JP2002314255A - Printed wiring board and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which a bump group can be formed without facilities for printing, etc., for forming the conductive bump group, and which has simultaneously a high smoothness; and to provide its manufacturing method. SOLUTION: An insulating material corresponding to a part of a wiring pattern of an insulated material layer 12 formed on a metal plate 11 is removed to form a groove, and a metal is separated in this groove to form a first wiring body contained metal plate 15 in which a wiring body 14 and an insulator 12a form one layer. Conductive bumps 5, 5,... are formed on the wiring body 14, and second wiring body contained metal plates 25 same with the first wiring body contained metal plate 15 are disposed opposite to each other and pressed to obtain a core material intermediate body 30. A masking 7 is formed in the metal plates 11, 21 of the core material intermediate body 30, and metal bumps 33, 34 are formed by etching. An insulated resin layer and a metal layer are formed thereon to manufacture the multilayer printed wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board, and more particularly to a so-called through-conductor type multilayer printed wiring board in which wiring layers are connected by a through-type conductive wiring portion, and a method of manufacturing the same. .

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a multilayer board, a substantially conical conductive bump is press-fitted in the thickness direction of an insulating substrate to electrically connect two wiring patterns formed on both surfaces of the insulating substrate. The so-called conductor-to-conductor method is known.
FIG. 12 is a vertical sectional view schematically showing a manufacturing process of a conventional typical conductor penetration method. In this conductor penetration method, first, an insulating substrate on which a copper foil and a wiring layer are formed, as shown in FIG.
(A), a printing mask (not shown) having, for example, a plurality of through-holes is superimposed on the conductive plate 101, and the conductive composition such as silver paste is squeezed from above the printing mask while squeezing. The holes are filled, and then the printing mask and the conductive plate are peeled off to form the substantially conical conductive bump groups 102, 102,.... Next, for example, an insulating material plate precursor 103 obtained by impregnating a glass fiber mat with an epoxy resin is laminated, pressed and penetrated, and a copper foil 104 is laminated thereon and etched to form wiring patterns 104a and 101a. Formed and core material 11
0 is formed.

[0003] On the other hand, FIG.
A bumped copper foil 120 and 140 similar to (c) are prepared, and an insulating material plate similar to the insulating material plate precursor 103 is provided between the core material 110 and the bumped copper foils 120 and 140. Precursors 130 and 150 are shown in FIG.
Set as shown in (f). Then press and figure 1
2 (g), a wiring pattern is formed by etching the outermost copper foil of the multilayer body 160, and a multilayer printed wiring board as shown in FIG. 12 (h). 170 is obtained.

[0004]

When a conductor bump group is formed on an insulating substrate having such a wiring layer formed thereon,
A printing mask or the like for forming the conductor bump group is required. In addition, since the height of the conductive bump group formed of the conductive composition material varies, the interlayer connection may be defective. Furthermore, since the composition differs from that of the wiring layer, cracks may occur between the compositions due to thermal factors. Also, in the multilayering process, a wiring layer is required to have a wide layer corresponding to the thickness of the wiring layer in order to make the wiring layers adhere to each other with the insulating insulating material plate precursor interposed therebetween, and at the same time, the substrate smoothness is affected. There is a problem that it becomes an obstacle to the manufacture of a high multilayer printed wiring board. Also, in the printing method, technically 0.15mm
The bump diameter is considered to be the minimum of the bumps that can be formed, and the bumps with a diameter smaller than this cannot be formed, and the height of the conductor bumps formed by the printing method varies, so the reliability of interlayer connection is insufficient. There is a problem that is.

The present invention has been made to solve the above-mentioned conventional problems. That is, an object of the present invention is to provide a multilayer printed wiring board having high smoothness and a method for manufacturing the same.

[0006]

According to the present invention, there is provided a method of manufacturing a printed wiring board, comprising the steps of: forming an insulating material layer on a metal plate; and removing the insulating material from a portion of the insulating layer corresponding to a wiring pattern. Forming a groove along the wiring pattern; forming a wiring body by depositing a metal in the groove;
A step of obtaining a metal plate with a wiring body, a step of forming a substantially conical conductor bump on the wiring body of the first metal plate with a wiring body, and a step of superposing an insulating material plate precursor on the tip of the conductor bump Pressing, the step of penetrating the conductor bumps through the insulating material plate precursor, and the step of arranging the wiring body of the second wiring body-attached metal plate at the tip of the conductor bump penetrating the insulating material plate precursor, Pressing the metal plate with the first wiring body and the metal plate with the second wiring body to form a core material with a metal plate in which the conductor bumps and the wiring body are electrically connected; Masking the metal plate on both sides of the core material, etching the metal plate from above the masking to form a core material with metal bumps, and forming an outer insulating layer and the outer surface on both surfaces of the core material with metal bumps. Form with outer wiring layer on insulating layer ; And a that process.

In the above-described method for manufacturing a printed wiring board, a conductor bump is a bump formed by forming a conductive paste in which a conductor such as silver powder is dispersed in a liquid insulating resin such as an epoxy resin into a conical shape. And metal bumps obtained by processing a metal plate into a conical shape by plating or etching.

The step of forming an insulating layer includes a method of stacking a prepreg in which a glass fiber sheet is impregnated with a liquid insulating resin such as an epoxy resin, followed by pressing to allow a metal bump to penetrate the prepreg, A method of applying a liquid insulating resin such as an epoxy resin to the surface of the first layer where the base of the metal bump is formed, or attaching an insulating resin film to the surface of the first layer where the base of the metal bump is formed After curing, various known methods such as polishing the surface to expose the metal bump surface can be used.

In the above method of manufacturing a printed wiring board, the step of forming an outer insulating layer and an outer wiring layer on the outer insulating layer on both surfaces of the core material with metal bumps includes the steps of: There is a step of positioning the core material outside the core material and applying pressure under heating.

In the method of manufacturing a printed wiring board, the step of forming an insulating material layer on the metal plate includes a step of applying a photosensitive insulating resin to one surface of the metal plate. The step of forming a groove along the wiring pattern includes a step of exposing and curing the photosensitive insulating resin layer from above a pattern mask, and a step of developing the exposed photosensitive resin layer. No. Further, as a step of forming a wiring body by depositing a metal in the groove, a step of depositing a metal in the groove by electroless plating or electrolytic plating may be mentioned.

In the method for manufacturing a printed wiring board, between the step of forming the groove and the step of depositing a metal in the groove to form a wiring body, corrosion resistance to an etching solution for etching the metal plate is provided. The method may further include a step of forming a barrier metal layer having a property.

In the method of manufacturing a printed wiring board, the step of forming a substantially conical conductive bump on the wiring body of the first metal plate with a wiring body includes the step of forming a through hole for forming a bump on the wiring body. Placing a template with
A step of applying a conductive paste from above the template, a step of squeezing the conductive paste, filling the conductive paste into the through holes, and simultaneously removing unnecessary conductive paste, To form a group of substantially conical conductive bumps on the surface of the wiring body, and a step of curing the group of conductive bumps.

In the method of manufacturing a printed wiring board, the step of masking the metal plates on both sides of the core material with a metal plate includes forming a circular or polygonal dot mask at a predetermined position on the metal plate with a dry mask. Can be mentioned.

According to another method of manufacturing a printed wiring board of the present invention, there is provided a step of forming an insulating material layer on a metal plate, and removing the insulating material in a portion corresponding to the wiring pattern of the insulating layer so as to follow the wiring pattern. Forming a groove, forming a wiring body by depositing a metal in the groove, and obtaining a metal plate with a wiring body, and forming a substantially conical conductor on the wiring body of the metal plate with the wiring body. A step of forming a bump to form a single-layer wiring board with bumps, and sandwiching a core substrate having a wiring pattern on both surfaces thereof, and sandwiching the two single-layer wiring boards with bumps via an insulating material plate precursor; Setting the tip of the conductor bumps inward, pressing the two single-layer wiring boards with bumps to form a multilayer board unit in which the conductor bumps and the wiring patterns are electrically connected, Maskin on metal plate on both sides of multilayer board unit Forming the multi-layer board unit with metal bumps by etching the metal plate from above the masking; and forming outer insulating layers on both surfaces of the multi-layer board unit with metal bumps and outer wiring on the outer insulating layer. And a step of forming a layer.

A printed wiring board according to the present invention has a first wiring body having a wiring pattern planar shape and penetrating in a thickness direction of a layer, and is disposed in a space adjacent to the first wiring body. A first layer made of a first insulator forming a layer having a uniform thickness, a second wiring body having a wiring pattern-like planar shape, and penetrating in a thickness direction of the layer; A second layer composed of a second insulator disposed in a space adjacent to the second wiring body and forming a layer having a uniform thickness; and a second layer formed by the first layer and the second layer. A center insulating layer interposed therebetween; and a conductor bump disposed in the center insulating layer between the first wiring body and the second wiring body.

According to another aspect of the present invention, there is provided a printed wiring board having a wiring pattern-like planar shape, a first wiring body penetrating in a thickness direction of a layer, and a space adjacent to the first wiring body. A first layer comprising a first insulator formed to form a layer having a uniform thickness; and a second layer having a wiring pattern planar shape and penetrating in the thickness direction of the layer. A second layer comprising a second insulator disposed in a space adjacent to the second wiring body and forming a layer having a uniform thickness; the first layer and the second layer; A conductive bump interposed between the first wiring body and the second wiring body in the center insulating layer; and a first wiring formed between the first wiring body and the second wiring body. A metal bump provided on the outer surface of the body and / or the second wiring body; and
An outer insulating layer is provided on one or both outer surfaces of the core material with metal bumps, and a wiring layer is provided on the outer insulating layer and is in contact with the metal bumps.

According to another aspect of the present invention, there is provided a printed wiring board comprising: a core member having a wiring pattern on both surfaces thereof; a first inner insulating layer provided adjacent to one surface of the core member; Adjacent to the outside of the layer, has a wiring pattern planar shape,
A first wiring body penetrating in a thickness direction of the layer, and a first insulator provided in a space adjacent to the first wiring body and forming a layer having a uniform thickness. A conductor bump disposed in the first inner insulating layer and electrically connecting a wiring pattern on the core material to the first wiring body;
A first outer insulating layer adjacent to the outside of the first layer, a first outer wiring pattern provided on the outer insulating layer, and a first outer wiring pattern provided in the first outer insulating layer; A metal bump for electrically connecting a first wiring body and the first outer wiring pattern, a second inner insulating layer provided adjacent to the other surface of the core material, and a second inner insulating layer; A second wiring body adjacent to the outside of the layer and having a wiring pattern-like planar shape and penetrating in the thickness direction of the layer; and a second wiring body disposed in a space adjacent to the second wiring body. A second layer comprising a first insulator forming a uniform layer; and a second layer disposed in the second inner insulating layer, electrically connecting the wiring pattern on the core material and the second wiring body. Conductive bumps, a second outer insulating layer adjacent to the outside of the second layer, and a second bump disposed on the outer insulating layer. And the side wiring pattern, is disposed on the second outer insulating layer comprises a metal bump for electrically connecting the said second wire member second outer wiring pattern.

According to still another aspect of the present invention, there is provided a printed wiring board having a wiring pattern-like planar shape, a first wiring body penetrating in a layer thickness direction, and a space adjacent to the first wiring body. A first layer formed of a first insulator disposed to form a layer having a uniform thickness, an insulating layer provided on one side of the first layer, and an outer surface of the insulating layer. A wiring pattern provided, a conductive bump provided between the first wiring body and the wiring pattern in the insulating layer, and a conductive bump provided on an outer surface of the first wiring body. Metal bumps.

In the method of manufacturing a printed wiring board according to the present invention, since the core material having the metal bumps formed on the wiring body is used, the thermal conductivity is improved, and heat is trapped inside the printed wiring board or uneven heating is performed. Is eliminated, and the thermal effect of the interlayer connection is improved. Also, in the present invention, an insulating material layer is formed on a metal plate, a portion corresponding to a wiring pattern is removed in a groove shape, and the groove is filled with metal by plating or the like, so that the insulating material and the wiring body are formed on the same layer. Therefore, a thin layer with high smoothness can be formed. Further, in the present invention, since the metal bumps are formed by processing the metal plate on the substrate by etching or the like, it is possible to manufacture a core material with metal bumps having a uniform height. Further, since the adhesion between the bump and the wiring layer is improved as compared with the conventional conductor bump, the reliability of interlayer connection is improved. In addition, a bump having a diameter of 0.05 mm can be formed by the etching method, and a fine pitch of the surface layer can be obtained. Furthermore, since the metal plate is etched compared to the bumps obtained by the printing method, the height of the bumps is less varied.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) Hereinafter, a method for manufacturing a printed wiring board according to an embodiment of the present invention will be described. FIG. 1 is a flowchart showing a flow of each step of the method for manufacturing a printed wiring board according to the present embodiment, and FIG. 2 is a vertical view schematically showing each step of the method for manufacturing a printed wiring board according to the present embodiment. It is sectional drawing. To manufacture the printed wiring board 1 according to the present embodiment, FIG.
As shown in FIG. 1A, an insulating material layer 12, for example, an insulating resin layer 12 called "permanent resist" is formed on one surface of a metal plate 11 such as copper.

The insulating material layer 12 is formed, for example, by applying a photosensitive insulating resin film, for example, Provarec 81/8000 (trade name, manufactured by Bantico) as shown in FIG. 2 (b). A uniform layer 12 is formed (Step 1). Masking (not shown) is performed by punching only the wiring pattern portion from above the insulating resin layer 12 made of the insulating resin film (step 2), and the wiring pattern is exposed from above to expose the wiring pattern on the photosensitive insulating resin film. (Step 3), and developing the insulating resin film to remove the portion of the insulating resin corresponding to the wiring pattern (Step 4), as shown in FIG. It is cut into a groove. Next, plating or the like is applied to a portion corresponding to the wiring pattern cut into a groove shape to form a wiring body, and a thin barrier metal layer 13 of Ni or the like is formed as shown in FIG. 5). Then, a metal 14 such as Cu is deposited by electrolytic plating, electroless plating, or the like (step 6), and the metal 14 is filled in a groove formed in a portion corresponding to the wiring pattern, as shown in FIG. As shown in FIG.
a and a wiring body 14 formed by depositing a metal in a wiring pattern
The first wiring body-attached metal plate 15 having the (first wiring body) is obtained. Next, the first wiring body 1 of the first wiring body-attached metal plate 15 is formed.
.. Are formed on a predetermined portion of the surface of the surface 4 by a known method as shown in FIG. 2 (f) (step 7). As a method of forming such a conductor bump group 5, 5,..., For example, a screen having a through hole formed in a portion where a conductor bump is formed is positioned on the surface of the wiring body 14 of the first wiring body-attached metal plate 15. Then, a conductive paste such as a silver paste is applied from above the screen, and then the squeegee is pressed with a spatula to fill the conductive paste into the through holes. When the conductive paste is dried to some extent, only the screen is peeled off, and a substantially conical conductive bump 5 is formed on the surface of the first wiring member 14 of the first wiring member-attached metal plate 15. By curing this (step 8), the conductor bumps 5 having appropriate hardness as shown in FIG. 2 (f) are obtained.

Next, an insulating material plate precursor 6, for example, a glass fiber mat impregnated with an epoxy resin is set on the conductor bump groups 5, 5,... (Step 9) and pressed with a pressure roller. (Step 10), the conductor bump groups 5, 5,.
A core material intermediate 17 as shown in (a) is obtained.

On the other hand, a metal plate 25 with a second wiring body similar to the metal plate 15 with a first wiring body is formed by the same operation as in the above steps 1 to 6, and as shown in FIG. The surface of the core material intermediate 17 on which the conductive bump groups 5, 5,... Are formed and the second wiring body-attached metal plate 25 are positioned and set (step 11). In this state, step 1
Roller press in the same manner as in Step 0 (Step 1)
2), the tips of the conductor bump groups 5, 5,... Abut against the second wiring body 24 of the second wiring body-attached metal plate 25 to electrically connect the first wiring body 14 and the second wiring body 24 to each other. At the same time, the metal plate 25 with the second wiring body and the insulating material plate precursor 6 come into close contact with each other, and the core material intermediate 30 as shown in FIG.
Is obtained.

Next, as shown in FIG. 3D, the first metal plate 11 and the second metal plate
The mask layers 31 and 32 are formed on the surface of the metal plate 21 (step 13). The mask layers 31 and 32 can be formed by the same method as in the steps 1 to 3. That is, a photosensitive film is applied, masked and exposed (Step 14), developed (Step 15), and unnecessary mask layers 31 and 32 are removed. By such a process, the mask pattern 31 as shown in FIG.
a, 32a are formed. The mask pattern at this time is
A mask pattern having a shape such that a substantially conical metal bump is formed in the next etching step is formed. For example, the mask patterns 31a and 32a are formed in small circles or polygonal dots. After the formation of the mask patterns 31a and 32a, the core material intermediate body 30 on which the mask patterns have been formed is immersed in an etching solution for etching the first metal plate 11 and the second metal plate 21, for example. ,
Etching is performed with the mask patterns 31a and 32a attached (step 16).

By this etching process, the portions of the first metal plate 11 and the second metal plate 21 where the mask patterns 31a and 32a are not formed are etched.
The substantially conical or substantially trapezoidal metal bumps 33 and 34 as shown in FIG. Next, the metal bump 33,
By removing the mask patterns 31a and 32a remaining on the head of the step 34 (step 17), a core material 35 with metal bumps as shown in FIG. 4C is obtained.

Next, as shown in FIG. 5 (a), an insulating material plate precursor 40 is set on both sides of the core material 35 with metal bumps (step 18), and thereafter, the laminate is pressed by a roller in the same manner as described above. As a result (Step 19), the metal bumps 33 and 34 penetrate the insulating material plate precursor 40. Next, the surface of the insulating material plate precursor 40 is polished to expose the heads of the metal bumps 33 and 34 (step 20). The insulating material plate precursor 4 whose surface has been polished thereafter
The surface of the insulating material plate precursor 40 with the heads of the metal bumps 33 and 34 exposed is subjected to electroless plating to form a metal layer 41. Further, when the metal layer 41 is thickened by performing electroplating on the metal layer formed by the electroless plating, a so-called multilayer board type printed wiring board 1 as shown in FIG. 5C is obtained.

In the method of manufacturing a printed wiring board according to the present embodiment, a layer (first layer) 12a in which a wiring body and an insulator are formed in one layer is formed, and then a conductor is formed on the wiring body. Since the bumps are formed, it is possible to confirm whether or not the first layer is non-defective before the formation of the conductor bumps. Then, since the conductor bumps are formed only on the non-defective products and the multilayer structure is formed, the defective rate can be reduced. That is, the quality of the first layer is determined at a stage before the formation of the conductor bumps, and the defective product is eliminated at this point. Therefore, the unnecessary work of forming a conductor bump on the defective product and forming a multilayer is eliminated. it can. Since the conductor bumps are formed only on the first layer determined to be non-defective in the inspection, the cause of the occurrence of defective products thereafter exists in the process after the formation of the conductor bumps. Therefore, the defective rate can be reduced to the defective rate after the formation of the conductor bumps, and as a result, the overall yield of the multilayer board can be improved.

In the method of manufacturing a printed wiring board according to the present invention, since the core material having the metal bumps formed on the wiring body is used, the heat conductivity is improved, and heat is trapped or uneven inside the printed wiring board. Heat is eliminated, and the thermal effect of interlayer connection is improved. Also, in the present invention, an insulating material layer is formed on a metal plate, a portion corresponding to a wiring pattern is removed in a groove shape, and the groove is filled with metal by plating or the like, so that the insulating material and the wiring body are formed on the same layer. Therefore, a thin layer with high smoothness can be formed. Further, in the present invention, since the metal bumps are formed by processing the metal plate on the substrate by etching or the like, it is possible to manufacture a core material with metal bumps having a uniform height. Further, since the adhesion between the bump and the wiring layer is improved as compared with the conventional conductor bump, the reliability of interlayer connection is improved. Also, it is possible to form a bump having a diameter of 0.05 mm by the etching method.
Fine pitching of the surface layer becomes possible. Furthermore, since the metal plate is etched compared to the bumps obtained by the printing method, the height of the bumps is less varied.

The present invention is not limited to the above embodiment. For example, in the above embodiment, the insulator 12a is formed using a photosensitive insulating resin film. However, a solution obtained by dissolving a similar resin in a solvent may be applied, and a non-photosensitive insulating resin may be applied. A layer of a photosensitive resin is applied thereon, and the photosensitive resin layer is masked, exposed and developed to form a mask layer, and the insulating resin layer below and above the mask layer is selectively dissolved and removed. Then, a groove may be formed along the wiring pattern.

In this embodiment, the remaining type of insulating material layer 12 called "permanent resist" is an insulating material layer. Instead of the permanent resist, a peeling type type called "temporary resist" is used. You may. FIG. 6 is a flowchart of a printed wiring board manufacturing method according to a modified example of the first embodiment. When a release type temporary resist is used, a step (step 7) of peeling the photosensitive film is necessary as shown in the flowchart of FIG.
In this embodiment, the insulating material plate precursor 40 is overlaid on the metal bumps 33 and 34 and pressed (steps 18 and 1).
9) The electroless plating (step 21) and the electrolytic plating (step 22) are performed thereon to form the metal layer 41. However, steps 19 to 19 in the flowchart of FIG.
As shown in 20, it is also possible to connect the metal bumps 33, 34 and the copper foil by overlaying and pressing the insulating material plate precursor 40 and the copper foil on the metal bumps 33, 34.

(Second Embodiment) Hereinafter, a method for manufacturing a printed wiring board according to a second embodiment of the present invention will be described. FIG. 7 is a flowchart of a method for manufacturing a printed wiring board according to the present embodiment, and FIGS. 8 to 9 are vertical cross-sectional views schematically showing steps of the method for manufacturing a printed wiring board according to the present embodiment. . In the printed wiring board according to the present embodiment, a core substrate is used at the center, and a single-layer wiring board with conductor bumps is pressed on the wiring patterns on both surfaces thereof via prepregs to form a multilayer.

In order to manufacture the printed wiring board according to the present embodiment, two single-layer wiring boards 51 and 53 with bumps are prepared in the same manner as in Steps 1 to 8 of the first embodiment (Step 1). To 8). Next, as shown in FIG.
An existing core substrate 60 is prepared and used as a core. The core substrate 60 has a plurality of wiring patterns, for example, 4
The wiring patterns 61 to 64 are laminated via insulating layers 65 to 67, respectively, and the wiring patterns 61 to 64 are connected to each other via through-hole plating layers 68 and 69.

On the core substrate 60, the single-layer wiring boards 51 and 53 with bumps are set as shown in FIG. 8A via insulating material plate precursors, ie, prepregs 52 and 54 (step 9). When pressed in this state and pressed under heating (step 10), a multilayer board unit 70 as shown in FIG. 8B is formed.

Next, mask layers 31 and 32 are respectively formed on the surfaces of the first metal plate 11 and the second metal plate 21 exposed on both surfaces of the multilayer board unit 70 (step 1).
1). That is, a photosensitive film is applied, masked and exposed (Step 12), developed (Step 13), and unnecessary mask layers 31 and 32 are removed. By such a process, the mask pattern 31 as shown in FIG.
a, 32a are formed. Mask patterns 31a and 32a
Is completed, the multilayer plate unit 70 on which the mask pattern is formed is connected to the first metal plate 11 and the second metal plate 2.
1 is subjected to etching with the mask patterns 31a and 32a attached thereto by a method such as immersion in an etching solution for etching (step 14).

By this etching process, the portions of the first metal plate 11 and the second metal plate 12 where the mask patterns 31a and 32a are not formed are etched, and the substantially conical or substantially trapezoidal metal bumps 33 and 34 are etched. Is formed.
Next, the mask patterns 31a and 32a remaining on the heads of the metal bumps 33 and 34 are removed (step 1).
5), a multilayer board unit 71 with metal bumps as shown in FIG. 9B is obtained.

Next, an insulating material plate precursor (prepreg) 40 is provided on both sides of the multilayer board unit 71 with the metal bumps.
And copper foil 41, insulating material plate precursor (prepreg) 42
And the copper foil 43 are set one on top of the other (Step 16), and then passed through a roller in the same manner as described above and laminated and pressed (Step 17), so that the metal bumps 33 and 34 become the insulating material plate precursor. The electrical connection is formed by penetrating through each of the copper foils 40 and 42 and making contact with the copper foils 41 and 43 on the outside thereof, so that a so-called multilayer board 72 as shown in FIG. 9C is obtained.

(Third Embodiment) Hereinafter, a method for manufacturing a printed wiring board according to a third embodiment of the present invention will be described. FIG. 10 is a flowchart of the method for manufacturing a printed wiring board according to the present embodiment, and FIG. 11 is a vertical cross-sectional view schematically showing each step of the method for manufacturing a printed wiring board according to the present embodiment. The printed wiring board according to the present embodiment has a structure in which a wiring pattern is provided on one surface, a wiring body is provided on the other surface, and metal bumps protrude outward from the wiring body.

To manufacture the printed wiring board according to the present embodiment, a single-layer wiring board 51 with bumps is prepared in the same manner as in steps 1 to 8 of the first embodiment (step 1).
To 8). Next, as shown in FIG. 11A, an insulating material plate precursor, that is, a prepreg 52 and a copper foil 41 are set on an upper portion of the single-layer wiring board 51 with bumps on the tip side of the conductor bumps 5 (step). 9). When pressed in this state and pressed under heating (step 10), a multilayer board unit 80 as shown in FIG. 11B is formed.

Next, a mask layer 31 as shown in FIG. 11C is formed on the surface of the metal plate 11 exposed on the lower surface side of the multilayer plate unit 80 in the drawing (step 11). That is, a photosensitive film is applied, masked and exposed (Step 12), developed (Step 13), and the unnecessary mask layer 31 is removed. By such a process, FIG.
A mask pattern 31a as shown in FIG. After the formation of the mask pattern 31a, the multi-layer board unit 80 on which the mask pattern is formed is subjected to etching with the mask pattern 31a attached thereto by a method such as immersion in an etchant for etching the metal plate 11 ( Step 14).

As a result of this etching process, the metal plate 11 where the mask patterns 31a and 32a are not formed is formed.
Is etched to form a substantially conical or substantially trapezoidal metal bump 33. Next, by removing the mask pattern 31a remaining on the head of the metal bump 33, FIG.
As shown in FIG. 1E, a multilayer board unit 81 with the metal bumps 33 is obtained.

A semiconductor element is mounted by forming a wiring pattern 41a on the upper surface, or a solder ball (not shown) is formed on the metal bump 33, and the solder ball is formed on the wiring pattern on the upper surface of the same multilayer board unit. Or mounted on a wiring pattern of a motherboard.

[0042]

According to the present invention, a wiring body is formed by forming an insulating layer on a metal plate from an insulating material, shaving a portion corresponding to a wiring pattern in the insulating layer into a groove, and filling a deposited metal with the groove. Therefore, a smoother and thinner printed wiring board can be manufactured. At the same time, the used metal plate is processed into a substantially conical shape by etching or the like, so that printed wiring with a metal bump group excellent in easy and uniform interlayer connectivity without using special equipment such as a printing mask. A substrate can be manufactured. In addition, a bump having a diameter of 0.05 mm can be formed by the etching method, and a fine pitch of the surface layer can be obtained. Furthermore, since the metal plate is etched compared to the bumps obtained by the printing method, the height of the bumps is less varied.

[Brief description of the drawings]

FIG. 1 is a flowchart showing each step of a printed wiring board manufacturing method according to a first embodiment.

FIG. 2 is a vertical sectional view showing each step of a method for manufacturing a printed wiring board according to the first embodiment.

FIG. 3 is a vertical sectional view showing each step of the printed wiring board manufacturing method according to the first embodiment.

FIG. 4 is a vertical sectional view showing each step of the printed wiring board manufacturing method according to the first embodiment.

FIG. 5 is a vertical sectional view showing each step of the printed wiring board manufacturing method according to the first embodiment.

FIG. 6 is a flowchart showing each step of a printed wiring board manufacturing method according to a modification of the first embodiment.

FIG. 7 is a flowchart showing each step of a printed wiring board manufacturing method according to a second embodiment.

FIG. 8 is a vertical sectional view showing each step of a method for manufacturing a printed wiring board according to the second embodiment.

FIG. 9 is a vertical sectional view showing each step of the printed wiring board manufacturing method according to the second embodiment.

FIG. 10 is a flowchart showing each step of a printed wiring board manufacturing method according to a third embodiment.

FIG. 11 is a vertical sectional view showing each step of a method for manufacturing a printed wiring board according to the third embodiment.

FIG. 12 is a vertical sectional view showing a manufacturing process of a conventional conductor penetration method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 ... Metal plate, 12 ... Insulating material layer, 13 ... Barrier metal, 14 ... Metal, 15 ... Metal plate with 1st wiring body, 21 ... Metal plate, 22 ... Insulating material layer, 23 ... Barrier metal, 24 ...
Metal, 25: metal plate with second wiring body, 5: conductor bump, 6
... an insulating material plate precursor, 16 ... first wiring body, 17 ... second wiring body, 31 ... mask layer, 32 ... mask layer, 35 ... core material with metal bumps.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/40 H05K 3/40 Z (72) Inventor Yasuhiro Takamatsu 376-1 Toyohira 1-chome, Chino-shi, Nagano Pref. (72) Inventor Noriaki Sekine 1 Toshiba-cho, Fuchu-shi, Tokyo DTC Circuit Technology Co., Ltd. (72) Inventor Masayuki Taguchi 1 Toshiba-cho, Fuchu-shi, Tokyo DTC Circuit Technology Co., Ltd. F Terms (Reference) 5E317 AA30 BB02 BB12 CC22 GG17 5E346 AA04 AA06 AA43 CC04 CC09 CC32 CC39 CC54 CC55 DD02 DD12 DD25 DD32 DD33 DD44 EE33 FF35 GG13 GG17 GG18 GG22 GG23 GG28 HH07 HH24

Claims (11)

[Claims] A step of forming an insulating material layer on a metal plate; a step of removing the insulating material from a portion of the insulating layer corresponding to the wiring pattern to form a groove along the wiring pattern; Forming a wiring body by depositing a metal on the first wiring body to obtain a metal plate with a first wiring body; and forming a substantially conical conductive bump on the wiring body of the first metal plate with a wiring body; A step of superimposing and pressing an insulating material plate precursor on the tip of the conductor bump to cause the conductor bump to penetrate the insulating material plate precursor; and forming a second wiring on the tip of the conductor bump penetrating the insulating material plate precursor. A step of arranging the wiring body of the body-attached metal plate to face each other, and pressing the first metal plate with a wiring body and the second metal plate with a wiring body so that the conductor bumps and the wiring body are electrically connected to each other. Forming a core material with a metal plate, A step of masking the metal plate on both sides; a step of etching the metal plate from above the masking to form a core material with metal bumps; and an outer insulating layer and an outer insulating layer on both surfaces of the core material with metal bumps. Forming an outer wiring layer of the above. 2. The method for manufacturing a printed wiring board according to claim 1, wherein the step of forming an outer insulating layer and an outer wiring layer on the outer insulating layer on both surfaces of the core material with metal bumps includes: A method for manufacturing a printed wiring board, comprising a step of positioning a copper foil with resin on the outside of the core material with metal bumps and applying pressure under heating. 3. The method for manufacturing a printed wiring board according to claim 1, wherein the step of forming an insulating material layer on the metal plate includes applying a photosensitive insulating resin to one surface of the metal plate. Forming a groove along the wiring pattern, wherein the step of exposing and curing the photosensitive insulating resin layer from above a pattern mask, and the step of developing the exposed photosensitive resin layer Forming a wiring body by depositing a metal in the groove,
A method for manufacturing a printed wiring board, comprising a step of depositing a metal in the groove by electroless plating or electrolytic plating. 4. The method for manufacturing a printed wiring board according to claim 1, wherein the step of forming the groove and the step of forming a wiring body by depositing a metal in the groove. Forming a barrier metal layer having corrosion resistance to an etchant for etching the metal plate between the steps. 5. The method for manufacturing a printed wiring board according to claim 1, wherein a substantially conical conductive bump is formed on the wiring body of the first metal plate with a wiring body. A step of mounting a template having a through hole for forming a bump on the wiring body, a step of applying a conductive paste from above the template, and a step of squeezing the conductive paste. Removing unnecessary conductive paste at the same time as filling the conductive paste into the through-holes, and removing the template to form a group of substantially conical conductive bumps on the surface of the wiring body; Curing a group of conductive bumps. 6. The method for manufacturing a printed wiring board according to claim 1, wherein the step of masking the metal plates on both surfaces of the core material with a metal plate includes a step of masking the metal plates on both sides of the metal plate. Forming a dot mask of a circular or polygonal shape with a dry mask. 7. A step of forming an insulating material layer on a metal plate, a step of forming a groove along the wiring pattern by removing the insulating material from a portion of the insulating layer corresponding to the wiring pattern; Forming a wiring body by depositing a metal on the wiring body to obtain a metal plate with a wiring body; and forming a substantially conical conductive bump on the wiring body of the metal plate with the wiring body to form a single-layer wiring board with bumps. A step of sandwiching a core substrate having a wiring pattern on both sides thereof, setting two single-layered wiring boards with bumps via an insulating material plate precursor, and inwardly setting the tip of the conductor bump. Pressing the two single-layer wiring boards with bumps to form a multilayer board unit in which the conductive bumps and the wiring patterns are electrically connected; and masking the metal plates on both sides of the multilayer board unit. And from above the masking Forming a multilayer board unit with metal bumps by etching the metal plate, and forming an outer insulating layer and an outer wiring layer on the outer insulating layer on both surfaces of the multilayer board unit with metal bumps. Printed wiring board manufacturing method. 8. A first wiring body having a wiring pattern planar shape and penetrating in a thickness direction of a layer, and a first wiring body is disposed in a space adjacent to the first wiring body and has a uniform thickness. A first layer made of a first insulator forming a layer, a second wiring body having a wiring pattern planar shape and penetrating in a thickness direction of the layer, and a second wiring body. A second layer comprising a second insulator disposed in an adjacent space and forming a layer having a uniform thickness; and a second layer interposed between the first layer and the second layer. A printed wiring board, comprising: a central insulating layer; and a conductor bump disposed in the central insulating layer between the first wiring body and the second wiring body. 9. A first wiring body having a wiring pattern planar shape and penetrating in a thickness direction of a layer, and a first wiring body is provided in a space adjacent to the first wiring body and has a uniform thickness. A first layer made of a first insulator forming a layer, a second wiring body having a wiring pattern planar shape and penetrating in a thickness direction of the layer, and a second wiring body. A second layer comprising a second insulator disposed in an adjacent space and forming a layer having a uniform thickness; and a second layer interposed between the first layer and the second layer. A center insulating layer; a conductor bump disposed in the center insulating layer between the first wiring body and the second wiring body; and the first wiring body and / or the second wiring body. A core material with metal bumps, comprising: a metal bump disposed on an outer surface of the wiring body; and one or both outer surfaces of the core material with metal bumps An outer insulating layer disposed, is disposed in the outer insulating layer, the printed wiring board having a said metal bump and contact wiring layer. 10. A core material having a wiring pattern on both surfaces, a first inner insulating layer provided adjacent to one surface of the core material, and a wiring adjacent to the outside of the first inner insulating layer. A first wiring body having a pattern-like planar shape and penetrating in the thickness direction of the layer, and a first wiring body arranged in a space adjacent to the first wiring body to form a layer having a uniform thickness. A first layer comprising: an insulator; a conductive bump disposed in the first inner insulating layer, for electrically connecting a wiring pattern on the core material to the first wiring body; A first outer insulating layer adjacent to the outside of the first layer, a first outer wiring pattern provided on the outer insulating layer, and a first outer wiring pattern provided in the first outer insulating layer; A metal bump for electrically connecting a first wiring body to the first outer wiring pattern; and a metal bump adjacent to the other surface of the core material. A second wiring body adjacent to the outside of the second inner insulation layer, having a planar shape of a wiring pattern, and penetrating in the thickness direction of the layer; A second layer comprising a first insulator disposed in a space adjacent to the second wiring body and forming a layer having a uniform thickness; and a second layer disposed in the second inner insulating layer; A conductive bump for electrically connecting a wiring pattern on a core material to the second wiring body; a second outer insulating layer adjacent to the outside of the second layer; and disposing on the outer insulating layer And a metal bump disposed in the second outer insulating layer and electrically connecting the second wiring body and the second outer wiring pattern. Printed wiring board. 11. A first wiring body having a wiring pattern planar shape and penetrating in a thickness direction of a layer, and a first wiring body disposed in a space adjacent to the first wiring body and having a uniform thickness. A first layer made of a first insulator forming a layer, an insulating layer provided on one side of the first layer, a wiring pattern provided on an outer surface of the insulating layer, A printed wiring comprising: a conductive bump disposed in the insulating layer between the first wiring body and the wiring pattern; and a metal bump disposed on an outer surface of the first wiring body. substrate.