JPH04110491A - Circuit board - Google Patents

Abstract

PURPOSE:To enable partial plating of plural parts by a simple process by bringing probe pins into contact with the separate parts to be plated and carrying out electroplating. CONSTITUTION:An electrically conductive pattern 3, 4A-4L is formed on a board 2 with a prescribed electrically conductive layer. Probe pins 37 are brought into contact with all the land parts 4A-4D and 4I-4L among the land parts 4A-4L by prescribed pressing force except the small land parts 4E-4H connected to the land parts 4A-4D through the circuit pattern 3. The board 2 and an anode 43 connected to the positive electrode side of a power source for plating through an electrically conductive wire 45 are immersed in a plating soln. 47 and electroplating is carried out. Plating layers 9 can be formed on the desired land parts 4A-4L.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a wiring board, and is particularly suitable for application to a wiring board in which a portion of a wiring pattern is partially plated.

B. Summary of the Invention The present invention provides partial plating at multiple locations on a wiring board through a very simple processing process by bringing probe pins into contact with each unit to be plated and performing electroplating. I can do it.

C. Prior Art Conventionally, as iron-based wiring boards for small motors, copper-clad laminates have been etched to form predetermined wiring patterns and land portions made of copper foil on the surface thereof.

The durability of this wiring board is further improved by applying anti-rust treatment to the surface of the land portion formed on the surface.

D Problems to be Solved by the Invention However, it is difficult to establish electrical continuity simply by contacting the leads of electronic components in the lands formed by applying anti-corrosion treatment to the surface of the copper foil. It was difficult to use it as a land for IC wire bonding.

As one method for solving this problem, a method has been considered in which the land portions are partially plated using a shorting wire 5, as shown in FIG.

That is, as shown in FIG. 4, by etching the copper-clad laminate, wiring patterns 3 and land portions 4A to 4L made of copper foil are formed on the surface of the substrate 2.
), of which the parts to be plated (land parts 4A to 4
A plating resist 7 is applied to the parts other than L) (FIG. 4(B)).

Here, all of the wiring patterns 3 formed on the substrate 2 are connected by shorting wires 5 (FIG. 4(A)), so that only one of the land portions 4A to 4L is used for plating. By setting up the probe pins, immersing the entire board in the plating solution, and performing the plating process, all of the land parts 4A to 4L to which the plating resist 7 is not applied can be plated, thereby forming the plating layer 9. (Figure 4(C)).

Therefore, it is considered that by removing the plating resist 7 applied on the substrate 2, it is possible to perform plating only on the necessary portions (land portions 4A to 4L) of the 61i4fg pattern (Fig. 4(D)). ).

However, in the state shown in FIG. 4(D), all the wiring patterns 3 are connected by shorting lines 5 formed as a part of the wiring patterns 3, and etching treatment is used as a method for removing these shorting lines 5. It was necessary to apply.

That is, as shown in FIG. 4(E), the short circuit line 5 to be removed
By applying a resist 13 to the entire surface of the substrate other than the portion 12 (FIG. 4(D)) and removing the resist after etching, each short circuit is removed as shown in FIG. 4(F). Part of the line 5 is removed to make the wiring patterns 3 independent.

A desired wiring board 10 is thus obtained by applying solder resist 15 to the entire surface of the board 2 other than the plated lands 4A to 4L.

If the shorting line 5 is formed in this way and then plating is performed, there is a problem that the manufacturing process of the wiring board 10 becomes complicated due to the need for an etching process to remove the shorting line 5. However, there were still insufficient issues.

The present invention has been made in consideration of the above points, and it is an object of the present invention to propose a wiring board that can perform partial plating on a plurality of desired parts using a much simpler method.

8 Means for Solving the Problems In order to solve the problems, in the present invention, conductive patterns 3.4A to 4L are formed on the substrate 2 by a predetermined conductive layer, and a part of the conductive patterns 3.4A to 4L is In the wiring board 20 configured to be plated, a plating unit unit consisting of a plurality of plating parts 4A to 4D and 4E to 4H connected by a conductive pattern 3 and one independent plating part One probe pin 3 for each unit to be plated consisting of 41 to 4L.
7 are brought into contact with each other and electroplating is performed to form a plurality of partial plating parts 9.

F action Plural plating processing parts 4A and 4F (or 4B and 4E
or 4C and 4G or 4D and 4H), and one independent plating processing unit 41
By performing electroplating by contacting the probe pins 37 with the probe pins 37 for each of ~4L, the plating can be performed using the shorting wire 5 (FIG. 4). Since the etching process for removing the shorting wire 5 is not performed, the plurality of parts 4A to 4 are formed by a simple process of -stage.
L partial plating treatment can be performed.

G example An embodiment of the present invention will be described in detail below with reference to the drawings.

Fig. 1 shows the wiring board according to the present invention, with the same reference numerals attached to the corresponding parts as in Fig. 4! 20, the wiring pattern 3 made of copper foil and the land portions 4A to 4L are formed by etching the surface of the substrate 2 formed by forming the insulating layer 2B on the surface of the base material 2A. (Fig. 1(A)).

When plating the land portions 4A to 4L, the solder resist 15 must be applied to the entire surface of the board other than the land portions 4A to 4L (Fig. 1 (B) and (C)). Probe pins are brought into contact with 4D and 4I to 4L to perform plating.

At this time, the small land parts 4E, 4F, 4G, and 4H for IC wire bonding are connected to the land parts 4A, 4B, 4C, and 4D by the wiring pattern 3, so that there is no need to contact the probe pins. , if the plating solution is in contact with the surface, this part 4E
Plating treatment can also be performed in ~4H.

Here, as a plating method, a plating bag W30 shown in FIG. 2 is used.

That is, in the plating processing apparatus 30, a substrate fixing device 33 is provided inside a liquid tank 32.

This substrate fixing device 33 includes a fixing plate 34 configured to fix the substrate 2, and a probe pin holding member 36 provided on the fixing plate 34 at a predetermined interval.

The probe pin holding member 36 holds a plurality of probe pins 37 whose surfaces are coated with Teflon, and the ends of the probe pins 37 are connected to the negative electrode side of a power source (not shown) by a conductive wire 42. The whole forms a cathode electrode.

As shown in an enlarged view in FIG. 3, the probe pin 37 is held via a spring 39 by a cylindrical engagement member 38 that is held and fixed to the probe pin holding member 36. After contacting the land portion 4A formed on the probe pin holding member 36 and the engagement member 38
By biasing the probe pin 37 in the direction shown by arrow a, a spring 39 is applied between the tip 37A of the probe pin 37 and the land 4A.
A predetermined pressing force is obtained by

Land portions 4A to 4 formed on the substrate 2 in this way
Probe pins 3 are connected to all the land parts 4A to 4D and 4I to 4L except for the small land parts 4E to 4H which are connected to the land parts 4A to 4D via the wiring pattern 3.
7 are brought into contact with each other with a predetermined pressing force, and immersed in the plating solution 47 together with the anode electrode 43 connected to the positive electrode side of the plating power source via the conductive wire 45 to perform electrolytic plating treatment. Figure 1 (D) and (E
), a plating layer 9 can be formed on the surface of the desired land portions 4A to 4L.

Incidentally, by performing the plating process in this manner, the plating process can be performed on the land parts 4A to 4D and the minute land parts 4E to 4 connected by the wiring pattern 3 through a simple process. 4E~
By using 4H for wire bonding of the IC and bringing the leads of a predetermined electronic component into contact with the land portions 4A to 4D, the electronic component and the IC can be electrically connected.

According to the above configuration, by partially plating a plurality of locations using a plurality of probe pins 37, a plurality of land portions 4A are formed without forming a short circuit line 5 (FIG. 4) as in the conventional method. The plating layer 9 can be formed on ~4L.

In this way, partial plating can be applied to a plurality of locations by a very simple method.

Incidentally, the land portion 4A (
or 4B, 4C14D) and land portion 4F (or 4E,
4G, 4H), one land portion 4F (or 4E, 4G, 4H) can be plated.
H) is used for RC wire bonding, and the other land part 4A (or 4B, 4C14D) is used as a land part for contacting the leads of electronic components, etc. These land parts are connected by the wiring pattern 3. 4A (or 4B, 4C, 4D) and 4F giant (or 4E, 4G, 4H) can be used for different purposes, thereby allowing the wiring board 20 to be used in common.

In the above embodiment, the present invention is applied to the wiring board 20 having the wiring pattern 3 made of copper foil and the land portions 4A to 4L, but the present invention is not limited to this. The present invention can be widely applied to wiring boards using various other conductive materials as parts.

Furthermore, in the above-described embodiments, a case has been described in which the present invention is applied to a wiring board for a small motor, but the present invention is not limited to this, but can be widely applied to wiring boards for various other electronic devices. .

[Brief explanation of the drawing]

Fig. 1 is a plan view showing the process of plating a wiring board according to the present invention, Fig. 2 is a route diagram showing the plating equipment, Fig. 3 is a partially enlarged view showing the detailed structure of the probe pin, and Fig. 4 is FIG. 3 is a plan view showing a plating process when a short-circuit wire is used. 2...Substrate, 2A...Base material, 2B...
...Insulating layer, 3...Wiring batten, 4A
~4 L... Land portion, 5... Short circuit line, 9... Plating layer, 10.20... Wiring board, 15...・Solder resist.

Claims (1)

[Claims] A conductive pattern is formed on a substrate by a predetermined conductive layer,
In a wiring board in which a part of the conductive pattern is plated, a unit part to be plated consisting of a plurality of parts to be plated connected by the conductive pattern and an independent part to be plated 1. A wiring board characterized in that a plurality of partial plating parts are formed by performing electroplating by bringing one probe pin into contact with each unit part to be plated, which is a processing part.