507490 A7 B7 五、發明説明（1 ) 【發明所屬之技術領域】 (請先閲讀背面之注意事項再填寫本頁} 本發明係關於在兩面具有導體圖案之配線基板使用不 含鉛之無鉛軟焊料進行電氣零件銲錫之零件實裝基板及其 製造方法。 【發明所欲解決之問題】 從以往，作爲配線基板之印刷配線板銲錫電氣零件時 ’從其製造性之良好度與可靠性之觀點，使用錫與鉛合金 之共晶軟焊料。共晶軟焊料係錫6 3重量％，鉛3 7重量 %之合金。然而，廢棄製品時，使用此共晶軟焊料所銲錫 之零件實裝基板一般爲被掩埋處理。近年，在被掩埋處理 之處因下降酸性雨，致使溶出共晶軟焊料之鉛成分，而引 起環保問題受到關注。 經濟部智慧財產局員工消費合作社印製 爲了對應此環保問題，近年盛行著不含鉛軟焊料之硏 究•開發。將不含鉛軟焊料，一般稱爲「無鉛軟焊料」。 無鉛軟焊料係以錫爲主體者，其係對於錫摻配數％左右之 銀或銅之合金。作爲使用此無鉛軟焊料時之一問題，可舉 出剝離（lift-off)現象。 例如在玻璃環氧基材（glass-reinforced epoxy subst rate )等兩面設有導體圖案（印刷電路）之印刷電路板（ printed-wiring board )(兩面基板），係使用上述無鉛軟焊 料進行銲錫時，於印刷配線板之表面（配置有電氣零件側 之面）側，銲錫與導體圖案之陸地（land )之間發現引起剝 離之現象，將此現象叫做lift-off。 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -4- 507490 A7 B7_ 五、發明説明（2) (請先閱讀背面之注意事項再填寫本頁) 在兩面具有導體圖案之印刷配線板，以往，係施加依 銲錫之表面處理。此處理係在含有銅之熔化軟焊料浸漬印 刷配線板，將其印刷配線板從熔化軟焊料取出時，噴射高 溫空氣藉吹散於印刷配線板之貫通孔內之軟焊料，將使在 導電圖案之露出部分之軟焊料皮膜厚度保持爲一定，而叫 做熱空氣吹平（HOT AIR LEVELER )處理）（以下，稱爲 H A L處理）。如施加此H A L處理，銲錫電氣零件時， 就可提升銲錫性。 於第7圖表示施加這種HAL處理之兩面基板。於此 第7圖，屬於配線基板之印刷配線板1之基材2，係例如 玻璃環氧製，在此基材2之表裏兩面設有銅製之導體圖案 3 ，3，並且，爲了在其等導體圖案3不附著軟焊料設有 阻附劑（resist) 4。又，在印刷配線板1形成有·貫通孔5 經濟部智慧財產局員工消費合作社印製 。此貫通孔5係例如用來插入未圖示之電氣零件之導線者 ，在其內周面，也設有將表裏兩面之兩導體圖案3，3間 以電氣性地連接所用之連接圖案3 a。並且·表裏兩面之 兩導體圖案3 ，3中未被覆蓋阻附劑4而露出之部分（成 爲陸地部分）表面，及於貫通孔5之連接圖案3 a表面， 設有經H A L處理所形成之共晶軟焊料層7。 然而，於這種施加H A L處理之印刷配線板1 ，使用 上述無鉛軟焊料進行電氣零件之銲錫時，有時會發生liftoff 現象 。第 8 圖係用 來說明 lift-off 現象 ，使 用此第 8 圖 說明1 i f t · 〇 f f現象。 在印刷配線板1之貫通孔5插入電氣零件之導線8 ’ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 507490 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（3) 在自動銲錫槽，進行使用無鉛之軟焊料時（浸漬銲錫法（ dip soldering))，熔化狀態之無鉛軟焊料9，爲從印刷配 線板1下面（銲錫側）通過貫通孔5內面與導線8之間， 進入到印刷配線板1上面（零件側）側，而與上述共晶軟 焊料層7成爲一體，導線8與上下兩面之導體圖案3，3 與連接圖案3 a爲由其無鉛軟焊料9進行銲錫。 此時，由含於H A L處理所形成之上述共晶軟焊料層 7之鉛成分1 〇就溶出，此將進入於原本無鉛軟焊料9中 。並且，無鉛軟焊料9被冷卻固化時，該無鉛軟焊料9即 使在印刷配線板1之上面側係依a，b，c ，d之順序固 化。a部分固化時，熔點高之錫先固化，鉛成分1 〇將被 趕往下方。同樣b部分固化時，鉛成分1 〇也被趕往下方 。像這樣，熔點低鉛成分.1 0將集聚於d部分。·此將被稱 爲偏析。因此，無鉛軟焊料9係於印刷配線板1之上面側 ’從上方依序固化，最後d附近固化。並且，當上方固化 時同時發生收縮之力而將引拉未固化之d部。像這樣，於 印刷配線板1之上面側，就發生無鉛軟焊料9與上面側之 導體圖案3陸地3 b剝雌之剝離現象（於第8圖，符號 1 1係表示剝離發生部）。 這種剝離，已知在印刷配線板1下面側（銲錫面側） 不會發生。又，如上述之剝離，除了上述η A L處理之外 ，例如在電氣零件之導線8，即使由含有鉛之表面處理時 ，由於其鉛之影響而發生。 發生剝離時將損及銲錫部連接之可靠性。又，若在其 (請先閲讀背面之注意事項存填寫本頁) •裝· 訂 ΙΓ - -= - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -6 - 507490 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明（4 ) 發生剝離之銲錫部流動大電流時，其部分將發熱，發煙， 而發火。 本發明係鑑於上述情形所發明者，其目的係提供一種 使用不含鉛之無鉛軟焊料進行銲錫者，可提升連接可靠性 之零件實裝基板及其製造方法。 【解決問題之手段】 爲了達成上述目的，申請專利範圍第1項之發明，係 在兩面具有導體圖案之配線基板之導線插入孔插入電氣零 件之導線，將此導線與上述配線基板面面之兩導體圖案， 使用不含鉛之無軟焊料進行銲錫構成之零件實裝基板，其 特徵爲：在上述配線基板，位於上述導線插入孔附近設置 .導體插入孔，並且，插入於此導體插入孔，裝設將上述導 線與被銲錫之上述配線基板兩面之兩導體圖案間加以電氣 連接之補助導體。 於上述之手段，於銲錫電氣零件之導線之導線插入孔 附近，將電氣零件之導線被銲錫之配線基板兩面之兩導體 圖案間之電氣性連接，也在補助導體部分進行。因此，即 使於銲錫電氣零件之導線部分發生剝離之現象，因可補助 在上述補助導體部分之配線基板兩面之兩導體圖案間之電 氣性連接，所以，結果來說，可提升電氣零件之導線與配 線基板兩面之兩導體圖案間之電氣性連接之可靠性。 此時，如申請專利範圍第2項，補助導體係於配線基 板與設有導體圖案之基板面所對向之基板面對向部具有一 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ' (請先閱讀背面之注意事項再填寫本頁) 507490 A7 B7_ 五、發明説明（5 ) 體構成較佳。 依據此，使用無錯軟焊料進行銲錫時’也變成補助導 體之基板面對向部與導體圖案之間也容易進入無鉛軟焊料 ，可取大的補助導體與導體圖案之銲錫面積，進而也可提 升補助體積導體圖案之銲錫部分之連接可靠性。 申請專利範圍第3項之發明，其特徵爲：插入上述補 助導體之導體插入孔，在其內周面具有將配線基板兩面之 兩導體圖案間以電氣性連接連接圖案貫通孔。 在導體插入孔插入補助導體之狀態下銲錫時，無鉛軟 焊料容易流入到其導體插入孔之上面側（零件面側），藉 無鉛軟焊料與補助導體，將配線基板兩面之兩導體圖案間 ’可容易且確實地連接。蓋因，在導體插入孔之內周面， .若無將配線基板兩面之兩導體圖案間以電氣性連接之連接 圖案時，將補助導體與導體圖間，雖然需要上下兩側進行 ’但是，依據補助導體與導體圖案之銲錫就可一次進行。 申請專利範圍第4項之發明，其特徵爲：無鉛軟焊料 係以錫爲主體者，作爲補助導體，使用在表面鍍錫。 若據此，以錫爲主體之無鉛軟焊料，與在表面鍍錫之 補助導體，都爲錫容易馴服，銲錫性也良好。 申請專利範圍第5項之發明係如第2項之發明，其中 於配線基板，在補助導體之基板面對向部位，在內周面將 配線基板兩面之兩導體圖案間設以電氣性連接之連接圖案 之補助貫通孔’並且，在此補助貫通孔使其流入無鉛軟焊 料。若據此，使用無鉛軟焊料之銲錫時，即使無鉛軟焊料 本紙張尺度適财關家標準（CNS)八4規格（：歐297公着） - -8- (請先閱讀背面之注意事項再填寫本頁) -裝.507490 A7 B7 V. Description of the invention (1) [Technical field to which the invention belongs] (Please read the precautions on the back before filling out this page} The present invention relates to the use of lead-free lead-free solder on wiring boards with conductor patterns on both sides A component mounting substrate for soldering electrical components and a method for manufacturing the same. [Problems to be Solved by the Invention] Conventionally, when soldering electrical components on a printed wiring board as a wiring substrate, from the viewpoint of good manufacturability and reliability, A eutectic solder of tin and lead alloy is used. The eutectic solder is an alloy of 63% by weight of tin and 37% by weight of lead. However, when a product is discarded, the component mounting substrate using the eutectic solder is generally used. In order to be buried, in recent years, environmental issues have been aroused due to the drop of acid rain in the buried sites, which caused the dissolution of the lead content of eutectic soft solders. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in response to this environmental issue In recent years, the research and development of lead-free soft solders has prevailed. Lead-free soft solders are generally referred to as "lead-free soft solders." Lead-free soft solders The material is mainly tin, which is an alloy of silver or copper with a content of about several percent of tin. One of the problems when using this lead-free solder is lift-off. For example, in glass rings Glass-reinforced epoxy subst rate and other printed-wiring boards (two-sided substrates) with conductor patterns (printed circuits) on both sides are used for printed wiring boards when soldering using the above-mentioned lead-free soft solder. On the side of the surface (the side on which the electrical parts are arranged), the phenomenon of peeling between the solder and the land of the conductor pattern is found, and this phenomenon is called lift-off. This paper standard applies to Chinese National Standard (CNS) A4 Specifications (210X297mm) -4- 507490 A7 B7_ V. Description of the invention (2) (Please read the precautions on the back before filling this page) Printed wiring boards with conductor patterns on both sides. In the past, the surface was soldered. Treatment. This treatment is to impregnate a printed wiring board with molten soft solder containing copper and remove the printed wiring board from the molten soft solder by spraying high-temperature air to disperse the printed wiring board. The through hole of the solder, the solder will cause the exposed portion of the film thickness of the conductive pattern remains constant, while the hot air blow call made flat (HOT AIR LEVELER) process) (hereinafter referred to process H A L). If this H A L treatment is applied, solderability can be improved when soldering electrical parts. Fig. 7 shows a two-sided substrate to which this HAL process is applied. In FIG. 7, the base material 2 of the printed wiring board 1 which belongs to the wiring substrate is made of, for example, glass epoxy, and copper conductive patterns 3 and 3 are provided on both surfaces of the base material 2. The conductive pattern 3 is provided with a resist 4 without a soft solder adhered thereto. In addition, through-holes 5 are formed in the printed wiring board 1 and printed by an employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. This through hole 5 is, for example, a conductor for inserting a lead wire of an electric component (not shown), and the inner peripheral surface is also provided with a connection pattern 3 a for electrically connecting the two conductor patterns 3 and 3 on the front and back surfaces. . In addition, the surface of the two conductor patterns 3 and 3 on both sides of the surface, which are not covered by the anti-adhesion agent 4, are exposed (become land parts), and the surface of the connection pattern 3a of the through hole 5 is provided with HAL treatment. Eutectic soft solder layer 7. However, in the printed wiring board 1 to which the H A L treatment is applied, when the above-mentioned lead-free solder is used for soldering electrical parts, a liftoff phenomenon may occur. Figure 8 is used to illustrate the lift-off phenomenon. Use this figure to illustrate the 1 i f t · 〇 f f phenomenon. Insert the wires of electrical parts into the through holes 5 of the printed wiring board 1 'This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) 507490 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Explanation (3) When the lead-free solder is used in an automatic solder bath (dip soldering), the lead-free solder 9 in the molten state passes through the through hole 5 from under the printed wiring board 1 (the solder side). Between the surface and the lead 8, it enters the upper side (part side) of the printed wiring board 1 and is integrated with the eutectic soft solder layer 7 described above. The lead 8 and the conductor patterns 3, 3 and the connection pattern 3 a on the upper and lower sides are used as a reason. The lead-free solder 9 is soldered. At this time, the lead component 10 of the eutectic solder layer 7 formed by the H A L treatment is dissolved, and this will enter the original lead-free solder 9. When the lead-free solder 9 is cooled and solidified, the lead-free solder 9 is cured in the order of a, b, c, and d even on the upper side of the printed wiring board 1. When part a is cured, the high-melting tin is solidified first, and the lead component 10 will be driven downward. Similarly, when part b is cured, the lead component 10 is also driven downward. As such, the low-melting lead component .10 will accumulate in the d portion. • This will be called segregation. Therefore, the lead-free solder 9 is sequentially cured from the upper side of the printed wiring board 1 from above, and is finally cured near d. In addition, when the upper part is cured, the force of contraction occurs simultaneously, and the uncured part d is pulled. In this way, the peeling phenomenon of the lead-free solder 9 and the conductor pattern 3 land 3 b on the upper side of the printed wiring board 1 occurs (the symbol 11 in FIG. 8 indicates the peeling part). It is known that such peeling does not occur on the lower surface side (solder surface side) of the printed wiring board 1. In addition, as described above, in addition to the above η A L treatment, for example, even when the lead wire 8 of an electrical component is treated with a lead-containing surface, it occurs due to the influence of the lead. When peeling occurs, the reliability of the solder joint connection is impaired. Also, if it is (please read the precautions on the back and fill in this page first) • Binding · Order Γ--=-This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -6-507490 Ministry of Economic Affairs Printed by the Intellectual Property Bureau employee consumer cooperative A7 B7 V. Description of the invention (4) When a large current flows in the soldering part where the peeling occurs, part of it will generate heat, smoke and ignite. The present invention has been made by the inventors in view of the above circumstances, and an object thereof is to provide a component mounting substrate capable of improving connection reliability by soldering using a lead-free soft solder containing no lead and a method of manufacturing the same. [Means for solving the problem] In order to achieve the above-mentioned object, the first invention of the scope of patent application is to insert the wires of electrical parts into the wire insertion holes of the wiring substrate having a conductor pattern on both sides, The conductor pattern is a component mounting substrate composed of solder using lead-free and soft solder. It is characterized in that the wiring substrate is provided near the wire insertion hole. The conductor insertion hole is inserted into the conductor insertion hole. A supplementary conductor is provided to electrically connect the lead wire and two conductor patterns on both sides of the wiring substrate to be soldered. In the above-mentioned means, the electrical connection between the two conductor patterns on both sides of the wiring board of the soldered electrical substrate near the lead insertion hole of the lead of the solder electrical component is also performed in the auxiliary conductor portion. Therefore, even if the wire part of the solder electrical part is peeled off, the electrical connection between the two conductor patterns on both sides of the wiring substrate of the auxiliary conductor part can be subsidized. Therefore, as a result, the wire and electrical parts of the electrical part can be improved. Reliability of electrical connection between two conductor patterns on both sides of a wiring substrate. At this time, if item 2 of the scope of patent application is applied, the subsidy guide system has a paper size on the facing side of the substrate facing the wiring substrate and the substrate surface provided with the conductor pattern. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 (Mm) '(Please read the notes on the back before filling out this page) 507490 A7 B7_ 5. Description of the invention (5) The structure is better. Based on this, when soldering using error-free soft solder, the lead-free solder is also easily accessible between the substrate-facing portion of the auxiliary conductor and the conductor pattern, and a large solder area of the auxiliary conductor and the conductor pattern can be taken, which can also improve Supplement the connection reliability of the solder part of the volume conductor pattern. The invention according to claim 3 is characterized in that: the conductor insertion hole into which the auxiliary conductor is inserted has a through-hole electrically connecting the two conductor patterns on both sides of the wiring substrate with a pattern through hole on an inner peripheral surface thereof. When soldering in the state where the conductor insertion hole is inserted into the auxiliary conductor, the lead-free solder easily flows into the upper side (part surface side) of the conductor insertion hole, and the lead-free solder and the auxiliary conductor are used to interpose the two conductor patterns on both sides of the wiring substrate. Easy and secure connection. Caine, on the inner peripheral surface of the conductor insertion hole, if there is no connection pattern that electrically connects the two conductor patterns on both sides of the wiring board, the auxiliary conductor and the conductor pattern need to be carried out on both sides, but Soldering can be performed at one time based on the auxiliary conductor and conductor pattern. The invention of claim 4 is characterized in that the lead-free solder is mainly tin, and as a supplementary conductor, tin plating is used on the surface. According to this, the lead-free soft solder mainly composed of tin and the auxiliary conductor plated with tin are easy to be tamed by tin, and the solderability is also good. The invention according to the fifth item of the patent application scope is the invention of the second item, wherein the wiring substrate is provided with an electrical connection between the two conductor patterns on both sides of the wiring substrate on the inner peripheral surface of the auxiliary conductor substrate facing portion. The auxiliary through-holes of the connection pattern 'are also used to supplement the through-holes so as to flow into the lead-free solder. According to this, when using lead-free solder, even if the lead-free solder is used, this paper is compliant with CNS Standard 8 (Specification: Euro 297)--8- (Please read the precautions on the back before (Fill in this page)-installed.
、1T 經濟部智慧財產局員工消費合作社印製 507490 A7 B7 五、發明説明（6 ) (請先閲讀背面之注意事項再填寫本頁) ，透過補助貫通孔也容易流入於補助導體之基板面對向部 與導體圖案之間，可使補助導體與導體圖案之銲錫面積更 加變大，進而可更加提升這些補助導體與導體圖案之銲錫 部分之連接可靠性。 申請專利範圍第6項之發明，其特徵爲：設補助導體 之部分，係流動較大電流之電氣零件之導線所插入之導線 插入孔附近。 電氣零件之導線與配線基板兩面之兩導體圖案之連接 可靠性，因流動於電氣零件之電流愈大愈成爲問題，所以 將連接其電氣零件之導線之兩導體圖案間補助性地連接之 補助導體，係設於大電流流動之電氣零件之導線所插入之 導線插入孔之附近爲有效。 申請專利範圍第7項之發明，係一種零件貧裝基板之 製造方法，爲了達成上述目的，其特徵爲：在兩面具有導 體圖案之配線基板，不施加含鉛軟焊料之H A L處理之狀 態下，將電氣零件之導線，使用不含鉛之無鉛軟焊料而與 上述導體圖案進彳了婷錫。 經濟部智慧財產局員工消費合作社印製 若依此，對於配線基板未施加H A L處理，並且使用 不含鉛之無鉛軟焊料進行銲錫，所以可進行不含鉛之銲錫 。因此，可防止因含鉛所發生之剝離，進而可提升依銲錫 之連接可靠性。又，在配線基板，未施加高溫之H A L處 理，所以與施加H A L處理相較，施加於配線基板之應力 變小。 申請專利範圍第8項之發明，係爲了達成與第7項之 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） • 9 - 507490 經濟部智慧財產局員工消費合作社印製 A7 _ B7五、發明説明（7 ) 發明同樣之目的，其係一種零件實裝基板，其特徵爲：因 在兩面具有導體圖案之配線基板，未施加含鉛之hal處 理狀態下，將電氣零件之導線，使用不含鉛之無鉛軟焊料 進行與上述導體圖案之銲錫。 若據此，就可得到與上述申請專利範圍第7項之發明 同樣之效果。 申請專利範圍第9項之發明，係如第8項之發明，其 中於配線基板，在導體圖案之露出部分施加鍍金。 對於配線基板未施加H A L處理時導體圖案之露出部 分恐有腐蝕之虞，但是因在其導體圖案之露出部分施加鍍 金，就可防止其部分之腐蝕，可提升可靠性。 申請專利範圍第1 0項之發明，係如第8項之發明， .其中於配線基板，在內周面具有將配線基板兩面之兩導體 圖案間以電氣性連接之連接圖案之貫通孔插入電氣零件之 導線共用導線插入孔。 對於配線基板未施加H A L處理時，若係不插入電氣 零件之導線只爲普通貫通孔時，無鈴軟焊料就不容易流入 於其貫通孔內，軟焊料就不容易上來。於是，將其貫通孔 ’電氣零件之導線與欲插入之導線插入孔共用，無鈴軟焊 料就容易流入於其貫通孔內，軟焊料就容易上來。因此， 將配線基板兩.面之導體圖案間，藉由無鉛軟焊料就可良好 地連接。申請專利範圍第1 1項之發明，係如第8項之發 明，其中於配線基板，將在內周面具有配線基板兩面之兩 導體圖案間以電氣性連接之連接圖案，並且，具有未插入 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公楚) (請先閱讀背面之注意事_ 4 項再填、 裝— :寫本頁) J· -10- 其流入 設定爲 氣零件 獨貫通 得了無 將其內 上面側 無鉛軟 (請先閱讀背面之注意事項再填寫本頁) •裝· 507490 五、發明説明（8) 電氣零件之導線之單獨貫通孔，於此單獨貫通孔使 無鉛軟焊料者，其特徵爲；將上述單獨貫通孔內徑 0 · 7 m m以上。 對於配線基板未施加H A L處理時，不插入電 之導線之單獨貫通孔欲流入無鉛軟焊料時，倘若單 孔內徑爲較0 . 6 m m爲小時，其內徑爲太小，曉 鉛軟焊料不會上到上面側（零件面側）。於是，若 徑設定爲0 · 7 m m以上時，無鉛軟焊料容易上到 。藉此，將配線基板間之導體圖案間，將變成可由 焊料良好地連接。 【發明之實施形態】 茲關於本發明之第1實施例參照第1圖說明如下。 於此第1圖，表示對於構成配線基板之印刷電路基板 2 1，將電氣零件2 2，使用不含鉛之無鉛軟焊料2 3實 施銲錫之狀態。於此第1圖，印刷電路基板2 1之基材 2 4係例如玻璃環氧製，在此基材2 4之表裏兩面設有銅 製導體圖案25 ，25，並且，爲了使軟焊料不附著於這 些導體圖案2 5設有阻附劑2 6。 在印刷電路基板2 1形成有欲插入上述電氣零件2 2 之導線2 2 a所用之導線插入孔2 7，並且，位於此導線 插入孔2 7附近，形成有2個導體插入孔2 8，這些導線 插入孔2 7及導體插入孔2 8，係分別由貫通孔所構成， 在各個內周面，設有將印刷電路基板2 1之上下兩面之導 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -訂 __ 經濟部智慧財產局員工消費合作社印製 -11 507490 經濟部智慧財產局員工消費合作社印製 A7 ___B7___五、發明説明（9 ) 體圖案2 5，2 5間以電氣性連接之連接圖案2 5 a。上 下兩面之導體圖案25 ，25之中，成爲導線插入孔27 周緣部銲錫面之上面側之陸地2 9 a之直徑A 1 ，設定爲 較下面側之陸地2 9 b之直徑A 2爲小（A 1 < A 2 )。 在導線插入孔2 7有上述電氣零件2 2之導線2 2 a 爲從圖中上方插入，其導線2 2 a與上下兩面之導體圖案 2 5，2 5爲由無鉛軟焊料2 3加以銲錫。此時，作爲電 氣零件2 2係在內部流動較大電流，例如流動1 A以上電 流之電容器（capacitor )。又，無鈴軟焊料2 3係將錫爲主 體者，例如，錫95·8重量％，銀3.5重量％，銅 0 · 7重量％之合金。 在上述2個導體插入孔2 8，28，約略成〕字形之 .補助導體3 0兩側之插入部3 0 a ，3 0 a爲從圖中上方 插入，此補助導體3 0，與上下兩面之導體圖案2 5， 2 5爲由無鉛軟焊料2 3銲錫。因此，補助導體3 0係將 上述電氣零件2 2之導線2 2 a所連接之上下兩面之導體 圖案2 5，2 5間經由無鉛軟焊料2 3以電氣性地連接。 補助導體3 0係一體地具有與印刷電路基板2 1上面（基 板面）對向之基板面對向部3 0 b，此基板面對向部3 0 b與印刷電路基板2 1上面側之導體圖案2 5間也進入無 鉛軟焊料2 3。補助導體3 0之兩插入部3 0 a ，3 0 a 下端部也向內側彎曲。此時，作爲補助導體3 0係使用在 表面施加錫之軟銅線。 對於上述印刷電路基板2 1欲銲錫電氣零件2 2或補 ^紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 一 -12- (請先閱讀背面之注意事 4 -項再填· 裝— 寫本頁) 訂 507490 A7 B7 五、發明説明（10) 助導體3 0時如下列地進行。首先，對於印刷電路基板 (請先閱讀背面之注意事項再填寫本頁) 2 1之導線插入孔2 7插入電氣零件2 2之導線2 2 a， 並且，對於各導體插入孔2 8插入補助導體3 0之插入部 3 0 a。並且，於自動銲錫槽，將印刷電路基板2 1之下 面浸漬於熔化狀態之無鉛軟焊料之所謂浸漬銲錫法。藉此 ，如第1圖使用無鉛軟焊料2 3，銲錫電氣零件2 2或補 助導體3〇。 依據上述實施例，就可得到如下效果。 於流動較大電流之電氣零件2 2之導線2 2 a被銲錫 之導線插入孔2 7附近，將其電氣零件2 2之導線2 2 a 被銲錫之印刷電路基板2 1兩面之兩導體圖案2 5，2 5 間之電氣性連接，也在補助導體3 0部分進行。因此，例 如於銲錫電氣零件2 2之導線2 2 a之部分（導線插入孔 2 7之周緣部）即使發生剝離現象，因可在上述補助導體 經濟部智慧財產局員工消費合作社印製 3 0部分補助兩導體圖案2 5，2 5間之電氣性連接，所 以結果來說，可提升電氣零件2 2之導線2 2 a與兩面之 兩導體圖案2 5 ，2 5間之電氣性連接之可靠性。所以設 此補助導體3 0，在印刷電路基板2 1上面側流動大電流 部分特別有效。 補助導體3 0係約略成爲〕字形，因一體地構成具有 於印刷電路基板2 1設有與導體圖案2 5之基板面（上面 )如對向之基板面對向部3 0 b，所以使用無鉛軟焊料之 銲錫時，補助導體3 0之基板面對向部3 0 b與導體圖案 2 5間無鉛軟焊料2 3變成容易進入，可使補助導體3 0 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -13- 507490 A7 B7 五、發明説明（11) 與導體圖案2 5之銲錫面積變大’進而可提升這些補助導 體3 0與導體圖案2 5之銲錫部分之連接可靠性。 (請先閱讀背面之注意事項再填寫本頁) 又，補助導體3 0係約略成爲π字形，將兩插入部 3 0 a，3 0 a插入於導體插入孔2 8使用無鉛軟焊料 2 3銲錫，所以，可使補助導體3 0與導體圖案2 5之驛 錫面積更加變大。 並且，各導體插入孔2 8，係由在其內周面將上下兩 面之兩導體圖案2 5 ’ 2 5間具有以電氣性地連接之連接 圖案2 5 a之貫通孔所構成’所以’進行銲錫時’無鉛軟 焊料2 3容易進入到其導體插入孔2 8之上面側（零件面 側），所以藉無鉛軟焊料2 3與補助導體3 0 ’可使上下 兩面之兩導體圖案2 5間容易且確實地連接。蓋因，在導 體插入孔2 8內周面，將無上下兩面之兩導體圖案2 5， 2 5間以電氣性地連接之連接圖案時，就將補助導體3 0 與導體圖案2 5之銲錫，需要在上下兩側，但是，若依據 本實施例，就可將補助導體3 0與導體圖案2 5之銲錫一 次且可確實地進行。 經濟部智慧財產局員工消費合作社印製 並且，使用無鉛軟焊料2 3將錫爲主體者，作爲補助 導體3 0，藉使用在表面鍍錫者，將錫作爲主體之無鉛軟 焊料2 3 ，與在表面被鍍錫之補助導體3 0，都與錫馴服 ’鲜錫性爲良好。 又，於上述實施例，上下兩面之導體圖案25 ，2 5: 之中，將導線插入孔2 7周緣部之上面側之陸地2 9 a之 直徑A 1 ，設定爲較下面側之陸地2 9 b之直徑A 2爲小 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -14- 507490 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（12) (A 1 < A 2 )，所以具有不容易發生剝離之益處。 第2圖係表示本發明之第2實施例者，此第2實施例 ，係與上述實施例如下之點爲不同。亦即，在印刷電路基 板2 1在與補助導體3 0之基板面對向部3 0 b對向之部 位設補助貫通孔3 1，於此例爲設有2個，對於這些各補 助貫通孔3 1流入無鉛軟焊料2 3。在各補助貫通孔3 1 內周面，也設有將上下兩面之兩導體圖案2 5 ，2 5間以 電氣性連接之連接圖案2 5 a。 成爲這種構成時，使用無鉛軟焊料之銲錫時，無鉛軟 焊料2 3即使通過各補助貫通孔3 1也容易進入於補助導 體3 0之基板面對向部3 0 b與導體圖案2 5之間，可更 加增大補助導體3 0與導體圖案2 5之銲錫面積，進而可 提升這些補助導體3 0與導體圖案2 5之銲錫部分之連接 可靠性。 第3圖係表示本發明之第3實施例，此第3實施例係 與上述第1實施例下列之點不同。亦即，導體插入孔2 8 係1個，在此導體插入孔2 8插入有成銷狀之補助導體 32之插入部32a，將此補助導體32，與上下兩面之 兩導體圖案2 5，2 5使用無鉛軟焊料2 3銲錫。在補助 導體32雖然如無第1，第2實施例之補助導體30之基 板面對向部3 0 b，但是在上部從插入部3 2 a向橫方向 變大形成有止拔部3 2 b。 即使於這種第3實施例，也可得到與第1實施例如約 略同樣之作用效果。 (請先閲讀背面之注意事 I# -項再填· 裝-- 寫本頁) 訂 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -15- 507490 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（ 於上述第1〜第3實施例，作爲印刷電路基板2 1即 使經H A L處理者，或無處理者皆可。 / 於此，於使用這種無鉛軟焊料進行銲錫時，爲了儘量 減少其無鉛之鉛摻入量，若使用含有鉛之共晶軟焊料而未 施加H A L處理之印刷配線板，就可更加減少對於無鉛軟 焊料之鉛摻入量，也可減少剝離之發生。 第4圖係表示本發明之第4實施例者。於此，印刷電 路基板2 1係使用含有鉛之共晶軟焊料而未施加H A L處 理者。於未施加HAL處理之印刷電路基板21 ，導體圖 案2 5之中，未被阻附劑2 6覆蓋部分，亦即成爲銲錫面 之露出部分3 3 ，因導體圖案2 5之銅變成露出狀態，所 以，恐有在硫化氫等環境下受到銅腐鈾之虞。於是，於此 第4實施例，在導體圖案2 5之露出部分3 3表面施加鍍 金3 4處理。 構成爲如此時，因將導體圖案2 5之露出部分3 3由 鍍金3 4覆蓋，就可防止導體圖案2 5之露出銅發生腐貪由 。並且，此時，作爲印刷電路基板2 1 ，含有鉛之共晶軟 焊料之未施加H A L處理，所以可減少被使用於銲錫之無 鉛軟焊料之鉛摻入，也可減少剝離之發生，可提供可靠性 高之印刷電路基板2 1。 第5圖係表示本發明之第5實施例。 於未施加H A L處理之印刷電路基板2 1 ，不將電氣 零件之導線通過之貫通孔，亦即爲了連接上下兩面之兩導 體圖案2 5，2 5間只不過是貫通孔3 5部分，若使用無 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事 4 項再填· 裝II :寫本頁) 訂 ·1# -16- 507490 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（Μ 鉛軟焊料2 3之銲錫時，從銲錫下面側向上面側之上升情 形會變成不良。於是，於此第5實施例，將其貫通孔3 5 設計成與插入電氣零件3 6之導線3 6 a之導線插入孔共 用。成爲這種構成時，藉在貫通孔3 5插入電氣零件3 6 之導線3 6 a，使用無鉛軟焊料2 3銲錫時，從印刷電路 基板2 1下面側向上面側之銲錫之上升情形就變成良好， 將上下兩面之兩導體圖案2 5 ，2 5間，可使用無鉛軟焊 料2 3良好地連接。 第6圖係表示本發明之第6實施例。 此例，係於未施加H A L處理之同樣印刷電路基板 2 1 ，對於無插入電氣零件之導線之單獨貫通孔3 7，使 用無鉛軟焊料2 3進行銲錫時之例。 蓋因，於以往，這種單獨貫通孔之內徑，係〇·· 6 mm 0 · 6mm以下。未施加HAL處理，對於這種單 獨貫通孔，使用無鉛軟焊料時，曉得了銲錫不會上升到印 刷配線板之上面側。 於是，本實施例係將上述單獨貫通孔3 7之內徑D設 定爲0 · 7 m m以上。於是，無鉛軟焊料2 3就容易從單 獨貫通孔3 7下面側上升到上面側，藉此，將印刷電路基 板2 1兩面之導體圖案2 5，2 5間，可由無鉛軟焊料 2 3進行良好之連接。 本發明並非限定於上述各實施例而已，可變形或擴充 爲如下。 作爲流動較大電流之電氣零件2 2，除了電容器之外 (請先閱讀背面之注意事 —0 項再填- 裝— :寫本頁)Printed by 507490 A7 B7 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs of the 1T. 5. Description of the invention (6) (Please read the precautions on the back before filling this page). It is also easy to flow into the substrate face of the auxiliary conductor through the auxiliary through hole Between the directing portion and the conductor pattern, the solder area of the auxiliary conductor and the conductor pattern can be made larger, and the connection reliability of the auxiliary conductor and the solder portion of the conductor pattern can be further improved. The invention in the sixth scope of the patent application is characterized in that the auxiliary conductor portion is provided near a wire insertion hole into which a wire of an electric component flowing a large current flows. The reliability of the connection between the lead of the electrical part and the two conductor patterns on both sides of the wiring substrate becomes more problematic as the current flowing through the electrical part becomes larger. Therefore, the auxiliary conductor that supplementally connects the two conductor patterns of the lead connecting the electrical part It is effective to be located near the wire insertion hole into which the wire of an electric part flowing a large current is inserted. The invention claimed in item 7 of the scope of patent application is a method for manufacturing a poorly mounted substrate. In order to achieve the above purpose, it is characterized in that in a state where a wiring substrate having a conductor pattern on both sides is not subjected to HAL treatment of lead-containing solder, The lead of the electrical component was tinned with the above conductor pattern using lead-free soft solder without lead. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs If this is the case, no wiring is applied to the wiring board, and lead-free soft solder is used for soldering, so lead-free solder can be used. Therefore, it is possible to prevent the occurrence of peeling due to the inclusion of lead, thereby improving the reliability of connection by solder. In addition, since the wiring substrate is not subjected to a high-temperature H A L treatment, the stress applied to the wiring substrate is smaller than the H A L treatment. The invention of item 8 of the scope of patent application is for the purpose of achieving the paper size of item 7 in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) • 9-507490 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _ B7 V. Description of the invention (7) The same purpose of the invention is a component mounting substrate, which is characterized in that the electrical component is a wiring substrate having a conductor pattern on both sides without being treated with lead-containing hal. The lead is soldered to the above-mentioned conductor pattern using a lead-free soft solder containing no lead. According to this, it is possible to obtain the same effect as that of the invention in claim 7 of the aforementioned patent application. The invention of claim 9 is the invention of claim 8 in which gold plating is applied to the exposed portion of the conductor pattern on the wiring substrate. The exposed part of the conductor pattern may be corroded when the wiring substrate is not subjected to H A L treatment. However, by applying gold plating to the exposed part of the conductor pattern, corrosion of the part can be prevented and reliability can be improved. The invention of item 10 in the scope of patent application is the invention of item 8. In the wiring substrate, a through hole having a connection pattern for electrically connecting between two conductor patterns on both sides of the wiring substrate is inserted into the inner side of the wiring substrate. The wires of the parts share the wire insertion holes. When H A L is not applied to the wiring board, if the wires that are not inserted into the electrical components are ordinary through-holes, no bell solder will not easily flow into the through-holes, and soft solder will not come up easily. Therefore, if the through-holes of the electrical parts are shared with the wire insertion holes to be inserted, the bell-free solder can easily flow into the through-holes and the soft solder can easily come up. Therefore, the conductor patterns on both surfaces of the wiring board can be connected well by using lead-free solder. The invention according to claim 11 in the scope of patent application is the invention according to item 8, wherein the wiring substrate has a connection pattern that is electrically connected between two conductor patterns on the inner peripheral surface that have both sides of the wiring substrate, and has a non-inserted connection pattern. This paper size applies to China National Standard (CNS) A4 specification (210X297). (Please read the notes on the back _ 4 items before filling and filling —: write this page) J · -10- The inflow setting is independent of gas parts It can be penetrated without softening the inner upper side without lead (please read the precautions on the back before filling out this page) • Installation · 507490 V. Description of the invention (8) Separate through hole for the lead of electrical parts. A soft solder is characterized in that the inner diameter of the above-mentioned individual through hole is 0. 7 mm or more. When the HAL treatment is not applied to the wiring board, when the single through hole of the electric wire is not inserted, and the lead-free soft solder is to be flowed in, if the inner diameter of the single hole is less than 0.6 mm, the inner diameter is too small. Does not go up to the upper side (part surface side). Therefore, if the diameter is set to 0 · 7 mm or more, the lead-free solder is easy to reach. As a result, the conductor patterns between the wiring boards can be connected well by solder. [Embodiment of the invention] The first embodiment of the present invention is described below with reference to the first figure. Here, FIG. 1 shows a state where solder is applied to the printed circuit board 21 constituting the wiring substrate, and the electrical components 22 are soldered using lead-free solder 23 which does not contain lead. In this first figure, the base material 2 4 of the printed circuit board 21 is made of glass epoxy, for example, and copper conductor patterns 25 and 25 are provided on both surfaces of the base material 2 4. These conductor patterns 25 are provided with an adhesion inhibitor 26. The printed circuit board 21 is formed with a lead insertion hole 27 for the lead 2 2 a to be inserted into the electrical component 2 2 described above, and two conductor insertion holes 2 8 are formed near the lead insertion hole 27. The wire insertion hole 27 and the conductor insertion hole 28 are respectively formed by through holes. On each inner peripheral surface, guides for the upper and lower sides of the printed circuit board 2 1 are provided. The paper size is applicable to the Chinese National Standard (CNS) A4 Specifications (210X 297 mm)-Order __ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -11 507490 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ___B7___ V. Description of the invention (9) Body pattern 2 5, 2 5 connection patterns 2 5 a electrically connected. Among the conductor patterns 25 and 25 on the upper and lower surfaces, the diameter A 1 of the land 2 9 a on the upper side of the solder surface of the periphery of the wire insertion hole 27 is set to be smaller than the diameter A 2 of the land 2 9 b on the lower side ( A 1 < A 2). In the lead insertion hole 27, the lead 2 2a of the above-mentioned electrical component 2 2 is inserted from above, and the lead 2 2 a and the upper and lower conductor patterns 2 5 and 25 are soldered by a lead-free soft solder 23. At this time, as the electric component 22, a large current flows inside, for example, a capacitor that flows a current of 1 A or more. In addition, the bell-free solder 23 is an alloy containing tin as the main component, for example, 95.8% by weight of tin, 3.5% by weight of silver, and 0.7% by weight of copper. The above two conductor insertion holes 28, 28 are approximately in the shape of []. The auxiliary conductors 30 on both sides of the insertion portions 30a, 30a are inserted from the top of the figure, and this auxiliary conductor 30 is on the upper and lower sides. The conductor patterns 25, 25 are soldered by lead-free soft solder 23. Therefore, the auxiliary conductor 30 is electrically connected to the conductor patterns 25 on the upper and lower sides of the conductor 2 2 a of the electrical component 2 2 described above via lead-free solder 23. The auxiliary conductor 3 0 is a conductor having a substrate facing portion 30 b facing the upper surface (substrate surface) of the printed circuit board 21 integrally. The substrate facing portion 3 0 b and a conductor on the upper side of the printed circuit substrate 21 are integrated. Patterns 2 to 5 also enter lead-free solder 2 3. The two insertion portions 30 a of the auxiliary conductor 30 and the lower end portion of the 30 a also bend inward. In this case, as the auxiliary conductor 30, a soft copper wire having tin applied to its surface is used. For the above printed circuit board 2 1 electrical components to be soldered 2 2 or supplementary ^ paper size applicable Chinese National Standard (CNS) A4 specifications (210X297 mm) -12- (Please read the note 4 on the back before filling in the- Installation — write this page) Order 507490 A7 B7 V. Description of the invention (10) The auxiliary conductor 30 is performed as follows. First, for printed circuit boards (please read the precautions on the back before filling this page) 2 1 lead insertion holes 2 7 insert electrical parts 2 2 lead 2 2 a, and each conductor insertion hole 28 insert auxiliary conductors The insertion portion of 3 0 3 a. The so-called immersion soldering method in which the lower surface of the printed circuit board 21 is immersed in a molten lead-free solder in an automatic solder bath. With this, as shown in Fig. 1, lead-free soft solder 23 is used, electrical parts 22 are soldered or auxiliary conductors 30 are soldered. According to the above embodiment, the following effects can be obtained. Near the lead 2 2 a of the electrical component 2 2 a where the current flows is near the solder insertion hole 2 7, and the lead 2 2 a of the electrical component 2 2. The printed circuit board 2 on both sides of the solder 2 The electrical connection between 5, 2 and 5 is also performed in the auxiliary conductor 30 section. Therefore, for example, if the peeling phenomenon occurs in the portion of the lead 2 2 a of the solder electrical component 2 (the peripheral portion of the lead insertion hole 27), it is possible to print the part 30 in the consumer property cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The electrical connection between the two conductor patterns 25 and 25 is subsidized, so as a result, the reliability of the electrical connection between the conductor 2 2 a of the electrical component 2 2 and the two conductor patterns 2 5 and 25 on both sides can be improved. . Therefore, the auxiliary conductor 30 is particularly effective for flowing a large current on the upper surface of the printed circuit board 21. The auxiliary conductor 3 0 is roughly shaped like a []. Since the substrate surface (upper surface) provided with the conductor pattern 25 on the printed circuit board 21 is integrally formed, the substrate facing portion 3 b is opposed, so it is lead-free. When soldering with soft solder, the lead-free soft solder 23 between the substrate-facing portion 3 0 b and the conductor pattern 25 of the auxiliary conductor 30 becomes easy to enter, and the auxiliary conductor 30 can be applied to this paper. Chinese National Standard (CNS) A4 specification (210X297mm) -13- 507490 A7 B7 V. Description of the invention (11) The solder area with conductor pattern 25 becomes larger, which can improve the reliable connection between these auxiliary conductors 30 and the solder portion of conductor pattern 25 Sex. (Please read the precautions on the back before filling in this page.) The auxiliary conductor 3 0 is approximately π-shaped, and the two insertion portions 3 a and 3 0 a are inserted into the conductor insertion hole 2 8 using lead-free solder 2 3 solder Therefore, the area of the tin between the auxiliary conductor 30 and the conductor pattern 25 can be made larger. In addition, each of the conductor insertion holes 28 is formed by a through hole having two conductive patterns 2 5 ′ 2 5 on its inner peripheral surface with a connection pattern 2 5 a electrically connected to each other. When soldering, 'lead-free soft solder 2 3 easily enters the upper side (part surface side) of its conductor insertion hole 28, so by using lead-free soft solder 23 and auxiliary conductor 3 0', two conductor patterns on the upper and lower sides can be used. Easy and secure connection. Gein, when there is no connection pattern between the two conductor patterns 25 and 25 electrically connected to the inner peripheral surface of the conductor insertion hole 28, the auxiliary conductor 30 and the conductor pattern 25 are soldered. It needs to be on the upper and lower sides, but according to this embodiment, the soldering of the auxiliary conductor 30 and the conductor pattern 25 can be performed once and reliably. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and using lead-free soft solder 2 3 as the main conductor, as a supplementary conductor 30, and by using tin-plated surface, tin as the main lead-free soft solder 2 3, and The auxiliary conductors 30, which are tin-plated on the surface, are tamed with tin, and the fresh tin is good. Also, in the above embodiment, among the conductor patterns 25, 2 5 on the upper and lower surfaces, the wire is inserted into the hole 2 7 and the diameter A 1 of the land 2 9 a on the upper side of the peripheral portion is set to the land 2 9 on the lower side. The diameter of b A 2 is the size of a small paper. Applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -14- 507490 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (12) (A 1 < A 2), so there is a benefit that peeling does not easily occur. Fig. 2 shows a second embodiment of the present invention. This second embodiment is different from the above embodiment in the following points. That is, in the printed circuit board 21, auxiliary through-holes 31 are provided at positions facing the substrate-facing portion 30b of the auxiliary conductor 30. In this example, two auxiliary through-holes are provided. For each of these auxiliary through-holes, 3 1 Flow into lead-free soft solder 2 3. On the inner peripheral surface of each of the auxiliary through holes 3 1, there are also provided connection patterns 2 5 a for electrically connecting the two conductor patterns 2 5 and 2 5 on the upper and lower surfaces. In such a configuration, when using a lead-free solder, the lead-free solder 2 3 easily enters the substrate facing portion 3 0 b of the auxiliary conductor 30 and the conductor pattern 25 even through the auxiliary through-holes 31. In this way, the solder area of the auxiliary conductor 30 and the conductor pattern 25 can be further increased, and the connection reliability of the auxiliary conductor 30 and the solder portion of the conductor pattern 25 can be improved. Fig. 3 shows a third embodiment of the present invention. This third embodiment is different from the following points in the first embodiment. That is, one conductor insertion hole 2 8 is provided, and an insertion portion 32 a of a pin-shaped auxiliary conductor 32 is inserted into the conductor insertion hole 28, and the auxiliary conductor 32 and the upper and lower two conductor patterns 2 5 and 2 5 Use lead-free soft solder 2 3 Solder. Although the auxiliary conductor 32 is not provided with the substrate-facing portion 3 0 b of the auxiliary conductor 30 of the first and second embodiments, the pull-out portion 3 2 b is formed at the upper portion from the insertion portion 3 2 a in the lateral direction. . Even in such a third embodiment, the same effects as those of the first embodiment can be obtained. (Please read the note I # on the back-fill in the items first-write this page) The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) -15- 507490 A7 B7 Ministry of Economic Affairs Printed by the Intellectual Property Bureau's Consumer Cooperatives 5. Description of the invention (in the first to third embodiments described above, the printed circuit board 2 1 can be processed by HAL or without a processor. / Here, in this use In order to minimize the lead-free lead content when soldering with lead-free soft solder, if the printed wiring board containing eutectic solder containing lead without HAL treatment is used, the lead content of lead-free soft solder can be further reduced. It is also possible to reduce the occurrence of peeling. Fig. 4 shows a fourth embodiment of the present invention. Here, the printed circuit board 21 is a eutectic solder containing lead without applying a HAL treatment. Without applying a HAL Of the processed printed circuit board 21 and the conductor pattern 25, the portion not covered by the anti-adhesive agent 26 is the exposed portion 3 3 of the solder surface. The copper of the conductor pattern 25 is exposed, so there may be Ring in hydrogen sulfide It is subject to copper rot. Therefore, in the fourth embodiment, gold plating 3 4 is applied to the surface of the exposed portion 3 3 of the conductive pattern 25. In this configuration, the exposed portion 3 of the conductive pattern 25 is formed. Covered with gold plating 3 4 can prevent the exposed copper of the conductor pattern 25 from being corroded. Also, at this time, as the printed circuit board 2 1, the eutectic solder containing lead is not treated with HAL, so it can be reduced. Lead in lead-free soft solder used for soldering can also reduce the occurrence of peeling, and can provide a highly reliable printed circuit board 21. Figure 5 shows the fifth embodiment of the present invention. The printed circuit board 2 1 is a through hole that does not pass the wires of electrical parts, that is, to connect the two conductor patterns 25 and 25 on the upper and lower sides. It is only a part of the through hole 35. If this paper is used, it is applicable to China. National Standard (CNS) A4 specification (210X297 mm) (Please read the notes on the back of the 4 items before filling in II: Write this page) Order 1 # -16- 507490 A7 B7 Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printing Explanation (In the case of the solder of M lead soft solder 23, the rise from the lower side to the upper side of the solder becomes defective. Therefore, in this fifth embodiment, the through-hole 3 5 is designed to be inserted into the electrical part 36. The lead insertion hole of the lead 3 6 a is shared. In this configuration, the lead 3 6 a of the electrical component 3 6 is inserted through the through hole 3 5 and the lead-free solder is used. 2 3 The rise of the solder on the upper side becomes good, and the two conductor patterns 2 5 and 25 on the upper and lower sides can be connected well using a lead-free solder 23. Fig. 6 shows a sixth embodiment of the present invention. This example is an example in which the same printed circuit board 2 1 without H A L treatment is applied, and the lead-free solder 23 is used for soldering the individual through-holes 3 7 of the wires without the electric parts inserted therein. Gein, in the past, the inner diameter of such a separate through-hole was 0 ·· 6 mm 0 · 6 mm or less. When HAL treatment was not applied, it was known that when this lead-free solder was used for such individual through holes, the solder did not rise to the upper side of the printed wiring board. Therefore, in this embodiment, the inner diameter D of the individual through-hole 37 is set to be greater than or equal to 0 · 7 mm. Therefore, the lead-free solder 23 can easily rise from the lower side to the upper side of the single through-hole 37, and thereby, the conductor patterns 2 5 and 25 on both sides of the printed circuit board 2 1 can be performed well by the lead-free solder 23 Of connection. The present invention is not limited to the above-mentioned embodiments, but may be modified or expanded as follows. Except for capacitors, as electrical parts 2 2 that carry large currents (please read the precautions on the back — 0 items, then fill-install —: write this page)
、1T 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -17- 507490 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明（β ，也可以爲開關元件（switching device )，二極體（diode )，線圈（coil)，變壓器（transformer)等。 【發明效果】 由以上之說明就可淸楚，若依據本發明，可得到下列 效果。 依據申請專利範圍第1項之發明，於銲錫電氣零件之 導線之導線插入孔之附近，將銲錫電氣零件之導線之配線 基板兩面之兩導體圖案間之電氣性連接，也在補助導體部 分進行。因此，於銲錫電氣零件之導線之部分即使發生所 謂剝離現象，因可在上述補助導體部分可電氣性連接補助 配線基板兩面之兩導體圖案間，結果來說，就可提升電氣 零件之導線與配線基板兩面之兩導體圖案間之電氣性連接 之可靠性。 依據申請專利範圍第7，8項之發明，對於配線基板 未施加H A L處理，並且因使用不含鉛之無鉛軟焊料進行 銲錫，所以可不包含鉛就可進行銲錫。因此，可防止因含 鉛所發生之剝離之發生，進而，可提升銲錫之連接可靠性 。又，因對於配線基板，未施加高溫之H A L處理，所以 與施加H A L處理時相較，可減小施加於配線基板之應力 〇 圖式之簡單說明 第1圖係表示本發明之第1實施例之要部縱剖面圖。 第2圖係表示本發明之第2實施例之第1圖相當圖。： (請先閱讀背面之注意事 4 ▼項再填」 裝— 寫本頁) 訂 J· 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ297公釐） -18- 507490 A7 ______B7_ 五、發明説明（$ 第3圖係表示本發明之第3實施例之第1圖相當圖。 (請先閱讀背面之注意事項再填寫本頁) 第4圖係表示本發明之第4實施例，而是銲錫前之要 部縱剖面圖。 第5圖係表示本發明之第5實施例之第1圖相當圖。 第6圖係表示本發明之第6實施例之第1圖相當圖。 第7圖係表示以往例，在進行H A L處理狀態之印刷 配線板之縱剖面圖。 第8圖係用來說明發生剝離之機制（m e c h a n i s m )所用 之縱剖面圖。 【符號之說明】 2 1 印刷電路基板（配線基板） 2 2 電氣零件 2 2 a 導線 23 無鉛軟焊料 2 5 導體圖案 2 5 a 連接圖案 經濟部智慧財產局員工消費合作社印製 27 導線插入孔 28 導體插入孔 3 0 補助導體 3〇a 插入部 3 0b 基板面對向部 31 補助貫通孔 32 補助導體 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ^、 1T This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) -17- 507490 A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (β, can also be a switching device ), Diode (diode), coil (coil), transformer (transformer), etc. [Inventive effect] It can be understood from the above description, according to the present invention, the following effects can be obtained. According to the scope of patent application No. 1 In the invention, the electrical connection between the two conductor patterns on both sides of the wiring board of the lead of the solder electrical part is made near the lead insertion hole of the lead of the solder electrical part. Therefore, the auxiliary conductor is also provided. Even if the so-called peeling phenomenon occurs in the part of the wire, the above-mentioned auxiliary conductor part can be electrically connected between the two conductor patterns on both sides of the auxiliary wiring substrate. As a result, the space between the wires of the electrical parts and the two conductor patterns on both sides of the wiring substrate can be improved. Reliability of electrical connection. According to the inventions in claims 7 and 8 of the scope of patent application, for wiring substrates No HAL treatment is applied, and lead-free soft solder is used for soldering, so soldering can be performed without lead. Therefore, peeling due to lead can be prevented, and solder connection reliability can be improved. In addition, since the wiring substrate is not subjected to a high-temperature HAL treatment, the stress applied to the wiring substrate can be reduced compared to the case where the HAL treatment is applied. Brief description of the diagram The first diagram shows the first implementation of the present invention A longitudinal sectional view of the main part of the example. Figure 2 is a diagram corresponding to the first figure of the second embodiment of the present invention: (Please read the note on the back 4 ▼ Items before filling. · This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -18- 507490 A7 ______B7_ V. Description of the invention ($ The third figure is the first figure corresponding to the third embodiment of the present invention. (Please read the precautions on the back before filling out this page.) Figure 4 shows the fourth embodiment of the present invention, but is a longitudinal sectional view of the main part before soldering. Figure 5 shows the fifth embodiment of the present invention. Figure 1 is equivalent. Figure 6 Fig. 7 is a diagram corresponding to Fig. 1 showing a sixth embodiment of the present invention. Fig. 7 is a longitudinal sectional view showing a conventional example of a printed wiring board in a HAL-treated state. Fig. 8 is a diagram for explaining the mechanism of peeling ( mechanism). [Description of symbols] 2 1 Printed circuit board (wiring board) 2 2 Electrical parts 2 2 a Wire 23 Lead-free soft solder 2 5 Conductor pattern 2 5 a Connection pattern Intellectual property office staff consumption Cooperative printed 27 Conductor insertion hole 28 Conductor insertion hole 3 0 Auxiliary conductor 30a Insertion part 3 0b Substrate facing portion 31 Auxiliary through hole 32 Auxiliary conductor This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) ) ^
Λ Q 507490 A7 _B7 五、發明説明（17) 33 露出部分 3 4 鍍金 3 5 貫通孔 36 電氣零件 3 6a 導線 37 單獨貫通孔 I-------0^-- (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -20-Λ Q 507490 A7 _B7 V. Description of the invention (17) 33 Exposed part 3 4 Gold-plated 3 5 Through-hole 36 Electrical parts 3 6a Conductor 37 Separate through-hole I ------- 0 ^-(Please read the back Please fill in this page for the matters needing attention) Order the paper printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs to apply the Chinese National Standard (CNS) A4 specification (210X 297 mm) -20-