CN210093807U - Temperature control system of laminated circuit board and large-current brushless servo motor driver - Google Patents
Temperature control system of laminated circuit board and large-current brushless servo motor driver Download PDFInfo
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- CN210093807U CN210093807U CN201920309259.2U CN201920309259U CN210093807U CN 210093807 U CN210093807 U CN 210093807U CN 201920309259 U CN201920309259 U CN 201920309259U CN 210093807 U CN210093807 U CN 210093807U
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Abstract
The utility model discloses a temperature control system and brushless servo motor driver of heavy current of stromatolite circuit board. The temperature control system comprises at least two circuit boards which can be completely or partially overlapped, wherein a gap between the circuit boards is arranged at the overlapping part of the circuit boards, each circuit board is provided with at least one connector connected with other circuit boards, at least one fan which has the same blowing direction and is aligned with the side surface of all or part of the circuit boards and/or is intermittently arranged between the circuit boards, and all or part of the circuit boards are provided with a first temperature sensor and a control module; the control module receives a temperature signal of the first temperature sensor and outputs a control signal corresponding to the temperature signal to a rotating speed adjusting end of the fan. Controlling the rotating speed of the fan according to the actual temperature of the circuit board to enable the laminated circuit board to work at a proper temperature; the fan is aligned with the side of all or part of the circuit boards and/or the intermittence between the boards, so that the heat of each circuit board and the heat above the circuit board cannot enter other circuit boards, and the heat crosstalk between the boards is reduced.
Description
Technical Field
The utility model relates to a motor driver especially relates to a temperature control system and the brushless servo motor driver of heavy current of stromatolite circuit board.
Background
The large-current brushless servo motor driver is widely applied to the fields of electric automobiles, precision instruments, medical instruments, robots and the like at present and is a core component for driving the brushless direct current motor. The driver generally adopts the design of one deck circuit board, and the controller volume of this kind of structure is generally very big, is being applied to heavy current brushless motor, and the volume can be very big, and be not convenient for install to produce the signal between power device and the logic device easily and interfere with each other, the power device during operation of heavy current brushless servo motor can produce a large amount of heats simultaneously, and this heat can cause the operational environment temperature of logic device to increase, its working property descends.
Chinese patent publication No. CN207069950U in the prior art discloses an air-cooled isolated BLDCM controller structure, which includes four PCB boards, namely, a first PCB board, a second PCB board, a third PCB board and a fourth PCB board, a heat sink, a small dc fan set, an IPM module, a bus capacitor charging current-limiting resistor, a bus capacitor charging current-limiting switching tube, a brake resistor, two signal isolating aluminum boards, namely, a first shielding aluminum board and a second shielding aluminum board, and other components and external interfaces forming a control circuit; the hierarchical design is adopted to realize reliable isolation of weak current and strong current, the bottommost layer is a power circuit part, the upper layer is an analog signal and power supply conversion circuit part, the top layer is a digital signal circuit part, and an air cooling forced heat dissipation mode suitable for a brushless direct current motor control system is designed. Although this patent adopts according to circuit board function layering design to add shielding aluminum plate, realized that forceful electric power and weak current are effectively kept apart, weaken strong and weak electric electromagnetic interference, hug closely the bottom radiator with the power component that easily generates heat, increase heat radiating area as far as, and be furnished with the fan in order to accelerate the radiating rate, it has the ventilation radiating groove to open on the controller casing, in order in time with the heat release on the PCB board. However, the fan set in the patent only cools the bottom layer power element through the heat sink in an air cooling manner, and because the power element is the largest heat source, the temperature of the upper layer PCB board is increased through heat conduction, and the working performance of the devices on the upper layer PCB board is further affected, but the patent does not relate to the problem; meanwhile, the rotating speed of the fan set cannot be adjusted along with the actual temperature of the PCB, so that the problems that the fan continuously works at a lower temperature to waste energy and the air cooling capacity of the fan cannot meet the heat dissipation requirement at a higher temperature exist.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving the technical problem who exists among the prior art at least, innovated a temperature control system and the brushless servo motor driver of heavy current of stromatolite circuit board very much.
In order to achieve the above object of the present invention, according to a first aspect of the present invention, the present invention provides a temperature control system for a laminated circuit board, including at least two circuit boards that can be placed in a wholly or partially overlapped manner, wherein an inter-board gap is provided at the overlapped portion of the circuit boards, at least one connector connected to other circuit boards is provided on each circuit board, at least one fan is provided with the same blowing direction and aligned with the side surface of the whole or partial circuit boards and/or the inter-board interval, and a first temperature sensor and a control module are provided on the whole or partial circuit boards;
the control module receives a temperature signal of the first temperature sensor and outputs a control signal corresponding to the temperature signal to a rotating speed adjusting end of the fan.
The beneficial effects of the above technical scheme are: the rotating speed of the fan is controlled according to the actual temperature of the circuit board, so that the problems that the energy is wasted when the low-temperature fan works and the wind speed of the high-temperature fan does not meet the refrigeration requirement are solved, and the laminated circuit board works at a proper temperature; in addition, the fan is aligned with the side faces of all or part of the circuit boards and/or the intervals among the circuit boards, so that hot air on each circuit board and above the circuit boards is transferred out through the space near the circuit boards and/or the gaps among the circuit boards, heat among the circuit boards is isolated, other circuit boards cannot enter, and crosstalk of heat among the circuit boards is reduced.
In a preferred embodiment of the present invention, the first temperature sensor is disposed in the vicinity of a heat generating element of the circuit board.
The beneficial effects of the above technical scheme are: the temperature of the highest temperature point on the circuit board is obtained, the damage or working failure caused by the fact that the temperature around the heating element reaches the limit is avoided, and the reliability of temperature control is improved.
In a preferred embodiment of the invention, the inter-board gap is formed by support columns arranged on two diagonal vertices or four vertices of the circuit board.
The beneficial effects of the above technical scheme are: the mechanical installation is convenient, and the width of the gap between the plates can be adjusted.
In a preferred embodiment of the present invention, the supporting column is made of a heat insulating material.
The beneficial effects of the above technical scheme are: the thermal crosstalk between the circuit boards is prevented from being accelerated due to the heat conduction of the supporting columns.
In a preferred embodiment of the present invention, the connector is connected to a connector of a circuit board adjacent to the circuit board where the connector is located, and the connectors connected to each other are a pin and a socket that are mutually matched and directly inserted, so that a gap between the boards is formed when the two are directly inserted.
The beneficial effects of the above technical scheme are: the installation is simple and convenient.
In a preferred embodiment of the present invention, the control module includes a first comparator, a first reference power supply, an electronic switch, a second reference power supply and an adding circuit, an output end of the first temperature sensor is connected to a positive input end of the first comparator, an output end of the first reference power supply is connected to a negative input end of the first comparator, an output end of the first comparator is connected to a conduction control end of the electronic switch, a first end of the electronic switch is connected to the second reference power supply, a second end of the electronic switch is connected to a first input end of the adding circuit, an output end of the first temperature sensor is further connected to a second input end of the adding circuit, and an output end of the adding circuit is connected to a rotation speed adjusting end of the fan;
the output voltage value of the first reference power supply is the voltage value output when the temperature sensed by the first temperature sensor reaches the threshold temperature for starting air cooling; the output voltage value of the second reference power supply is the difference value of the minimum input voltage of the rotating speed adjusting end of the fan and the minimum output voltage of the first temperature sensor.
The beneficial effects of the above technical scheme are: the hardware circuit structure of the control module is simple and reliable, algorithm and program intervention are not needed, and the rotating speed of the fan can be automatically adjusted to realize automatic temperature management.
In a preferred embodiment of the present invention, the heat sink further includes a heat sink in contact with the bottom surface of the bottom circuit board.
The beneficial effects of the above technical scheme are: further, the bottom circuit board is cooled, and the cooling performance of the system is enhanced.
In order to realize the above-mentioned purpose, according to the utility model discloses a second aspect, the utility model provides a heavy current brushless servo motor driver has temperature control system, the circuit board from the bottom up that overlaps includes first circuit board, second circuit board and third circuit board in proper order.
The beneficial effects of the above technical scheme are: besides the beneficial effects of the temperature control system, the motor control signal output by the temperature control system has high precision, and the working performance of the motor is improved.
In a preferred embodiment of the present invention, the first circuit board is provided with a driving circuit for driving current commutation in the motor coil and a first temperature sensor, and the fan blows air to the side surface of the first circuit board and/or the gap between the plates above the first circuit board;
the second circuit board is provided with a signal conditioning circuit and an A/D conversion circuit;
and the third circuit board is provided with an external interface and a control module.
The beneficial effects of the above technical scheme are: the main devices on the three circuit boards are disclosed, from bottom to top, the heat productivity of the devices on the circuit boards is gradually reduced, the heating element containing the power element is arranged on the first circuit board, the heat productivity is large, the heat produced can be discharged in time in a targeted mode through the fan, and the influence on other circuit boards is greatly reduced.
In a preferred embodiment of the present invention, the external interface includes a serial interface for communicating with the upper computer, a signal input interface of the second temperature sensor for sensing the temperature of the motor, a fan control interface, a signal input interface of the position sensor for sensing the position of the rotor of the motor, and a part or all of a signal input interface of the torque sensor for measuring the torque of the motor shaft.
The beneficial effects of the above technical scheme are: the connection with the external motor, the sensor on the motor and the upper computer of the user is facilitated.
Drawings
FIG. 1 is a schematic front view of a temperature control system according to an embodiment of the present invention;
fig. 2 is a schematic view of a temperature control system structure according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a control module according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, unless otherwise specified and limited, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, mechanically or electrically connected, or may be connected between two elements through an intermediate medium, or may be directly connected or indirectly connected, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.
The utility model provides a temperature control system of stromatolite circuit board, in a preferred implementation mode of this temperature control system, this temperature control system is as shown in fig. 1 and fig. 2, including at least two circuit boards that can wholly or partly overlap and place, be provided with the interplate clearance in circuit board overlap part, be provided with at least one connector that is connected with other circuit boards on every circuit board, at least one is bloied the same direction and aims at the side of whole or partial circuit board and/or the intermittent fan between the interplate, be provided with first temperature sensor on whole or partial circuit board, and control module;
the control module receives the temperature signal of the first temperature sensor and outputs a control signal corresponding to the temperature signal to the rotating speed adjusting end of the fan.
In the embodiment, the fan is located at the side of the laminated circuit board, the air outlet of the fan faces the side face of the laminated circuit board and/or the gap between the laminated circuit board, and the fan can be fixed on the laminated circuit board or fixed through another support. Preferably, the fan only aims at the circuit board with the largest heating value and/or the gap between the boards above the circuit board, so that the cost is lowest, and the temperature control benefit is greatest.
In the present embodiment, the first temperature sensor is preferably disposed on a circuit board that generates the largest amount of heat, such as a circuit board that generates the largest amount of power components, and is preferably disposed close to the heat generating components. The first temperature sensor is preferably, but not limited to, an NTC resistor, which is connected in series with a reference resistor, one end of the reference resistor is connected to a power source terminal, the other end of the reference resistor is connected to a first end of the NTC resistor, a second end of the NTC resistor is connected to ground, and the first end of the NTC resistor serves as an output terminal of the first temperature sensor.
In the present embodiment, the fan is preferably, but not limited to, a micro dc electric fan, such as a dc fan of wind source company, and the rotation speed of the fan, i.e. the wind volume, can be adjusted by the magnitude of the input dc voltage, such as FD3007S1H-AP00 or FD3007S2H-AP 00. Because the input voltage of the fan has a range, the output signal of the first temperature sensor is matched with the range, preferably, the control module is an addition circuit which is conventionally built by an operational amplifier in the field, the positive input end of the addition circuit is respectively connected with the output end of the first temperature sensor and a second reference power supply, the output end of the addition circuit is connected with the voltage input end of the fan, the value range of the output voltage value of the second reference power supply is obtained by subtracting the output voltage range of the first temperature sensor from the input voltage range of the fan, the voltage reference chip of the voltage corresponding to TI or ADI company and a peripheral circuit thereof can be selected for obtaining, the specific circuit structure refers to a technical manual of the selected chip, and the detailed description is omitted. When there are a plurality of fans, it is preferable that the voltage input terminals of the plurality of fans are connected in parallel, for example, the output terminal of the adder circuit is connected to the voltage input terminal of each fan.
In the present embodiment, the connectors are preferably, but not limited to, electrically connected through a bus line or an FPC flexible board, and are used for outputting signals from the circuit board to other circuit boards or receiving signals from other circuit boards.
In a preferred embodiment of the invention, the interplate gap is formed by support columns arranged on two diagonal vertices or four vertices of the circuit board.
In this embodiment, the supporting columns may be copper columns or plastic columns, mounting holes matched with the supporting columns are formed in the top points of the circuit boards, and the circuit boards are overlapped through fasteners such as nuts and gaskets. Preferably, both ends or all of the supporting columns are made of heat insulating materials.
In a preferred embodiment of the present invention, the connector is connected to a connector of a circuit board adjacent to the circuit board where the connector is located, and the connectors connected to each other are a pin and a socket that are in a straight-line type and are engaged with each other, so that a gap between the boards is formed when the two are in straight-line insertion.
In a preferred embodiment of the present invention, as shown in fig. 3, the control module includes a first comparator a1, a first reference power supply, an electronic switch S, a second reference power supply and an adding circuit, an output end of the first temperature sensor is connected to a positive input end of the first comparator a1, an output end of the first reference power supply is connected to a negative input end of the first comparator a1, an output end of the first comparator a1 is connected to a conduction control end of the electronic switch S, a first end of the electronic switch S is connected to the second reference power supply, a second end of the electronic switch S is connected to a first input end of the adding circuit, an output end of the first temperature sensor is further connected to a second input end of the adding circuit, and an output end of the adding circuit is connected to a rotation speed adjusting end of the fan;
the output voltage value of the first reference power supply is the voltage value output when the temperature sensed by the first temperature sensor reaches the threshold temperature for starting air cooling; the output voltage value of the second reference power supply is the difference value of the minimum input voltage of the rotating speed adjusting end of the fan and the minimum output voltage of the first temperature sensor.
In this embodiment, the first reference power supply and the second reference power supply can be obtained by selecting a voltage reference chip with a voltage corresponding to TI or ADI and peripheral circuits thereof, and for a specific circuit structure, reference is made to a technical manual of the selected chip, which is not described herein again. The threshold temperature for activating air cooling is preferably lower than the minimum rated use temperature of the circuit board with the largest heat generation amount or the device on the circuit board with the highest temperature, such as 80 ℃. The adder circuit is an analog adder circuit built by an operational amplifier, which is conventional in the art and is not described in detail herein. The first comparator a1 is preferably, but not limited to, LM 324. The electronic switch S is preferably, but not limited to, an NMOS switch tube, a triode, etc.
In a preferred embodiment of the present invention, the heat sink further includes a heat sink in contact with the bottom surface of the bottom circuit board.
In the present embodiment, the heat sink is preferably, but not limited to, an aluminum profile heat sink.
The utility model provides a brushless servo motor driver of heavy current, it has the utility model discloses a temperature control system, the circuit board from the bottom up that overlaps include first circuit board, second circuit board and third circuit board in proper order.
In a preferred embodiment of the present invention, the first circuit board is provided with a driving circuit for driving current commutation in the motor coil and a first temperature sensor, and the fan blows air to the side surface of the first circuit board and/or the gap between the plates above the first circuit board;
the second circuit board is provided with a signal conditioning circuit and an A/D conversion circuit;
and the third circuit board is provided with an external interface and a control module.
In this embodiment, the driver circuit, the signal conditioning circuit, and the a/D converter circuit all have the conventional configurations, and will not be described in detail here. Preferably, the external interface includes a serial interface for communicating with the upper computer, a signal input interface of a second temperature sensor for sensing a temperature of the motor, a fan control interface, a signal input interface of a position sensor for sensing a position of a rotor of the motor, and a signal input interface of a torque sensor for measuring a torque of a motor shaft. The structure and pin definition of each interface are in the prior art and are not described in detail herein. Preferably, the position sensor is an absolute value encoder or a rotary transformer. The serial interface may be an RS232 interface.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The temperature control system of the laminated circuit board is characterized by comprising at least two circuit boards which can be completely or partially overlapped, wherein a gap between the circuit boards is arranged at the overlapping part of the circuit boards, at least one connector connected with other circuit boards is arranged on each circuit board, at least one fan which has the same air blowing direction and is aligned with the side surfaces of all or part of the circuit boards and/or intervals between the circuit boards is arranged on all or part of the circuit boards, a first temperature sensor is arranged on all or part of the circuit boards, and a control module is arranged on the control module;
the control module receives a temperature signal of the first temperature sensor and outputs a control signal corresponding to the temperature signal to a rotating speed adjusting end of the fan.
2. The laminated circuit board temperature control system of claim 1, wherein the first temperature sensor is disposed near a heat generating element of the circuit board.
3. The laminated circuit board temperature control system of claim 1, wherein the inter-board gap is formed by support posts provided at two diagonal vertices or four vertices of the circuit board.
4. The temperature control system of a laminated circuit board as claimed in claim 3, wherein the support posts are made of a heat insulating material.
5. The temperature control system of a laminated circuit board as claimed in claim 1, wherein said connector is connected to a connector of a circuit board adjacent to the circuit board on which it is mounted, the connectors being in the form of mating in-line pins and sockets which form a board-to-board gap when in-line.
6. The temperature control system of a laminated circuit board according to claim 1, wherein the control module comprises a first comparator, a first reference power supply, an electronic switch, a second reference power supply, and an adder circuit, wherein an output terminal of the first temperature sensor is connected to a positive input terminal of the first comparator, an output terminal of the first reference power supply is connected to a negative input terminal of the first comparator, an output terminal of the first comparator is connected to a conduction control terminal of the electronic switch, a first terminal of the electronic switch is connected to the second reference power supply, a second terminal of the electronic switch is connected to a first input terminal of the adder circuit, an output terminal of the first temperature sensor is further connected to a second input terminal of the adder circuit, and an output terminal of the adder circuit is connected to a rotation speed adjustment terminal of the fan;
the output voltage value of the first reference power supply is the voltage value output when the temperature sensed by the first temperature sensor reaches the threshold temperature for starting air cooling; the output voltage value of the second reference power supply is the difference value of the minimum input voltage of the rotating speed adjusting end of the fan and the minimum output voltage of the first temperature sensor.
7. The laminated circuit board temperature control system of claim 1, further comprising a heat sink in contact with the bottom surface of the bottom circuit board.
8. A high current brushless servo motor driver having the temperature control system of any one of claims 1 to 7, wherein the overlapped circuit boards comprise, in order from bottom to top, a first circuit board, a second circuit board, and a third circuit board.
9. The high current brushless servo motor driver of claim 8, wherein the first circuit board is provided with a driving circuit for driving current commutation in the motor coil and a first temperature sensor, and the fan blows air to the side of the first circuit board and/or the inter-board gap above the first circuit board;
the second circuit board is provided with a signal conditioning circuit and an A/D conversion circuit;
and the third circuit board is provided with an external interface and a control module.
10. The high current brushless servo motor driver of claim 9, wherein the external interface comprises some or all of a serial interface for communicating with an upper computer, a signal input interface for a second temperature sensor for sensing motor temperature, a fan control interface, a signal input interface for a position sensor for sensing motor rotor position, and a signal input interface for a torque sensor for measuring motor shaft torque.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920309259.2U CN210093807U (en) | 2019-03-12 | 2019-03-12 | Temperature control system of laminated circuit board and large-current brushless servo motor driver |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920309259.2U CN210093807U (en) | 2019-03-12 | 2019-03-12 | Temperature control system of laminated circuit board and large-current brushless servo motor driver |
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| CN210093807U true CN210093807U (en) | 2020-02-18 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112091955A (en) * | 2020-07-31 | 2020-12-18 | 深圳市优必选科技股份有限公司 | Steering wheel driver, steering wheel and robot |
| CN112753288A (en) * | 2020-03-17 | 2021-05-04 | 深圳市大疆创新科技有限公司 | Circuit board structure, electronic product and preparation method of circuit board structure |
| CN114812644A (en) * | 2022-05-11 | 2022-07-29 | 中航电测仪器股份有限公司 | Sensor structure |
-
2019
- 2019-03-12 CN CN201920309259.2U patent/CN210093807U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112753288A (en) * | 2020-03-17 | 2021-05-04 | 深圳市大疆创新科技有限公司 | Circuit board structure, electronic product and preparation method of circuit board structure |
| WO2021184189A1 (en) * | 2020-03-17 | 2021-09-23 | 深圳市大疆创新科技有限公司 | Circuit board structure, electronic product, and preparation method for circuit board structure |
| CN112091955A (en) * | 2020-07-31 | 2020-12-18 | 深圳市优必选科技股份有限公司 | Steering wheel driver, steering wheel and robot |
| CN114812644A (en) * | 2022-05-11 | 2022-07-29 | 中航电测仪器股份有限公司 | Sensor structure |
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