembly portion for connecting with the second connecting portion 113. The first assembling part and/or the second assembling part may be a flat part or a hole-like structure or the like. In some embodiments, the first connecting portion 111 is attached to the back surface of the first substrate 12. In some embodiments, the first assembly portion has a hole-shaped structure, and the first connecting portion 111 is inserted into the first assembly portion.

In some embodiments, the first assembly portion penetrates the front and back of the first substrate 12, so that the connection area between the rigid connector 11 and the first substrate 12 can be increased, and the connection between the rigid connector 11 and the first substrate 12 can be improved. reliability.

Similarly, in some embodiments, the second connecting portion 113 is attached to the first surface of the second substrate 13. In some embodiments, the second assembly portion has a hole-shaped structure, and the second connection portion 113 is inserted into the second assembly portion. In some embodiments, the second assembly portion penetrates the first surface and the second surface of the second substrate 13, so that the connection area between the rigid connector 11 and the second substrate 13 can be increased, and the rigid connector 11 and the second substrate can be increased. The connection reliability of the substrate 13.

Please refer to FIG. 23. In some embodiments, the rigid connector 11 includes a first electrical conductor 114, an insulator 115 and a second electrical conductor 116. The first conductor 114 is electrically connected to two adjacent substrates. The insulator 115 is sleeved outside the first conductive body 114. The second conductive body 116 is electrically connected to two adjacent substrates. The second conductive body 116 is sleeved on the outside of the insulator 115. The second electrical conductor 116 is insulated from the first electrical conductor 114 by an insulator 115. The above-mentioned rigid connector 11 adopts the first electrical conductor 114 and the second electrical conductor 116, which can improve the stability of signal transmission.

Please refer to FIG. 23. In some embodiments, the rigid connector 11 further includes a covering body 117. The covering body 117 is sleeved on the outside of the second conductive body 116. Specifically, the covering body 117 includes at least one of the covering body 117 with anti-oxidation property, the covering body 117 with insulating property, etc., so as to realize the anti-oxidation or insulation properties of the rigid connector 11 and improve the structure of the circuit board. 10 reliability.

In some embodiments, the first conductive body 114, the insulator 115, the second conductive body 116, and the covering body 117 are coaxially arranged to further improve the signal transmission reliability of the circuit board structure 10.

In some embodiments, the first conductive body 114 and the second conductive body 116 can use any suitable conductive material according to actual needs. Exemplarily, the first electrical conductor 114 and the second electrical conductor 116 each include a rigid connector 11 made of copper, a rigid connector 11 made of copper alloy, a rigid connector 11 made of aluminum, and a rigid connector 11 made of aluminum alloy. , At least one of the rigid connector 11 made of silver, the rigid connector 11 made of silver alloy, the rigid connector 11 made of gold, the rigid connector 11 made of gold alloy, and the like.

Referring to FIG. 24, an embodiment of the present application also provides a method for preparing a circuit board structure. The preparation method is used for preparing a circuit board structure. The circuit board structure may be the circuit board structure in any of the foregoing embodiments. The preparation method includes step S101 to step S103.

Step S101, connecting a first electronic component to the first substrate.

Step S102, connecting a second electronic component to the second substrate.

Step S103: The first substrate is electrically and mechanically connected to the second substrate through the rigid connector, and the first substrate and the second substrate are laminated and arranged at intervals.

In some embodiments, the first substrate is connected to the second substrate through at least four of the rigid connectors. Specifically, in the process of preparing the circuit board structure, at least four of the rigid connectors can be connected to the first substrate and/or the second substrate at the same time, so as to improve the processing efficiency and reduce the relative relationship between the rigid connectors. The position error of the rigid connector can be accurately positioned.

In some embodiments, the position error of each rigid connector is 0-20u, for example, it can be any other suitable value among 0u, 3u, 5u, 7u, 10u, 13u, 15u, 20u, and 0-20u.

In some embodiments, the rigid connector includes a first electrical conductor, an insulator, and a second electrical conductor. The first conductor is electrically connected to two adjacent substrates. The insulator is sheathed outside the first conductive body. The second conductor is electrically connected to two adjacent substrates. The second conductive body is sheathed outside the insulator. The second electrical conductor is insulated from the first electrical conductor by the insulator. The above-mentioned rigid connector adopts the first electrical conductor and the second electrical conductor, which can improve the signal transmission stability.

In some embodiments, the first electrical conductor and the second electrical conductor may use any suitable conductive material according to actual requirements. Exemplarily, the first electrical conductor and the second electrical conductor both include a rigid connector made of copper, a rigid connector made of copper alloy, a rigid connector made of aluminum, a rigid connector made of aluminum alloy, and silver At least one of a rigid connector made of material, a rigid connector made of silver alloy, a rigid connector made of gold, a rigid connector made of gold alloy, and the like.

In some embodiments, the rigid connector further includes a covering body. The covering body is sleeved on the outside of the second conductive body. Specifically, the covering body includes at least one of a covering body with anti-oxidation properties, a covering body with insulating properties, etc., so as to realize the anti-oxidation or insulation performance of the rigid connector and improve the reliability of the circuit board structure. sex.

In some embodiments, the preparation method further includes: externally filling at least one of the at least two rigid connectors with a covering filler.

Specifically, the filler is filled and covered on the outside of at least one of the plurality of rigid connectors. In this way, on the one hand, the reliability of the circuit board structure can be improved; on the other hand, the rigid connector can be prevented from directly contacting the air, thereby providing a uniform transmission medium for the signal and ensuring the stability of high-speed signal transmission. In some embodiments, a part of the rigid connectors of the plurality of rigid connectors is filled with a filler, and another part of the rigid connectors is not provided with a filler, and is not filled with a filler. The other part of the rigid connector can still provide space for air convection, which facilitates the heat dissipation of the first substrate, the second substrate or the electronic components, and takes into account the heat dissipation effect, signal transmission stability and connection reliability. The filler can be made of any suitable material according to actual needs, such as molding material or underfill rubber.

In some embodiments, the electrically connecting and mechanically connecting the first substrate to the second substrate through the rigid connector includes: attaching or inserting the rigid connector on the first substrate Attach or insert the rigid connector on the second substrate.

Specifically, in some embodiments, the first substrate may be connected to the rigid connector in a pasting manner, and the second substrate may be connected to the rigid connector in a pasting manner. In another embodiment, the first substrate can be connected to the rigid connector in a plug-in manner, and the second substrate can be connected to the rigid connector in a plug-in manner. In yet another embodiment, one of the first substrate and the second substrate may be connected to the rigid connector in a plug-in manner, and the other one of the first substrate and the second substrate may be in a mounting manner Connect with rigid connector.

In the circuit board structure produced by the preparation method of the above embodiment, since the electronic components are separately arranged on the first substrate and the second substrate, and the first substrate and the second substrate are stacked, the area occupied by the electronic components is smaller than that of the electronic components. The total area of the components. Compared with the electronic components arranged on the same circuit board, the circuit board structure made by the embodiment of the present application greatly reduces the area occupied by the electronic components, thereby realizing the realization in a limited space. The high-density integration of multiple electronic components improves the integration of electronic products, thereby leaving other spaces inside the electronic products for the batteries or other electronic components of the electronic products, thereby reducing the size of the electronic products, which is beneficial to the electronics Product miniaturization, and improve the battery life of electronic products or enrich the functions of electronic products.

Understandably, the footprint of each electronic component means that when each electronic component is projected onto the same substrate (first substrate or second substrate) along the stacking direction of the first substrate and the second substrate, each electronic component is The area occupied by the same substrate.

Exemplarily, in the circuit board structure produced by the preparation method of the embodiment of the present application, since the first substrate and the second substrate are stacked, and the first substrate and the second substrate are both provided with electronic components, different subsystems can be integrated The electronic components are separately arranged on the first substrate and the second substrate, and the number of layers and orders of the substrate are not restricted by the interconnection of a certain electronic component. Compared with all electronic components being arranged on the same circuit board, the circuit board structure manufactured by the embodiment of the present application can reduce the cost of a certain part of the substrate.

Understandably, a circuit board structure made by mechanically connecting and electrically connecting at least two substrates through a frame plate has a poor heat dissipation effect on the one hand, which is not conducive to the heat dissipation of electronic components, and ultimately leads to the performance of electronic products. Decrease; on the other hand, the frame plate is prone to warpage and deformation, which makes the process more difficult. In the circuit board structure produced by the preparation method of the embodiment of the present application, two adjacent substrates are stacked and arranged at intervals by the rigid connector, and the rigid connector can play a supporting role, so that the two adjacent substrates are separated by a certain distance. A space for air to flow is formed, and the communication between the space and the outside is maintained. Under natural conditions or with the addition of a fan, the air in the space has good fluidity, and the air flowing in the space can exchange heat with at least one of the electronic components, the first substrate, and the second substrate, thereby It facilitates the dissipation of heat from the electronic components, improves the heat dissipation effect of the circuit board structure, and prevents the electronic product from affecting the performance of the electronic product due to local heating up too fast. At the same time, the rigid connector has rigidity and is not prone to warping deformation, thereby reducing the difficulty of the processing technology of the circuit board structure.

Due to the circuit board structure made by mechanically connecting and electrically connecting at least two substrates with solder paste, once the solder paste collapses, the circuit board structure is extremely prone to short-circuit problems; in addition, the height consistency of the solder paste is poor. For this reason, the circuit board structure prepared in the embodiments of the present application realizes the spaced stacking arrangement of two adjacent substrates through rigid connectors. Because the rigid connectors have certain rigidity, the rigid connectors have good height consistency and are not easy to be pressed. It is not easy to cause the short circuit problem of the circuit board structure.

In addition, in the circuit board structure produced by the preparation method of the embodiment of the present application, when two adjacent substrates and rigid connectors are assembled, the positioning of each rigid connector is accurate, and the connection position of the rigid connector and the substrate is not easy. When offset or rolling occurs, the relative position error between the rigid connectors is small, which is beneficial to the assembly of the rigid connectors and the base plate, improves the processing efficiency, and has a simple process and low processing cost.

The above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or changes within the technical scope disclosed in this application. Replacement, these modifications or replacements shall be covered within the scope of protection of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

A circuit board structure, characterized in that it comprises:

At least two substrates, at least two of the substrates are stacked in sequence, and electronic components are provided on each of the substrates;

A rigid connector, which has conductivity, is electrically and mechanically connected to two adjacent substrates;

Wherein, at least part of the rigid connecting member is sandwiched between two adjacent substrates, so that at least two substrates are stacked and arranged at intervals.
The circuit board structure according to claim 1, wherein the at least two substrates comprise:

The first substrate is connected to one end of the rigid connector;

The second substrate is connected to the other end of the rigid connecting member; the second substrate is spaced from the first substrate through the rigid connecting member to form a gap.
The circuit board structure according to claim 2, wherein the rigid connector is attached or inserted on the first substrate; and/or, the rigid connector is attached or inserted on the On the second substrate.
3. The circuit board structure according to claim 3, wherein part of the rigid connector is inserted into the first substrate and/or the second substrate.
3. The circuit board structure according to claim 2, wherein the rigid connector extends along the stacking direction of the first substrate and the second substrate.
3. The circuit board structure according to claim 2, wherein the rigid connector extends along the stacking direction of the first substrate and the second substrate with the same outline size.
The circuit board structure according to claim 2, wherein the number of the rigid connectors includes at least four.
8. The circuit board structure of claim 7, wherein at least four of the rigid connectors are arranged at intervals.
8. The circuit board structure according to claim 7, wherein at least four of the rigid connectors are arranged on the first substrate or the second substrate according to a preset arrangement rule.
9. The circuit board structure of claim 9, wherein a plurality of the rigid connectors are arranged in an array.
10. The circuit board structure of claim 10, wherein at least some of the plurality of rigid connectors are arranged in an array on the first substrate to form a first array.
11. The circuit board structure according to claim 11, wherein at least some of the plurality of rigid connectors are arranged at intervals along the edge area of the first substrate to form the first array.
The circuit board structure of claim 12, wherein the first array is located on at least two sides of the first substrate.
11. The circuit board structure according to claim 11, wherein the first array is distributed in a ring shape, and the rigid connectors in the first array are arranged around the middle of the circuit board.
The circuit board structure of claim 11, wherein the first array comprises:

First sub-array

The second sub-array is distributed opposite to the first sub-array in the edge area of the first substrate.
The circuit board structure of claim 10, wherein a plurality of the rigid connectors are arranged in an array on the first substrate to form a first array and a second array, and the first array surrounds the The second array setting.
8. The circuit board structure of claim 7, wherein the circuit board structure further comprises:

The filler is used to fill and wrap the exterior of at least one of the plurality of rigid connectors.
The circuit board structure according to claim 2, wherein the rigid connector has:

A first connecting portion connected to the first substrate;

A spacer, one end of which is connected to the first connecting portion, and is sandwiched between the first substrate and the second substrate;

The second connection part is connected to the other end of the spacer part and connected to the second substrate.
The circuit board structure according to claim 18, wherein the first connection portion, the spacer portion, and the second connection portion are sequentially arranged along the stacking direction of the first substrate and the second substrate .
The circuit board structure according to claim 18, wherein the outline size of the first connecting portion is greater than or equal to the outline size of the spacer; and/or the outline size of the second connecting portion is larger than or It is equal to the outline size of the spacer.
The circuit board structure according to claim 18, wherein the outline size of the first connecting portion is smaller than the outline size of the spacer; and/or the outline size of the second connecting portion is smaller than the spacer The outline size of the part.
The circuit board structure of claim 18, wherein the first substrate has a front surface and a back surface opposite to the front surface; the second substrate has a first surface facing the back surface of the first substrate, and The first side is opposite to the second side.
The circuit board structure according to claim 22, wherein the back surface of the first substrate is provided with a first assembly portion for connecting with the first connection portion, and the first surface of the second substrate is provided with a In the second assembling part connected with the second connecting part.
22. The circuit board structure of claim 23, wherein the first connecting portion is mounted on the back surface of the first substrate.
23. The circuit board structure according to claim 23, wherein the first assembling portion is a hole-shaped structure, and the first connecting portion is inserted into the first assembling portion.
26. The circuit board structure of claim 25, wherein the first assembling portion penetrates through the front and back of the first substrate.
26. The circuit board structure according to any one of claims 23-26, wherein the second connecting portion is mounted on the first surface of the second substrate.
28. The circuit board structure of claim 27, wherein the second assembling portion is a hole-shaped structure, and the second connecting portion is inserted into the second assembling portion.
28. The circuit board structure of claim 28, wherein the second assembling portion penetrates the first surface and the second surface of the second substrate.
The circuit board structure according to claim 1, wherein the rigid connector comprises:

The first electrical conductor is electrically connected to two adjacent substrates;

An insulator, sheathed outside the first electrical conductor;

The second electrical conductor is electrically connected to two adjacent substrates; and is sheathed outside the insulator, and the second electrical conductor is insulated from the first electrical conductor by the insulator.
The circuit board structure according to claim 30, wherein the rigid connector further comprises:

The covering body is sleeved on the outside of the second conductive body.
The circuit board structure according to claim 31, wherein the covering body comprises at least one of a covering body having anti-oxidation properties and a covering body having insulation properties.
The circuit board structure according to claim 31, wherein the first conductive body, the insulator, the second conductive body and the cladding body are coaxially arranged.
The circuit board structure according to claim 30, wherein the first electrical conductor and the second electrical conductor both comprise a rigid connector made of copper, a rigid connector made of copper alloy, and a rigid connection made of aluminum. At least one of a rigid connector, an aluminum alloy rigid connector, a silver rigid connector, a silver alloy rigid connector, a gold rigid connector, and a gold alloy rigid connector.
The circuit board structure according to claim 1, wherein the electronic component includes at least one of an active electronic device and a passive electronic device.
An electronic product, characterized in that it includes:

case;

The circuit board structure according to any one of claims 1-35, which is arranged on the housing.
The electronic product according to claim 36, wherein the electronic product comprises:

At least one of cameras, unmanned aerial vehicles, electronic toys, movable vehicles, and mobile terminals.
A method for preparing a circuit board structure, characterized in that the circuit board structure includes a first substrate, a second substrate and a rigid connector, and the preparation method includes:

Connecting the first electronic component to the first substrate;

Connecting a second electronic component to the second substrate;

The first substrate is electrically and mechanically connected to the second substrate through the rigid connector, and the first substrate and the second substrate are laminated and arranged at intervals.
The preparation method according to claim 38, wherein the first substrate is connected to the second substrate through at least four of the rigid connectors.
The preparation method according to claim 39, wherein the position error of each of the rigid connectors is 0-20u.
The preparation method according to claim 39, wherein the preparation method further comprises:

At least one of the at least two rigid connectors is externally filled with a covering filler.
The preparation method according to claim 38, wherein the electrically and mechanically connecting the first substrate to the second substrate through the rigid connection member comprises:

Mounting or inserting the rigid connector on the first substrate;

Mounting or inserting the rigid connector on the second substrate.