JP3111227B2 - Printed wiring board for IC card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for an IC card which is formed as an IC card by mounting electronic components, and which is incorporated in the IC card. The present invention relates to a printed wiring board for an IC card having a contact terminal formed thereon and having a surface plated to expose the IC card outside.

[0002]

2. Description of the Related Art Conventionally, an electronic component is mounted on an IC card, and various IC card printed wiring boards incorporated in the IC card have been proposed.
Among them, there is a printed wiring board for an IC card including an insulating base material and a contact terminal formed on the insulating base material and exposed to the outside of the IC card.

Here, the structure of this type of printed circuit board for an IC card will be described in detail together with the structure of the IC card.

First, in a conventional printed wiring board for an IC card, as shown in FIG. 6, a conductor pattern made of a metal such as copper having excellent conductivity is formed on an insulating base material such as a polyimide resin film having excellent flexibility. It has a formed structure.
The conductor pattern constitutes a contact terminal. As shown in FIGS. 7 and 8, the contact terminal is exposed to the outside air because it is exposed to the outside of the IC card.
Or you come in contact with the sweat of the person who uses the IC card,
Corrosion will be caused on the conductor pattern. Therefore, usually, the contact terminals are plated with nickel and gold having excellent corrosion resistance on the surface of the conductor pattern,
The conductor pattern is isolated from the outside air to prevent corrosion of the conductor pattern.

[0005]

However, in a conventional printed circuit board for an IC card, as shown in FIG. 9, a contact portion between a side surface of a conductor pattern constituting the contact terminal and an insulating base material is provided. There was a portion where plating was not applied (hereinafter referred to as a non-plated portion).

[0006] This is due to the plating characteristics in the step of plating the conductor pattern, and the plating solution hardly circulates at the boundary portion, and the plating is hardly applied to the plating member.

Further, since the printed wiring board for an IC card is highly flexible, peeling occurs between the conductor pattern and the insulating base material at the boundary portion, and the conductor pattern is easily exposed.

Therefore, in the conventional printed wiring board for IC card, the non-plated portion of the conductor pattern constituting the contact terminal comes into contact with the outside air, and the non-plated portion is contacted with the conductor pattern from the non-plated portion. Corrosion had occurred.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a problem to be solved is to completely shut off the surface of a conductor pattern constituting a contact terminal of a printed wiring board for an IC card from the outside air. , To prevent corrosion.

An object of the present invention is to provide a printed wiring board for an IC card having a contact terminal excellent in corrosion resistance with a simple structure.

[0011]

In order to solve the above-mentioned problems, the means adopted by the present invention will be described with reference to the reference numerals of the embodiments. a printed circuit board 100 for an IC card that includes a contact terminal 20 exposed to the outside of the IC card by plating 22 formed surfaces, the respective contact terminals 2
Fill the insulating resin 30 up to its upper surface during the
A printed wiring board 100 for an IC card , wherein a dent 31 is provided in the insulating resin 30 .

That is, the printed wiring board 100 for an IC card according to the present invention is filled between the contact terminals 20.
This is a structure in which the dent 31 is provided in the insulating resin 30 that has been formed .

[0013]

In the printed wiring board 100 for an IC card according to the present invention having the above-described structure, the conductor pattern 21 constituting the contact terminal 20 is formed by plating 22
The portion provided with is covered by the plating 22, and the non-plated portion 25 is shielded from the outside air by the insulating resin 30. That is, the surface of the conductor pattern 21 is completely shielded from the outside air. Therefore, since the conductor pattern 21 does not come into contact with the outside air, the corrosion of the conductor pattern 21 due to the outside air is prevented. Further
And the insulating resin 30 filled between the contact terminals 20
Since the recess 31 is provided, such IC card
In the printed wiring board 100 for bending, bending stress is applied.
Contact terminals 20 and insulating resin 30 peel off
It becomes difficult.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the embodiments shown in the drawings.

First, FIGS. 1 and 2 show an IC according to the present invention.
One embodiment of a printed wiring board 100 for a card is shown.

In the printed wiring board 100 for an IC card, the insulating base material 10 made of a polyimide resin film is used.
The conductor pattern 21 is formed of copper foil on the upper surface, and the surface of the conductor pattern 21 is plated with gold 22. The conductor pattern 21 and the plating 22 constitute a contact terminal 20. The space between the contact terminals 20 after plating 22 is applied to the conductor pattern 21 is filled with an insulating resin 30 of epoxy resin up to the upper surface of the contact terminals 20. Accordingly, the insulating resin 30 allows the plated portion 2 on the side surface 23 of the conductor pattern 21 forming the contact terminal 20.
5 is shut off from the outside air.

The insulating resin 30 may be filled before the conductive pattern 21 is plated 22. FIG. 3 shows a printed wiring board 100 for an IC card in this case.

In this printed wiring board for an IC card, after the conductor pattern 21 is formed on the insulating base material 10,
The insulating resin 30 is filled up to the upper surface of the conductor pattern 21. After the insulating resin 30 is filled, the surface of the conductor pattern 21 is plated 22 to form the contact terminal 20. At this time, the conductor pattern 21 as a plating member and the insulating resin 30 as a non-plating member are separated. Because they are in contact at an angle, the conductor pattern 2
First, there is no non-plated portion 25 due to plating characteristics. Therefore, the conductive pattern constituting the contact terminal 20 is completely shielded from the outside air by the plating 22 and the insulating resin 30.

FIG. 2 shows the embodiment of FIG.
A partially enlarged sectional view is shown.

The dent 31 is formed by polishing or melting the insulating resin 30 filled between the contact terminals 20. In such a printed wiring board 100 for an IC card, when a bending stress is applied, the contact terminals 20 and the insulating resin 30 are not easily peeled off. In addition, if the dent 31 is provided also in the insulating resin 30 filled before the plating 22 is applied to the conductor pattern 21, the same effect can be naturally obtained.

[0021]

[0022]

As described above in detail, according to the present invention, the conductor pattern constituting the contact terminal of the printed wiring board for an IC card can be completely shielded from the outside air. That is, it is possible to completely prevent corrosion of the conductor pattern from the outside air. Therefore, the I of the present invention
The printed wiring board for the C card is provided with contact terminals having excellent corrosion resistance. Furthermore, the present invention
The printed wiring board 100 for an IC card according to
The dent 31 is formed in the insulating resin 30 filled between the contact terminals 20.
Is installed so that when bending stress is applied,
G terminal 20 and insulating resin 30 are hardly peeled off, and reliability is improved.
Is high.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a printed wiring board for an IC card according to the present invention.

FIG. 2 is an enlarged view of a portion A in FIG.

FIG. 3 is a partial sectional view showing another embodiment of the printed wiring board for an IC card according to the present invention.

FIG. 4 is a sectional view showing a conventional printed circuit board for an IC card .
FIG.

FIG. 5 is a perspective view showing an IC card.

6 is a sectional view taken along the line CC in FIG.

FIG. 7 is an enlarged view of a portion B in FIG . 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Insulating base material 20 Contact terminal 21 Conductor pattern 22 Plating 23 Side surface 24 Boundary part 25 Non-plated part 30 Insulating resin 31 Dent 100 Printed wiring board for IC cards

Claims (1)

(57) [Claims] 1. A printed wiring board for an IC card, comprising : an insulating base material; and contact terminals formed on the insulating base material, the surfaces of which are plated and exposed to the outside of the IC card. Fill insulation resin between terminals up to the top surface
A printed wiring board for an IC card , wherein said insulating resin is provided with a dent .