CN108365357A - Terminal and electric connector with the terminal - Google Patents
Terminal and electric connector with the terminal Download PDFInfo
- Publication number
- CN108365357A CN108365357A CN201810086369.7A CN201810086369A CN108365357A CN 108365357 A CN108365357 A CN 108365357A CN 201810086369 A CN201810086369 A CN 201810086369A CN 108365357 A CN108365357 A CN 108365357A
- Authority
- CN
- China
- Prior art keywords
- solder mask
- layer
- terminal
- solder
- welding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
Abstract
A kind of electric connector is for electrically connecting to a chip module to a circuit board, including：One insulating body has a upper and lower perforative at least accepting hole；An at least terminal, each accepting hole, which corresponds to, accommodates the terminal, the terminal has a contact site at its upper end and the weld part positioned at its lower end, the weld part extends downwardly out outside the accepting hole, the weld part has a welding surface and surrounds a solder mask of the welding surface, the welding surface is to engage a solder, and the solder mask is preventing the solder from being spread on the solder mask.
Description
Technical field
The present invention relates to a kind of terminal and with the electric connector of the terminal, espespecially a kind of end for preventing solder siphon
Son and the electric connector with the terminal.
Background technology
There is a kind of existing electric connector an insulating body, multiple terminals to be set to insulating body, and terminal has a main body
Portion and the weld part extended downwardly by main part, weld part is by solder and welding circuit board, to prevent solder and terminal soldering
It is generated when connecing and climbs tin, in the connecting portion of weld part and main part by one nonproliferation region of radium-shine formation, work as melt solder
When at liquid, entire weld part is enveloped, which can prevent liquid solder from rising to main part.However, packet
It covers entire weld part and needs excessive solder, both waste solder, and as the density of terminal in electric connector is increasing, mistake
When more solders is welded with terminal, and easily cause the short circuit between terminals of adjacent.
The present invention employs new technology in view of the above problems, a kind of new terminal of offer and the electric connector with the terminal
Means are to solve these problems.
Invention content
For background technology problem encountered, present invention creation is designed to provide a kind of new terminal and has the end
The electric connector of son is welded by less solder and terminal, not only saves solder, but also avoid the short circuit between terminals of adjacent.
To achieve the above object, invention uses following technological means：
The present invention provides a kind of terminal, including：One contact site is located at the upper end of the terminal；One weld part is located at the terminal
Lower end, the weld part has a welding surface and surrounds a solder mask of the welding surface, and the welding surface is engaging one
Solder, the solder mask is preventing the solder from being spread on the solder mask.
Further, the welding surface and the solder mask are arranged downward, and the lower surface of the solder mask is less than the weldering
Junction.
Further, the solder mask is three-proofing coating, and the solder mask on the weld part by carrying out inkjet printing
Mode is formed.
Further, the section of the weld part is multilayered structure, including a substrate layer and is coated on outside the substrate layer
One can layer, the welding surface be formed in it is described can layer, it is outer and be exposed to described that the solder mask is formed in the substrate layer
It can layer.
Further, the substrate layer be layers of copper, it is described can layer be tin coating, a nickel coating be set to the substrate layer and institute
State can between layer, the nickel coating be exposed to it is described can the part of layer form the solder mask.
Further, the solder mask is the oxide layer that the base material layer surface is formed.
Further, the welding surface and the solder mask are arranged downward, and the solder mask passes through on the weld part
It carries out radium-shine mode to be formed, the lower surface of the solder mask is higher than the welding surface.
The present invention provides a kind of electric connector, is for electrically connecting to a chip module to a circuit board, including：One insulation is originally
Body has a upper and lower perforative at least accepting hole；An at least terminal, each accepting hole, which corresponds to, accommodates the terminal, described
There is terminal a contact site at its upper end and the weld part positioned at its lower end, the weld part to extend downwardly out the receipts
Hold outside hole, the weld part has a welding surface and surrounds a solder mask of the welding surface, and the welding surface is engaging one
Solder, the solder mask is preventing the solder from being spread on the solder mask.
Further, the welding surface and the solder mask are arranged downward, and the lower surface of the solder mask is less than the weldering
Junction.
Further, the solder mask is three-proofing coating, and the solder mask on the weld part by carrying out inkjet printing
Mode is formed.
Further, the section of the weld part is multilayered structure, including a substrate layer and is coated on outside the substrate layer
One can layer, the welding surface be formed in it is described can layer, it is outer and be exposed to described that the solder mask is formed in the substrate layer
It can layer.
Further, the substrate layer be layers of copper, it is described can layer be tin coating, a nickel coating be set to the substrate layer and institute
State can between layer, the nickel coating be exposed to it is described can the part of layer form the solder mask.
Further, the solder mask is the oxide layer that the base material layer surface is formed.
Further, the welding surface and the solder mask are arranged downward, and the solder mask passes through on the weld part
It carries out radium-shine mode to be formed, the lower surface of the solder mask is higher than the welding surface.
Further, the lower surface of the insulating body correspond to be downwardly extending around each accepting hole it is multiple convex
Go out portion, the welding surface more than the half of the bead height and is less than the solder at a distance from the lower surface of the protrusion
Height.
Compared with prior art, the invention has the advantages that：
The terminal of the present invention and the electric connector with the terminal, the weld part have described in the welding surface and encirclement
The solder mask of welding surface, the welding surface is to engage a solder, and the solder mask is preventing the solder described
It is spread on solder mask, the solder is only engaged in the welding surface, is not required to envelope the entire weld part, therefore need not be excessive
The solder caused adjacent institute when both having saved the solder, while the excessive solder and the terminal also being avoided to weld
State the short circuit between terminal.
【Description of the drawings】
Fig. 1 is the three-dimensional cutaway view of electric connector first embodiment of the present invention；
Fig. 2 is the side view before electric connector and welding circuit board in Fig. 1；
Fig. 3 be Fig. 2 in electric connector welding after circuit board, then with chip module cooperation schematic diagram；
Fig. 4 is a terminal in Fig. 1, the stereogram after being inverted；
Fig. 5 is a terminal in Fig. 1, and the side view of tin ball is preset on weld part；
Fig. 6 is the enlarged drawing of the parts a in Fig. 5；
Fig. 7 is the second embodiment of terminal of the present invention, and the side view of tin ball is preset on terminal weld part；
Fig. 8 is the enlarged drawing of the parts b in Fig. 7；
Fig. 9 is the 3rd embodiment of terminal of the present invention, and the enlarged drawing of tin ball is preset on terminal weld part.
The drawing reference numeral explanation of specific implementation mode：
| Electric connector 100 | Insulating body 1 | Accepting hole 11 | Protrusion 12 | Terminal 2 |
| Base portion 20 | Elastic arm 21 | Contact site 211 | Interconnecting piece 22 | Weld part 23 |
| Welding surface 231 | Solder mask 232 | Substrate layer 233 | Nickel coating 234 | It can layer 235 |
| Solder 3 | Chip module 200 | Circuit board 300 |
【Specific implementation mode】
For ease of purpose, structure, feature and the effect etc. for being better understood from invention, in conjunction with the drawings and specific embodiments pair
The present invention is described further.
As shown in figures 1 and 3, it is the first embodiment of electric connector 100 of the present invention comprising：It one insulating body 1 and sets
In multiple terminals 2 of the insulating body 1, the electric connector 100 is for electrically connecting to 200 to one circuit board of a chip module
300。
As shown in Fig. 2, the insulating body 1 has multiple perforative accepting holes 11 up and down, multiple terminals 2 are to receivable
Multiple accepting holes 11 are dissolved in, the lower surface of the insulating body 1 corresponds to be extended downwardly around each described accepting hole 11
There are multiple protrusions 12, the protrusion 12 to can be used to abut the circuit board 300.
As shown in Fig. 2, the terminal 2 has a base portion 20 and is folded upward at an elastic arm 21 of extension by the base portion 20,
There is the free terminal of the elastic arm 21 contact site 211, the contact site 211 to extend the accepting hole 11 to contact
State chip module 200.The terminal 2 further includes from the base portion 20 bending downward an interconnecting piece 22 of extension and by the connection
The weld part 23 that portion 22 is bent and horizontal extension is formed, the weld part 23 extends downwardly out the accepting hole 11, and passes through
One solder 3 is welded in the circuit board 300.
As shown in Figure 2 and Figure 4, the weld part 23 has a welding surface 231 and surrounds a welding resistance of the welding surface 231
Layer 232, the welding surface 231 and the solder mask 232 are arranged downward, and in the present embodiment, the welding surface 231 is one flat
Face and in horizontally disposed, the welding surface 231 is circle, and to engage the solder 3, the solder mask 232 is in circular ring shape, is used
To be spread on the solder mask 232 when the solder 3 being prevented to melt.
As shown in Figure 5 and Figure 6, in the present embodiment, the solder mask 232 is three-proofing coating, by way of inkjet printing
It is formed in the weld part 23 so that the lower surface of the solder mask 232 is less than the welding surface 231, the i.e. welding surface 231
It is relatively recessed among the solder mask 232, the welding surface 231 and the solder mask 232 enclose jointly is set as a receiving space
(not shown) is to accommodate the solder 3.
In the present embodiment, the solder 3 is tin ball, and tin liquor is poor to the wetability of three-proofing coating so that the solder mask 232 can
It is spread on the solder mask 232 when the solder 3 being prevented to melt, to make the solder 3 that can be gathered in the welding surface
231。
When assembling, as shown in Figure 1, by multiple terminals 2, correspondence is installed in multiple accepting holes from top to bottom first
11；Later, as shown in Fig. 2, Fig. 4 and Fig. 5, the solder 3 is defaulted in into the welding surface 231, around the accepting hole 11
Multiple protrusions 12 limit the solder 3, and the welding surface 231 is big at a distance from the lower surface of the protrusion 12
Half in 3 height of the solder and the height less than the solder 3, the protrusion 12 play guarantor to the solder 3 simultaneously
The effect of shield avoids the solder 3 from being impacted and falls off；As shown in figure 3, the electric connector 100 is returned by the solder 3 again
Fluid welding is connected to the circuit board 300, and the protrusion 12 is connected to the circuit board 300, prevents 3 excessive deformation of the solder,
The chip module 200 is finally installed on the electric connector 100, makes the chip module 200 and 211 electricity of the contact site
Property conducting.
Certainly, in other embodiments（It is not shown）, by multiple between the chip module 200 and the circuit board 300
When the terminal 2 is electrically connected, the terminal 2 can not be positioned by the insulating body 1, in other words, as described
When terminal 2 is electrically connected the chip module 200 with the circuit board 300, the insulating body 1 is not present；Other embodiments
In（It is not shown）, the insulating body 1 is provided only with an accepting hole 11, and the correspondence of the electric connector 100 is provided only with one
The terminal 2 is contained in the accepting hole 11.
As shown in Figure 7 and Figure 8, it is the second embodiment of terminal 2 of the present invention, with terminal described in first embodiment
2 difference lies in：The section of the weld part 23 is multilayered structure, including a substrate layer 233, is coated on the substrate layer 233
An outer nickel coating 234 and be coated on outside the solder mask 232 one can layer 235, the solderability of the nickel coating 234
Difference.
In the present embodiment, the substrate layer 233 is copper or Cu alloy material, by being plated on 233 surface of the substrate layer
Form the nickel coating 234, it is described can layer 235 be the tin coating for being plated on 234 surface of the nickel coating.
When on the weld part 23 the nickel coating 234 and it is described can layer 235 be electroplated after the completion of, described in radium-shine removal
One circle coating of the lower surface edge of weld part 23（Including it is described can layer 235 and the nickel coating 234）, make the institute at the position
It states the surface exposure of substrate layer 233 and is aoxidized, when formation can prevent the solder 3 from melting on the surface of the substrate layer 233
The oxide layer of the oxide layer of diffusion, 233 surface of the substrate layer forms the solder mask 232, and is surround by the solder mask 232
It is described can layer 235 not by radium-shine removal, define the welding surface 231, the lower surface of the solder mask 232 is higher than at this time
The welding surface 231 so that the welding surface 231 protrudes out downwards and the lower surface beyond the solder mask 232, when the solder
When 3 melting, the welding surface 231 can protrude into the solder 3, increase the bond strength of the weld part 23 and the solder 3.
As shown in figure 9, for terminal 2 of the present invention 3rd embodiment, with second embodiment difference lies in：It is radium-shine
Remove the lower surface edge of the weld part 23 a circle can layer 235, while the nickel coating 234 at the position is not removed
And it is exposed, the exposed nickel coating 234 becomes the solder mask 232.Terminal of the present invention and electric connector with the terminal
It has the advantages that：
1, the welding surface 231 by the solder mask 232 enclose set on centre, the welding surface 231 to engage the solder 3,
For the solder mask 232 to be spread on the solder mask 232 when the solder 3 being prevented to melt, the solder 3 is only engaged in institute
Welding surface 231 is stated, is not required to envelope the entire weld part 23, therefore does not need the excessive solder 3, had both saved the solder
3, while when the excessive solder 3 and the weld part 23 also being avoided to weld, 3 slime flux of the solder to the adjacent terminal
2, it causes to form short circuit between the adjacent terminal 2.
2, the welding surface 231 and the solder mask 232 are arranged downward, and the lower surface of the solder mask 232 is less than institute
State welding surface 231 so that the welding surface 231 is recessed among the solder mask 232, the solder mask 232 and the welding
Face 231 is enclosed jointly is set as the receiving space to accommodate the solder 3.
3, the solder mask 232 is three-proofing coating, is formed by way of carrying out inkjet printing on the weld part 23,
Since inkjet printing has very high precision, it is ensured that the solder mask 232 is accurately set to around the welding surface 231.
4, the solder mask 232 is formed by carrying out radium-shine mode on the weld part 23, the solder mask 232
Lower surface is higher than the welding surface 231 so that and the welding surface 231 protrudes out downwards and the lower surface beyond the solder mask 232,
When the solder 3 melts, the welding surface 231 can protrude into the solder 3, increase the weld part 23 and the solder 3
Bond strength.
Detailed description above is only the explanation of the preferred embodiments of the invention, the scope of the claims that is non-therefore limiting to the present invention,
So all, with this creation specification and diagramatic content institute, equivalence techniques change for it, are both contained in the scope of the claims of this creation
It is interior.
Claims (15)
1. a kind of terminal, which is characterized in that including：
One contact site is located at the upper end of the terminal；
One weld part, is located at the lower end of the terminal, and the weld part has a welding surface and surrounds a resistance of the welding surface
Layer, the welding surface is to engage a solder, and the solder mask is preventing the solder from being spread on the solder mask.
2. terminal as described in claim 1, it is characterised in that：The welding surface and the solder mask are arranged downward, described
The lower surface of solder mask is less than the welding surface.
3. terminal as described in claim 1, it is characterised in that：The solder mask is three-proofing coating, and the solder mask passes through in institute
The mode for stating progress inkjet printing on weld part is formed.
4. terminal as described in claim 1, it is characterised in that：The section of the weld part is multilayered structure, including a base material
Layer and be coated on outside the substrate layer one can layer, the welding surface be formed in it is described can layer, the solder mask is formed in
The substrate layer it is outer and be exposed to it is described can layer.
5. terminal as claimed in claim 4, it is characterised in that：The substrate layer be layers of copper, it is described can layer be tin coating, one
Nickel coating be set to the substrate layer and it is described can between layer, the nickel coating be exposed to it is described can layer part formed described in
Solder mask.
6. terminal as claimed in claim 4, it is characterised in that：The solder mask is the oxidation that the base material layer surface is formed
Layer.
7. terminal as described in claim 1, it is characterised in that：The welding surface and the solder mask are arranged downward, described
Solder mask is formed by carrying out radium-shine mode on the weld part, and the lower surface of the solder mask is higher than the welding surface.
8. a kind of electric connector is for electrically connecting to a chip module to a circuit board, which is characterized in that including：
One insulating body has a upper and lower perforative at least accepting hole；
An at least terminal, each accepting hole, which corresponds to, accommodates the terminal, and the terminal has a contact at its upper end
Portion and a weld part positioned at its lower end, the weld part extend downwardly out outside the accepting hole, and the weld part has a weldering
Junction and the solder mask for surrounding the welding surface, the welding surface is to engage a solder, and the solder mask is to prevent
Solder is stated to spread on the solder mask.
9. electric connector as claimed in claim 8, it is characterised in that：The welding surface and the solder mask are arranged downward,
The lower surface of the solder mask is less than the welding surface.
10. electric connector as claimed in claim 8, it is characterised in that：The solder mask is three-proofing coating, and the solder mask passes through
The mode that inkjet printing is carried out on the weld part is formed.
11. electric connector as claimed in claim 8, it is characterised in that：The section of the weld part is multilayered structure, including one
Substrate layer and be coated on outside the substrate layer one can layer, the welding surface be formed in it is described can layer, the solder mask shape
Substrate layer described in Cheng Yu it is outer and be exposed to it is described can layer.
12. electric connector as claimed in claim 11, it is characterised in that：The substrate layer be layers of copper, it is described can layer be tin
Coating, a nickel coating be set to the substrate layer and it is described can between layer, the nickel coating be exposed to it is described can layer part
Form the solder mask.
13. electric connector as claimed in claim 11, it is characterised in that：The solder mask is what the base material layer surface was formed
Oxide layer.
14. electric connector as claimed in claim 8, it is characterised in that：The welding surface and the solder mask are arranged downward,
The solder mask is formed by carrying out radium-shine mode on the weld part, and the lower surface of the solder mask is higher than the welding
Face.
15. electric connector as claimed in claim 8, it is characterised in that：The lower surface of the insulating body corresponds to each described
Multiple protrusions are downwardly extending around accepting hole, the welding surface is more than institute at a distance from the lower surface of the protrusion
State the half of bead height and the height less than the solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810086369.7A CN108365357B (en) | 2018-01-30 | 2018-01-30 | Terminal and electric connector with the terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810086369.7A CN108365357B (en) | 2018-01-30 | 2018-01-30 | Terminal and electric connector with the terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108365357A true CN108365357A (en) | 2018-08-03 |
| CN108365357B CN108365357B (en) | 2019-11-26 |
Family
ID=63007542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810086369.7A Active CN108365357B (en) | 2018-01-30 | 2018-01-30 | Terminal and electric connector with the terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108365357B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449632A (en) * | 2018-12-14 | 2019-03-08 | 深圳市远爱电子科技有限公司 | Solder terminal, welded type terminal and data connector |
| CN111755933A (en) * | 2019-03-26 | 2020-10-09 | 富士康(昆山)电脑接插件有限公司 | Method for manufacturing conductive terminal |
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| CN2682693Y (en) * | 2003-11-26 | 2005-03-02 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN101295695A (en) * | 2007-04-29 | 2008-10-29 | 飞思卡尔半导体（中国）有限公司 | Lead frame with welding flux flow control |
| CN102549738A (en) * | 2010-05-18 | 2012-07-04 | 丰田自动车株式会社 | Semiconductor device and method for manufacturing the same |
| CN106252471A (en) * | 2016-08-31 | 2016-12-21 | 吴懿平 | A kind of many I/O flip LED chips array bump packaging structure and method for packing thereof |
| CN206532913U (en) * | 2017-01-20 | 2017-09-29 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN107394568A (en) * | 2017-06-29 | 2017-11-24 | 番禺得意精密电子工业有限公司 | Electric connector assembling method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2682693Y (en) * | 2003-11-26 | 2005-03-02 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN101295695A (en) * | 2007-04-29 | 2008-10-29 | 飞思卡尔半导体（中国）有限公司 | Lead frame with welding flux flow control |
| CN102549738A (en) * | 2010-05-18 | 2012-07-04 | 丰田自动车株式会社 | Semiconductor device and method for manufacturing the same |
| CN106252471A (en) * | 2016-08-31 | 2016-12-21 | 吴懿平 | A kind of many I/O flip LED chips array bump packaging structure and method for packing thereof |
| CN206532913U (en) * | 2017-01-20 | 2017-09-29 | 番禺得意精密电子工业有限公司 | Electric connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449632A (en) * | 2018-12-14 | 2019-03-08 | 深圳市远爱电子科技有限公司 | Solder terminal, welded type terminal and data connector |
| CN111755933A (en) * | 2019-03-26 | 2020-10-09 | 富士康(昆山)电脑接插件有限公司 | Method for manufacturing conductive terminal |
| CN111755933B (en) * | 2019-03-26 | 2024-04-16 | 富士康(昆山)电脑接插件有限公司 | Manufacturing method of conductive terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108365357B (en) | 2019-11-26 |
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