JP3274648B2 - High melting point ball connector and contact for high melting point ball connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high melting point ball connector and a contact for a high melting point ball connector.

[0002]

2. Description of the Related Art As electronic devices have become smaller, lighter, and more sophisticated, there has been an increasing demand for packages that can be mounted on semiconductors with high density. QFP (Quad Flat Package) is a package that realizes high-density mounting.
e) was developed. After solder paste is printed on the lead connection portion on the printed circuit board, and the QFP is mounted with high precision by a mounting device, the solder connection is performed by passing through a reflow furnace.

With the birth of QFP, lead pitch 0.5
mm and 0.4 mm have been commercialized.
mm pitch ones are being considered.

However, with the fine pitch of the leads, a new problem of defective mounting on a printed circuit board has arisen. That is, the package may not be reliably mounted on the printed circuit board due to the so-called bending of the lead (the leading end of the lead faces upward or downward).

In recent years, a BGA ( Ball Grid Array) package has been developed as a package that overcomes this problem. The BGA package is a package in which a chip is mounted on a substrate, and after molding, solder balls (high melting point) as electrodes are formed in a grid pattern on the bottom surface of the substrate (the surface opposite to the chip mounting surface).

According to this BGA package, since the electrode portion is formed on the bottom surface, the pitch of the solder balls can be increased. Further, since there is no lead, the size can be reduced, and it is necessary to consider the bending of the lead. Therefore, mounting on a printed circuit board can be reliably performed.

Attention has been paid to this good mounting property, and there is an increasing demand for BGA type connectors to which BGA package technology is applied.

[0008]

However, the connector is generally inserted and removed manually, and the dynamic stress (stress) such as vibration and impact applied to the solder joint is larger than that of the BGA package.

For this reason, when a BGA type connector manufactured by applying the BGA package technology is mounted on a printed circuit board, the strength of the solder joint does not exist, and the contact between the contact electrode and the printed circuit board electrode is not provided. There was a possibility that a connection failure might occur.

The present invention has been made in view of such circumstances, and an object thereof is to provide a high melting point ball connector and a high melting point ball connector contact having sufficient bonding strength and good BGA package mountability. That is.

[0011]

According to a first aspect of the present invention, there is provided a high melting point ball connector including an insulator and a plurality of contacts held by the insulator.
A high melting point ball is welded to a connection portion of each of the contacts,
A reinforcing member for increasing the mounting strength is provided on the insulator, and the reinforcing member is larger than a diameter of the high melting point ball.
A high-melting ball for reinforcement with a large diameter is welded,
And the height from the bottom of the
From the bottom of the insulator to the top of the high melting point ball for reinforcement
It is characterized in that the height to the point matches .

A high-melting point ball is welded to a connection portion of each contact, a reinforcing member for increasing mounting strength is provided on the insulator, and a reinforcing high-melting point ball is welded to the reinforcing member.
Since the height of the high-melting point ball and the height of the reinforcing high-melting point ball are the same, welding strength of the reinforcing high-melting point ball welded to the reinforcing member to the printed circuit board can be ensured, and the joining strength of the joint can be secured. The pitch of the melting point balls can be increased. In addition, since the diameter of the reinforcing high-melting point ball is larger than the diameter of the high-melting point ball, sufficient bonding strength when welded to a printed board is obtained.

The high melting point ball connector according to the second aspect of the present invention.
The contact for the insulator is an insulator and this insulator
Multiple contacts held linearly on the
A high melting point ball connector comprising:
The connection parts of the contacts are arranged in a zigzag pattern,
A high melting point ball is welded to the continuation part, and the ball tower of the connection part is welded.
The mounting surface is higher than the projection surface of the high melting point ball,
The width of the mounting surface in the contact arrangement direction is
Larger than the width of the contact arrangement direction
The pitch in the contact arrangement direction of the surface is
It is characterized in that the pitch is twice the pitch in the contact arrangement direction of the connecting portion .

The connection portions of the contacts are arranged in a staggered manner,
A high melting point ball is welded to the connection part of each contact to connect
The ball mounting surface of the part is higher than the projection surface of the high melting point ball,
The width of the ball mounting surface in the contact arrangement direction
High melting point because it is larger than the width of the contact area in the contact arrangement direction
Balls can be narrower in pitch and high melting point ball connectors
In addition to being more compact,
Welding becomes easy.

According to a third aspect of the present invention, there is provided a contact for a high melting point ball connector having a connection portion exposed from an insulator, wherein a ball mounting surface of the connection portion is equal to or more than a projection surface of the high melting point ball. And a recess for supporting the high melting point ball so as to be rollable is formed on the ball mounting surface of the connection portion.

Since the ball mounting surface of the connecting portion is equal to or larger than the projection surface of the high melting point ball, and the concave portion for supporting the high melting point ball so as to be able to roll is formed on the ball mounting surface of the connecting portion. The ball can be easily mounted at a predetermined position on the ball mounting surface, and the high melting point ball can be positioned at the center of the ball mounting surface during mounting, so that the bonding strength between the high melting point ball and the ball mounting surface can be increased.

According to a fourth aspect of the present invention, there is provided the contact for a high melting point ball connector according to the third aspect, wherein the ball mounting surface of the connection portion is not chamfered. Features.

Since the ball mounting surface of the connecting portion is not chamfered, when the high melting point ball is melted, the molten high melting point ball can be prevented from protruding from the ball mounting surface and spreading.

According to a fifth aspect of the present invention, there is provided the contact for a high melting point ball connector according to the third aspect, wherein the ball mounting surface of the connection portion is plated with solder which is hard to be wetted with solder. It is characterized by being.

Since the ball mounting surface of the connection portion is plated so as to prevent solder wetting, when the high melting point ball is melted and heated again, an oxide film is formed on the surface of the contact. The high melting point ball does not spread wet. Note that the oxide film suppresses solder wetting.

[0021]

[0022]

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view of a high melting point ball connector (socket side) according to a first embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a bottom view thereof, FIG. FIG. 3 is a sectional view taken along line AA of FIG. 2.

The high melting point ball connector 1 includes a housing (insulator) 10, a contact 20, a solder ball (high melting point ball) 30, and a hold down (reinforcing member) 40.

The housing 10 has a rectangular flat plate portion 10a.
And two guide portions 10b and 10c provided integrally with the flat plate portion 10a and extending in the longitudinal direction.

A plurality of bellows-type contacts 20 are press-fitted into the guide portions 10b and 10c.

A connecting portion 21 of the contact 20 protrudes from the bottom surface 10d of the housing 20, and a solder ball 30 is welded to the connecting portion 21.

The diameter of the solder ball 30 is determined by the pitch of the contacts 20. For example, if the pitch of the contacts 20 is 1.0 mm, the diameter of the solder ball is about 0.6 mm.

In general, eutectic solder (for example, Sn: Pb = 63: 37 (weight ratio), melting point: 183 ° C.) is used for re-melting the solder ball. When soldering on the wiring board in a later process,
High melting point solder (for example, Sn: Pb = 5: 95) so as not to re-melt at the soldering temperature (220 to 240 ° C.).
(Weight ratio: melting point: 315 ° C.).

Three holddowns 40 are provided at both ends of the housing 10 in the longitudinal direction.

Solder balls (reinforcing high melting point balls) 41 are welded to these holddowns 40, respectively.

Since the solder ball 41 is used for reinforcement, it is preferable that the diameter of the solder ball 41 be as large as possible so as to obtain a large mounting strength.

A solder ball larger than the diameter of the solder ball 30 so that the height from the bottom surface 10d of the housing 10 to the apex of the solder ball 41 and the height from the bottom surface 10d of the housing 10 to the apex of the solder ball 30 match. 4
1 is used.

Next, a method of manufacturing the high melting point ball connector 1 will be described with reference to FIGS.

FIG. 6 is a view for explaining a method for welding a reinforcing high-melting ball, FIG. 7 is a view for explaining a method for welding a high-melting ball, and FIG. 8 is a perspective view of the high-melting ball connector after the high-melting ball is welded. FIG.

The mounting of the solder balls 41 on the housing 10 is performed using a ball placer 45.

The ball placer 45 is a device for mounting the solder ball 41 on the housing 10, and is provided with a suction nozzle 46 (see FIG. 27) provided at the tip.
Is held by vacuum suction.

The housing 10 is arranged upside down from FIG. 1 such that the bottom surface 10d of the housing 10 faces the suction nozzle 46 of the ball placer 45.

First, a solder ball 41 is vacuum-sucked from a solder ball tank (not shown) by a ball placer 45 (see FIG. 6), a flux 42 is applied to the solder ball 41, and the solder ball 41 is mounted on a hold down 40. .

Since the solder wetting is greatly affected by the amount of the flux 42 applied, the flux 42 is uniformly applied to the solder balls 41 by using, for example, a spray type device.

Note that the flux 42 may be applied to the hold down 40 instead of the solder ball 41.

Next, the solder ball 30 for signal is vacuum-sucked from another solder ball tank (not shown) by the ball placer 45 (see FIG. 7), the flux 31 is applied to the solder ball 30, and the connection is made. It is mounted on the unit 21 (see FIG. 3).

As in the case of the solder ball 41, since the solder wetting is greatly affected by the amount of the flux 31 applied, the flux 31 is uniformly applied to the solder ball 30 by using, for example, a spray type device.

The flux 31 may be applied to the connecting portion 21 of the contact 20 instead of the solder ball 30.

Finally, the solder balls 41 and 30
After mounting, the solder ball 41 and the solder ball 30 are melted by hot air or infrared rays according to a predetermined temperature profile (temperature-time curve), and the solder ball 41 is connected to the holddown 40 and the solder ball 30 is connected to the contact 20. Part 21
Respectively.

As a result, the socket-side connector shown in FIG. 8 is completed.

FIG. 9 is a front view of a high melting point ball connector (pin side) according to the first embodiment of the present invention, FIG. 10 is a plan view thereof, FIG. 11 is a bottom view thereof, FIG.
3 is a cross-sectional view taken along the line BB in FIG.

The high-melting-point ball connector 51 includes a housing (insulator) 60, a contact 70, a solder ball (high-melting-point ball) 80, and a hold-down (reinforcing member) 90.

The housing 60 has a rectangular flat plate portion 60a.
And a guide portion 60e. Guide part 60
The guide hole 60e is formed integrally with the flat plate portion 60a and fits with the guide portions 10b and 10c of the socket-side connector.
b, 60c.

The contact 70 that contacts the contact 20 is press-fitted into the housing 60, and the contact portion of the contact 70 is exposed in the guide holes 60b and 60c.

A connecting portion 71 of the contact 70 projects from the bottom surface 60d of the housing 60, and a solder ball 80 is welded to the connecting portion 71.

Three holddowns (reinforcing members) 90 are provided at both ends of the housing 60 in the longitudinal direction.

Each of these holddowns 90 is welded with a reinforcing solder ball (a high-melting ball for reinforcement) 91.

Since the solder ball 91 is for reinforcement, it is preferable that the diameter of the solder ball 91 be as large as possible so as to obtain a large mounting strength.

Further, the solder ball 91 larger than the solder ball 80 is formed so that the height from the bottom surface 60d of the housing 60 to the apex of the solder ball 91 and the height from the bottom surface 60d of the housing 60 to the apex of the solder ball 80 match. used.

Since the pin-side high-melting point ball connector can be manufactured by the same manufacturing method as the above-described socket-side high-melting point ball connector, description thereof will be omitted.

FIG. 14 is a front view showing a fitted state of the pin side high melting point ball connector mounted on the wiring board and the socket side high melting point ball connector, and FIG. 15 is a side view thereof.

As the wiring substrates 95 and 96, a printed substrate, a glass substrate, a Si substrate or the like is used, and electrodes (not shown) and the like are printed in advance by solder printing.

After aligning the solder balls 30 of the socket-side high-melting ball connector 1 with the electrodes of the wiring board 95, the solder balls 30 and 41 are melted by reflow heating, and the solder balls 30 and 41 are welded to the wiring board 95.

As a result, the high melting point ball connector 1 is mounted on the wiring board 95.

The solder balls 80 and 91 of the pin-side high melting point ball connector 51 are also welded to the wiring board 96 in the same manner as described above.

When the pin-side high-melting point ball connector 51 and the socket-side high-melting point ball connector 1 are fitted, the wiring board 95 and the wiring board 96 are electrically connected.

According to this embodiment, hold down 4
By soldering the solder balls 41 and 91 welded to 0 and 90 to the wiring boards 95 and 96, the bonding strength can be secured and the pitch of the solder balls 30 can be increased. Goodness can be secured.

Further, since the diameters of the reinforcing solder balls 41 and 91 are larger than the diameters of the solder balls 30 and 80, the bonding strength when welded to the wiring boards 95 and 96 increases.

Further, the fluxes 31, 4 are uniformly applied to the contacts 20, 70 or the solder balls 30, 80, 41, 91.
Since 2 is applied, the wettability of the solder to the connection portions 21 and 71 can be adjusted by the amount of the applied flux.

FIG. 16 is a front view of a high melting point ball connector (pin side) according to a second embodiment of the present invention, FIG. 17 is a plan view thereof, FIG. 18 is a bottom view thereof, FIG. 19 is a side view thereof, and FIG. FIG. 18 is a sectional view taken along the line CC in FIG. 17.

The high melting point ball connector 101 includes a housing (insulator) 110, a contact (high melting point ball connector contact) 120, and a solder ball (high melting point metal ball) 130.

The rectangular housing 110 is
Guide holes 110 to be fitted with 60b and 160c (described later)
b, 110c.

A contact 170 is provided in the housing 110.
A contact 120 that makes contact with a contact (described later) is press-fitted, and the contact portion of the contact 120 is exposed to the guide holes 110b and 110c.

The connecting portion 121 of the contact 120 protrudes from the bottom surface 110 d of the housing 110.
1, a solder ball 130 is welded.

In this embodiment, the contact 120
Are four rows, but may be six rows or more.

Next, a method for manufacturing the contact 120 will be described.

FIG. 21 is a front view of a high melting point ball connector contact used in the high melting point ball connector according to the second embodiment of the present invention, FIG. 22 is a plan view thereof, FIG. 23 is a side view thereof, and FIG. FIG. 23 is a perspective view of the contact, and FIG. 25 is a perspective view of the contact.

The contact 120 is formed by stamping a copper plate with a press, and has a pin portion 122 and a connection portion 121.

At the time of press-fitting into the housing 110, the guide holes 110b and 110c of the housing 110 are inserted into the pin portion 122.
The flanges 122a and 122b that bite into the inner peripheral surface of the rim are formed.

The connecting portion 121 is formed by shearing a copper plate by so-called shearing from the carrier portion 90 °.
It is formed by bending (see FIG. 23).

The ball mounting surface 123 of the connection portion 121 is circular, and has a diameter larger than the diameter of the solder ball 130 (that is, not less than the projection surface of the solder ball 130).

Further, the ball mounting surface 123 is a so-called flash surface which is not subjected to chamfering.

Further, in the center of the ball mounting surface 123, FIG.
As shown in FIG. 4, solder balls 1 are punched or drilled.
A concave portion 123a that supports the roll 30 in a rotatable manner is formed.

The ball mounting surface 123 is plated with Ni (nickel).

The Ni plating is a plating having good solder wettability. However, if an oxide film is formed on the surface by heating or the like, soldering becomes difficult.

Therefore, when the solder ball 130 is welded to the ball mounting surface 123, an oxide film on the surface of the ball mounting surface 123 is removed by using a flux having a strong activity against Ni plating.

Next, the housing 11 of the contact 120
The incorporation into 0 will be described.

FIG. 26 is a partial cross-sectional view of the housing for explaining the assembling of the contacts.

First, the pin portion (contact portion) 122 of the contact 120 is pressed into the housing 110 from the direction of the arrow b, and the connection portion 121 is pressed against the bottom surface 110 d of the housing 110.

At this time, the flange 122a,
Since the pin 122 b is formed, the pin section 122 is securely fixed to the housing 110.

Thereafter, the carrier portion 124 is removed by bending it in the direction of arrow c.

Next, a method of applying the flux 6 to the solder balls 130 will be described.

FIG. 27 is a sectional view for explaining a method of applying a flux to a high melting point ball.

The flux is applied to the solder balls 130 by the same ball placer 4 as that used in the first embodiment.
5 is performed.

First, the solder ball 130 is vacuum-sucked by the nozzle 46 of the ball placer 45.

The nozzle 46 is moved to the flux tank 5, and the solder balls 130 are immersed in the flux 6.

At this time, since the surface of the flux 6 is leveled by the squeegee, the flux 6 is uniformly applied to the solder balls 130.

The flux 6 contains the solder balls 130.
A high-viscosity type is used so as not to cause excessive solder wetting when melting.

Next, the solder ball 130 is connected to the contact 12.
The method of welding to zero will be described with reference to FIGS.

FIG. 28 is an explanatory diagram showing a state before the high-melting-point ball is mounted on the contact, FIG. 29 is an explanatory diagram showing a state when the high-melting-point ball is mounted on the contact, and FIG. It is explanatory drawing which shows the state at the time of welding.

After applying the flux 6, the solder balls 1
The position of the ball placer 45 sucking 30 is corrected,
The designated ball mounting surface 123 and the solder ball 130 face each other (see FIG. 28).

The solder ball 1 is formed by the ball placer 45.
After being mounted on the designated ball mounting surface 123 and pressed, the vacuum suction is released and the nozzle 46 (FIG.
7) (see FIG. 29).

Thereafter, the connector 101 on which the solder balls 130 are mounted is put into a reflow furnace, and the solder balls 130 are melted by hot air or infrared rays according to a predetermined temperature profile (temperature-time curve). The solder balls 130 are welded (see FIG. 30).

The flux 6 becomes liquid at a predetermined temperature and the flux 6 covers the Ni-plated ball mounting surface 123 and removes an oxide film in a predetermined range of the ball mounting surface 123.
Flux 6 of solder ball 130 on ball mounting surface 123
The part covered with is welded.

At this time, since the applied amount of the flux 6 is uniform, excessive wetting and spreading of the solder is prevented, and the solder ball 130 can secure a uniform ball shape.

After the welding, an oxide film is formed on the surface around the solder ball 130 on the ball mounting surface 123.

FIG. 31 is a front view of a high melting point ball connector (socket side) according to a second embodiment of the present invention, FIG. 32 is a plan view thereof, FIG. 33 is a bottom view thereof, FIG. 34 is a side view thereof, and FIG. FIG. 32 is a sectional view taken along the line D-D in FIG. 31.

The high melting point ball connector 151 includes a housing (insulator) 160, a contact 170,
And a solder ball (high melting point metal ball) 180.

The housing 160 has a rectangular flat plate portion 160.
a and two guide portions 160b and 160c provided integrally with the flat plate portion 160a and extending in parallel with the longitudinal direction.

The housing 160 holds a contact 170 having a bellows-type spring portion 172 to be fitted with the contact 120.

The ball mounting surface 1 of the connection portion 171 of the contact 170 protruding from the bottom surface 160d of the housing 160
A solder ball 180 is welded to 73.

A recess 173a for supporting the solder ball 180 is formed on the ball mounting surface 173.

FIG. 36 is a partial cross-sectional view of the housing for explaining the assembling of the contacts.

First, the contact 120 press-fits the spring portion 172 into the housing 160 in the direction of arrow d, and
71 is pressed against the bottom surface 160d of the housing 160.

Next, the carrier part 174 is removed by bending it in the direction of arrow e.

After that, the solder balls 180 are welded to the ball mounting surface 173 of the connection portion 171 by the same method as the method of manufacturing the pin side high melting point ball connector.

FIG. 37 is a cross-sectional view showing a state where the high melting point ball connector is mounted on a wiring board.

The pin-side high melting point ball connector 101 manufactured by the above manufacturing method is fitted with the socket side high melting point ball connector 151, and the contact portions are in contact with each other.

As the wiring substrate 195, a printed substrate, a glass substrate, a Si substrate or the like is used, and electrodes (not shown) and the like are printed in advance by solder printing.

The socket-side high melting point ball connector 151 is mounted on the wiring board 195. At this time, the solder balls 18
0 and the electrode of the wiring board 195 are opposed to each other.

Thereafter, the solder balls 1 are heated by reflow heating.
80 is melted, and solder balls 180 are welded to the wiring board 195.

As a result, the high melting point ball connector 151 is mounted on the wiring board 195.

The pin-side high melting point ball connector 101 is mounted on the wiring board 196 in the same manner as described above.

At this time, since an oxide film is formed on the surface of the ball mounting surface 123 around the solder ball 130,
Even when heated at the time of mounting, the solder is
No spread from 3

According to this embodiment, the following effects can be obtained.

The same good mountability as that of the BGA package can be ensured, for example, the pitch of the solder balls 130 and 180 can be increased.

The ball mounting surface 12 of the connection portions 121 and 171
3, 173 is circular and the diameter is
0,180 and larger, and the ball mounting surface 1
23 and 173 are not subjected to chamfering and are burrs, so that when the solder balls 130 and 180 are melted, the molten solder is prevented from protruding from the ball mounting surfaces 123 and 173 and spreading. And solder balls 130,
180 height adjustments can be made. The amount of spread of the solder can also be adjusted by the amount of the flux 6 applied.

Since the concave portions 123a and 173a are formed at the center of the ball mounting surfaces 123 and 173 by a punch or a drill, the solder balls 130 and 180 can be easily positioned when mounted. When 130 and 180 are melted, the solder balls 13
Numerals 0 and 180 are located in central recesses 123a and 173a of the ball mounting surfaces 123 and 173, respectively.
73 and a good bonding state can be formed, and sufficient strength of the solder bonding portion can be secured.

Since the ball mounting surfaces 123 and 173 are plated with Ni, when the solder balls 130 and 180 are melted and heated when mounted on the wiring boards 195 and 196, the ball mounting surfaces 123 and 173 are heated. Since the oxide film is formed on the surface, the solder does not protrude from the ball mounting surfaces 123 and 173 and does not spread.

FIG. 38 is a perspective view of a high melting point ball connector (pin side) according to a third embodiment of the present invention.

The pin side high melting point ball connector 201 includes a housing (insulator) 210, a contact (high melting point ball connector contact) 220, and a solder ball (high melting point metal ball) 230.

A contact 220 that comes into contact with socket-side contacts 270A and 270B (described later) is press-fitted into the rectangular housing 210, and a pin portion (contact portion) 222 (see FIG. 39) of the contact 220 is connected to the housing 210.
Is exposed on the bottom surface 210d.

A connecting portion 221 (see FIG. 39) of the contact 220 protrudes from the bottom surface 210d of the housing 210, and a solder ball 230 is welded to the connecting portion 221.

The pin portion 222 is provided on the bottom surface 2 of the housing 210.
A predetermined pitch p (for example, p
= 0.4 mm).

The pin portion 222 has a housing 210
At the time of press-fitting, a flange 222a that cuts into the inner peripheral surface of the guide hole 210b of the housing 210 is formed.

The connecting portion 221 is provided on the bottom surface 2 of the housing 210.
They are arranged in a zigzag pattern at 10d.

As shown in FIG. 38, a plurality of pin portions 222
Are arranged in a line along the longitudinal direction of the housing 210, and a plurality of connecting portions 221 are arranged in parallel on both sides of the row of the pin portions 222.

The connecting portions 221 in one row and the connecting portions 222 in the other row are shifted by a pitch p in the longitudinal direction.

At this time, the connecting portions 221 are arranged at a pitch of 2p on a straight line in the longitudinal direction.

The ball mounting surface 223 of the connection portion 221 is substantially square, and the length of one side is equal to or larger than the diameter of the solder ball 230.

The ball mounting surface 223 is a so-called burred surface which is not subjected to chamfering similarly to the second embodiment, and has a concave portion (not shown) for supporting the solder ball 230 in a rollable manner at the center thereof. It is formed and its surface is plated with Ni.

Next, a method for manufacturing the contact 220 will be described.

FIG. 39 is a perspective view of a high melting point ball connector contact used in the high melting point ball connector (pin side) according to the third embodiment of the present invention.

The contact 220 is formed by stamping a copper plate into an L-shape by pressing.
21.

The pin portion 222 is made thinner than the connection portion 221 by so-called crushing or coining. For example, the thickness of the connection portion 221 is set to 0.
When the thickness is 4 mm, the thickness of the pin portion 222 is 0.2 mm.

FIG. 40 is a perspective view of a high melting point ball connector (socket side) according to a third embodiment of the present invention.

Socket-side high melting point ball connector 251
Is composed of a housing (insulator) 260, a contact (a contact for a high melting point ball connector) 270, and a solder ball (a high melting point metal ball) 280 (see FIG. 44).

The housing 260 has a rectangular flat plate portion 260.
a and a guide portion 260b provided integrally with the flat plate portion 260a and extending in the longitudinal direction.

In the housing 260, contacts 270A and 270B that are in contact with the contact 220 on the pin side are alternately held in the longitudinal direction.

The contacts 270A and 27OB are press-fitted into the rectangular housing 260, and the pins 272A and 272
B contact portions 274A and 274B (see FIG. 41) protrude from the side surface of the guide portion 260b of the housing 260.

Next, a method of manufacturing the contacts 270A and 270B will be described.

FIGS. 41 (a) and 41 (b) are perspective views of a high melting point ball connector contact used for a high melting point ball connector (socket side) according to a third embodiment of the present invention.

The contacts 270A and 270B are also formed in the same manner as the contact 220, and include the pin portions 272A and 270B.
272B and connection parts 271A and 271B.

The contacts 270A and 270B are provided at the tips of the pin portions 272A and 272B at the ends of the semicircular contact portions 274A and 274A.
The only difference from the contact 220 is that the 274B is formed.

As shown in FIG. 41, contact 270A
Contact portion 274A protrudes to the side without the connection portion 271A,
The contact portion 274B of the contact 270B is connected to the connection portion 271B.
Project to the side with

Next, the contacts 220, 270A, 27
The incorporation of OB into the housings 210 and 260 will be described.

FIG. 42 is a cross-sectional view of the connector for explaining the assembling of the contact.

First, the pin portions 2 of the pair of contacts 220
22 is pressed into the housing 210 from the direction of the white arrow d, and the connecting portion 221 is pressed against the housing 210.

Next to this contact 220, another contact 220 is inserted in the housing 210 from the direction of the white arrow d.
Press-fit.

At this time, the direction of another contact 220 is changed so that the connecting portions 221 are arranged in a staggered manner.
Pressing is performed by inverting 180 ° in the width direction of 10 (left-right direction in the figure).

Similarly, for the remaining contacts 220, the adjacent contacts 220 are
Pressing is performed by inverting the directions by 180 ° in the width direction of 10.

The pin portion 272 of the contact 270B
B is pressed into the housing 260 from the direction of the white arrow e, and the connection portion 271B is pressed against the housing 260.

The contact 270A adjacent to the contact 270B is similarly pressed into the housing 260 from the direction of the white arrow e.

Similarly, the connection portions 271A and 27
Adjacent contacts 120 are press-fitted with their directions inverted by 180 ° in the width direction of the housing 260 (horizontal direction in the figure) so that 1B and 1B are arranged in a staggered manner.

FIG. 43 is a view for explaining the relationship between the high melting point ball connector and the wiring board before the high melting point ball is mounted on the contact.

A printed circuit board is used as the wiring board 295. The wiring board 295 has electrodes 295a at positions facing the connecting portions 271A and 271B by solder printing.
(Only the electrode 295a facing the connection portion 271B is shown in FIG. 43).

FIG. 44 is a view for explaining the relationship between the high melting point ball connector and the wiring board.

The solder balls 280 are welded to the connection portions 271A and 271B by the same method as in the above embodiment.

After mounting the high melting point ball connector 251 on the wiring board 295 with the solder ball 280 and the electrode 295a of the printed board 295 facing each other, the solder ball 280 is melted by reflow heating, and the solder ball 280 is connected to the electrode 2
95 a and mounted on the wiring board 295.

The high melting point ball connector 201 is similarly mounted on a wiring board (not shown).

According to the third embodiment, the following effects can be obtained in addition to the same effects as in the above-described embodiment.

Since the contacts 220 having the connection portions 221 wider than the pin portions 222 are used, and the contacts 220 are arranged in a staggered manner with the pin portions 222 interposed therebetween, the pitch of the solder balls 230 can be narrowed compared to the above embodiment. The high-melting-point ball connector 201 can be smaller than that of the above-described embodiment, and can be easily soldered.

The contact 27 having the connection portions 271A and 271B wider than the pin portions 272A and 272B.
0A, 270B, and contacts 270A, 270B
Are arranged in a staggered manner with the pin portions 272A and 272B interposed therebetween, so that the pitch of the solder balls 280 can be narrower than in the above embodiment, and the high melting point ball connector 251 can be made smaller than that of the above embodiment. Soldering becomes easy.

In each of the above embodiments, the case where a high melting point solder ball is used as the high melting point metal ball has been described, but a Cu ball or the like may be used instead.

As described above, according to the first aspect,
According to Ming's high-melting point ball connector,
Welded high-melting ball for reinforcement to printed circuit board
Bonding strength between the high-melting ball for reinforcement and the printed circuit board
The solder ball pitch and increase the solder ball pitch.
And mountability similar to BGA package
Goodness can be secured. In addition, printed circuit boards
Sufficient physical strength at the time of welding is obtained.

The high melting point ball connector according to the second aspect of the present invention.
According to the Kuta, the pitch of the high melting point ball can be narrower,
If the melting point ball connector can be made more compact,
In addition, welding of the high melting point ball becomes easy.

According to the third aspect of the present invention, the high melting point ball can be easily mounted at a predetermined position on the ball mounting surface. It can be located at the center, and the bonding strength between the high melting point ball and the ball mounting surface can be increased.

According to the high melting point ball connector contact of the present invention, when the high melting point ball is melted, the high melting point ball melted by the burrs is prevented from protruding from the ball mounting surface and spreading. it can.

According to the contact for a high melting point ball connector of the present invention, when the high melting point ball is melted and heated again, an oxide film is formed on the surface of the high melting point ball. Spreading of the molten high melting point ball on the ball mounting surface is prevented.

[0177]

[Brief description of the drawings]

FIG. 1 is a front view of a high melting point ball connector (socket side) according to a first embodiment of the present invention.

FIG. 2 is a plan view of a high melting point ball connector (on the socket side).

FIG. 3 is a bottom view of the high melting point ball connector (on the socket side).

FIG. 4 is a side view of a high melting point ball connector (socket side).

FIG. 5 is a sectional view taken along the line AA of FIG. 2;

FIG. 6 is a diagram for explaining a method of welding a reinforcing high-melting ball.

Figure 7 is <br/> a view for explaining a welding method of the high melting point balls.

FIG. 8 is a perspective view of the high melting point ball connector after welding the high melting point ball.

FIG. 9 is a front view of a high melting point ball connector (pin side) according to the first embodiment of the present invention.

FIG. 10 is a plan view of a high melting point ball connector (pin side).

FIG. 11 is a bottom view of the high melting point ball connector (pin side).

FIG. 12 is a side view of a high melting point ball connector (pin side).

FIG. 13 is a sectional view taken along the line BB of FIG. 10;

FIG. 14 is a front view showing a fitted state of the pin side high melting point ball connector and the socket side high melting point ball connector mounted on the wiring board.

FIG. 15 is a side view showing a fitted state of the pin side high melting point ball connector and the socket side high melting point ball connector mounted on the wiring board.

FIG. 16 is a front view of a high melting point ball connector (pin side) according to a second embodiment of the present invention.

FIG. 17 is a plan view of a high melting point ball connector (pin side).

FIG. 18 is a bottom view of the high melting point ball connector (pin side).

FIG. 19 is a side view of a high melting point ball connector (pin side).

FIG. 20 is a cross-sectional view taken along the line CC of FIG. 16 ;

FIG. 21 is a front view of a high melting point ball connector contact used in a high melting point ball connector according to a second embodiment of the present invention.

FIG. 22 is a plan view of a high melting point ball connector contact used in the high melting point ball connector.

FIG. 23 is a side view of a high melting point ball connector contact used in the high melting point ball connector.

FIG. 24 is a view as viewed in the direction of arrow a in FIG. 23;

FIG. 25 is a perspective view of a high melting point ball connector contact used in the high melting point ball connector.

FIG. 26 is a partial cross-sectional view of the housing illustrating the assembling of contacts.

FIG. 27 is a cross-sectional view illustrating a method of applying a flux to a high melting point ball.

FIG. 28 is an explanatory diagram showing a state before a high melting point ball is mounted on a contact.

FIG. 29 is an explanatory view showing a state when a high melting point ball is mounted on a contact.

FIG. 30 is an explanatory diagram showing a state when a high melting point ball is welded to a contact.

FIG. 31 is a front view of a high-melting-point ball connector (socket side) according to a second embodiment of the present invention.

FIG. 32 is a plan view of a high melting point ball connector (on the socket side).

FIG. 33 is a bottom view of a high melting point ball connector (on the socket side).

FIG. 34 is a side view of a high melting point ball connector (socket side).

FIG. 35 is a sectional view taken along the line DD in FIG. 31;

FIG. 36 is a partial cross-sectional view of the housing illustrating the assembling of contacts.

FIG. 37 is a cross-sectional view showing a state where a high-melting point ball connector is mounted on a wiring board.

FIG. 38 is a perspective view of a high melting point ball connector (pin side) according to a third embodiment of the present invention.

FIG. 39 is a perspective view of a high melting point ball connector contact used for a high melting point ball connector (pin side) according to a third embodiment of the present invention.

FIG. 40 is a perspective view of a high-melting point ball connector (socket side) according to a third embodiment of the present invention.

41 (a) and 41 (b) are perspective views of a high melting point ball connector contact used for a high melting point ball connector (socket side) according to a third embodiment of the present invention.

FIG. 42 is a cross-sectional view of the connector illustrating the assembling of contacts.

FIG. 43 is a diagram illustrating a relationship between the high-melting-point ball connector and the wiring board before the high-melting-point ball is mounted on the contact.

FIG. 44 is a diagram illustrating a relationship between a high-melting point ball connector and a wiring board;

[Explanation of symbols]

1,51,101,151,201,251 High melting point ball connector 10,60,110,160,210,260 Housing (insulator) 20,70,120,170,220,270A, 27
OB contact 21, 71, 121, 171, 221, 271A, 27
1B Connection part 30, 80, 130, 180, 230, 280 Solder ball (high melting point ball) 40, 90 Hold down (reinforcing member) 41, 91 High melting point ball (high melting point ball for reinforcement) 123, 173, 223 Ball mounted Surface 123a, 173a recess

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01R 12/22

Claims (5)

(57) [Claims] 1. A high-melting point ball connector comprising an insulator and a plurality of contacts held by the insulator, wherein a high-melting point ball is welded to a connection portion of each of the contacts, and a reinforcing member for increasing mounting strength is provided on the insulator. A diameter larger than the diameter of the high melting point ball provided on the reinforcing member.
The high melting point ball for reinforcement is welded, and the top of the high melting point ball is
From the bottom of the insulator
A high melting point ball connector characterized in that the height of the point ball coincides with the height of the ball. 2. An insulator, and the insulator
And a plurality of contacts held linearly in a row.
In the high-melting-point ball connector, the connecting portions of the contacts are arranged in a staggered manner , high-melting-point balls are welded to the connecting portions of the respective contacts, and the ball mounting surface of the connecting portion is equal to or more than the projected surface of the high-melting-point ball.
, And the contact arrangement direction width of the ball mounting surface, the con
The contact arrangement direction pitch of the ball mounting surface is larger than the contact arrangement direction width of the tact connection portion ,
Double the pitch in the contact arrangement direction of the contact connection part
Refractory ball connector contacts, characterized in that. 3. A high melting point ball connector contact having a connecting portion exposed from an insulator, wherein the ball mounting surface of the connecting portion is equal to or larger than a projection surface of the high melting point ball, and the ball mounting surface of the connecting portion has the high mounting point. A contact for a high melting point ball connector, wherein a concave portion for supporting the melting point ball so as to roll is formed. 4. The contact for a high melting point ball connector according to claim 3, wherein the ball mounting surface of the connection portion is not chamfered. 5. The contact for a high-melting point ball connector according to claim 3, wherein the ball mounting surface of the connection part is plated so that solder is hardly wetted.