CN217884014U - Make things convenient for multiply wood mechanism of connector encapsulation - Google Patents
Make things convenient for multiply wood mechanism of connector encapsulation Download PDFInfo
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- CN217884014U CN217884014U CN202221158084.8U CN202221158084U CN217884014U CN 217884014 U CN217884014 U CN 217884014U CN 202221158084 U CN202221158084 U CN 202221158084U CN 217884014 U CN217884014 U CN 217884014U
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Abstract
The utility model provides a make things convenient for multiply wood mechanism of connector encapsulation, include: the PCB multilayer board main part has seted up a plurality of non-metallization jacks on the PCB multilayer board main part, and every non-metallization jack is equipped with a pad, and the pad sets up near non-metallization jack, and every fan-shaped pad passes through via hole and is connected with PCB multilayer board main part, and the lead wire of connector inserts and utilizes electric iron to link to each other the lead wire with fan-shaped pad welding in the non-metallization jack, and the pad links to each other with the lead wire welding at non-metallization jack top. The utility model discloses a plurality of non-metallization jacks have been seted up in the PCB multiply wood main part, set up the pad by the non-metallization jack, the pad is through each circuit board electrical connection in other via hole and the PCB multiply wood main part, and it is downthehole that the connector inserts non-metallization, and the connector lead wire that is located non-metallization jack top during the welding welds with the pad and links to each other, reduces the heat and runs off, and the pad is in the same place with the lead wire welding easily.
Description
Technical Field
The utility model relates to a circuit board processing encapsulation field especially relates to a make things convenient for multilayer board mechanism of connector encapsulation.
Background
The encapsulation of multilayer board connector is the important adapting unit of module PCB board, present connector disect insertion carries out welding operation in the metal hole of PCB board, because the thickness of multilayer PCB board exceeds 3mm, the pad heat conduction piece, the heat can transmit rapidly in the metal hole during the connector welding, link to each other metal hole and connector together welding during the welding, owing to increased welded face territory, the needs electric iron that corresponds provides higher power, otherwise the heat runs off and can lead to the welding difficulty at the excessive speed, the connector links together difficult demolishs with the inner wall of pin hole when dismantling the maintenance simultaneously.
Disclosure of Invention
To the problem in the above-mentioned background art, the utility model provides a make things convenient for multiply wood mechanism of connector encapsulation, include: the method comprises the following steps: the PCB multi-layer board comprises a PCB multi-layer board main body, wherein a plurality of non-metallization jacks are formed in the PCB multi-layer board main body, each non-metallization jack is provided with a bonding pad, the bonding pad is arranged close to the non-metallization jack, each fan-shaped bonding pad is connected with the PCB multi-layer board main body through a via hole, a lead of a connector is inserted into the non-metallization jack and is connected with the fan-shaped bonding pad in a welding mode through an electric soldering iron, and the bonding pad is connected with the lead at the top of the non-metallization jack in a welding mode.
As an optimized mode of the utility model, the pad specifically sets sector structure to, the setting of non-metallization jack is in the inboard of pad.
As an optimized mode of the present invention, the non-metalized socket is spaced from the paired pad by 0.1mm.
As a preferable mode of the present invention, the pads are arranged in a group of four and in an annular array.
As a preferred mode of the present invention, the distance between two sets of adjacent pads is determined according to the withstand voltage requirement between the leads.
As a preferred mode of the utility model, the interval between two sets of adjacent pads is 0.52mm.
As an optimized mode of the utility model, the diameter of the non-metallized jack is 0.75mm.
As an optimal mode of the utility model, at least one via hole is connected to every pad, the via hole is filled the hole through resin consent and is electroplated and fill level, the lateral wall in via hole and each layer circuit board electrical connection of PCB multiply wood main part, the top and the pad electrical connection in via hole.
Compared with the prior art, the utility model provides a make things convenient for multilayer board mechanism of connector encapsulation has following beneficial effect:
1. the utility model discloses a plurality of non-metallization jacks have been seted up in the PCB multiply wood main part, set up the pad by the non-metallization jack, the pad is through each circuit board electrical connection in other via hole and the PCB multiply wood main part, and it is downthehole that the connector inserts non-metallization, and the connector lead wire that is located non-metallization jack top during the welding welds with the pad and links to each other, reduces the heat and runs off, and the pad is in the same place with the lead wire welding easily.
2. The utility model discloses a there is not soldering tin to fill in the non-metallization jack hole, only need during the dismantlement to pad with pin connection's position department heat can, the connector dismantlement is more convenient.
Description of the drawings:
fig. 1 is a packaging diagram of a multi-layer board mechanism that facilitates connector packaging.
Fig. 2 is a layout of a multi-layer board mechanism that facilitates connector packaging.
Wherein: 1-PCB multilayer board main body; 2-a non-metallized jack; 3-bonding pad.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, other ways of implementing the invention may be devised different from those described herein, and it will be apparent to those skilled in the art that the invention can be practiced without departing from the spirit and scope of the invention.
As shown in fig. 1-2, the present invention provides a multi-layer board mechanism for facilitating connector packaging, comprising: the PCB multi-layer board comprises a PCB multi-layer board main body 1, wherein a plurality of non-metallization jacks 2 are formed in the PCB multi-layer board main body 1, each non-metallization jack 2 is provided with a bonding pad 3, the bonding pad 3 is arranged close to the non-metallization jack 2, each fan-shaped bonding pad 3 is connected with the PCB multi-layer board main body 1 through a via hole, a lead of a connector is inserted into the non-metallization jack 2 and is connected with the fan-shaped bonding pad 3 in a welding mode through an electric soldering iron, the bonding pad 3 is connected with a lead at the top of the non-metallization jack 2 in a welding mode, each bonding pad 3 is connected with at least one via hole, the via holes are plugged through resin and are filled and leveled through electroplating, the side wall of each via hole is electrically connected with each layer of circuit board of the PCB multi-layer board main body 1, and the top of each via hole is electrically connected with the bonding pads 3. The utility model discloses a plurality of non-metallization jacks have been seted up in the PCB multiply wood main part, at the other pad that sets up of non-metallization jack, the pad is through each circuit board electrical connection in other via hole and the PCB multiply wood main part, and it is downthehole that the connector inserts non-metallization, and the connector lead wire that is located non-metallization jack top during the welding welds with the pad and links to each other, reduces the heat and runs off, and the pad is in the same place with the lead wire welding easily.
For making things convenient for pad 3 and lead wire to weld, the utility model discloses a fan-shaped structure is specifically set to pad 3, and non-metallization jack 2 sets up in the inboard of pad 3, and non-metallization jack 2 is at a distance of 0.1mm rather than the pad 3 that pairs in the actual implementation process.
In practical implementation, the non-metallized jack 2 is usually arranged in four groups, the pads 3 corresponding to the non-metallized jack 2 are arranged in a circular array, the distance between two adjacent groups of pads 3 is determined according to the voltage resistance requirement between leads, in this embodiment, the diameter of the non-metallized jack 2 is 0.75mm, and the distance between two adjacent groups of pads 3 is 0.52mm.
The specific implementation process comprises the following steps: passing the lead through the non-metallized jack 2; the wire is soldered to the adjacent pad 3 using an electric soldering iron, since the solder is only soldered at the top layer at this time because of the non-metallized holes and the heat transfer rate is slow, the wire can be soldered quickly within 3 seconds. When the connector is disassembled, the tin suction device or the tin suction belt is used, the electric soldering iron is matched to heat at the welding disc, and because no tin is filled in the non-metallization insertion hole 2, the top-layer soldering tin can be quickly removed, and the connector is disassembled.
It should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (8)
1. A multi-layer board mechanism that facilitates connector packaging, comprising: PCB multiply wood main part (1), its characterized in that, a plurality of non-metallization jack (2) have been seted up on PCB multiply wood main part (1), and every non-metallization jack (2) are equipped with a pad (3), pad (3) are close to non-metallization jack (2) set up, and every fan-shaped pad (3) are connected with PCB multiply wood main part (1) through the via hole, and lead wire (4) of connector insert in non-metallization jack (2) utilize electric iron to link to each other lead wire (4) and fan-shaped pad (3) welding, lead wire (4) welding at pad (3) and non-metallization jack (2) top links to each other.
2. A multiplate mechanism facilitating connector packaging according to claim 1, characterized in that the pads (3) are arranged in a fan-shaped configuration, the non-metallized sockets (2) being arranged inside the pads (3).
3. A multi-layer board mechanism for facilitating connector packaging according to claim 2, wherein the non-metallized jack (2) is 0.1mm away from its mating pad (3).
4. A multi-layer board mechanism facilitating connector packaging according to claim 3, characterized in that the pads (3) are arranged in groups of four and in an annular array.
5. A multi-layer board mechanism facilitating connector packaging according to claim 4, characterized in that the spacing between two sets of adjacent pads (3) is determined according to the requirement of voltage resistance between leads (4).
6. A multi-layer board mechanism for facilitating connector packaging according to claim 4, wherein the spacing between two sets of adjacent pads (3) is 0.52mm.
7. A multi-layer board mechanism for facilitating connector packaging according to claim 6, wherein the diameter of the non-metalized receptacle (2) is 0.75mm.
8. The multilayer board mechanism for facilitating connector packaging according to claim 1, wherein each bonding pad (3) is connected with at least one via hole, the via hole is plugged by resin and is filled by electroplating, the side wall of the via hole is electrically connected with each layer of circuit board of the PCB multilayer board main body (1), and the top of the via hole is electrically connected with the bonding pad (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221158084.8U CN217884014U (en) | 2022-05-16 | 2022-05-16 | Make things convenient for multiply wood mechanism of connector encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221158084.8U CN217884014U (en) | 2022-05-16 | 2022-05-16 | Make things convenient for multiply wood mechanism of connector encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217884014U true CN217884014U (en) | 2022-11-22 |
Family
ID=84088517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221158084.8U Active CN217884014U (en) | 2022-05-16 | 2022-05-16 | Make things convenient for multiply wood mechanism of connector encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217884014U (en) |
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2022
- 2022-05-16 CN CN202221158084.8U patent/CN217884014U/en active Active
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