JP4556327B2 - Manufacturing method of inspection jig - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to an inspection jig used when conducting an electrical inspection of a semiconductor device or a semiconductor device substrate.ofIt relates to a manufacturing method.
[0002]
[Prior art]
In order to assure the quality of a semiconductor device, a semiconductor device in which a semiconductor chip is mounted on a substrate for a semiconductor device such as a film carrier, or the semiconductor device substrate itself, an electrical inspection is performed. As one of the methods of electrical inspection, an inspection jig is brought into contact with the electrode of the object to be inspected as described above to inspect electrical open or short.
With the recent trend toward smaller and thinner electronic devices, the pitch of the electrodes of the object to be inspected has been reduced, and the inspection jigs used have higher density and higher accuracy. . As such an inspection jig, one described in JP-A-11-326378 is known.
[0003]
An example of a conventional method for manufacturing an inspection jig is shown in FIGS.
First, a dry film resist is laminated on a metal substrate 101 made of a stainless steel plate having a thickness of 0.3 mm, a resist layer 102, and an insulating base material made of a polyimide film having a thickness of 20 μm (Upilex: manufactured by Ube Industries, Ltd.). 103 is attached (see FIG. 6A).
[0004]
Next, a 300 nm-thick chromium thin film layer 104 is sputtered on the insulating substrate 103, and copper is further sputtered to form a 300 nm-thick thin film conductor layer 105 (see FIG. 6B).
Next, using an excimer laser, the thin film conductor layer 105, the chromium thin film layer 104, the insulating base material 103, and the resist layer 102 are punched to form a truncated cone-shaped opening 106 of 40 μmφ (FIG. 6 ( c)).
[0005]
Next, using the metal substrate 101 as a cathode, electrolytic copper plating is performed to continuously form the conductor electrode 107 and the conductor layer 108 having a thickness of 15 to 20 μm (see FIG. 6D).
Next, the conductor layer 108, the thin film conductor layer 105, and the chromium thin film layer 104 are patterned by a photoetching process to form a wiring layer 108a (see FIG. 6E).
[0006]
Next, the test electrode 109 is formed on one surface of the insulating base material 103 by immersing the substrate on which the conductor electrode 107 and the wiring layer 108a are formed in a stripping solution and stripping the metal substrate 101 and the resist layer 102. An inspection jig having the wiring layer 108a formed on the other surface is produced (see FIG. 6F).
[0007]
[Problems to be solved by the invention]
In such an inspection jig, in order to further improve the contact reliability with the object to be inspected at the time of inspection, it has been required to form a metal layer that increases the contact reliability at the tip of the inspection electrode.
There is also a method of plating the inspection electrode after the manufacturing process of the conventional inspection jig as described above, but there is a problem that the plating adheres to the entire exposed inspection electrode and the electrode becomes thick. is there. Furthermore, the amount of thickening depends on the plating thickness. However, it is difficult to apply uniform plating to the inspection electrode having such a convex shape and control the thickness, and thus how thick it is. This is not suitable as an inspection jig for performing high-density inspection.
In addition, since the conductor layer is formed by electrolytic copper plating, the wiring layer thickness may vary unless the plating time and the plating solution are managed accurately. Furthermore, there is a problem that it takes time for plating.
[0008]
The present invention has been made in view of the above-described problems, and an object thereof is to provide an inspection jig capable of inspecting a high-density object to be inspected and a manufacturing method thereof.
[0010]
[Means for Solving the Problems]
In order to solve the above-mentioned problem in the present invention, in claim 1, a wiring layer is formed on one surface of an insulating substrate, and an inspection electrode is formed on the other surface through the insulating substrate. One end of the inspection electrode is connected to a wiring layer, and the other end of the inspection electrode is gradually narrowed toward the tip, and the inspection electrode has a flat tip, and the tip of the inspection electrode A method for manufacturing an inspection jig in which a metal layer for improving contact reliability is formed on a part, at least,The following stepsTheWith featuresDoThis is a method for manufacturing an inspection jig.
(A) A step of forming a first metal layer on one surface of the insulating substrate and a second metal layer on the other surface.
(B) A step of drilling with a laser from the first metal layer side, forming an opening at a predetermined position of the first metal layer and the insulating base, and exposing the second metal layer at the hole bottom of the opening.
(C) A step of forming a metal layer having resistance to the etching solution for the second metal layer on the second metal layer at the bottom of the hole in the opening of the insulating base by plating.
(D) A step of performing electrolytic plating using the second metal layer as a plating electrode, and forming a conductor electrode in the opening of the insulating substrate and a conductor layer on the first metal.
(E) A step of patterning the first metal layer and the conductor layer to form a wiring layer and removing the second metal layer.
(F) A resist layer is formed on one surface of the insulating base material and the wiring layer, and the other surface of the insulating base material is removed by a predetermined thickness by etching to expose a part of the metal layer and the conductor electrode. Forming a test electrode.
(G) A step of peeling off the resist layer, and producing an inspection jig in which an inspection electrode having a wiring layer on one surface of the insulating substrate and a metal layer on the other surface is formed on the other surface.
[0011]
Claims2InA wiring layer is formed on one surface of the insulating substrate, and an inspection electrode is formed on the other surface via the insulating substrate. One end of the inspection electrode is connected to the wiring layer, and the other end of the inspection electrode is Manufacturing of an inspection jig that has the inspection electrode whose shape gradually becomes thinner toward the tip, the tip is flat, and a metal layer that increases contact reliability is formed at the tip of the inspection electrode A method, at least,The following stepsTheWith featuresDoThis is a method for manufacturing an inspection jig.
(A) A step of forming the first metal layer on one surface of the insulating base and the second metal layer on the other surface via an easily removable adhesive layer.
(B) A step of drilling with a laser from the first metal layer side, forming an opening at a predetermined position of the first metal layer and insulation, and exposing the second metal layer at the hole bottom of the opening.
(C) A step of forming a metal layer having resistance to the etching solution for the second metal layer on the second metal layer in the opening of the insulating base material by plating.
(D) A step of performing electrolytic plating using the second metal layer as a plating electrode, and forming a conductor electrode in the openings of the insulating base material and the adhesive layer and a conductor layer on the first metal layer.
(E) A step of patterning the first metal layer and the conductor layer to form a wiring layer and removing the second metal layer.
(F) The adhesive layer is removed to expose a part of the metal layer and the conductor electrode, thereby forming an inspection electrode having a wiring layer on one surface of the insulating base and a metal layer at the tip on the other surface. The process of producing the inspection jig.
[0012]
Furthermore, the claims3In the above, when the insulating base material is drilled by laser from the first metal layer side, the first metal layer is patterned in advance to form an opening mask, and the laser beam is irradiated to drill the hole. Claims1Or claims2This is a manufacturing method of the described inspection jig.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described. FIG. 1A illustrates the present invention.Made by manufacturing methodA schematic perspective view of the inspection jig is shown in FIG. 1B, and a schematic configuration cross-sectional view of the inspection jig cut along line A-A ′ is shown. Of the present inventionMade by manufacturing methodIn the inspection jig, a wiring layer is formed on one surface of an insulating substrate, an inspection electrode is formed on the other surface, and a metal layer is formed on a flat end portion of the inspection electrode.
[0014]
Claim1A method for manufacturing the described inspection jig will be described with reference to FIGS. First, the first metal layer 12 and the second metal layer 13 are formed on both surfaces of the insulating substrate 11 (see FIG. 2A). For the insulating base material 11, a material such as polyimide generally used for TAB can be used. A copper foil is usually used for the first metal layer 12 and the second metal layer 13.
[0015]
Next, the first metal layer 12 is irradiated with a laser beam to perform drilling, the opening 14 is formed in the first metal layer 12 and the insulating base material 11, and the second metal layer is formed at the hole bottom of the opening 14. 13 is exposed (see FIG. 2B).
The processing conditions are set so that the opening 14 has a frustoconical shape whose diameter becomes narrower as it approaches the second metal layer 13, and the surface of the second metal layer 13 is exposed at the hole bottom of the opening 14. As the laser, an excimer laser or a UV-YAG laser is suitable because of the shape of the hole.
[0016]
Next, a metal layer 15 is plated on the second metal layer 13 at the bottom of the hole of the opening 14 to enhance contact reliability and to be resistant to an etchant used to etch the second metal layer 13. (See FIG. 2C).
Examples of the metal material of the metal layer 15 include gold, palladium, and nickel. In the case of gold or palladium, it is preferable to further apply nickel plating to the upper layer to form a two-layer structure. Although the etching resistance varies depending on the etching solution, gold plating is suitable when a ferric chloride solution is used as the etching solution. Gold plating is desirable because it also has the effect of reducing contact resistance.
The thickness of the metal layer 15 is preferably about 1 to 2 μm. If it is too thin, defects such as pinholes are produced, and the effect of improving contact reliability may be reduced, or when etching the second metal layer, the etching solution may enter and damage the electrode. If it is too thick, the cost increases because the material is expensive. In addition, since gold is soft, the hardness of the electrode may be insufficient.
[0017]
Next, electrolytic copper plating is performed on the opening 14 and the first metal layer 12 by using the second metal layer 13 as a plating electrode to form a conductor electrode 16 in the opening 14 and a conductor layer 17 on the first metal layer 12. (See FIG. 2 (d)).
If a direct plating system is used for the plating method, the process is simplified. In the direct plating system, a catalyst layer such as palladium particles is formed on the wall of the resin layer in advance, thereby enabling electrolytic plating directly on the resin by electrolytic plating.
Further, hole filling plating is used for plating the metal in the opening 14 so that voids are not generated in the conductor electrode 16.
[0018]
Next, the first metal layer 12 and the conductor layer 17 are patterned to form the wiring layer 18 composed of the first metal layer pattern 12a and the conductor layer pattern 17a, and at the same time, the second metal layer 34 is removed by etching ( (Refer FIG.2 (e)).
[0019]
Next, a protective resist layer 19 is formed on one surface of the insulating base material 11 and the wiring layer 18, and the insulating base material 11 is removed by etching until a predetermined thickness is obtained. Then, the metal layer 15 and a part of the conductor electrode are exposed to form the inspection electrode 21 (see FIG. 2F).
[0020]
Next, the resist layer 19 is stripped to obtain an inspection jig 100 in which the wiring layer 18 is formed on one surface of the insulating substrate 11a and the inspection electrode 21 having the metal layer 15 at the tip is formed on the other surface. (See FIG. 2 (g)).
[0021]
Claim2A method for manufacturing the described inspection jig will be described with reference to FIGS. First, the first metal layer 33 is formed on one surface of the insulating base material 31 and the second metal layer 34 is formed on the other surface through an easily removable adhesive layer 32 (see FIG. 3A). A material such as polyimide generally used for TAB can be used for the insulating base 31, and a thermoplastic resin material can be used for the adhesive layer 32. For the first metal layer 33 and the second metal layer 34, a copper foil is usually used.
[0022]
Next, the first metal layer 33 is irradiated with laser to perform drilling, and an opening 35 is formed in the first metal layer 33, the insulating base material 31, and the adhesive layer 32. The bimetallic layer 34 is exposed (see FIG. 3B).
Processing conditions are set so that the opening 35 has a truncated cone shape whose diameter decreases as the second metal layer 34 is approached, and the surface of the second metal layer 34 is exposed at the hole bottom of the opening 35. As the laser, an excimer laser or a UV-YAG laser is suitable because of the shape of the hole.
[0023]
Next, the metal layer 36 is plated on the second metal layer 34 at the bottom of the hole 35 by plating a metal that is highly reliable in contact and resistant to an etching solution for etching the second metal layer 34. (See FIG. 3C).
Examples of the metal material of the metal layer 36 include gold, palladium, and nickel. In the case of gold or palladium, it is preferable to further apply nickel plating to the upper layer to form a two-layer structure. Although the etching resistance varies depending on the etching solution, gold plating is suitable when a ferric chloride solution is used as the etching solution. Gold plating is desirable because it also has the effect of reducing contact resistance.
The thickness of the metal layer 36 is preferably about 1 to 2 μm. If it is too thin, defects such as pinholes are produced, and the effect of improving contact reliability may be reduced, or when etching the second metal layer, the etching solution may enter and damage the electrode. If it is too thick, the cost increases because the material is expensive. In addition, since gold is soft, the hardness of the electrode may be insufficient.
[0024]
Next, electrolytic copper plating is performed on the opening 35 and the first metal layer 33 using the second metal layer 34 as a plating electrode, and a conductor electrode 37 is formed on the opening 35 and a conductor layer 38 is formed on the first metal layer 33. (See FIG. 3D).
If a direct plating system is used for the plating method, the process is simplified. In the direct plating system, a catalyst layer such as palladium particles is formed on the wall of the resin layer in advance, so that the resin can be directly electroplated by electrolytic plating.
Moreover, hole filling plating is used for metal plating of the opening 35 so that voids are not generated in the conductor electrode 37.
[0025]
Next, the first metal layer 33 and the conductor layer 38 are patterned to form a wiring layer 39 composed of the first metal layer pattern 33a and the conductor layer pattern 38a, and at the same time, the second metal layer 34 is removed by etching ( (Refer FIG.3 (e)).
[0026]
Next, the adhesive layer 32 is dissolved and removed with a solvent or the like to expose a part of the metal layer 36 and the conductor electrode 37 to form the inspection electrode 41, and the wiring layer 39 is formed on one surface of the insulating base material 31. Thus, the inspection jig 200 having the inspection electrode 41 having the metal layer 36 at the tip thereof can be obtained (see FIG. 3F).
[0027]
Claim3A method for manufacturing the described inspection jig will be described with reference to FIGS. First, the first metal layer 12 and the second metal layer 13 are formed on both surfaces of the insulating substrate 11 (see FIG. 4A). For the insulating base material 11, a material such as polyimide generally used for TAB can be used. A copper foil is usually used for the first metal layer 12 and the second metal layer 13.
[0028]
Next, the first metal layer 12 is patterned to form an opening mask 22 at a predetermined position of the first metal layer 12 (see FIG. 4B).
[0029]
Next, the opening mask 22 of the first metal layer 12 is irradiated with a laser to perform drilling to form the opening 14 in the insulating base material 11, and the second metal layer 13 is exposed at the bottom of the opening 14. (See FIG. 4C).
In the method of forming the opening 14 by irradiating the opening mask 22 of the first metal layer 12 with laser, it is easy to set the laser processing conditions, and it is particularly easy to control the end point at the bottom of the hole of the opening 14. is there. An excimer laser is suitable as the laser.
[0030]
Thereafter, the metal layer 15, the conductor electrode 16, and the conductor layer 17 are formed in the same process as described above (see FIGS. 4D to 4E), and the first metal layer 12 and the conductor layer 17 are patterned. The wiring layer 18 is formed, and at the same time, the second metal layer 13 is removed by etching (see FIG. 4F).
Next, a protective resist layer 19 is formed on one surface of the insulating base material 11 and the wiring layer 18, and the insulating base material 11 is removed by etching until a predetermined thickness is obtained. Then, the metal layer 15 and a part of the conductor electrode 16 are exposed to form the inspection electrode 21 (see FIG. 4G).
[0031]
Next, the resist layer 19 is stripped to obtain an inspection jig 300 in which the wiring layer 18 is formed on one surface of the insulating substrate 11a and the inspection electrode 21 having the metal layer 15 at the tip is formed on the other surface. (See FIG. 4 (h)).
[0032]
Claim3A method for manufacturing the described inspection jig will be described with reference to FIGS. First, the first metal layer 33 is formed on one surface of the insulating base material 31, and the second metal layer 34 is formed on the other surface through an easily removable adhesive layer 32 (see FIG. 5A). A material such as polyimide generally used for TAB can be used for the insulating base 31, and a thermoplastic resin material can be used for the adhesive layer 32. For the first metal layer 33 and the second metal layer 34, a copper foil is usually used.
[0033]
Next, the first metal layer 33 is patterned to form an opening mask 42 at a predetermined position of the first metal layer 33 (see FIG. 5B).
[0034]
Next, the opening mask 42 of the first metal layer 33 is irradiated with a laser to form a hole, the opening 35 is formed in the insulating base material 31 and the adhesive layer 32, and the second metal is formed at the hole bottom of the opening 35. The layer 34 is exposed (see FIG. 5C).
In the method of forming the opening 35 by irradiating the opening mask 42 of the first metal layer 33 with laser, it is easy to set laser processing conditions, and in particular, it is easy to control the end point at the hole bottom of the opening 35. is there. An excimer laser is suitable as the laser.
[0035]
Thereafter, the metal layer 36, the conductor electrode 37, and the conductor layer 38 are formed in the same process as described above (see FIGS. 5D to 5E), and the first metal layer 33 and the conductor layer 38 are patterned. The wiring layer 39 is formed, and at the same time, the second metal layer 13 is removed by etching (see FIG. 5F).
Next, the adhesive layer 32 is peeled off with a solvent or the like, and the inspection jig 400 in which the wiring layer 39 is formed on one surface of the insulating base 31 and the inspection electrode 41 having the metal layer 36 at the tip is formed on the other surface. Can be obtained (see FIG. 5G).
[0036]
Hereinafter, the present invention will be described in detail by way of examples.
<Example 1>
First, a 9 μm-thick copper foil was laminated on both surfaces of a 50 μm-thick insulating base material 11 to form a first metal layer 12 and a second metal layer 13 (see FIG. 2A).
[0037]
Next, using a UV-YAG laser processing machine (Sumitomo Heavy Industries, Ltd.), the first metal layer 12 was irradiated with a laser to form an opening 14 (see FIG. 2B).
The processing condition is that the energy of one pulse is 0.2 mJ / cm.²5 shots, 0.03mJ / cm²Were irradiated by 50 shots.
[0038]
Next, the second metal layer 13 was used as a plating electrode, and a metal layer 15 having a thickness of 1 to 2 μm was formed on the second metal layer 13 at the bottom of the opening 14 by electrolytic gold plating (FIG. 2 (c). )reference).
[0039]
Next, electrolytic copper plating is performed on the opening 14 and the metal layer 15 on the second metal layer 13 using the second metal layer 13 as a plating electrode, and the conductor 14 and the first metal layer 12 are formed on the opening 14. A conductor layer 17 was formed (see FIG. 2D).
Electrolytic copper plating uses a direct plating system made by Sugawara Eugene. The method of copper plating is to apply a catalyst and apply copper plating to about 5 μm, and then perform electrolytic plating with a hole filling plating solution to form the conductor electrode 16. In the hole-filling plating, plating without voids could be performed in the conductor electrode 16 by alternately repeating electrolytic plating and electrolytic etching.
[0040]
Next, a photosensitive layer is formed on the conductor layer 17, patterned by a series of photo processes to form a resist pattern, and the conductor layer 17 and the first metal layer 12 are etched using the resist pattern as a mask. A wiring layer 18 composed of the metal layer pattern 12a and the conductor layer pattern 17a was formed, and at the same time, the second metal layer 13 was removed by etching (see FIG. 2E).
Etching conditions include ferric chloride solution double-sided spray etching, etching solution temperature of 65 ° C., spray pressure of 3 kg / cm.²Met.
[0041]
Next, a dry film resist having a thickness of 50 μm was pasted on one surface of the insulating base material 11 and the wiring layer 18 with a laminator to form a resist layer 19.
Further, the insulating base material 11 is etched to a thickness of 20 μm to form an insulating base material 11a having a thickness of 20 μm, and the metal layer 15 and a part of the conductor electrode are exposed to form an inspection electrode 21 (FIG. 2). (Refer to (f)).
Etching of the insulating substrate 11 was performed by spraying a sodium hydroxide solution (200 g / L) at 70 ° C.
[0042]
Next, the resist layer 19 is stripped with a 10% sodium hydroxide solution, and the wiring layer 18 is formed on one surface of the insulating substrate 11a having a thickness of 20 μm, and the metal layer 15 is formed on the other surface. An inspection jig 100 of the present invention in which an inspection electrode 21 of 30 μm was formed was obtained (see FIG. 2G).
[0043]
<Example 2>
First, a 9 μm-thick copper foil is laminated on one surface of an insulating base 31 made of 25 μm-thick polyimide, and a first metal layer 33 is pasted and a 30 μm-thick epoxy adhesive film is pasted on the other surface. The layer 32 was formed, and a 12 μm thick copper foil was laminated to form the second metal layer 34 (see FIG. 3A).
[0044]
Next, using a UV-YAG laser processing machine (Sumitomo Heavy Industries, Ltd.), the first metal layer 33 was irradiated with a laser to form an opening 35 (see FIG. 3B).
The processing condition is that the energy of one pulse is 0.2 mJ / cm.²5 shots, 0.03mJ / cm²Were irradiated by 50 shots.
[0045]
Next, a metal layer 36 having a thickness of 1 to 2 μm was formed on the second metal layer 34 at the bottom of the hole 35 by electrolytic plating with gold resistant to an etching solution (see FIG. 3C). .
[0046]
Next, electrolytic copper plating is performed on the opening 35 and the metal layer 36 on the second metal layer 34 using the second metal layer 34 as a plating electrode, and the conductor 35 and the first metal layer 33 are formed on the opening 35. A conductor layer 38 was formed (see FIG. 3D).
Electrolytic copper plating uses a direct plating system made by Sugawara Eugene. The method of copper plating is to apply a catalyst and apply copper plating to about 5 μm, and then perform electroplating with a hole filling plating solution to form a conductor electrode 37. In the hole-filling plating, plating without voids could be performed in the conductor electrode 37 by alternately repeating electrolytic plating and electrolytic etching.
[0047]
Next, a photosensitive layer is formed on the conductor layer 38, patterned by a series of photo processes to form a resist pattern, and the conductor layer 38 and the first metal layer 33 are etched using the resist pattern as a mask. A wiring layer 39 composed of the metal layer pattern 33a and the conductor layer pattern 38a was formed, and at the same time, the second metal layer 34 was removed by etching (see FIG. 3E).
Etching conditions include ferric chloride solution double-sided spray etching, etching solution temperature of 65 ° C., spray pressure of 3 kg / cm.²Met.
[0048]
Next, the adhesive layer 32 is dissolved and removed with a solvent such as acetone, and a part of the metal layer 36 and the conductor electrode 37 is exposed to form an inspection electrode 41. A wiring is formed on one surface of the insulating substrate 31 having a thickness of 25 μm. The inspection jig 200 of the present invention in which the inspection electrode 41 having a height of 30 μm having the metal layer 36 at the tip was formed on the other surface of the layer 39 was obtained (see FIG. 3F).
[0049]
<Example 3>
First, a 9 μm-thick copper foil was laminated on both surfaces of an insulating base material 11 made of 50 μm-thick polyimide to form a first metal layer 12 and a second metal layer 13 (see FIG. 4A).
[0050]
Next, the first metal layer 12 was patterned to form an opening mask 22 at a predetermined position of the first metal layer 12 (see FIG. 4B).
[0051]
Next, using an UV-YAG laser processing machine (Sumitomo Heavy Industries, Ltd.), the opening mask 22 of the first metal layer 12 was irradiated with laser to form the opening 14 (see FIG. 4C). ). Processing conditions are 1.5 J / cm²Met.
[0052]
Next, using the second metal layer 13 as a plating electrode, a metal layer 15 having a thickness of 1 to 2 μm was formed on the second metal layer 13 at the bottom of the opening 14 by electrolytic gold plating (FIG. 4D). )reference).
[0053]
Next, electrolytic copper plating is performed on the opening 14 and the metal layer 15 on the second metal layer 13 using the second metal layer 13 as a plating electrode, and the conductor 14 and the first metal layer 12 are formed on the opening 14. A conductor layer 17 was formed (see FIG. 4E).
Electrolytic copper plating uses a direct plating system made by Sugawara Eugene. The method of copper plating is to apply a catalyst and apply copper plating to about 5 μm, and then perform electrolytic plating with a hole filling plating solution to form the conductor electrode 16. In the hole-filling plating, plating without voids could be performed in the conductor electrode 16 by alternately repeating electrolytic plating and electrolytic etching.
[0054]
Next, a photosensitive layer is formed on the conductor layer 17, patterned by a series of photo processes to form a resist pattern, and the conductor layer 17 and the first metal layer 12 are etched using the resist pattern as a mask. A wiring layer 18 composed of one metal layer pattern 12a and a conductor layer pattern 17a was formed, and at the same time, the second metal layer 13 was removed by etching (see FIG. 4F).
Etching conditions include ferric chloride solution double-sided spray etching, etching solution temperature of 65 ° C., spray pressure of 3 kg / cm.²Met.
[0055]
Next, a dry film resist having a thickness of 50 μm was pasted on one surface of the insulating base material 11 and the wiring layer 18 with a laminator to form a resist layer 19.
Furthermore, the insulating base material 11 was etched to a thickness of 20 μm to expose a part of the metal layer 15 and the conductor electrode, thereby forming the inspection electrode 21 (see FIG. 4G). Etching of the insulating substrate 11 was performed by spraying a sodium hydroxide solution (200 g / L) at 70 ° C.
[0056]
Next, the resist layer 19 is stripped with a 10% sodium hydroxide solution, and the wiring layer 18 is formed on one surface of the insulating substrate 11a having a thickness of 20 μm, and the metal layer 15 is formed on the other surface. The inspection jig 300 of the present invention in which the inspection electrode 21 of 30 μm was formed was obtained (see FIG. 4H).
[0057]
<Example 4>
First, a 9 μm-thick copper foil is laminated on one surface of an insulating base 31 made of 25 μm-thick polyimide, and a first metal layer 33 is pasted and a 30 μm-thick epoxy adhesive film is pasted on the other surface. A layer 32 was formed, and a 12 μm thick copper foil was further laminated to form a second metal layer 34 (see FIG. 5A).
[0058]
Next, the first metal layer 33 was patterned to form an opening mask 42 at a predetermined position of the first metal layer 33 (see FIG. 5B).
[0059]
Next, using a UV-YAG laser processing machine (Sumitomo Heavy Industries, Ltd.), laser was irradiated from the opening mask 42 of the first metal layer 33 to form the opening 35 (see FIG. 5C). ). Processing conditions are 1.5 J / cm²Met.
[0060]
Next, a metal layer 36 having a thickness of 1 to 2 μm was formed on the second metal layer 34 at the bottom of the hole 35 by electrolytic plating with gold resistant to an etching solution (see FIG. 5D). .
[0061]
Next, electrolytic copper plating is performed on the opening 35 and the metal layer 36 of the second metal layer 34 using the second metal layer 34 as a plating electrode, and a conductor electrode 37 is formed on the opening 35 and a conductor is formed on the first metal layer 33. A layer 38 was formed (see FIG. 5E).
Electrolytic copper plating uses a direct plating system made by Sugawara Eugene. The method of copper plating is to apply a catalyst and apply copper plating to about 5 μm, and then perform electroplating with a hole filling plating solution to form a conductor electrode 37. In the hole-filling plating, plating without voids could be performed in the conductor electrode 37 by alternately repeating electrolytic plating and electrolytic etching.
[0062]
Next, a photosensitive layer is formed on the conductor layer 38, patterned by a series of photo processes to form a resist pattern, and the conductor layer 38 and the first metal layer 33 are etched using the resist pattern as a mask. A wiring layer 39 composed of the metal layer pattern 33a and the conductor layer pattern 38a was formed, and at the same time, the second metal layer 34 was removed by etching (see FIG. 5F).
Etching conditions include ferric chloride solution double-sided spray etching, etching solution temperature of 65 ° C., spray pressure of 3 kg / cm.²Met.
[0063]
Next, the adhesive layer 32 is dissolved and removed with a solvent such as acetone, the metal layer 36 and a part of the conductor electrode 37 are exposed, the test electrode 41 is formed, and the wiring is formed on one surface of the 25 μm-thick insulating substrate 31. The inspection jig 400 of the present invention was obtained in which the layer 39 was formed with the inspection electrode 41 having a height of 30 μm and having the metal layer 36 at the tip on the other surface (see FIG. 5G).
[0064]
【The invention's effect】
Claims of the invention1-3DescribedMade by manufacturing methodInspection jigTheSince the metal layer for improving the contact reliability is formed at the tip of the inspection electrode, accurate inspection with high contact reliability can be performed. Accordingly, it is possible to inspect a high-density object to be inspected. Claims of the invention1According to the described invention, since the height of the inspection electrode can be accurately controlled, an inspection jig capable of performing an accurate inspection can be manufactured. Further, the plating time can be shortened, and the inspection jig can be manufactured with high manufacturing efficiency. Furthermore, it is easy to make the tip of the inspection electrode thin, and it is possible to manufacture an inspection jig that can maintain good contact, has high contact reliability, and can inspect a high-density object to be inspected. is there. Claims of the invention2According to the described invention, the claims1In addition to the effect obtained by the above, it is possible to stabilize the protruding amount of the inspection electrode, and it is possible to carry out by a simple process. Claims of the invention3According to the described invention, the opening mask is provided in the first metal layer in advance, and the laser is irradiated from the opening mask to make a hole, so that the opening by the laser can be processed more easily and accurately. .
[Brief description of the drawings]
FIG. 1A is a schematic perspective view of an inspection jig 100 showing an embodiment of an inspection jig of the present invention.
FIG. 4B is a schematic cross-sectional view of the inspection jig 100 cut along the line A-A ′.
FIGS. 2A to 2G are schematic cross-sectional views of an inspection jig showing an embodiment of a method for manufacturing the inspection jig 100 of the present invention in the order of steps.
FIGS. 3A to 3F are schematic configuration cross-sectional views of an inspection jig showing another embodiment of the method of manufacturing the inspection jig 200 of the present invention in the order of steps.
FIGS. 4A to 4H are schematic cross-sectional views of an inspection jig showing another embodiment of the method for manufacturing the inspection jig 300 of the present invention in the order of steps.
FIGS. 5A to 5G are schematic cross-sectional views of an inspection jig showing another embodiment of the method of manufacturing the inspection jig 400 of the present invention in the order of steps.
6A to 6F are schematic cross-sectional views of an inspection jig showing an example of a conventional method of manufacturing an inspection jig in the order of processes.
[Explanation of symbols]
11, 11a, 31 ... Insulating base material
12, 33 …… First metal layer
12a, 33a ...... First metal pattern layer
13, 34 ... Second metal layer
14, 35 ... Opening
15, 36 …… Metal layer
16, 37 …… Conductor electrode
17, 38 ... Conductor layer
17a, 38a ... Conductor pattern layer
18, 39 …… Wiring layer
19 …… Resist layer
21, 41 ... Inspection electrode
22, 42 ... Opening mask
32 …… Adhesive layer
101 …… Metal substrate
102 …… Resist layer
103 …… Insulating base material
104 …… Chrome thin film layer
105 …… Thin film conductor layer
106 …… Opening
107 …… Conductor electrode
108 …… Conductor layer
108a …… Wiring layer
109 …… Inspection electrode

Claims (3)

A wiring layer is formed on one surface of the insulating substrate, and an inspection electrode is formed on the other surface via the insulating substrate. One end of the inspection electrode is connected to the wiring layer, and the other end of the inspection electrode is Manufacturing of an inspection jig that has the inspection electrode whose shape gradually becomes thinner toward the tip, the tip is flat, and a metal layer that increases contact reliability is formed at the tip of the inspection electrode a method, at least, the manufacturing method of inspecting jig, characterized in that it comprises the following steps.
(A) A step of forming a first metal layer on one surface of the insulating substrate and a second metal layer on the other surface.
(B) A step of drilling with a laser from the first metal layer side, forming an opening at a predetermined position of the first metal layer and the insulating base, and exposing the second metal layer at the hole bottom of the opening.
(C) A step of forming a metal layer having resistance to the etching solution for the second metal layer on the second metal layer at the bottom of the hole in the opening of the insulating base by plating.
(D) A step of performing electrolytic plating using the second metal layer as a plating electrode to form a conductor electrode in the opening of the insulating base material and a conductor layer on the insulating base material.
(E) A step of patterning the first metal layer and the conductor layer to form a wiring layer and removing the second metal layer.
(F) A resist layer is formed on one surface of the insulating base material and the wiring layer, and the other surface of the insulating base material is removed by a predetermined thickness by etching to expose a part of the metal layer and the conductor electrode. Forming a test electrode.
(G) A step of peeling off the resist layer, and producing an inspection jig in which an inspection electrode having a wiring layer on one surface of the insulating substrate and a metal layer on the other surface is formed on the other surface. A wiring layer is formed on one surface of the insulating substrate, and an inspection electrode is formed on the other surface via the insulating substrate. One end of the inspection electrode is connected to the wiring layer, and the other end of the inspection electrode is Manufacturing of an inspection jig that has the inspection electrode whose shape gradually becomes thinner toward the tip, the tip is flat, and a metal layer that increases contact reliability is formed at the tip of the inspection electrode a method, at least, the manufacturing method of inspecting jig, characterized in that it comprises the following steps.
(A) A step of forming the first metal layer on one surface of the insulating base and the second metal layer on the other surface via an easily removable adhesive layer.
(B) A step of drilling with a laser from the first metal layer side, forming an opening at a predetermined position of the first metal layer and insulation, and exposing the second metal layer at the hole bottom of the opening.
(C) A step of forming a metal layer having resistance to the etching solution for the second metal layer on the second metal layer in the opening of the insulating base material by plating.
(D) A step of performing electrolytic plating using the second metal layer as a plating electrode, and forming a conductor electrode in the openings of the insulating base material and the adhesive layer and a conductor layer on the first metal layer.
(E) A step of patterning the first metal layer and the conductor layer to form a wiring layer and removing the second metal layer.
(F) The adhesive layer is removed to expose a part of the metal layer and the conductor electrode, thereby forming an inspection electrode having a wiring layer on one surface of the insulating base and a metal layer at the tip on the other surface. The process of producing the inspection jig. When the insulating base material is drilled from the first metal layer side with a laser, the first metal layer is patterned in advance to form an opening mask, and the laser is irradiated to perform the drilling process. The manufacturing method of the inspection jig of Claim 1 or Claim 2 to do .

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