JP3896611B2 - Wiring circuit board having inspection electrode and method for forming the same - Google Patents

Wiring circuit board having inspection electrode and method for forming the same Download PDF

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Publication number
JP3896611B2
JP3896611B2 JP23755796A JP23755796A JP3896611B2 JP 3896611 B2 JP3896611 B2 JP 3896611B2 JP 23755796 A JP23755796 A JP 23755796A JP 23755796 A JP23755796 A JP 23755796A JP 3896611 B2 JP3896611 B2 JP 3896611B2
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Prior art keywords
electrode
circuit board
inspection
forming
insulating resin
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JPH1082799A (en
Inventor
達広 岡野
雅則 松山
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Toppan Inc
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Toppan Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体装置あるいは配線回路基板の導通検査をするために用いられる検査治具基板に関する。
【０００２】
【従来の技術】
従来、半導体装置や配線回路基板の導通検査には、ウェハプローブや布線検査で知られるように被検査体の電極部に針状の検査電極を接触させ導通テストを行っていた。また、比較的配線密度の低い配線回路基板では電極を有する検査用の配線回路基板を形成し、異方性導電シートを介して被検査体である配線回路基板との接触を採り、導通テストを行っている。
【０００３】
【発明が解決しようとする課題】
従来のウェハプローブや布線検査による半導体装置や配線回路基板の導通検査の方法では、針状の検査電極を接触させるため、被検査体に検査痕を残し重大な損傷を与える可能性がある。また、配線密度の増加や高集積化によっては、検査用のプローブの形成が困難になってきた。検査基板を用いる方法では、異方性導電シートの導通ピッチの関係などから２００μｍピッチ程度の被検査体には対応できるが、それ以上の微細ピッチの検査には対応することが困難である。
本発明は上記問題を解決するためになされたもので、微細ピッチの検査に対応した検査電極の構造及び形成法を改良した検査電極を有する配線回路基板及びその形成法を提供する。
【０００４】
【課題を解決するための手段】
本発明において上記課題を解決するため、第１の形態において、絶縁樹脂層と導体層を積み重ねた構造を有する配線回路基板の電極及び配線回路に接続された検査電極であって、該検査電極の形状が先端にいくほど表面積が大きくなっており、且つ先端部が平坦になっていることを特徴とする検査電極を有する配線回路基板としたものである。
上記の検査電極構造を採ることによって今まで対応することが出来なかった微細ピッチにも対応することができ、さらに電極先端部を平坦にしたことで、検査時の被検査体への損傷を防止することができる。
また、回線回路基板を絶縁樹脂層と導体層を積み重ねた構造とするため、被検査体と電極の接触時に被検査体の凹凸を吸収することができる。
【０００５】
また、請求項１においては、以下の一連の工程からなる検査電極を有する配線回路基板
の製造方法としたものである。
（ａ）配線回路基板上に絶縁樹脂層を形成する工程。
（ｂ）前記絶縁樹脂層上にめっきレジスト層を形成する工程。
（ｃ）前記絶縁樹脂層及びめっきレジスト層にレーザ加工によって開口部を形成する工程。
（ｄ）前記開口部に導体電極を形成する工程。
（ｅ）前記導体電極の前記めっきレジスト層表面からはみ出した部分を除去して前記導体電極の先端部を平坦化する工程。
（ｆ）めっきレジスト層を除去して前記導体電極を検査電極とする工程。
【０００６】
【発明の実施の形態】
本発明の検査電極を有する配線回路基板は、上層に電極及び配線回路（１１ａ、１１ｂ、１１ｃ、１１ｄ）が形成された配線回路基板１０上に絶縁樹脂層１２を形成した後、さらにめっきレジスト層１３を形成し、めっきレジスト層１３及び絶縁樹脂層１２にレーザ加工によって開口部１４を形成する。この開口部１４に電解めっきによって導体電極１５を形成する。その後めっきレジスト層表面からはみ出した導体電極部分を除去し、先端部が平坦な導体電極１５ａを形成する。さらに、導体電極１５ａの先端部に金めっき層を形成して、めっきレジスト層１３ａを除去することにより配線回路基板１０上に検査電極１６を形成するものである。
以下、本発明の検査電極を有する配線回路基板の形成方法について述べる。（図１参照）。
【０００７】
上層に電極及び配線回路（１１ａ、１１ｂ、１１ｃ、１１ｄ）が形成された配線回路基板１０は、一般的に用いられている多層のプリント配線回路基板を用いることができる（図１（ａ）参照）。また、被検査基板と電極の接触時に被検査体の凹凸を吸収するためには、最近見かけられる一般的に用いられているプリント配線回路基板上に絶縁樹脂層と導体層を積み重ねた構造を有するビルドアップ基板を用いることが望ましい。さらにビルドアップに用いる絶縁樹脂層に柔軟性を持たせることにより、検査電極が被検査体に接触したときの吸収性は向上する。具体的には絶縁樹脂にゴムフィラーを入れたものを使用することで改善される。
【０００８】
配線回路基板１０上に絶縁樹脂層１２を形成する。絶縁樹脂には熱硬化型のエポキシ樹脂やポリイミド樹脂を使用することができる。この絶縁樹脂層１２には特に柔軟性は必要としないが、後の工程でレーザ加工によって開口部を形成するため、無機フィラーを含まないものが望ましい。しかし、無機フィラーの大きさが５μｍ程度で、含有量が１０% 程度であれば問題はない。絶縁樹脂層を形成した後、さらに絶縁樹脂層１２上にめっきレジスト層１３を形成する（図１（ｂ）参照）。このめっきレジスト層１３には特に感光性を必要としないため、幅広い材質選択が可能である。
【０００９】
次に、めっきレジスト層１３及び絶縁樹脂層１２にレーザ加工によりテーパーを有する開口部１４を形成する（図１（ｃ）参照）。ここで、開口部１４の形状は後工程の検査電極の形状に反映されるので、検査電極の形状によって加工法及び加工条件を設定する。ここで用いるレーザ加工は、エキシマレーザ加工あるいは短パルスの炭酸ガスレーザ加工などが使用できるが、特にこれらに限定されるものではない。また、これらのレーザ加工は形成する電極の大きさによって選択することが望ましい。電極径が１００〜２００μｍの場合には炭酸ガスレーザ加工が良いが、１００μｍ以下の場合にはエキシマレーザ加工が適している。レーザ加工を用いた場合には、光学系にマスクを入れることにより様々な形状の開口部１４を形成できるため、これによって電極形状を選択することが出来る。
【００１０】
次に、開口部１４に導体電極１５を形成する（図１（ｄ）参照）。導体電極１５の形成法としては電解めっき法、無電解めっき法、導電ペーストを使った印刷法または注入法があるが、導体電極１５の形状再現性、配線回路基板との電気的導通信頼性等により適宜選択して使い分けることができ、特に制限されるものではない。ここでは、形状再現性及び導通信頼性に優れた電解めっき法にて導体電極１５を形成する。
【００１１】
次に、めっきレジスト層１３ａ表面部からはみ出した導体電極部分を除去し、先端が平坦化処理された導体電極１５ａを形成する（図１（ｅ）参照）。具体的には表面研磨によって削り取る方法が適している。
【００１２】
次に、先端部が平坦化処理された導体電極１５ａの表面に、電解金めっきによって金めっき層（特に図示せず）を形成する。この金めっき層を形成することで被検査体との接触抵抗を大幅に低減することができる。
【００１３】
次に、めっきレジスト層１３ａを除去して、配線回路基板１０上に検査電極１６を形成する（図１（ｆ）参照）。めっきレジスト層１３の除去は使用する各レジスト層によって異なり、各めっきレジスト層の適正条件で行う。
これらの工程によって、本発明の検査電極を有する配線回路基板を形成することができる。
【００１４】
【実施例】
以下、実施例について図１（ａ）〜（ｆ）を用いて詳細に説明する。
【００１５】
０．４ｍｍ厚の両面銅箔付きガラスエポキシ積層板に片面２層のビルドアップ配線を行って、最上層に電極及び配線回路（１１ａ、１１ｂ、１１ｃ、１１ｄ）を形成した配線回路基板１０を作製した（図１（ａ）参照）。
【００１６】
次に、配線回路基板１０上に熱硬化型エポキシ樹脂をスクリーン印刷し、加熱硬化して２５μｍ厚の絶縁樹脂層１２を形成した。さらに絶縁樹脂層１２上に４０μｍ厚のドライフィルムレジスト（ＤＦＲ：日立化成工業( 株) 製）をラミネートして、めっきレジスト層１３を形成した（図１（ｂ）参照）。
【００１７】
次に、めっきレジスト層１３及び樹脂絶縁層１２にエキシマレーザ加工を用いて表面径５０μｍφのテーパーを有する開口部１４を形成した（図１（ｃ）参照）。
ここで、開口部１４は、後工程で形成される導体電極が確実に電気的接続が行えるように、配線回路基板１０上の電極及び配線回路（１１ａ、１１ｂ、１１ｃ、１１ｄ）に位置合わせして形成した。
エキシマレーザ加工の条件は、エネルギ密度１．０Ｊ／ｃｍ2 であった。
【００１８】
次に、配線回路基板１０の上層に形成された電極及び配線回路（１１ａ、１１ｂ、１１ｃ、１１ｄ）をめっき電極にして電解銅めっき（電解銅めっき浴：硫酸銅２０ｇ／ｌ、硫酸７０ｇ／ｌ、塩酸５０ｐｐｍ、電流密度２Ａ／ｄｍ2 ）を行い、開口部１４に導体電極１５を形成した（図１（ｄ）参照）。
【００１９】
次に、めっきレジスト層１３ａ表面部からはみ出した導体電極１５の先端部分を除去して、先端部が平坦化処理された導体電極１５ａを形成した（図１（ｅ）参照）。
導体電極１５の先端部の除去は研磨機を用いて、表面研磨によって削り取った。
【００２０】
次に、先端部が平坦化処理された導体電極１５ａの先端部に、電解金めっきによって金めっき層（特に図示せず）を形成した。金めっき層の厚さは１〜５μｍとした。
【００２１】
次に、５% の水酸化ナトリウム溶液に基板を浸せきし、めっきレジスト層１３ａを除去し、配線回路基板１０上に検査電極１６を形成した（図１（ｆ）参照）。
これらの工程によって本発明の検査電極を有する配線基板を形成することができた。
【００２２】
【発明の効果】
本発明の検査電極を有する配線回路基板は、検査電極形状が電極先端部に向かって表面積の大きい形状を有しているため、被検査体の接触電極との位置ズレが緩和される。さらに、本発明の検査電極の形成法は、微細ピッチの電極の形成が可能であり、めっきレジスト層の厚みを変えることによって電極高さの制御が容易になり、且つ、電極高さにバラツキを生じないため検査精度及び接触信頼性を上げることができる。
また、検査電極形状も比較的自由に設定できるため、従来よりも基板設計の自由度を向上することができる。
【図面の簡単な説明】
【図１】（ａ）〜（ｆ）は、本発明の検査電極を有する配線回路基板の構成及び製造工程を示す部分断面図である。
【符号の説明】
１０……配線回路基板
１１ａ、１１ｂ、１１ｃ、１１ｄ……電極及び配線回路
１２……絶縁樹脂層
１２ａ……開口部が形成された絶縁樹脂層
１３……めっきレジスト層
１３ａ……開口部が形成されためっきレジスト層
１４……開口部
１５……導体電極
１５ａ……平坦化処理された導体電極
１６……検査電極[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an inspection jig substrate used for inspecting the continuity of a semiconductor device or a printed circuit board.
[0002]
[Prior art]
Conventionally, in a continuity test of a semiconductor device or a printed circuit board, a needle-like test electrode is brought into contact with an electrode portion of an object to be inspected as is known from a wafer probe or a wiring test, and a continuity test is performed. In addition, a wiring circuit board for inspection having electrodes is formed on a wiring circuit board having a relatively low wiring density, and contact with the wiring circuit board, which is an object to be inspected, is conducted through an anisotropic conductive sheet to conduct a continuity test. Is going.
[0003]
[Problems to be solved by the invention]
In the conventional method of conducting a continuity inspection of a semiconductor device or a printed circuit board by a wafer probe or a wiring inspection, since a needle-shaped inspection electrode is brought into contact, there is a possibility that an inspection mark is left on an object to be inspected and serious damage is caused. In addition, it has become difficult to form a probe for inspection due to an increase in wiring density and high integration. The method using the inspection substrate can cope with an object to be inspected with a pitch of about 200 μm because of the relationship of the conduction pitch of the anisotropic conductive sheet, but it is difficult to cope with the inspection of fine pitch beyond that.
The present invention has been made to solve the above problems, and provides a printed circuit board having a test electrode improved in the structure and method of forming a test electrode corresponding to a fine pitch test, and a method for forming the same.
[0004]
[Means for Solving the Problems]
In order to solve the above problems in the present invention, in the first embodiment, an electrode of a printed circuit board having a structure in which an insulating resin layer and a conductor layer are stacked and a test electrode connected to the wiring circuit, A printed circuit board having a test electrode is characterized in that the surface area increases with increasing shape toward the tip and the tip is flat.
By adopting the above inspection electrode structure, it is possible to cope with fine pitches that could not be dealt with until now, and further flattening the tip of the electrode prevents damage to the inspected object during inspection can do.
In addition, since the circuit circuit board has a structure in which the insulating resin layer and the conductor layer are stacked, the unevenness of the object to be inspected can be absorbed when the object to be inspected contacts the electrode.
[0005]
Further, in the claim 1, in which the method of manufacturing a printed circuit board having testing electrodes made of the following sequence of steps.
(A) A step of forming an insulating resin layer on the printed circuit board.
(B) A step of forming a plating resist layer on the insulating resin layer.
(C) A step of forming openings in the insulating resin layer and the plating resist layer by laser processing.
(D) A step of forming a conductor electrode in the opening.
(E) The process of removing the part which protruded from the said plating resist layer surface of the said conductor electrode, and planarizing the front-end | tip part of the said conductor electrode.
(F) A step of removing the plating resist layer and using the conductor electrode as an inspection electrode.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
In the printed circuit board having the inspection electrode of the present invention, the insulating resin layer 12 is formed on the printed circuit board 10 on which the electrodes and the printed circuits (11a, 11b, 11c, 11d) are formed, and then a plating resist layer is formed. 13 is formed, and openings 14 are formed in the plating resist layer 13 and the insulating resin layer 12 by laser processing. A conductor electrode 15 is formed in the opening 14 by electrolytic plating. Thereafter, the conductor electrode portion protruding from the surface of the plating resist layer is removed to form a conductor electrode 15a having a flat tip. Furthermore, a gold plating layer is formed on the tip of the conductor electrode 15a, and the plating resist layer 13a is removed to form the inspection electrode 16 on the printed circuit board 10.
Hereinafter, a method for forming a printed circuit board having the inspection electrode of the present invention will be described. (See FIG. 1).
[0007]
A generally used multilayer printed wiring circuit board can be used as the wiring circuit board 10 on which electrodes and wiring circuits (11a, 11b, 11c, and 11d) are formed in the upper layer (see FIG. 1A). ). Further, in order to absorb the unevenness of the object to be inspected when the substrate to be inspected and the electrode are in contact with each other, it has a structure in which an insulating resin layer and a conductor layer are stacked on a commonly used printed wiring circuit board that is recently seen It is desirable to use a build-up substrate. Further, by providing flexibility to the insulating resin layer used for build-up, the absorbability when the inspection electrode contacts the object to be inspected is improved. Specifically, it can be improved by using an insulating resin containing a rubber filler.
[0008]
An insulating resin layer 12 is formed on the printed circuit board 10. As the insulating resin, a thermosetting epoxy resin or polyimide resin can be used. The insulating resin layer 12 does not require flexibility, but it is preferable that the insulating resin layer 12 does not contain an inorganic filler because an opening is formed by laser processing in a later step. However, there is no problem if the size of the inorganic filler is about 5 μm and the content is about 10%. After forming the insulating resin layer, a plating resist layer 13 is further formed on the insulating resin layer 12 (see FIG. 1B). Since the plating resist layer 13 does not require photosensitivity, a wide variety of materials can be selected.
[0009]
Next, an opening 14 having a taper is formed in the plating resist layer 13 and the insulating resin layer 12 by laser processing (see FIG. 1C). Here, since the shape of the opening 14 is reflected in the shape of the inspection electrode in the subsequent process, the processing method and processing conditions are set according to the shape of the inspection electrode. The laser processing used here may be excimer laser processing or short pulse carbon dioxide laser processing, but is not particularly limited thereto. Further, it is desirable to select the laser processing depending on the size of the electrode to be formed. Carbon dioxide laser processing is good when the electrode diameter is 100 to 200 μm, but excimer laser processing is suitable when the electrode diameter is 100 μm or less. When laser processing is used, the openings 14 having various shapes can be formed by putting a mask in the optical system, so that the electrode shape can be selected.
[0010]
Next, the conductor electrode 15 is formed in the opening 14 (see FIG. 1D). The method for forming the conductor electrode 15 includes an electroplating method, an electroless plating method, a printing method using a conductive paste, or an injection method. The shape reproducibility of the conductor electrode 15 and the reliability of electrical continuity with the printed circuit board, etc. Can be appropriately selected and used properly, and is not particularly limited. Here, the conductor electrode 15 is formed by an electrolytic plating method excellent in shape reproducibility and conduction reliability.
[0011]
Next, the conductor electrode portion protruding from the surface portion of the plating resist layer 13a is removed to form a conductor electrode 15a whose tip is flattened (see FIG. 1E). Specifically, a method of scraping by surface polishing is suitable.
[0012]
Next, a gold plating layer (not specifically shown) is formed on the surface of the conductor electrode 15a whose tip has been flattened by electrolytic gold plating. By forming this gold plating layer, the contact resistance with the object to be inspected can be greatly reduced.
[0013]
Next, the plating resist layer 13a is removed, and the inspection electrode 16 is formed on the printed circuit board 10 (see FIG. 1 (f)). The removal of the plating resist layer 13 varies depending on each resist layer to be used, and is performed under appropriate conditions for each plating resist layer.
By these steps, a printed circuit board having the inspection electrode of the present invention can be formed.
[0014]
【Example】
Hereinafter, an Example is described in detail using Fig.1 (a)-(f).
[0015]
Two-layer build-up wiring is performed on a glass epoxy laminate with double-sided copper foil having a thickness of 0.4 mm to produce a wiring circuit board 10 in which electrodes and wiring circuits (11a, 11b, 11c, 11d) are formed on the uppermost layer. (See FIG. 1 (a)).
[0016]
Next, a thermosetting epoxy resin was screen-printed on the printed circuit board 10 and heat cured to form an insulating resin layer 12 having a thickness of 25 μm. Furthermore, a dry film resist (DFR: manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 40 μm was laminated on the insulating resin layer 12 to form a plating resist layer 13 (see FIG. 1B).
[0017]
Next, an opening 14 having a taper with a surface diameter of 50 μmφ was formed in the plating resist layer 13 and the resin insulating layer 12 using excimer laser processing (see FIG. 1C).
Here, the openings 14 are aligned with the electrodes and the wiring circuits (11a, 11b, 11c, 11d) on the wiring circuit board 10 so that the conductor electrodes formed in the subsequent process can be securely connected. Formed.
Excimer laser processing conditions were an energy density of 1.0 J / cm 2 .
[0018]
Next, electrolytic copper plating (electrolytic copper plating bath: copper sulfate 20 g / l, sulfuric acid 70 g / l, and electrodes and wiring circuits (11 a, 11 b, 11 c, 11 d) formed in the upper layer of the printed circuit board 10 are used as plating electrodes. Hydrochloric acid 50 ppm, current density 2 A / dm 2 ), and conductor electrode 15 was formed in opening 14 (see FIG. 1D).
[0019]
Next, the tip portion of the conductor electrode 15 protruding from the surface portion of the plating resist layer 13a was removed to form a conductor electrode 15a whose tip portion was flattened (see FIG. 1E).
The removal of the tip of the conductor electrode 15 was carried out by surface polishing using a polishing machine.
[0020]
Next, a gold plating layer (not particularly shown) was formed by electrolytic gold plating on the tip of the conductor electrode 15a whose tip was flattened. The thickness of the gold plating layer was 1 to 5 μm.
[0021]
Next, the substrate was immersed in a 5% sodium hydroxide solution, the plating resist layer 13a was removed, and the inspection electrode 16 was formed on the printed circuit board 10 (see FIG. 1 (f)).
By these steps, a wiring board having the inspection electrode of the present invention could be formed.
[0022]
【The invention's effect】
The printed circuit board having the inspection electrode of the present invention has a shape in which the inspection electrode has a large surface area toward the tip of the electrode, so that the displacement of the inspection object from the contact electrode is alleviated. Furthermore, the inspection electrode forming method of the present invention can form electrodes with a fine pitch, and the electrode height can be easily controlled by changing the thickness of the plating resist layer, and the electrode height varies. Since it does not occur, inspection accuracy and contact reliability can be improved.
Further, since the shape of the inspection electrode can be set relatively freely, the degree of freedom in designing the substrate can be improved as compared with the conventional case.
[Brief description of the drawings]
FIGS. 1A to 1F are partial cross-sectional views showing a configuration and a manufacturing process of a printed circuit board having a test electrode according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Wiring circuit board 11a, 11b, 11c, 11d ... Electrode and wiring circuit 12 ... Insulating resin layer 12a ... Insulating resin layer 13 with opening formed ... Plating resist layer 13a ... With opening formed Plated resist layer 14 ... opening 15 ... conductor electrode 15a ... planarized conductor electrode 16 ... inspection electrode

Claims (1)

下記の一連の工程からなる検査電極を有する配線回路基板の製造方法。
（ａ）配線回路基板上に絶縁樹脂層を形成する工程。
（ｂ）前記絶縁樹脂層上にめっきレジスト層を形成する工程。
（ｃ）前記絶縁樹脂層及びめっきレジスト層にレーザ加工によって開口部を形成する工程。
（ｄ）前記開口部に導体電極を形成する工程。
（ｅ）前記導体電極の前記めっきレジスト層表面からはみ出した部分を除去して前記導体電極の先端部を平坦化する工程。
（ｆ）めっきレジスト層を除去して前記導体電極を検査電極とする工程。A method for manufacturing a printed circuit board having an inspection electrode comprising the following series of steps.
(A) A step of forming an insulating resin layer on the printed circuit board.
(B) A step of forming a plating resist layer on the insulating resin layer.
(C) A step of forming openings in the insulating resin layer and the plating resist layer by laser processing.
(D) A step of forming a conductor electrode in the opening.
(E) The process of removing the part which protruded from the said plating resist layer surface of the said conductor electrode, and planarizing the front-end | tip part of the said conductor electrode.
(F) A step of removing the plating resist layer and using the conductor electrode as an inspection electrode.
JP23755796A 1996-09-09 1996-09-09 Wiring circuit board having inspection electrode and method for forming the same Expired - Fee Related JP3896611B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23755796A JP3896611B2 (en) 1996-09-09 1996-09-09 Wiring circuit board having inspection electrode and method for forming the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23755796A JP3896611B2 (en) 1996-09-09 1996-09-09 Wiring circuit board having inspection electrode and method for forming the same

Publications (2)

Publication Number Publication Date
JPH1082799A JPH1082799A (en) 1998-03-31
JP3896611B2 true JP3896611B2 (en) 2007-03-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Also Published As

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