JPH10233568A - Manufacturing method of printed wiring board, and jig for plating used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacture of a printed wiring board which connects a terminal with a power source without drawing out a wiring pattern from this terminal part made inward of an insulating substrate to the vicinity of the periphery, and forms a metallic film at the terminal part by electrdytrolytic plating, and a jig for plating used for this. SOLUTION: A terminal part 3 of a printed wiring board 1 is made electrically continuous with a power source for plating through a conductive part 6 for plating and a connection 7, by superposing the conductive part 6bf or plating of the jig 5 for plating provided with the conductive part 6 for plating, the connection 7 to connect this conductive part 6 for plating with the power source for plating, and an insulating support for supporting the conductive part 6 for plating and the connection 7, on the terminal part 3 of a printed wiring board 1, and electrolytic plating is applied to this terminal part 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board having a metal film formed on a terminal portion and a plating jig used for the method.

[0002]

2. Description of the Related Art A printed wiring board has a plurality of terminals called lands to which connection terminals of electronic components are electrically connected to an insulating substrate, and a connection between these terminals based on an electronic circuit design. A wiring pattern is formed.
The terminal portion and the wiring pattern are formed on the insulating substrate by etching as a conductor pattern.

[0005] In the printed wiring board, a metal film is formed on the terminal portion as necessary, for example, to improve the solderability, conductivity and abrasion resistance of the terminal portion. This metal coating,
The terminal portion is formed by plating by a method called an electrolytic plating method.

[0004] Electroplating is a method in which an aqueous solution of a metal salt serving as an ion source is used as an electrolytic solution, a printed wiring board is immersed in the electrolytic solution, and a current is supplied to the electrolytic solution using the terminal portion of the printed wiring board as an electrode. Is a method of depositing a metal film on a terminal portion of a printed wiring board.

[0005] When a metal film is formed on a terminal portion of a printed wiring board by an electrolytic plating method, a wiring pattern is drawn out from the terminal portion near the outer peripheral edge of the insulating substrate, and the wiring pattern and the plating are formed near the outer peripheral edge of the insulating substrate. By connecting to a power supply for use, the terminal portion is made to be an electrode.

[0006]

On the other hand, printed wiring boards are required to have high densities in order to reduce the size and performance of electrical products, and a large number of terminals and complicated wiring patterns are formed on a small board. Is formed. As the density of the printed wiring board increases, wiring cannot be drawn from the terminal portion formed on the inner side of the insulating substrate to the vicinity of the outer peripheral edge of the insulating substrate. You may not be able to connect. The terminal portion that is not connected to the plating electrode cannot form an electrode at the time of electrolytic plating, and remains without being plated.

Accordingly, the present invention provides a method for connecting a terminal to a power source without extending a wiring pattern from a terminal formed on an inner side of the insulating substrate to a portion near an outer peripheral edge of the insulating substrate, and forming the terminal by electrolytic plating. It is an object of the present invention to provide a method for manufacturing a printed wiring board in which a metal film is formed on a part and a plating jig used for the method.

[0008]

According to the present invention, there is provided a method for manufacturing a printed wiring board, comprising: a conductive portion for plating; and a connecting portion for connecting the conductive portion for plating to a power source for plating. The terminal of the printed wiring board is electrically connected to the terminal of the printed wiring board by superposing the conductive part for plating of the plating jig having the conductive part for plating and the insulating support member for supporting the connection part on the terminal of the printed wiring board. It is electrically connected to a plating power supply through the section and the connection section, and electrolytic plating is performed on the terminal section.

According to the method of manufacturing a printed wiring board, the terminal portion is electrically connected to the plating power source via the plating conductive portion and the connection portion of the plating jig. Therefore, the electrical connection between the terminal portion and the power supply for plating can be achieved without forming a wiring for conducting the terminal portion to the power supply for plating on the insulating substrate.

A plating jig according to the present invention comprises a plating conductive portion superposed on a terminal portion of a printed wiring board, a connecting portion for connecting the plating conductive portion to a plating power source, and a plating conductive portion. And an insulating support member for supporting the connection section and the connection section.

In this plating jig, a conductive portion for plating is connected to a power source for plating via a connection portion. Therefore,
By superposing the conductive part for plating of this plating jig on the terminal part of the printed wiring board, the terminal part of the printed wiring board is electrically connected to the plating power source via the conductive part for plating and the connection part. You.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

In this embodiment, an example in which the present invention is applied to a printed wiring board on which wire bond pads are formed will be described.

This printed wiring board 1 is shown in FIGS.
As shown in FIG. 1, a terminal portion 3 called a wire bond pad for directly mounting an electronic component such as a semiconductor element is formed on an insulating substrate 2.

Since the terminal portion 3 is directly connected to the electrode of the electronic component via a wire such as a gold wire, the terminal portion 3 is provided on the insulating substrate 2 at a position corresponding to the electrode of the electronic component. Formed.

The terminal 3 is formed on the insulating substrate 2 by etching. That is, first, a metal plate such as a copper plate is bonded on the insulating substrate 2. Then, a resist is applied on the main surface of the metal plate by screen printing or the like. Then, the insulating substrate 2 on which the resist is applied is immersed in an etchant, and portions of the metal plate where the resist is not applied are removed by etching, whereby the terminal portions 3 having a desired pattern are formed on the insulating substrate 2. .

A metal coating 4 is formed on the terminal 3. This metal coating 4 is for improving the solderability, conductivity and abrasion resistance of the terminal portion 3. The metal coating 4 is formed on the terminal 3 by performing electrolytic plating using the terminal 3 as an electrode.

In the electroplating, an aqueous solution of a metal salt serving as an ion source is used as an electrolytic solution, the insulating substrate 2 on which the terminal portions 3 are formed is immersed in the electrolytic solution, and the electrolytic solution is formed using the terminal portions 2 of the printed wiring board 1 as electrodes. In this method, a metal film 4 is deposited on the terminal portion 3 of the printed wiring board 1 by supplying a current to the liquid.

In order to use the terminal portion 3 as an electrode during the electrolytic plating, the terminal portion 3 must be electrically connected to a plating power source. Therefore, this printed wiring board 1 is provided with FIG.
The terminal section 3 and a plating power supply are electrically connected by using a plating jig 5 as shown in FIG.

The plating jig 5 includes a conductive portion 6 for plating,
It has a connection portion 7 for connecting the plating conductive portion 6 to a plating power source, and an insulating support member 8 formed into a shape substantially the same as the shape of the printed wiring board 1. The conductive portion 6 for plating and the connecting portion 7 are made of an insulating support material 8.
It is supported by.

The conductive portion 6 for plating is formed on an insulating support member 8 by using a metal such as copper as a material and in a shape corresponding to the position of the terminal portion 3 on which the metal film 4 is formed on the insulating substrate 2. I have. That is, when the plating jig 5 is overlaid on the printed wiring board 1, the conductive portion 6 for plating comes into contact with a portion of the terminal portion 3 where the metal film 4 is formed, which does not hinder wire mounting. Is formed.

Preferably, a conductive elastic body 9 such as a conductive rubber or an anisotropic conductive film is laminated on the conductive portion 6 for plating. Thus, the conductive portion for plating 6
By laminating the conductive elastic body 9 on the base member, the contact state between the conductive part for plating 6 and the terminal part 3 can be stabilized, and when the conductive part for plating 6 is overlapped on the terminal part 3, The terminal portion 3 can be prevented from being damaged by the conductive portion 6 for plating.

The connection portion 7 is for connecting the conductive portion 6 for plating to a power source for plating. One end of the connecting portion 7 is connected to the conductive portion 6 for plating using a metal such as copper as a material, and the other end is insulated. It is formed on the insulating support member 8 so as to extend near the outer peripheral edge of the member 8.

The connecting portion 7 is connected to an insulating support member 8
Is connected to a plating power source at the other end extending near the outer peripheral edge of. Therefore, the conductive part 6 for plating is electrically connected to the power source for plating via the connection part 7.

The conductive part 6 for plating and the connecting part 7 are, for example,
A metal plate material such as copper is stuck on the insulating support member 8 and etched to form the above-described shape.

The plating jig 5 configured as described above
As shown in FIG. 4, in a state where the connection portion 7 is connected to the plating power source at the other end, the surface on which the plating conductive portion 6 and the connection portion 7 are formed is used as a mating surface, and One terminal portion 3 is overlaid on the main surface on which it is formed. At this time, the terminal portion 3 of the printed wiring board 1 is connected to the plating conductive portion 6 of the plating jig 5. As a result, the terminal portion 3 is connected to the plating conductive portion 6 of the plating jig 5.
And a connection portion 7 to electrically connect to a plating power supply.

The printed wiring board 1 on which the plating jig 5 is superimposed is placed in a liquid tank filled with an electrolytic solution, and a current is supplied to the electrolytic solution from a power supply for plating.
As a result, electrolytic plating is performed using the metal salt in the electrolytic solution as an ion source, and the metal film 4 is deposited on the terminal portion 3 which is electrically connected to the plating power supply and constitutes an electrode.

When the metal film 4 is formed on the terminal 3, the plating jig 5 is removed from the printed wiring board 1.
Then, the printed wiring board 1 in which the metal film 4 is formed on the terminal portion 3 is completed.

Although the present invention has been described with reference to the case where the present invention is applied to the printed wiring board 1 on which the wire bond pads are formed, the present invention is not limited to this. Can be applied to any printed circuit board on which is formed. In this case, the conductive portion for plating 6 is formed in a shape corresponding to the arrangement of the terminal portion 3, and when the jig for plating 5 is overlaid on the printed wiring board 1, the conductive portion for plating 6 and the terminal portion 3 are formed. What is necessary is just to make it connected.

[0030]

According to the method of manufacturing a printed wiring board of the present invention, a conductive portion for plating, a connecting portion for connecting the conductive portion for plating to a power source for plating, and an insulating member for supporting the conductive portion for plating and the connecting portion are provided. By superposing the conductive part for plating of the plating jig having the supporting member on the terminal part of the printed wiring board, the terminal part of the printed wiring board is electrically connected to the power source for plating via the conductive part for plating and the connection part. Since the terminal portion is subjected to electrolytic plating, the terminal portion is connected to a power source without drawing a wiring pattern from the terminal portion formed on the inner side of the insulating substrate to the vicinity of the outer peripheral edge of the insulating substrate. Then, a metal film can be formed on the terminal portion by electrolytic plating.

Further, the plating jig of the present invention comprises a conductive portion for plating, a connecting portion for connecting the conductive portion for plating to a power source for plating, and an insulating support member for supporting the conductive portion for plating and the connecting portion. When a metal film is formed on a terminal portion of a printed wiring board by electrolytic plating, the conductive portion for plating of the plating jig is superimposed on the terminal portion of the printed wiring board to form a printed wiring board. Is connected to a plating power source via a conductive portion for plating and a connection portion, and without drawing out a wiring pattern from a terminal portion formed on the inner side of the insulating substrate to a portion near the outer peripheral edge of the insulating substrate. A metal film can be formed on the terminal portion.

[Brief description of the drawings]

FIG. 1 is a plan view of a printed wiring board on which wire bond pads are formed.

FIG. 2 is an enlarged sectional view of a main part of the printed wiring board.

FIG. 3 is a perspective view of a plating jig according to the present invention.

FIG. 4 is a plan view showing a state where a plating jig is overlaid on a printed wiring board.

[Explanation of symbols]

1 printed wiring board, 2 insulating board, 3 terminals, 4
Metal coating, 5 plating jig, 6 plating conductive part,
7 connection part, 8 insulating support member

Claims (6)

[Claims] In a method of manufacturing a printed wiring board, wherein a terminal portion to which a connection terminal of an electronic component is electrically connected is electroplated, a conductive portion for plating and the conductive portion for plating are connected to a power supply for plating. The connecting portion, the conductive portion for plating of the plating jig including the conductive portion for plating and the insulating support member for supporting the connecting portion are superimposed on the terminal portion of the printed wiring board, and the terminal portion of the printed wiring board is placed on the printed wiring board. A method for manufacturing a printed wiring board, comprising connecting a plating power source through a plating conductive portion and a connection portion of a plating jig, and subjecting the terminal portion to electrolytic plating. 2. The printed wiring according to claim 2, wherein the conductive portion for plating and the connecting portion are formed by etching a metal plate bonded on a main surface of the insulating support member. Substrate manufacturing method. 3. The method for manufacturing a printed wiring board according to claim 2, wherein the conductive portion for plating is formed by laminating a conductive elastic body on a metal plate. 4. A conductive part for plating, comprising: a connecting part for connecting the conductive part for plating to a power source for plating; and an insulating support member for supporting the conductive part for plating and the connecting part. A jig for plating, wherein the terminal of the printed wiring board is connected to a plating power source via the conductive part for plating and the connection part by superimposing the terminal part on the terminal part of the printed wiring board. 5. The plating conductive part according to claim 4, wherein the conductive part and the connecting part for plating are formed by etching a metal plate bonded on a main surface of the insulating support member. jig. 6. The plating jig according to claim 5, wherein a conductive elastic body is laminated on the conductive portion for plating.