CN1360465A - Parts mounting baseplate and making method therefor - Google Patents
Parts mounting baseplate and making method therefor Download PDFInfo
- Publication number
- CN1360465A CN1360465A CN01143767A CN01143767A CN1360465A CN 1360465 A CN1360465 A CN 1360465A CN 01143767 A CN01143767 A CN 01143767A CN 01143767 A CN01143767 A CN 01143767A CN 1360465 A CN1360465 A CN 1360465A
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- conductor
- lead
- wire
- wiring board
- free solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
Abstract
An parts installation bottom and its manufacturing method. At the time of soldering the electronic parts 22 to the printed wiring board 21 by using the lead-free solder 23, conductor inserting holes 28 are made parts 22 are inserted. In addition, auxiliary conductors 30 which electrically connect conductor patterns 25 and 25 to each other are provided in the holes 28. Even when lift-off phenomena occur on the upper surface sides of the portions to which the leads 22a of the parts 22 are soldered, the auxiliary conductors 30 can supplement the electrical connection between the conductor patterns 25 and 25. The present invention improves the reliability of soldered connections at the time of soldering by using lead-free solder.
Description
Technical field
The present invention relates to electronic unit is welded to the two sides and have parts mounting baseplate and manufacture method thereof on the wiring board of conductor fig with lead-free solder.
Background technology
In the occasion that electronic component is soldered to as the printed circuit board (PCB) of wiring board, according to the viewpoint of being convenient to manufacturing and reliability, adopted the eutectic solder of terne metal, eutectic solder is that tin is 63% (weight) in the past, and lead is 37% (weight).But when product abandonment, using the parts mounting baseplate of eutectic solder welding generally is landfill disposal.Discovered in recent years because acid rain falls in landfill, makes the plumbous stripping in the eutectic solder, causes environmental problem.
In order to solve this environmental problem, the research and development to lead-free solder in vogue in recent years, lead-free scolder is commonly referred to as lead-free solder.Lead-free solder mixes silver, the copper of a few percent based on tin in tin.A problem when using this lead-free solder is phenomenon to occur peeling off.
For example, in case being set on two sides such as fiberglass base materials, the printed substrate (two sides base plate) of conductor fig (printed wire) goes up the aforementioned lead-free solder welding of use, the then phenomenon of peeling off in the weld zone of the surface of printed substrate (one side of arranging electronic element) generation scolder and conductor fig.
It was to do the surface with scolder to handle that there is the printed substrate of conductor fig on the two sides in the past.This processing is that printed substrate is immersed in the solder containing pb of fusion, when taking out printed substrate from the scolder of fusion, sprays high temperature air, blows the scolder in the printed substrate through hole off.Because the solder thickness of the exposed part on the conductor fig is fixed, handle (handling) to call HAL in the following text so be called the hot blast smoothing.In case implemented the HAL processing, when soldering of electronic components, can improve weldability.
Fig. 7 has implemented the two-sided base plate that this HAL handles.Among Fig. 7, the base plate 2 of printed substrate 1 for example is that fiberglass (ガ ラ ス エ Port キ シ) is made, and the surface of this base plate 2 and the back side are provided with copper conductors figure 3,3, are provided with simultaneously to prevent that scolder is attached to the protective layer 4 on the conductor fig 3.And, on printed substrate 1, be processed with through hole 5.Through hole 5 is used for for example inserting the lead-in wire of not shown electronic component, and inner circumferential surface also is provided with and will be electrically connected the connection figure 3a of usefulness between double-edged two conductor figs 3,3.And in double-edged two conductor figs 3,3 not the surface of the exposed part (becoming the part of weld zone) that covers of protected seam and the surface of the connection figure 3A in the through hole 5, the eutectic solder layer 7 of handling back formation through HAL is set.
Yet, if on the printed substrate of handling through this HAL 1 with aforesaid lead-free solder (not solder containing pb) soldering of electronic components, peeling off phenomenon sometimes.Fig. 8 be the explanation this peel off the figure of phenomenon.Peel off phenomenon below with reference to Fig. 8 explanation.
In case the lead-in wire 8 of electronic component is inserted in the through hole 5 of printed substrate 1, and carrying out pb-free solder (immersed solder method) in the welding groove automatically, the lead-free solder 9 of fusion just below printed substrate 1 (scolder face) by through hole 5 inner face and lead-in wire between enter on the printed substrate above (part surface), form one with aforementioned eutectic solder 7, the conductor fig 3,3 of lead-in wire 8, upper and lower surface and connection figure 3a are just welded by lead-free solder 9.
At this moment, contained lead composition 10 strippings in the aforementioned eutectic solder layer 7 that forms after HAL handles enter in the original unleaded lead-free solder 9.When lead-free solder 9 cooling curings, lead-free solder 9 just on printed substrate above the side consecutive solidification of pressing a, b, c, d.During a partial coagulation, the tin that fusing point is high solidifies earlier, and lead composition 10 is extruded into the bottom, and is same, during the b partial coagulation, lead composition 10 is extruded into the bottom, and like this, just in the enrichment of d part, this is called plumbous segregation to low-melting lead composition 10.Thereby, lead-free solder 9 just the upper face side of printed substrate from above solidify successively, be to solidify near the d at last.And the top produces convergent force when solidifying, and the d portion of ot-yet-hardened is formed pulling force.The phenomenon of peeling off at the weld zone 3b of the upper face side generation lead-free solder 9 of printed substrate 1 and the conductor fig 3 of upper face side (happening part is peeled off in 11 expressions among Fig. 8) like this, just.
Known below printed substrate side (scolder face) such phenomenon of peeling off can not take place.Even the aforementioned phenomenon of peeling off when for example adopting solder containing pb that the lead-in wire 8 of electronic component is done the surface processing, also can take place owing to the influence of lead in the occasion beyond aforementioned HAL.
In case peeling off phenomenon, the connection reliability of weld part is promptly impaired.In addition,, will generate heat, even produce smoke and fire if there is big electric current to flow through the weld part of peeling off.
Summary of the invention
The present invention In view of the foregoing, purpose provides a kind of parts mounting baseplate and manufacture method thereof, with lead-free solder welding, can improve the reliability of connection.
For reaching aforementioned purpose, the invention of technical scheme 1 is a kind of parts mounting baseplate, be that the lead-in wire of electronic component is inserted in the wire jack of the wiring board that there is conductor fig on the two sides, and lead-in wire and two conductor figs on aforementioned wiring board two sides are welded with lead-free solder, it is characterized in that, on aforementioned wiring board, the conductor jack is set near aforementioned wire jack, be provided with simultaneously insert the conductor jack, will and two conductor figs on the aforementioned wiring board two sides of aforementioned wire bonds between the auxiliary conductor that is electrically connected.
On aforementioned means, near the wire jack of soldering of electronic components lead-in wire, also realize being electrically connected between the conductor fig on wiring board two sides of wire bonds of electronic component with auxiliary conductor.Therefore, even part peeling off phenomenon at the soldering of electronic components lead-in wire, also available aforementioned auxiliary conductor comes being electrically connected between the conductor fig on auxiliary line plate two sides, has consequently improved the reliability that is electrically connected between two conductor figs on leads of electronic component and wiring board two sides.
This occasion, preferably as the invention of technical scheme 2, auxiliary conductor preferably is provided with integratedly in the circuit board and faces the portion of putting with the opposed base plate of base plate face that is provided with conductor fig.
If adopt this structure, when welding with lead-free solder, lead-free solder easily enters the base plate of auxiliary conductor in the face of putting between portion and the conductor fig, can enlarge the bonding area of auxiliary conductor and conductor fig, and then improve the connection reliability of these auxiliary conductors and conductor fig welding portion.
The feature of the invention of technical scheme 3 is, the conductor jack that inserts aforementioned auxiliary conductor is a through hole, and inner circumferential surface is provided with will carry out the connection figure that is electrically connected between the conductor fig on wiring board two sides.
When welding after inserting the conductor jack at auxiliary conductor, lead-free solder easily penetrates into the upper face side (part surface side) of conductor jack, can utilize lead-free solder and auxiliary conductor easily and reliably two conductor figs on wiring board two sides to be connected.By the way, when between the inner peripheral surface of conductor jack is not with two conductor figs on wiring board two sides, carrying out the connection figure that is electrically connected, to carry out the welding of auxiliary conductor and conductor fig in both sides up and down, but if adopt the invention of technical scheme 3, the welding of auxiliary conductor and conductor fig can be carried out once.
The feature of the invention of technical scheme 4 is that the main component of lead-free solder is a tin, the auxiliary conductor electroplating surfaces with tin.
Like this, main component is that the scolder of tin and the auxiliary conductor of electroplating surfaces with tin are all used tin, fusion easily, and weldability is good.
The feature of the invention of technical scheme 5 is, in the invention of technical scheme 2, in the circuit board, with the base plate of auxiliary conductor in the face of putting the opposed position of portion, auxiliary through hole is set, the inner peripheral surface in this hole is provided with the connection figure that implementation between two conductor figs on wiring board two sides is electrically connected, and makes lead-free solder flow into this auxiliary through hole.
Adopt this invention, when welding with lead-free solder, even lead-free solder passes through auxiliary through hole, the base plate that also enters auxiliary conductor easily is in the face of putting between portion and the conductor fig, can enlarge the bonding area of auxiliary conductor and conductor fig more, and then improve the connection reliability that connects part between these auxiliary conductors and conductor fig more.
The feature of the invention of technical scheme 6 is that the part that auxiliary conductor is set is positioned near the wire jack, the lead-in wire insertion of the electronic component that the big electric current of this jack confession flows through.
The electric current that flows through electronic component is big more, the reliability that is connected between two conductor figs on the lead-in wire of electronic component and wiring board two sides just becomes problem more, therefore, the jack that lead-in wire inserted that the auxiliary auxiliary conductor that connects of two conductor fig intercropping that lead-in wire connected of electronic component is located at the electronic component that big electric current flows through is effective nearby.
The invention of technical scheme 7 is manufacture methods of parts mounting baseplate, it is characterized in that, having on the two sides on the wiring board of conductor fig in order to reach aforementioned purpose, under the state that does not carry out the HAL processing, with lead-in wire and the aforementioned conductor fig welding of lead-free solder with electronic component with solder containing pb.
Adopt the present invention, handle because wiring board is not implemented HAL, and weld, thereby can under lead-free state, implement welding with lead-free solder.Thereby can prevent because of leaded take place peel off phenomenon, and then improve the reliability that is welded to connect.And because wiring board is not implemented the HAL processing of high temperature, therefore compare with the occasion that enforcement HAL handles, can reduce the stress that is added on the wiring board.
The invention of technical scheme 8 is parts mounting baseplates, in order to reach the purpose same with the invention of technical scheme 7, have on the two sides on the wiring board of conductor fig, under the state of doing the HAL processing without solder containing pb, with the lead-in wire and the welding of aforementioned conductor fig of lead-free solder with electronic component.
Adopt the present invention, can obtain the effect same with the invention of technical scheme 7.
The feature of the invention of technical scheme 9 is in the invention of technical scheme 8, in the circuit board the exposed part of conductor fig to be implemented gold-plated processing.
Do not implement the occasion that HAL handles at wiring board, the exposed part of conductor fig may corrode, and the exposed part of conductor fig is implemented gold-plated processing, can prevent this partial corrosion, and then improves reliability.
The feature of the invention of technical scheme 10 is in the invention of claim item 8, in the circuit board, it is shared with the wire jack of the lead-in wire that inserts electronic component to make inner peripheral surface have a through hole of the connection figure that is electrically connected between two conductor figs to the wiring board two sides.
Do not implement the occasion that HAL handles at wiring board, if adopt the private through hole of the lead-in wire that does not insert electronic component, then lead-free solder is difficult to flow in this through hole, scolder is difficult to rise, therefore, by making this through hole shared with the wire jack that inserts leads of electronic component, lead-free solder just flows in this through hole easily, also rises easily.Thereby, can will connect well between the conductor fig on wiring board two sides with lead-free solder.
The feature of the invention of technical scheme 11 is, in the invention of technical scheme 8, wiring board possesses private through hole, inner circumferential surface has the connection figure that the conductor fig with the wiring board two sides is electrically connected, and do not insert the lead-in wire of electronic component, and making lead-free solder flow into this private through hole, the internal diameter of aforementioned private through hole is set at more than the 0.7mm.
Known to the occasion of wiring board not being implemented the HAL processing, if make lead-free solder flow into the private through hole of the lead-in wire that does not insert electronic component, if private through hole internal diameter is less than 0.6mm, then its internal diameter is too little, and lead-free solder can not rise to base plate upper face side (part surface side).For this reason, if its internal diameter is set in more than the 0.7mm, the lead-free solder liquation just rises to upper face side easily.Available thus lead-free solder well connects the conductor fig on wiring board two sides.
Description of drawings
Fig. 1 is the main position longitudinal sectional view of the present invention the 1st embodiment.
Fig. 2 is the main position longitudinal sectional view of the present invention the 2nd embodiment.
Fig. 3 is the main position longitudinal sectional view of the present invention the 3rd embodiment.
Fig. 4 is the preceding main position of the welding longitudinal sectional view of the present invention the 4th embodiment.
Fig. 5 is the main position longitudinal sectional view of the present invention the 5th embodiment.
Fig. 6 is the main position longitudinal sectional view of the present invention the 6th embodiment.
Fig. 7 is an example in the past, is the longitudinal sectional view of the printed substrate after HAL handles.
Fig. 8 is the longitudinal sectional view that genesis mechanism is peeled off in explanation.
Embodiment
Below, with reference to Fig. 1 the first embodiment of the present invention is described.
State on the printed substrate 21 that Fig. 1 represents to use lead-free solder 23 electronic component 22 to be welded to the formation wiring board.Among Fig. 1, the base material 24 of printed substrate 21 is for example used the glass steel, and these base material positive and negative are provided with copper conductor fig 25,25, and is provided with and prevents that scolder is attached to the diaphragm 26 on the conductor fig 25.
Form on the printed substrate 21 and insert wire jack 27, be used to insert the lead-in wire 22a of aforementioned electronic element 22, and nearby be provided with 2 conductor jacks 28 in the position at jack 27.Wire jack 27 and conductor jack 28 respectively are made of through hole, and each hole inner peripheral surface is provided with and connects figure 25a, is used for conductor fig 25,25 intercropping of printed substrate 21 upper and lower surfaces are electrically connected.In the conductor fig 25,25 of upper and lower surface, the diameter A1 of the solder side of wire jack 27 circumferences, the weld zone 29a above promptly is set at the little (A1＜A2) of diameter A2 than following weld zone 29b.
Roughly aforementioned 2 conductor jacks 28,28 are inserted in insertion section 30a, the 30a of auxiliary conductor 30 both sides of コ font top from figure, and 25,25 of auxiliary conductor 30 and upper and lower surface conductor figs weld with lead-free solder.Thereby auxiliary conductor 30 will connect the lead-in wire 22a of aforementioned electronic element 22 by lead-free solder 23 upper and lower surface conductor fig 25,25 intercropping are electrically connected.Auxiliary conductor 30 be provided with integratedly with top (base plate face) opposed base plate of printed substrate 21 in the face of putting the 30b of portion, this base plate is in the face of also having lead-free solder 23 to enter between the upper face side conductor fig 25 of putting 30b of portion and printed substrate 21.The also bending to the inside of the bottom of two insertion section 30a, 30a of auxiliary conductor 30.In this occasion, auxiliary conductor 30 adopts the annealed copper wire of electroplating surfaces with tin.
Following carrying out when electronic component 22, auxiliary conductor 30 being welded to aforementioned printed substrate 21.At first the lead-in wire 22a with electronic component 22 inserts wire jack 27 on the printed substrate 21, and the insertion section 30a with auxiliary conductor 30 inserts each conductor jack 28 simultaneously.Then in automatic welding groove to the lead-free solder of coated with melted below the printed substrate 21, adopt the welding of immersed solder method.Like this, just as shown in Figure 1 electronic component 22, auxiliary conductor 30 welding are lived with lead-free solder 23.
Previous embodiment can obtain following effect.
Near the soldered wire jack 27 of living of the lead-in wire 22a of the electronic component 22 that has big electric current to flow through, also be welded with between two conductor figs 25,25 on printed substrate 21 two sides of lead-in wire 22a of this electronic component 22 and be electrically connected with 30 pairs of auxiliary conductors.Therefore, even for example in part (circumference of the wire jack 27) peeling off phenomenon of the lead-in wire 22a that is welded with electronic component 22, because aforementioned auxiliary conductor 30 parts can be assisted being electrically connected of 25,25 of two conductor figs, the result still can improve the lead-in wire 22a of electronic component 22 and 25,25 reliabilities that are electrically connected of two conductor figs on two sides.It is effective especially that the part that 30 pairs of printed substrate 21 upper face sides of this auxiliary conductor have big electric current to flow through is set.Auxiliary conductor 30 formations are roughly コ shape, originally had base plate in the face of putting the 30b of portion, with with printed substrate 21 on that the base plate face (top) of conductor fig 25 is set is opposed, so when welding with lead-free solder, lead-free solder also easily enters the base plate of auxiliary conductor 30 in the face of putting between 30b of portion and the conductor fig 25, enlarges bonding area between auxiliary conductor 30 and the conductor fig 25.And then improve bonding area between these auxiliary conductors 30 and the conductor fig 25.
Again because auxiliary conductor 30 is コ font roughly, be will two insertion section 30a, 30a insert auxiliary conductor jacks 28 backs with lead-free solder 23 welding, so more enlarged the bonding area between auxiliary conductor 30 and the conductor fig 25.
And each conductor jack 28 is made of through hole, the through hole inner peripheral surface has the figure of connection 25a, be used for two conductor figs 25,25 of upper and lower surface are electrically connected, so during welding, lead-free solder 23 easily enters into the upper face side (part side) of this conductor jack 28, available lead-free solder and auxiliary conductor 30 easily, positively will be between the conductor fig 25,25 of upper and lower surface connect.By the way, during the connection figure when do not establish at the inner peripheral surface of conductor jack 28 between, doing to be electrically connected to two conductor figs 25,25 of upper and lower surface, to weld auxiliary conductor 30 and conductor fig 25 in upper and lower both sides, but, once just auxiliary conductor 30 and conductor fig 25 can be welded reliably if adopt present embodiment.
Lead-free solder 23 is to be the alloy of main body in order to tin, and therefore 30 electroplating surfaces with tin of auxiliary conductor, all use tin based on the lead-free solder 23 of tin and the auxiliary conductor 30 of electroplating surfaces with tin, fusion easily, and weldability is good.
In the aforementioned embodiment, in the conductor fig 25,25 of upper and lower surface, the diameter A1 of the upper face side weld zone 29a of wire jack 27 circumferences sets for littler than the diameter A2 of following side weld zone 29b, (A1＜A2), so the difficult advantage of peeling off is arranged.
Fig. 2 is the 2nd embodiment of the present invention.The 2nd embodiment and aforesaid the 1st embodiment have following difference.That is, on printed substrate 21, in the face of putting the opposed position of the 30b of portion 2 auxiliary through hole 31 are set, and make the lead-free solder 23 of fusing flow into each auxiliary through hole 31 at base plate with auxiliary conductor 30.The inner peripheral surface of each auxiliary through hole 31 also is provided with and connects figure 25a, is used for 25,25 implementations of conductor fig of upper and lower surface are electrically connected.
Adopt this structure, when welding with lead-free solder, lead-free solder 23 also flows into the base plate of auxiliary conductor 30 easily in the face of putting between 30b of portion and the conductor fig 25 by each auxiliary through hole 31, enlarge the bonding area between auxiliary conductor 30 and the conductor fig 25 more, and then further improved the connection reliability of welding portion between auxiliary conductor 30 and the conductor fig 25.
Fig. 3 is the present invention the 3rd embodiment.It is following different that the 3rd embodiment and the 1st embodiment have, that is, conductor jack 28 is one, and the insertion section 32a of the auxiliary conductor 32 of pin shape is inserted this conductor jack 28, with lead-free solder the conductor fig 25,25 of this auxiliary conductor 32 with upper and lower surface welded.Auxiliary conductor 32 does not have the such base plates of the auxiliary conductor 30 of the 1st, the 2nd embodiment in the face of putting the 30b of portion, but its top forms from the removal stop section 32b of insertion section 32a to horizontal expansion.
The 3rd embodiment also can obtain the action effect roughly same with the 1st embodiment.
Among aforementioned the 1st embodiment～the 3rd embodiment, printed substrate 21 can be to handle through HAL, also can handle without HAL.
In the occasion of using this lead-free solder welding, owing to reduce plumbous mixed volume as far as possible, therefore, then can reduce plumbously more to the sneaking into of lead-free solder if the printed substrate that uses is handled without the HAL of leaded eutectic solder to lead-free solder, can reduce and peel off phenomenon.
Fig. 4 is the 4th embodiment of the present invention.Printed substrate 21 is not wherein handled through the HAL of leaded eutectic solder.Do not doing on the printed substrate 21 that HAL handles, in conductor fig 25 not with the part of diaphragm 26 coverings, promptly, become the exposed part 33 of solder side, the copper of conductor fig 25 exposes, thereby may in atmosphere such as hydrogen sulfide copper corrosion take place.Therefore, in this 4th embodiment, Gold plated Layer 34 is implemented on the surface of the exposed part 33 of conductor fig 25 handled.
When adopting this structure, cover the exposed part 33 of conductor figs 25, can prevent that conductor fig 25 exposed copper are corroded with Gold plated Layer 34.And in this occasion, printed substrate 21 is handled without the HAL of leaded eutectic solder, sneaks into so can reduce the plumbous lead-free solder that uses more when welding, reduces the generation of peeling off, and the high printed substrate of reliability 21 can be provided.
Fig. 5 is the present invention the 5th embodiment.
On the printed substrate of handling without HAL 21, at the through hole that does not insert leads of electronic component, promptly, connect private through hole 35 parts of the conductor fig 25,25 of upper and lower surface, if weld with lead-free solder, then fusion welding rises out of order from following side direction upper face side.Therefore, the 5th embodiment is designed to through hole 35 and to insert the wire jack of lead-in wire 36a of electronic component 36 shared.
In the occasion that adopts this structure, owing in through hole 35, insert the lead-in wire 36a of electronic component 36, when welding with lead-free solder 23, the scolder state that the side direction upper face side rises below printed substrate 21 is good, can carry out good connection with lead-free solder 23 between two conductor figs 25,25 of upper and lower surface.
Fig. 6 is the 6th embodiment of the present invention.
This example is on the identical printed substrate of handling without HAL 21, welds with lead-free solder 23 in not inserting the private through hole 37 of leads of electronic component.
Carry one in passing, the internal diameter of this private through hole was below the 0.6mm in the past.Known when connecting with lead-free solder for this private through hole of handling without HAL, the scolder of fusing can not rise to the upper face side of printed substrate.
Therefore, present embodiment is set at the inside diameter D of aforementioned private through hole 37 more than the 0.7mm.Like this, lead-free solder 23 easily below private through hole 37 side rise to upper face side, therefore, 25,25 available lead-free solders 23 welding of the conductor fig on printed substrate 21 two sides connect well.
The invention is not restricted to aforesaid each embodiment, can do following distortion or expansion.
Except capacitor, the electronic component 22 that has big electric current to flow through can be switching device, diode, coil, transformer etc.
As seen from the above description, if use the present invention can obtain following effect.
The invention of technical scheme 1 is near the wire jack of soldering of electronic components lead-in wire, is electrically connected with carrying out between two conductor figs of auxiliary conductor to the wiring board two sides that is welded with leads of electronic component.Therefore, even part peeling off phenomenon at the soldering of electronic components lead-in wire, because available aforementioned auxiliary conductor partly comes being electrically connected between two conductor figs on auxiliary line plate two sides, the result is still the reliability that is electrically connected between the conductor fig that has improved leads of electronic component and wiring board two sides.
The invention of technical scheme item 7,8 is not made HAL to wiring board and is handled, and with lead-free lead-free solder welding, so can carry out lead-free welding.Can prevent thus because of leaded take place peel off phenomenon, and then improve the reliability that is welded to connect.And the HAL without high temperature handles because of wiring board, so compare with the occasion of handling through HAL, can reduce stress.
Claims (11)
1. parts mounting baseplate is that lead-in wire with electronic component inserts in the wire jack of the wiring board that there is conductor fig on the two sides, and with lead-free solder two conductor figs of lead-in wire with aforementioned wiring board two sides is welded,
It is characterized in that, on aforementioned wiring board, the conductor jack is set near aforementioned wire jack, be provided with simultaneously insert the conductor jack, will and two conductor figs on the aforementioned wiring board two sides of aforementioned wire bonds between the auxiliary conductor that is electrically connected.
2. parts mounting baseplate according to claim 1 is characterized in that, auxiliary conductor is provided with integratedly in the circuit board and faces the portion of putting with the opposed base plate of base plate face that is provided with conductor fig.
3. parts mounting baseplate according to claim 1 and 2 is characterized in that the conductor jack is a through hole, and inner circumferential surface is provided with and will carries out the connection figure that is electrically connected between two conductor figs on wiring board two sides.
4. parts mounting baseplate according to claim 1 and 2 is characterized in that the main component of lead-free solder is a tin, the auxiliary conductor electroplating surfaces with tin.
5. parts mounting baseplate according to claim 2, it is characterized in that, in the circuit board, with the base plate of auxiliary conductor in the face of putting the opposed position of portion, auxiliary through hole is set, the inner peripheral surface in this hole is provided with the connection figure that implementation between two conductor figs on wiring board two sides is electrically connected, and makes lead-free solder flow into this auxiliary through hole.
6. according to each described parts mounting baseplate in the claim 1,2,5, it is characterized in that the part that auxiliary conductor is set is positioned near the wire jack, this jack inserts for the lead-in wire of the electronic component that has big electric current to flow through.
7. the manufacture method of a parts mounting baseplate is characterized in that, has on the two sides on the wiring board of conductor fig, under the state that does not carry out hot blast smoothing processing with solder containing pb, welds with the lead-in wire and the aforementioned conductor fig of lead-free solder with electronic component.
8. a parts mounting baseplate is characterized in that, has on the two sides on the wiring board of conductor fig, under the state that carries out hot blast smoothing processing without solder containing pb, welds with the lead-in wire and the aforementioned conductor fig of lead-free solder with electronic component.
9. parts mounting baseplate according to claim 8 is characterized in that, in the circuit board the exposed part of conductor fig is implemented gold-plated processing.
10. parts mounting baseplate according to claim 8, it is characterized in that, in the circuit board, it is shared with the wire jack of the lead-in wire that inserts electronic component to make inner peripheral surface have a through hole of the connection figure that is electrically connected between two conductor figs to the wiring board two sides.
11. parts mounting baseplate according to claim 8, it is characterized in that, wiring board possesses private through hole, inner circumferential surface has the connection figure that is electrically connected between two conductor figs with the wiring board two sides, and do not insert the lead-in wire of electronic component, and making lead-free solder flow into this private through hole, the internal diameter of described private through hole is set at more than the 0.7mm.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP385149/2000 | 2000-12-19 | ||
| JP2000385149A JP2002185120A (en) | 2000-12-19 | 2000-12-19 | Parts mounting substrate and its manufacturing method |
| JP385149/00 | 2000-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1360465A true CN1360465A (en) | 2002-07-24 |
| CN1183813C CN1183813C (en) | 2005-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011437677A Expired - Fee Related CN1183813C (en) | 2000-12-19 | 2001-12-19 | Parts mounting baseplate and making method therefor |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2002185120A (en) |
| KR (1) | KR100497862B1 (en) |
| CN (1) | CN1183813C (en) |
| TW (1) | TW507490B (en) |
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| CN103563495A (en) * | 2011-05-26 | 2014-02-05 | 株式会社丰田自动织机 | Wiring board and method for manufacturing wiring board |
| CN104936378A (en) * | 2015-06-05 | 2015-09-23 | 新际电子元件（杭州）有限公司 | PCB and drafting technology thereof |
| CN105665864A (en) * | 2016-04-15 | 2016-06-15 | 歌尔声学股份有限公司 | Welding method for FPCB and metal bonding pad |
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| JP4547817B2 (en) * | 2000-03-15 | 2010-09-22 | ソニー株式会社 | Land portion of printed wiring board, printed wiring board mounted with components, printed wiring board manufacturing method, and printed wiring board mounting method |
| JP2002246734A (en) * | 2001-02-19 | 2002-08-30 | Sony Corp | Substrate and electronic equipment having substrate |
| JP2007109836A (en) * | 2005-10-13 | 2007-04-26 | Fuji Electric Holdings Co Ltd | Printed wiring board |
| KR20220131684A (en) * | 2021-03-22 | 2022-09-29 | 삼성전자주식회사 | Electronic apparatus including printed circuit board and manufacturing method of printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03117867U (en) * | 1990-03-16 | 1991-12-05 | ||
| JPH06326459A (en) * | 1993-05-17 | 1994-11-25 | Mitsubishi Materials Corp | Through-hole conductor forming method |
| JPH0851262A (en) * | 1994-08-08 | 1996-02-20 | Sony Corp | Printed wiring board and its manufacturing method |
| JPH08181424A (en) * | 1994-12-26 | 1996-07-12 | Sony Corp | Printed board and its soldering method |
| JP2000307223A (en) * | 1999-04-22 | 2000-11-02 | Matsushita Electronics Industry Corp | Substrate for electronic circuit and manufacture of electronic circuit using the same |
| KR20020002495A (en) * | 2000-03-15 | 2002-01-09 | 마츠시타 덴끼 산교 가부시키가이샤 | Bonded structure and electronic circuit board |
| JP2001339135A (en) * | 2000-05-30 | 2001-12-07 | Sony Corp | Insertion mounting component and its mounting method |
| JP2002185119A (en) * | 2000-12-14 | 2002-06-28 | Nissan Motor Co Ltd | Structure and method for soldering |
-
2000
- 2000-12-19 JP JP2000385149A patent/JP2002185120A/en active Pending
-
2001
- 2001-12-10 KR KR10-2001-0077759A patent/KR100497862B1/en not_active IP Right Cessation
- 2001-12-12 TW TW090130807A patent/TW507490B/en not_active IP Right Cessation
- 2001-12-19 CN CNB011437677A patent/CN1183813C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100391319C (en) * | 2003-09-25 | 2008-05-28 | 华为技术有限公司 | Single board able to realize live-wire insertion and its realizing method |
| CN102164473A (en) * | 2010-02-16 | 2011-08-24 | 雅马哈发动机株式会社 | Element mounting device and element mounting method |
| CN102164473B (en) * | 2010-02-16 | 2014-04-30 | 雅马哈发动机株式会社 | Element mounting device and element mounting method |
| CN103563495A (en) * | 2011-05-26 | 2014-02-05 | 株式会社丰田自动织机 | Wiring board and method for manufacturing wiring board |
| US9332638B2 (en) | 2011-05-26 | 2016-05-03 | Kabushiki Kaisha Toyota Jidoshokki | Wiring board and method for manufacturing wiring board |
| CN103563495B (en) * | 2011-05-26 | 2016-10-12 | 株式会社丰田自动织机 | Wiring plate and the manufacture method of wiring plate |
| CN104936378A (en) * | 2015-06-05 | 2015-09-23 | 新际电子元件（杭州）有限公司 | PCB and drafting technology thereof |
| CN104936378B (en) * | 2015-06-05 | 2018-01-09 | 新际电子元件（杭州）有限公司 | A kind of pcb board and its draw craft |
| CN105665864A (en) * | 2016-04-15 | 2016-06-15 | 歌尔声学股份有限公司 | Welding method for FPCB and metal bonding pad |
Also Published As
| Publication number | Publication date |
|---|---|
| TW507490B (en) | 2002-10-21 |
| KR20020050109A (en) | 2002-06-26 |
| JP2002185120A (en) | 2002-06-28 |
| CN1183813C (en) | 2005-01-05 |
| KR100497862B1 (en) | 2005-06-29 |
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