CN112753288A

CN112753288A - Circuit board structure, electronic product and preparation method of circuit board structure

Info

Publication number: CN112753288A
Application number: CN202080005225.XA
Authority: CN
Inventors: 申中国; 巨涛; 胡正高; 程功
Original assignee: SZ DJI Technology Co Ltd
Current assignee: SZ DJI Technology Co Ltd
Priority date: 2020-03-17
Filing date: 2020-03-17
Publication date: 2021-05-04
Also published as: WO2021184189A1

Abstract

A circuit board structure (10), an electronic product and a method for manufacturing the circuit board structure, the circuit board structure (10) comprises a rigid connecting piece (11) and at least two substrates, each substrate is provided with an electronic element (14); the rigid connecting piece (11) has conductivity and is electrically and mechanically connected with two adjacent substrates; at least part of the rigid connecting pieces (11) are clamped between two adjacent substrates, so that the at least two substrates are arranged in a stacked mode at intervals.

Description

Circuit board structure, electronic product and preparation method of circuit board structure

Technical Field

The present disclosure relates to electronic product technologies, and particularly to a circuit board structure, an electronic product, and a method for manufacturing the circuit board structure.

Background

In order to achieve high performance of electronic products such as a motion camera and an unmanned aerial vehicle, electronic components with different functions, such as an integrated circuit chip and/or a passive component, are generally required to be integrated. However, in the existing electronic product, with the increase of the number of electronic components, different electronic components are usually arranged side by side on the product main board, and the board occupied area of the electronic components, that is, the area occupied by each electronic component on the product main board, is large, so that the size of the electronic product is large, and it is difficult to adapt to the miniaturization demand of people on the electronic product.

Disclosure of Invention

Based on this, the application provides a circuit board structure, an electronic product and a manufacturing method of the circuit board structure, which aim to reduce the size of the electronic product and miniaturize the electronic product.

According to a first aspect of the present application, there is provided a circuit board structure comprising:

the electronic device comprises at least two substrates, a circuit board and a circuit board, wherein the at least two substrates are sequentially stacked, and each substrate is provided with an electronic element;

rigid connecting pieces which have conductivity, are electrically and mechanically connected with two adjacent substrates;

at least part of the rigid connecting pieces are clamped between two adjacent substrates, so that the at least two substrates are arranged in a stacked mode at intervals.

According to a second aspect of the present application, there is provided an electronic product comprising a housing; the circuit board structure as described in any of the above, is disposed on the housing.

According to a third aspect of the present application, there is provided a method of manufacturing a circuit board structure comprising a first substrate, a second substrate and a rigid connection member, the method comprising: connecting a first electronic component to the first substrate; connecting a second electronic component to the second substrate; and electrically and mechanically connecting the first substrate to a second substrate through the rigid connecting piece, wherein the first substrate and the second substrate are arranged in a stacking mode at intervals.

The embodiment of the application provides a circuit board structure, an electronic product and a manufacturing method of the circuit board structure, the area of each electronic element is smaller than the sum of the areas of the electronic elements, the area of each electronic element is greatly reduced, high-density integration of the electronic elements is achieved in a limited space, other spaces inside the electronic product are reserved for batteries or other electronic components of the electronic product, the size of the electronic product is further reduced, and the miniaturization of the electronic product is facilitated.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a circuit board structure according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a circuit board structure according to an embodiment of the present application;

FIG. 6 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 7 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 8 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 9 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 10 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 11 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 12 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 13 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors;

FIG. 14 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing an arrangement of rigid connectors and filler members;

FIG. 15 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing an arrangement of rigid connectors and filler members;

FIG. 16 is a partial schematic view of a circuit board structure provided by an embodiment of the present application, showing the arrangement of rigid connectors and filler members;

FIG. 17 is a partial schematic view of a circuit board structure provided in accordance with an embodiment of the present application, showing an arrangement of rigid connectors and filler members;

FIG. 18 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 19 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 20 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 21 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 22 is a schematic structural view of a rigid link provided in accordance with an embodiment of the present application;

FIG. 23 is a schematic view of the internal structure of a rigid connection provided by an embodiment of the present application;

fig. 24 is a schematic flow chart illustrating a method for manufacturing a circuit board structure according to an embodiment of the present disclosure.

Description of reference numerals:

10. a circuit board structure;

11. a rigid connection; 111. a first connection portion; 112. a spacer section; 113. a second connecting portion; 114. a first electrical conductor; 115. an insulator; 116. a second electrical conductor; 117. a cladding body;

12. a first substrate; 13. a second substrate; 14. an electronic component;

15. a gap;

16. a first array; 161. a first sub-array; 162. a second sub-array;

17. a second array;

18. a filling member;

19. a void portion.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It is also to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

The inventor of the present application finds that, in order to realize high performance of electronic products such as an unmanned aerial vehicle, a movable trolley, a mobile terminal, a motion camera, and an electronic toy, a plurality of electronic components such as chips are generally integrated in product motherboards such as a main board of a flight control main board of the unmanned aerial vehicle, a main control board of the movable vehicle, and a main board of the mobile terminal, which carry a System On Chip (SOC). With the increasing demand of electronic products for "light, thin, short, and small", the occupied space of the product motherboard is further reduced. However, when there are a plurality of electronic components, the electronic components are usually designed side by side, and the area of the main board occupied by each electronic component is the sum of the areas of the electronic components. The more the number of the electronic components is, the larger the area of the main board of the product occupied by each electronic component is, which increases the area of the electronic product and is not beneficial to the miniaturization of the electronic product. Therefore, how to realize high-density integration of multiple electronic components in a limited space is one of the technical problems to be solved urgently by those skilled in the art.

In view of this finding, the inventors of the present application have improved the circuit board structure so as to reduce the board occupation area of each electronic component, thereby reducing the size of the electronic product, resulting in miniaturization of the electronic product. Specifically, the present application provides a circuit board structure comprising: the electronic device comprises at least two substrates, a circuit board and a circuit board, wherein the at least two substrates are sequentially stacked, and each substrate is provided with an electronic element; rigid connecting pieces which have conductivity, are electrically and mechanically connected with two adjacent substrates; at least part of the rigid connecting pieces are clamped between two adjacent substrates, so that the at least two substrates are arranged in a stacked mode at intervals.

The application also provides an electronic product, which comprises a shell; the circuit board structure is arranged on the shell.

The application also provides a preparation method of the circuit board structure, the circuit board structure comprises a first substrate, a second substrate and a rigid connecting piece, and the preparation method comprises the following steps: connecting a first electronic component to the first substrate; connecting a second electronic component to the second substrate; and electrically and mechanically connecting the first substrate to a second substrate through the rigid connecting piece, wherein the first substrate and the second substrate are arranged in a stacking mode at intervals.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1 to 5, an embodiment of the present application provides an electronic product, which includes a circuit board structure 10 and a housing, where the circuit board structure 10 is disposed on the housing. The electronic product may include at least one of a camera, an unmanned aerial vehicle, an electronic toy, a movable vehicle, a mobile terminal, and the like. The mobile terminal may include at least one of a mobile phone, a tablet computer, and the like.

Referring to fig. 1 to 5, in some embodiments, the circuit board structure 10 includes a rigid connector 11 and at least two substrates, at least two substrates are sequentially stacked, and each substrate is provided with an electronic component 14. The rigid connecting member 11 has conductivity, and the rigid connecting member 11 is electrically and mechanically connected to two adjacent substrates. At least part of the rigid connecting piece 11 is clamped between two adjacent substrates, so that the at least two substrates are arranged in a stacked mode at intervals.

When the electronic components 14 are disposed on the same circuit board, the board area occupied by the electronic components 14 is the sum of the areas of the electronic components 14. In the circuit board structure 10 of the embodiment of the present application, because each electronic component 14 is separately disposed on at least two substrates, and at least two substrates are stacked, the area of each electronic component 14 is smaller than the sum of the areas of each electronic component 14, and the area of each electronic component 14 is greatly reduced, thereby realizing high-density integration of a plurality of electronic components 14 in a limited space, and improving the integration level of an electronic product, so that other spaces inside the electronic product are reserved for batteries or other electronic components of the electronic product, and further reducing the size of the electronic product, which is beneficial to miniaturization of the electronic product, and improving the endurance of the electronic product or enriching the functions of the electronic product.

It is understood that, in some embodiments of the present application, the occupied area of each electronic component 14 refers to an area occupied by each electronic component 14 on the same substrate when each electronic component 14 is projected onto the same substrate along the stacking direction of at least two substrates.

Illustratively, in the circuit board structure 10 of the embodiment of the present application, since at least two substrates are stacked and each substrate is provided with the electronic component 14, the electronic components 14 of different subsystems can be separately arranged on the at least two substrates, and the number of layers and the number of orders of the substrates are not restricted by the interconnection of a certain electronic component 14. Compared with the case where the electronic components 14 are disposed on the same circuit board, the circuit board structure 10 according to the embodiment of the present disclosure can reduce the cost of a certain portion of the substrate.

As can be understood, the circuit board structure manufactured by mechanically and electrically connecting at least two substrates through the frame plate has a poor heat dissipation effect, which is not favorable for heat dissipation of electronic components and finally leads to performance degradation of electronic products; and on the other hand, the frame plate is easy to warp and deform, so that the process difficulty is increased. For this reason, the present embodiment is provided with a rigid connection member 11 between two adjacent substrates. Specifically, two adjacent substrates are stacked at intervals through the rigid connecting member 11, and the rigid connecting member 11 can play a supporting role, so that a space for air to flow is formed between the two adjacent substrates at a certain interval, and the circulation of the space and the outside is maintained. Under natural conditions or conditions such as an external fan, the air in the space has good fluidity, and the air flowing in the space can exchange heat with the electronic element 14 and at least one of the two adjacent substrates, so that the heat on the electronic element 14 is dissipated conveniently, the heat dissipation effect of the circuit board structure 10 is improved, and the influence of local temperature rise on the performance of the electronic product is avoided. Meanwhile, the rigid connecting member 11 has rigidity and is not easy to warp, so that the difficulty of the processing technology of the circuit board structure 10 is reduced.

Because the circuit board structure is manufactured by realizing the mechanical connection and the electrical connection of at least two substrates through the soldering paste, once the soldering paste collapses, the circuit board structure is easy to generate the short circuit problem; further, the solder paste has poor height uniformity. Therefore, the rigid connecting piece 11 is used for realizing the interval stacking arrangement of two adjacent substrates, and the rigid connecting piece 11 has certain rigidity, so that the rigid connecting piece 11 is good in height consistency and not easy to collapse, and the problem of short circuit of the circuit board structure 10 is not easy to occur.

In addition, when the circuit board structure 10 of the embodiment of the present application is processed or manufactured, when two adjacent substrates and the rigid connecting member 11 are assembled, the rigid connecting member 11 is accurately positioned, and the connecting position between the rigid connecting member 11 and the substrates is not easy to shift or roll, which is beneficial to the assembly between the rigid connecting member 11 and the substrates and the improvement of the processing efficiency, and the process is simple and the processing cost is low.

It will be appreciated that the number of substrates may be set according to actual requirements, for example two, three, four, five or more. The substrates are sequentially stacked, and a rigid connecting member 11 is provided between two adjacent substrates. The number of the rigid connecting pieces 11 arranged between two adjacent substrates can be set according to actual requirements. Illustratively, the number of rigid links 11 includes at least four. Specifically, the number of rigid connectors 11 disposed between two adjacent substrates includes at least four, for example, four, five, six, seven, eight or more.

It is understood that the material of each substrate may be designed according to actual requirements, for example, the substrate may be made of epoxy resin, ceramic, or High Density Interconnect (HDI) epoxy fiberglass cloth.

Referring to fig. 1 to 5, in some embodiments, the at least two substrates include a first substrate 12 and a second substrate 13. The first substrate 12 is connected to one end of the rigid connection member 11. The second substrate 13 is connected to the other end of the rigid connection member 11. The second substrate 13 is spaced apart from the first substrate 12 by the rigid connector 11 to form a gap 15. The gap 15 can be used for gas or air flow, maintaining the gap 15 in fluid communication with the outside. Under natural conditions or conditions such as an external fan, the air in the gap 15 has good fluidity, the air flowing in the gap 15 can exchange heat with the electronic element 14 positioned between the first substrate 12 and the second substrate 13, and the air flowing in the gap 15 can also exchange heat with the first substrate 12 and/or the second substrate 13, so that the heat dissipation of the electronic element 14 on the first substrate 12 and/or the second substrate 13 can be accelerated, the heat dissipation effect is improved, and the influence of the electronic product on the performance of the electronic product due to the local too fast temperature rise is avoided.

Specifically, the first substrate 12 and the second substrate 13 are disposed oppositely. The first substrate 12 has a front surface and a back surface opposite to the front surface. The second substrate 13 has a first surface facing the back surface of the first substrate 12 and a second surface disposed opposite to the first surface. Electronic components 14 are disposed on the front and/or back side of the first substrate 12. Electronic components 14 are provided on the first surface and/or the second surface of the second substrate 13. A first pad is disposed on the back surface of the first substrate 12, a second pad corresponding to the first pad is disposed on the first surface of the second substrate 13, and the first pad is electrically connected to the second pad through the rigid connector 11. The rigid connection 11 may also serve as a structural support. Specifically, the number and the type of the electronic components 14 may be designed according to actual requirements, and may include at least one of active electronic devices, passive electronic devices, and the like, for example, and is not limited herein.

It is understood that the size and shape of each of the at least two substrates may be set according to actual requirements, as long as partial overlapping of the projection areas between the at least two substrates is allowed. Illustratively, the size and shape of the first substrate 12 and the second substrate 13 need not be identical, as long as the first substrate 12 and the second substrate 13 have a partial overlap in the projection area on the first substrate 12 or the second substrate 13 in the stacking direction of the two.

It will be appreciated that the first substrate 12 and the second substrate 13 may each be connected to the rigid connection member 11 by any suitable connection means. Referring to fig. 1, 4 and 5, the rigid connecting member 11 is mounted or inserted on the first substrate 12. The rigid connecting member 11 is mounted or inserted on the second substrate 13.

In some embodiments, referring to fig. 1, the first substrate 12 and the second substrate 13 can be both attached to the rigid connection member 11. Referring to fig. 4, in another embodiment, the first substrate 12 and the second substrate 13 can be connected to the rigid connection member 11 by inserting. Referring to fig. 5, in another embodiment, one of the first substrate 12 and the second substrate 13 is connected to the rigid connector 11 in an inserting manner, and the other of the first substrate 12 and the second substrate 13 is connected to the rigid connector 11 in a mounting manner. For example, the first substrate 12 is attached to the rigid connectors 11, and the second substrate 13 is inserted to the rigid connectors 11. For another example, the first substrate 12 is connected to the rigid connectors 11 in an insertion manner, and the second substrate 13 is connected to the rigid connectors 11 in a mounting manner.

Referring to fig. 4 and 5, in some embodiments, the partially rigid connecting member 11 is inserted into the first substrate 12 and/or the second substrate 13. I.e. one of the rigid connection members 11 is inserted in the first base plate 12 and/or the second base plate 13.

In some embodiments, the rigid connector 11 extends along the stacking direction of the first substrate 12 and the second substrate 13, so that the rigid connector 11 can connect the first substrate 12 and the second substrate 13 and can separate the first substrate 12 and the second substrate 13 to form a gap 15.

It is understood that the number of rigid connectors 11 disposed between the first substrate 12 and the second substrate 13 includes at least four, such as four, five, six, seven, eight, or more.

In some embodiments, at least four rigid links 11 are spaced apart. In some embodiments, two of the rigid connection members 11 are disposed at intervals, or two adjacent rigid connection members 11 are disposed at intervals, so that an interval space for air to flow is formed between the connection members, and the interval space can be used for air or gas to flow, so as to ensure the circulation between the interval space and the outside, which is beneficial to accelerating the heat dissipation of at least one of the first substrate 12, the second substrate 13, or the electronic component 14 located on the first substrate 12 and the second substrate 13, so as to improve the heat dissipation effect, avoid the local temperature rise of the electronic product being too fast, and provide a guarantee for the normal performance of the electronic product.

In some embodiments, at least four rigid connectors 11 are regularly arranged in a predetermined arrangement. Specifically, at least four rigid connection members 11 are regularly arranged in a predetermined arrangement on the first substrate 12. Alternatively, at least four rigid connection members 11 are regularly arranged in a predetermined arrangement on the second substrate 13. The following description will be made by taking as an example that at least four rigid connecting members 11 are regularly arranged on the first substrate 12 in a predetermined arrangement. The predetermined arrangement rule may be designed according to actual requirements, as long as the first substrate 12 can be electrically and mechanically connected to the second substrate 13 through each rigid connection member 11. In some embodiments, the plurality of rigid connectors 11 are arranged in an array to facilitate processing of the circuit board structure 10. Specifically, the plurality of rigid connectors 11 are arranged in an array on the first substrate 12 or the second substrate 13. For example, the arrangement pattern of each rigid connection member 11 may be in a shape like a "square", "japanese", "tian", "L", "di", other regular or irregular shapes, and the like, which is not limited herein. Illustratively, the arrangement shape of each rigid connection member 11 is adapted to the contour of the first substrate 12 or the first substrate 12, and may be a regular shape or an irregular shape.

Referring to fig. 6 to 13, in some embodiments, at least some of the rigid connectors 11 in the plurality of rigid connectors 11 are disposed on the first substrate 12 in an array to form a first array 16. Specifically, at least some of the rigid connectors 11 in the plurality of rigid connectors 11 are arranged in an array to form a first array 16.

In some embodiments, at least some of the rigid connectors 11 in the plurality of rigid connectors 11 are spaced along the edge region of the first substrate 12 to form the first array 16, so as to improve the mechanical connection reliability of the first substrate 12 and the second substrate 13 and ensure the electrical connection reliability of the first substrate 12 and the second substrate 13. The distance between the first array 16 and the side circumference profile of the first substrate 12 can be set according to practical requirements, and is not limited herein. Referring to fig. 6, the rigid connectors 11 are spaced along the edge region of the first substrate 12 to form a first annular array 16.

In some embodiments, the first array 16 is distributed in a ring shape. The rigid connectors 11 in the first array 16 are arranged around the middle of the first substrate 12.

Referring to fig. 7 to 11, a plurality of rigid connectors 11 are disposed on the first substrate 12 in an array to form a first array 16 and a second array 17. Specifically, a portion of the rigid connectors 11 in each rigid connector 11 are arranged in an array to form a first array 16. Another portion of the rigid connectors 11 in each rigid connector 11 are arranged in an array to form a second array 17. More specifically, the first array 16 is disposed around the second array 17 to further increase the connection reliability of the first substrate 12 and the second substrate 13. The second array 17 may be in a shape of a straight line, a cross, an X, other regular array or irregular array, and the like, which is not limited herein.

Referring to fig. 12 and 13, the first array 16 is disposed on at least two sides of the first substrate 12. Specifically, the first array 16 is located on at least two sides of the middle portion of the first substrate 12. The first substrate 12 and the second substrate 13 may have a regular shape such as a rectangle or any suitable irregular shape, and are not limited herein. The first substrate 12 is explained below as being rectangular. The first substrate 12 has two long sides and two short sides. The first array 16 is located on at least two sides of the two long sides and the two short sides of the first substrate 12. For example, as shown in FIG. 12, a portion of the rigid connectors 11 in the first array 16 is disposed on one long side, and another portion of the rigid connectors 11 in the first array 16 is disposed on the other long side. For another example, as shown in fig. 13, a portion of the rigid connectors 11 in the first array 16 is disposed on one of the short sides, and another portion of the rigid connectors 11 in the first array 16 is disposed on the other short side.

In some embodiments, first array 16 includes a first subarray 161 and a second subarray 162. The first sub-array 161 is disposed opposite to the second sub-array 162 with a space therebetween. Specifically, the second sub-array 162 and the first sub-array 161 are spaced and distributed relatively to the edge region of the first substrate 12. More specifically, as shown in fig. 12, the first subarray 161 is provided on one of the long sides of the first substrate 12, and the second subarray 162 is provided on the other long side of the first substrate 12. As shown in fig. 13, the first subarray 161 is provided on one of the short sides of the first substrate 12, and the second subarray 162 is provided on the other short side of the first substrate 12.

Referring to fig. 14-17, in some embodiments, the circuit board structure 10 further includes a filler 18. The filling member 18 is filled and coated on the outer part of at least one rigid connecting member 11 in the plurality of rigid connecting members 11. The provision of the filler 18, on the one hand, can improve the reliability of the circuit board structure 10; on the other hand, the rigid connecting piece 11 can be prevented from being directly contacted with air, so that a uniform transmission medium is provided for signals, and the high-speed signal transmission stability is ensured. The filling member 18 may be made of any suitable material according to actual requirements, such as a molding material or an underfill.

In some embodiments, a part of the rigid connectors 11 in the plurality of rigid connectors 11 is filled with the filling member 18, another part of the rigid connectors 11 in the plurality of rigid connectors 11 is not provided with the filling member 18, and another part of the rigid connectors 11 not filled with the filling member 18 still provides a space for air convection, so as to facilitate heat dissipation of the first substrate 12, the second substrate 13, or the electronic component 14, and achieve heat dissipation effect, signal transmission stability, and connection reliability. Referring to fig. 14, 16 and 17, specifically, the other portion of the rigid connecting member 11 not filled with the encapsulating filling member 18 is formed with a gap 19, which can provide a space for air convection, so as to facilitate heat dissipation of the first substrate 12, the second substrate 13 or the electronic element 14, thereby improving the heat dissipation effect of the circuit board structure 10. The gap 19 may be formed by a gap space between two adjacent rigid connecting members 11, which is not filled with the filling member 18, that is, the gap space between two adjacent rigid connecting members 11 is not filled with the filling member 18.

The shape of the rigid connecting member 11 can be designed into any suitable shape according to actual requirements, such as a cylinder, a "T" shaped cylinder, an "i" shaped cylinder, other cylinders with different diameters, other regular shapes or irregular shapes, and the like.

Referring to fig. 18, in some embodiments, the rigid connection members 11 extend along the stacking direction of the first substrate 12 and the second substrate 13 in a manner having the same contour dimension. Specifically, the dimensions of the rigid link 11 are substantially the same throughout the stacking direction of the first substrate 12 and the second substrate 13. The rigid connecting member 11 having such a structure may be inserted or attached to the first substrate 12, or may be inserted or attached to the second substrate 13.

In some embodiments, the rigid connector 11 has a first connection portion 111, a spacer portion 112, and a second connection portion 113. The first connection portion 111 is connected to the first substrate 12. One end of the spacer 112 is connected to the first connection portion 111, and the spacer 112 is interposed between the first substrate 12 and the second substrate 13 to form a gap 15 between the first substrate 12 and the second substrate 13 for air circulation, thereby improving the heat dissipation effect of the first substrate 12, the second substrate 13, or the electronic component 14. The second connection portion 113 is connected to the other end of the spacer portion 112. The second connection portion 113 is connected to the second substrate 13. Specifically, the first connection portion 111, the spacing portion 112, and the second connection portion 113 are sequentially disposed in the lamination direction of the first substrate 12 and the second substrate 13.

Referring to fig. 19 and 20, the first connecting portion 111 has a contour size greater than or equal to the contour size of the spacing portion 112. The outline dimension of the second connecting portion 113 is greater than or equal to the outline dimension of the spacing portion 112. For example, as shown in fig. 19, the outline of the first connection portion 111 is larger than the outline of the spacing portion 112, so as to increase the contact area between the first connection portion 111 and the first substrate 12, improve the accuracy of mounting and positioning the first connection portion 111, and facilitate the connection of the first connection portion 111 with the first substrate 12 through mounting. The second connection portion 113 has a contour size equal to that of the spacing portion 112. For another example, as shown in fig. 20, the outline of the first connecting portion 111 is larger than the outline of the spacer 112, and the outline of the second connecting portion 113 is larger than the outline of the spacer 112, so as to increase the contact area between the rigid connecting member 11 and the first substrate 12 and the second substrate 13, improve the accuracy of mounting and positioning the rigid connecting member 11, and facilitate the mounting process of the rigid connecting member 11.

Referring to fig. 21 and 22, in some embodiments, the first connecting portion 111 has a smaller profile than the spacer portion 112. The second connection portion 113 has a smaller contour dimension than the spacer portion 112. For example, as shown in fig. 21, the first connecting portion 111 has a smaller contour dimension than the spacer portion 112 to facilitate the insertion connection of the first connecting portion 111 with the first substrate 12. The second connection portion 113 has a contour size equal to that of the spacing portion 112. For another example, as shown in fig. 22, the first connecting portion 111 has a smaller contour size than the spacing portion 112, and the second connecting portion 113 has a smaller contour size than the spacing portion 112, so as to facilitate the insertion of the first connecting member on the first substrate 12 and the second substrate 13.

In some embodiments, the back surface of the first substrate 12 is provided with a first fitting portion for connection with the first connection portion 111. The first surface of the second substrate 13 is provided with a second fitting portion for connection with the second connection portion 113. The first and/or second fitting portion may be planar or have a hole-like structure or the like. In some embodiments, the first connection portion 111 is attached to the back surface of the first substrate 12. In some embodiments, the first fitting portion is a hole-shaped structure, and the first connecting portion 111 is inserted into the first fitting portion.

In some embodiments, the first mounting portion penetrates through the front surface and the back surface of the first substrate 12, so that the connection area of the rigid connection member 11 and the first substrate 12 can be increased, and the connection reliability of the rigid connection member 11 and the first substrate 12 can be improved.

Likewise, in some embodiments, the second connection portion 113 is attached to the first surface of the second substrate 13. In some embodiments, the second fitting portion is a hole-shaped structure, and the second connecting portion 113 is inserted into the second fitting portion. In some embodiments, the second mounting portion penetrates through the first surface and the second surface of the second substrate 13, so that the connection area between the rigid connection member 11 and the second substrate 13 can be increased, and the connection reliability between the rigid connection member 11 and the second substrate 13 can be improved.

Referring to fig. 23, in some embodiments, the rigid connector 11 includes a first electrical conductor 114, an insulator 115, and a second electrical conductor 116. The first conductor 114 is electrically connected to two adjacent substrates. The insulator 115 is disposed outside the first conductor 114. The second conductor 116 is electrically connected to two adjacent substrates. The second conductor 116 is sleeved outside the insulator 115. The second conductive body 116 is insulated from the first conductive body 114 by an insulator 115. The rigid connector 11 employs the first conductor 114 and the second conductor 116, which can improve signal transmission stability.

Referring to fig. 23, in some embodiments, the rigid connector 11 further includes a cover 117. The cladding body 117 is sleeved outside the second conductive body 116. Specifically, the cover 117 includes at least one of an anti-oxidation cover 117, an insulating cover 117, and the like, so as to achieve anti-oxidation or insulating performance of the rigid connector 11 and improve reliability of the circuit board structure 10.

In some embodiments, the first electrical conductor 114, the insulator 115, the second electrical conductor 116, and the cladding 117 are coaxially disposed, further improving the signal transmission reliability of the circuit board structure 10.

In some embodiments, the first and second

electrical conductors

114, 116 may be made of any suitable electrically conductive material depending on the actual requirements. Each of the first and second

electric conductors

114 and 116 includes at least one of a rigid connecting member 11 made of copper, a rigid connecting member 11 made of copper alloy, a rigid connecting member 11 made of aluminum alloy, a rigid connecting member 11 made of silver alloy, a rigid connecting member 11 made of gold alloy, and the like.

Referring to fig. 24, an embodiment of the present application further provides a method for manufacturing a circuit board structure, where the method is used to manufacture a circuit board structure, and the circuit board structure may be the circuit board structure in any of the embodiments. The preparation method includes steps S101 to S103.

Step S101, connecting a first electronic component to the first substrate.

Step S102, connecting a second electronic component to the second substrate.

And S103, electrically and mechanically connecting the first substrate to a second substrate through the rigid connecting piece, wherein the first substrate and the second substrate are arranged in a stacked mode at intervals.

In some embodiments, the first substrate is connected to the second substrate by at least four of the rigid connectors. Specifically, in the process of manufacturing the circuit board structure, at least four rigid connecting pieces can be simultaneously connected to the first substrate and/or the second substrate, so that the processing efficiency is improved, the relative position error between the rigid connecting pieces can be reduced, and the precise positioning of the rigid connecting pieces is realized.

In some embodiments, the position error of each rigid connection element is 0-20u, such as 0u, 3u, 5u, 7u, 10u, 13u, 15u, 20u, or any other suitable value in 0-20 u.

In some embodiments, the rigid connector includes a first electrical conductor, an insulator, and a second electrical conductor. The first conductor is electrically connected to two adjacent substrates. The insulator is sleeved outside the first conductor. The second conductor is electrically connected to two adjacent substrates. The second conductor is sleeved outside the insulator. The second conductor is insulated from the first conductor by the insulator. The rigid connecting piece adopts the first conductor and the second conductor, so that the signal transmission stability can be improved.

In some embodiments, the first conductive body and the second conductive body may be made of any suitable conductive material according to actual requirements. Each of the first and second electrical conductors may include at least one of a rigid copper connector, a rigid copper alloy connector, a rigid aluminum alloy connector, a rigid silver alloy connector, a rigid gold alloy connector, and the like.

In some embodiments, the rigid connection further comprises an envelope. The cladding body is sleeved outside the second electric conductor. Specifically, the coating body comprises at least one of an anti-oxidation coating body and an insulating coating body, so that the anti-oxidation or insulating performance of the rigid connecting piece is realized, and the reliability of the circuit board structure is improved.

In some embodiments, the method of making further comprises: at least one of at least two of the rigid connectors is externally filled with an enveloping filling member.

Specifically, the filling piece is filled and coated on the outer part of at least one rigid connecting piece in the plurality of rigid connecting pieces. Therefore, on one hand, the reliability of the circuit board structure can be improved; on the other hand, the rigid connecting piece can be prevented from directly contacting with air, so that an even transmission medium is provided for signals, and the stability of high-speed signal transmission is ensured. In some embodiments, a part of the rigid connectors is filled with and coated with a filling member, another part of the rigid connectors is not filled with the filling member, and the other part of the rigid connectors which is not filled with the coating filling member can still provide a space for air convection, so that heat dissipation of the first substrate, the second substrate or the electronic element is facilitated, and heat dissipation effect, signal transmission stability and connection reliability are considered. The filling member can be made of any suitable material according to actual requirements, such as a molding material or underfill.

In some embodiments, said electrically and mechanically connecting said first substrate to a second substrate through said rigid connection comprises: mounting or inserting the rigid connecting piece on the first substrate; and mounting or inserting the rigid connecting piece on the second substrate.

Specifically, in some embodiments, the first substrate may be attached to the rigid connector, and the second substrate may be attached to the rigid connector. In another embodiment, the first substrate may be connected to the rigid connection member by insertion, and the second substrate may be connected to the rigid connection member by insertion. In another embodiment, one of the first substrate and the second substrate may be connected to the rigid connector in an insertion manner, and the other of the first substrate and the second substrate may be connected to the rigid connector in a mounting manner.

The circuit board structure manufactured by the manufacturing method of the embodiment has the advantages that the electronic elements are respectively arranged on the first substrate and the second substrate, and the first substrate and the second substrate are arranged in a stacked mode, so that the area of each electronic element is smaller than the sum of the areas of the electronic elements.

It is understood that the area occupied by each electronic component means an area occupied by each electronic component on the same substrate (first substrate or second substrate) when each electronic component is projected onto the same substrate along the stacking direction of the first substrate and the second substrate.

For example, in the circuit board structure manufactured by the manufacturing method of the embodiment of the application, since the first substrate and the second substrate are stacked and the electronic components are arranged on both the first substrate and the second substrate, the electronic components of different subsystems can be separately arranged on the first substrate and the second substrate, and the number of layers and the number of orders of the substrates are not limited by interconnection of some electronic components. Compared with the circuit board with all electronic elements arranged on the same circuit board, the circuit board structure manufactured by the embodiment of the application can reduce the cost of a certain part of the substrate.

As can be understood, the circuit board structure manufactured by mechanically and electrically connecting at least two substrates through the frame plate has a poor heat dissipation effect, which is not favorable for heat dissipation of electronic components and finally leads to performance degradation of electronic products; and on the other hand, the frame plate is easy to warp and deform, so that the process difficulty is increased. According to the circuit board structure manufactured by the manufacturing method, the two adjacent substrates are arranged in a stacking mode at intervals through the rigid connecting piece, the rigid connecting piece can play a supporting role, a certain distance is formed between the two adjacent substrates to form a space for air to flow, and the circulation of the space and the outside is kept. Under the conditions of natural conditions or external fans and the like, the air in the space has good fluidity, and the air flowing in the space can exchange heat with at least one of the electronic element, the first substrate and the second substrate, so that the heat on the electronic element is conveniently dissipated, the heat dissipation effect of the circuit board structure is improved, and the influence of local temperature rise on the performance of the electronic product is avoided. Meanwhile, the rigid connecting piece has rigidity and is not easy to warp and deform, so that the processing difficulty of the circuit board structure is reduced.

Because the circuit board structure is manufactured by realizing the mechanical connection and the electrical connection of at least two substrates through the soldering paste, once the soldering paste collapses, the circuit board structure is easy to generate the short circuit problem; further, the solder paste has poor height uniformity. Therefore, in the circuit board structure manufactured by the embodiment of the application, the interval stacking arrangement of two adjacent substrates is realized through the rigid connecting piece, and the rigid connecting piece has certain rigidity, so that the rigid connecting piece is good in height consistency, not easy to collapse and not easy to cause the problem of short circuit of the circuit board structure.

In addition, when the circuit board structure manufactured by the manufacturing method of the embodiment of the application is assembled, when two adjacent substrates and rigid connecting pieces are assembled, the rigid connecting pieces are accurately positioned, the connecting positions of the rigid connecting pieces and the substrates are not easy to deviate or roll, relative position errors among the rigid connecting pieces are small, the rigid connecting pieces and the substrates are favorably assembled, the processing efficiency is improved, the process is simple, and the processing cost is low.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention, and these modifications or substitutions are intended to be included in the scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A circuit board structure, comprising:

2. The circuit board structure of claim 1, wherein the at least two substrates comprise:

the first substrate is connected with one end of the rigid connecting piece;

the second substrate is connected with the other end of the rigid connecting piece; the second substrate and the first substrate are arranged at intervals through the rigid connecting piece to form a gap.

3. The circuit board structure according to claim 2, wherein the rigid connector is mounted or inserted on the first substrate; and/or the rigid connecting piece is mounted or inserted on the second substrate.

4. A circuit-board structure according to claim 3, characterized in that part of said rigid connectors are inserted in said first base-plate and/or said second base-plate.

5. The circuit board structure according to claim 2, wherein the rigid connection member extends in a stacking direction of the first substrate and the second substrate.

6. The circuit board structure according to claim 2, wherein the rigid connectors extend in a stacking direction of the first substrate and the second substrate in a manner that profile dimensions are the same.

7. The circuit board structure according to claim 2, wherein the number of rigid connectors comprises at least four.

8. A circuit board structure according to claim 7, characterized in that at least four of said rigid connectors are arranged at intervals.

9. The circuit board structure according to claim 7, wherein at least four of the rigid connection members are regularly arranged on the first substrate or the second substrate in a predetermined arrangement.

10. The circuit board structure of claim 9, wherein the plurality of rigid connectors are arranged in an array.

11. The circuit board structure of claim 10, wherein at least some of the plurality of rigid connectors are arranged in an array on the first substrate to form a first array.

12. The circuit board structure of claim 11, wherein at least some of the plurality of rigid connectors are spaced along an edge region of the first substrate to form the first array.

13. The circuit board structure of claim 12, wherein the first array is located on at least two sides of the first substrate.

14. The circuit board structure of claim 11, wherein the first array is distributed in a ring shape, and the rigid connectors in the first array are arranged around the middle of the circuit board.

15. The circuit board structure of claim 11, wherein the first array comprises:

a first sub-array;

and the second sub-arrays are distributed in the edge area of the first substrate in a spaced and opposite mode with the first sub-arrays.

16. The circuit board structure of claim 10, wherein a plurality of the rigid connectors are disposed on the first substrate in an array to form a first array and a second array, and the first array is disposed around the second array.

17. The circuit board structure according to claim 7, characterized in that the circuit board structure further comprises:

and the filling piece is wrapped outside at least one rigid connecting piece in the plurality of rigid connecting pieces.

18. The circuit board structure according to claim 2, wherein the rigid connection member has:

a first connection part connected to the first substrate;

a spacer portion, one end of which is connected to the first connecting portion and is sandwiched between the first substrate and the second substrate;

and a second connection part connected to the other end of the spacer part and connected to the second substrate.

19. The circuit board structure according to claim 18, wherein the first connection portion, the spacing portion, and the second connection portion are provided in this order along a stacking direction of the first substrate and the second substrate.

20. The circuit board structure according to claim 18, wherein the first connecting portion has a contour dimension greater than or equal to a contour dimension of the spacer portion; and/or the outline size of the second connecting part is larger than or equal to the outline size of the spacing part.

21. The circuit board structure according to claim 18, wherein the first connecting portion has a profile dimension smaller than a profile dimension of the spacer portion; and/or the outline size of the second connecting part is smaller than that of the spacing part.

22. The circuit board structure of claim 18, wherein the first substrate has a front side and a back side opposite the front side; the second substrate has a first face facing the back face of the first substrate and a second face opposite to the first face.

23. The circuit board structure according to claim 22, wherein the back surface of the first substrate is provided with a first fitting portion for connection with the first connection portion, and the first surface of the second substrate is provided with a second fitting portion for connection with the second connection portion.

24. The circuit board structure of claim 23, wherein the first connecting portion is attached to a back surface of the first substrate.

25. The circuit board structure according to claim 23, wherein the first assembling portion is a hole structure, and the first connecting portion is inserted into the first assembling portion.

26. The circuit board structure of claim 25, wherein the first mounting portion penetrates the front and back surfaces of the first substrate.

27. The circuit board structure of any of claims 23-26, wherein the second connecting portion is attached to the first side of the second substrate.

28. The circuit board structure according to claim 27, wherein the second fitting portion is a hole-like structure, and the second connecting portion is inserted in the second fitting portion.

29. The circuit board structure of claim 28, wherein the second mounting portion penetrates the first and second surfaces of the second substrate.

30. The circuit board structure according to claim 1, wherein the rigid connector comprises:

a first conductor electrically connected to two adjacent substrates;

the insulator is sleeved outside the first conductor;

a second conductor electrically connected to two adjacent substrates; the second conductor is sleeved outside the insulator and is arranged in an insulating mode with the first conductor through the insulator.

31. The circuit board structure of claim 30, wherein the rigid connectors further comprise:

and the cladding body is sleeved outside the second electric conductor.

32. The circuit board structure of claim 31, wherein the cover includes at least one of an anti-oxidation cover and an insulating cover.

33. The circuit board structure of claim 31, wherein the first electrical conductor, the insulator, the second electrical conductor, and the overbody are coaxially disposed.

34. The circuit board structure of claim 30, wherein the first and second electrical conductors each comprise at least one of a rigid copper connector, a rigid copper alloy connector, a rigid aluminum alloy connector, a rigid silver alloy connector, a rigid gold connector, and a rigid gold alloy connector.

35. The circuit board structure of claim 1, wherein the electronic component comprises at least one of an active electronic device and a passive electronic device.

36. An electronic product, comprising:

a housing;

a circuit board structure according to any of claims 1-35, arranged on said housing.

37. The electronic product of claim 36, wherein the electronic product comprises:

at least one of a camera, an unmanned aerial vehicle, an electronic toy, a movable vehicle, and a mobile terminal.

38. A method for manufacturing a circuit board structure, wherein the circuit board structure comprises a first substrate, a second substrate and a rigid connecting member, the method comprising:

connecting a first electronic component to the first substrate;

connecting a second electronic component to the second substrate;

and electrically and mechanically connecting the first substrate to a second substrate through the rigid connecting piece, wherein the first substrate and the second substrate are arranged in a stacking mode at intervals.

39. The method of claim 38, wherein the first substrate is coupled to the second substrate by at least four of the rigid couplings.

40. The method of claim 39, wherein the positional error of each of the rigid connectors is 0 to 20 u.

41. The method of manufacturing of claim 39, further comprising:

at least one of at least two of the rigid connectors is externally filled with an enveloping filling member.

42. The method of claim 38, wherein said electrically and mechanically coupling said first substrate to a second substrate via said rigid connection comprises:

mounting or inserting the rigid connecting piece on the first substrate;

and mounting or inserting the rigid connecting piece on the second substrate.