JPH11326371A - Inspection jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection jig which is free from positional diviation and contact failure between an inspecting electrode and an electrode as an object to be inspected as caused when a continuity test is conducted by depressing the inspecting electrode onto the object to be inspected. SOLUTION: An inspecting electrode 15 is formed on one surface of an insulation layer 13 while a wire layer 16 on the other surface thereof and the inspecting electrode 15 is electrically connected to the wire layer 16. A U-shaped cut 17 is made in the insulation layer 13 at the peripheral part of the inspecting electrode 15 containing a part of the wire layer 16 to make the inspecting electrode 15 easily move vertically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection jig substrate used for inspecting continuity of a semiconductor device, a printed circuit board, and the like.

[0002]

2. Description of the Related Art In a conventional continuity test of a semiconductor device or a printed circuit board, as shown in FIG. 3, a test jig in which a test electrode 22 is formed on one surface of an insulating layer 21 and a wiring layer 23 is formed on another surface. Is used to perform a continuity test by pressing an inspection electrode of an inspection jig against an electrode portion of an object to be inspected.

[0003]

In the conventional continuity test, a continuity test is performed by placing an elastic rubber sheet on the lower surface of an inspection jig and pressing an object to be inspected from above. In the conventional inspection jig structure, when an object to be inspected is pressed, the inspection electrode sinks into the rubber sheet side, and the contact resistance becomes non-uniform or the pitch of the inspection electrode is shifted. Further, when an oxide film is formed on the electrode of the test object at the time of contact between the test electrode and the test object, there is a problem that the contact resistance between the test electrode and the test object is high, and a test failure occurs. .

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an inspection jig which does not cause positional displacement and poor contact with an electrode to be inspected when an inspection electrode is pressed against the object to be inspected to conduct a continuity inspection. The purpose is to do.

[0005]

In order to solve the above-mentioned problems in the present invention, a cut is made in the insulating layer around the test electrode in a test jig having a test electrode and a wiring layer formed on the insulating layer. An inspection jig characterized by the above. By using an inspection jig with a structure in which a cut is made in the insulating layer around the test electrode, the strain of the insulating layer is not transmitted to the test electrode when the test electrode sinks, and the position of the test electrode due to the distortion of the insulating layer is reduced. No shift occurs. Also, since the subsidence of the test electrode during the test is independent for each test electrode,
Electrical contact between the test electrode and the device under test can be ensured. Furthermore, the notch in the periphery of the test electrode allows the test electrode to sink while tilting when the test electrode sinks, and to rub the electrode surface of the device under test so that it can break through the oxide film on the electrode surface. , Poor contact is improved.

[0006]

Embodiments of the present invention will be described below. FIG. 1A is a partial schematic perspective view of the inspection jig of the present invention, and FIG. 1B is a partial schematic perspective view of the inspection jig.
FIGS. 2A to 2F are schematic cross-sectional views cut along the line A ′, and FIGS.

The inspection jig of the present invention is shown in FIGS. 1 (a) and 1 (b).
As shown in FIG. 3, the inspection electrode 15 is formed on one surface of the insulating layer 13 and the wiring layer 16 is formed on the other surface.
5 and the wiring layer 16 are electrically connected. Wiring layer 16
Are formed in the insulating layer 13 around the test electrode 15 including a part of the test electrode 15 so that the test electrode 15 can easily move up and down.

With the inspection jig having such a structure, when the rubber elastic sheet is laid under the inspection jig and the object to be inspected is pressed from above, the inspection electrode 15 is connected to the rubber sheet. The test electrode 15
Since the notch 17 is formed in the insulating layer in the peripheral portion of the inspection electrode 15, the inspection electrode 15 moves up and down in response to the pressing, and the tip of the inspection electrode 15 that comes into contact with the inspection object moves slightly in the front-back direction, but slightly. Rub the body electrodes. Therefore, when the electrode of the test object is aluminum, reliable electrical contact can be obtained in such a manner as to break through the surface oxide film.

Hereinafter, a method of forming the inspection jig of the present invention will be described with reference to FIGS. An insulating resin layer 12 and an insulating layer 13 are formed on a metal substrate 11.
(A)). Here, the metal substrate 11 can be used as long as it is a metal having conductivity, but a stainless steel plate is preferable here in terms of a manufacturing process. The insulating resin layer 12 is used for forming the inspection electrode 14 by electrolytic plating.
Any resin can be used as long as it has insulating properties. However, since it is finally stripped and removed in a later step, it is a liquid photosensitive resist that has sufficient resistance to the electrolytic plating process and is easy to strip. Alternatively, a dry film resist is suitable. The insulating layer 13 serves as an insulating substrate of the inspection jig, and is required to have insulation properties, heat resistance, and mechanical strength. Polyester, epoxy, acrylic, polyimide resin, and the like can be used, but polyimide resin is preferable. .

Next, a truncated cone-shaped opening 14 for forming a test electrode is formed in the insulating resin layer 12 and the insulating layer 13 by excimer laser processing (see FIG. 2B).

Next, using the metal substrate 11 as a plating electrode, an inspection electrode 15 is formed in the opening 14 by electrolytic plating (see FIG. 2C).

Next, a conductor layer is formed on the insulating layer 13 and the inspection electrode 15 and patterned to form a wiring layer 16 (see FIG. 2D). For forming the wiring layer 16, a photoetching method or a semi-additive method can be used.

Next, a U-shaped cut 17 having a width of 10 to 30 μm is formed in the insulating layer 13 around the inspection electrode 15 by using an excimer laser (see FIG. 2E).
A part of the insulating resin layer 12 is also processed when the "U" -shaped notch 17 is processed by the excimer laser. However, since the insulating resin layer 12 is finally peeled and removed, there is a problem in particular. There is no.

Next, the substrate on which the cuts 17 are formed in the test electrode 15, the wiring layer 16 and the insulating layer 13 is immersed in a dedicated stripping solution, and the metal substrate 11 and the insulating resin layer 12 are stripped and removed. An inspection jig of the present invention in which the inspection electrode 15, the wiring layer 16, and the cutout 17 are formed in the layer 13 can be obtained (see FIG. 2F). Here, after forming the protective layer on the wiring layer 16 side, the metal substrate 11 and the insulating resin layer 12 may be peeled off and removed to form an inspection jig.

[0015]

The present invention will be described in detail with reference to the following examples.
First, a metal substrate 1 made of a 0.3 mm thick stainless steel plate was used.
1 was laminated with a dry film resist (H-K850: manufactured by Hitachi Chemical Co., Ltd.) to form an insulating resin layer 12. Further, a polyimide film having a thickness of 25 μm was attached to form an insulating layer 13.

Next, a truncated cone-shaped opening 14 having a diameter of 40 μm was formed at a predetermined position of the insulating layer 13 and the insulating resin layer 12 using an excimer laser processing machine. The processing condition of the excimer laser was an energy density of 1.5 J / cm ² .

Next, the metal substrate 11 is used as a plating electrode,
An inspection electrode 15 made of nickel metal was formed in the opening 14 by electrolytic nickel plating.

Next, copper was sputtered on the insulating layer 13 and the inspection electrode 15 to form a thin conductor layer having a thickness of 3000 mm, and a wiring layer 16 having a thickness of 10 to 15 μm was formed by a semi-additive process.

Next, a U-shaped 30 μm wide through-hole was formed in the insulating layer 13 around the inspection electrode 15 using an excimer laser, and a cut 17 was formed.

Next, the substrate on which the inspection electrode 15, the wiring layer 16, and the cutout 17 are formed is immersed in a 10% caustic soda solution, and the metal substrate 11 and the insulating resin layer 12 are peeled off and removed. Inspection electrode 15, wiring layer 16
And the inspection jig of this invention in which the notch 17 was formed was able to be manufactured. As a result of inspecting the inspection object having the aluminum electrode using the inspection jig of the present invention, stable conductive contact was obtained.

[0021]

By using the inspection jig of the present invention,
Inspection without displacement of the inspection electrode can be performed without distortion of the insulating layer due to sinking of the inspection electrode during the inspection. Furthermore, the notch formed around the test electrode causes the tip of the test electrode to sink into the surface of the test object when the test electrode comes into contact with the test object, thereby oxidizing the electrode surface of the test object. Through the membrane, the stability of the conductive contact was improved.

[Brief description of the drawings]

FIG. 1A is a partial schematic perspective view of an inspection jig of the present invention. (B) is a schematic cross-sectional view of a partial schematic perspective view of the inspection jig of the present invention, taken along line AA ′.

FIGS. 2A to 2F are schematic cross-sectional views showing the steps of manufacturing the inspection jig of the present invention in the order of steps.

FIG. 3 is a schematic sectional view showing a configuration of a conventional inspection jig.

[Explanation of symbols]

 11 Metal substrate 12 Insulating resin layer 13, 21 Insulating layer 14 Opening 15, 22 Inspection electrode 16, 23 Wiring layer 17 Notch

Claims (1)

[Claims] 1. An inspection jig in which an inspection electrode and a wiring layer are formed on an insulating layer, wherein a cut is made in the insulating layer around the inspection electrode.