JPH09281145A - Inspecting jig with anisotropic conductive material and its manufacture - Google Patents
Inspecting jig with anisotropic conductive material and its manufactureInfo
- Publication number
- JPH09281145A JPH09281145A JP9239896A JP9239896A JPH09281145A JP H09281145 A JPH09281145 A JP H09281145A JP 9239896 A JP9239896 A JP 9239896A JP 9239896 A JP9239896 A JP 9239896A JP H09281145 A JPH09281145 A JP H09281145A
- Authority
- JP
- Japan
- Prior art keywords
- loop
- resin layer
- circuit board
- electrode
- shaped wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は半導体装置の実装基
板や半導体集積回路素子の実装用基板ならびに半導体装
置の検査用治具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting substrate, a semiconductor integrated circuit element mounting substrate, and a semiconductor device inspection jig.
【0002】[0002]
【従来技術】近年、電子機器の高機能、高性能化要求に
対応して半導体装置の入出力端子電極数が増加し、その
ピッチもますます微細化している。従来、半導体装置実
装用基板に代表される配線回路基板の電気的検査には、
針状の電極を配線基板の電極部に接触させ、電気的な導
通を確保していた。2. Description of the Related Art In recent years, the number of input / output terminal electrodes of semiconductor devices has increased in response to the demand for higher functionality and higher performance of electronic equipment, and the pitch thereof has become finer. Conventionally, electrical inspection of a printed circuit board typified by a semiconductor device mounting board,
The needle-shaped electrode was brought into contact with the electrode portion of the wiring board to ensure electrical continuity.
【0003】[0003]
【発明が解決しようとする課題】従来の配線回路基板の
検査方法では、マルチ・チップ・モジュール(複数の集
積回路素子を半導体装置内に納める方法)用の基板に代
表される高精細・高密度の配線回路基板には対応するこ
とが困難な状況にある。また、従来の検査方法では針状
の電極を基板に接触させるため、検査後の基板に検査痕
が残るという問題があった。また、被検査体と検査治具
との位置合わせが非常に困難な状況にある。In the conventional method for inspecting a wired circuit board, a high-definition, high-density represented by a board for a multi-chip module (a method for accommodating a plurality of integrated circuit elements in a semiconductor device) is used. It is difficult to deal with the printed circuit board of. Further, in the conventional inspection method, since the needle-shaped electrode is brought into contact with the substrate, there is a problem that an inspection mark remains on the substrate after the inspection. Moreover, it is very difficult to align the inspection object and the inspection jig.
【0004】[0004]
【課題を解決するための手段】本発明において上記課題
を解決するために、まず請求項1においては、絶縁性基
板の一方の面に検査用の端子電極が、もう一方の面に配
線回路が形成されており、前記端子電極は前記配線回路
と電気的に接続された配線回路基板において、前記配線
回路基板の前記端子電極にループ状のワイヤを少なくと
も1個以上形成し、前記ループ状のワイヤの高さ以上の
厚みの絶縁樹脂層を形成した後前記ループ状のワイヤが
露出するまで前記絶縁樹脂層の表面樹脂を除去して、露
出した前記ループ状のワイヤの先端を検査電極とするこ
とを特徴とする異方性導電材を有する検査治具としたも
のである。In order to solve the above problems in the present invention, first, in claim 1, a terminal electrode for inspection is provided on one surface of an insulating substrate and a wiring circuit is provided on the other surface. In the printed circuit board in which the terminal electrode is electrically connected to the wiring circuit, at least one loop-shaped wire is formed on the terminal electrode of the printed circuit board, and the loop-shaped wire is formed. After forming an insulating resin layer having a thickness equal to or higher than the height, the surface resin of the insulating resin layer is removed until the loop-shaped wire is exposed, and the tip of the exposed loop-shaped wire is used as an inspection electrode. And an inspection jig having an anisotropic conductive material.
【0005】また、請求項2においては、下記の(a)
〜(d)の一連の工程からなる請求項1記載の異方性導
電材を有する検査治具の製造方法としたものである。 (a)前記配線回路基板の前記端子電極にボンディング
性の良好な金属膜を形成する工程。 (b)前記端子電極に形成された前記金属膜にワイヤボ
ンディングによってループ状のワイヤを少なくとも1個
以上形成する工程。 (c)前記ループ状のワイヤが形成された前記端子電極
上に前記ループ状のワイヤの高さ以上の厚みの前記絶縁
樹脂層を形成する工程。 (d)前記ループ状のワイヤが露出するまで前記絶縁樹
脂層の表面樹脂を除去する工程。Further, in claim 2, the following (a)
The method for manufacturing an inspection jig having an anisotropic conductive material according to claim 1, which comprises a series of steps (d) to (d). (A) A step of forming a metal film having good bonding properties on the terminal electrodes of the printed circuit board. (B) A step of forming at least one loop-shaped wire by wire bonding on the metal film formed on the terminal electrode. (C) A step of forming the insulating resin layer having a thickness equal to or higher than the height of the loop-shaped wire on the terminal electrode on which the loop-shaped wire is formed. (D) A step of removing the surface resin of the insulating resin layer until the loop wire is exposed.
【0006】[0006]
【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。図1に本発明の検査治具の部分断面図を示
し、図2(a)〜(d)に本発明の検査治具の実施例の
製造工程を示す部分断面図を示し、図3(a)〜(c)
に本発明の検査治具の実施例の製造工程を示す斜視図を
示す。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. FIG. 1 shows a partial sectional view of an inspection jig of the present invention, FIGS. 2A to 2D show partial sectional views showing a manufacturing process of an embodiment of the inspection jig of the present invention, and FIG. ) ~ (C)
The perspective view which shows the manufacturing process of the Example of the inspection jig of this invention is shown in FIG.
【0007】両面銅張り積層板の一方の面に検査用の端
子電極10を、もう一方の面に配線回路13を形成し、
端子電極10と配線回路13はスルーホール12で電気
的に接続された配線回路基板1を作製する(図2(a)
参照)。A terminal electrode 10 for inspection is formed on one surface of a double-sided copper-clad laminate, and a wiring circuit 13 is formed on the other surface thereof.
The terminal electrode 10 and the wiring circuit 13 are electrically connected to each other through the through hole 12 to produce the wiring circuit board 1 (FIG. 2A).
reference).
【0008】配線回路基板1の端子電極10上にボンデ
ィング性の良好な金属膜を形成するため、無電解ニッケ
ルめっきならびに金めっきを行う。最初に、無電解ニッ
ケルめっきを用いて、端子電極10上にニッケル膜を形
成する。めっき厚は1μm程度析出させることが望まし
い。次に、90℃に加熱した無電解金めっき液(ELG
B511:上村工業(株)製)に10分間浸せきするこ
とで、0.1μmの金めっき膜を形成し、端子電極10
上にニッケルめっき膜と金めっき膜の2層膜からなる金
属膜を作製する。Electroless nickel plating and gold plating are performed to form a metal film having good bonding properties on the terminal electrode 10 of the printed circuit board 1. First, a nickel film is formed on the terminal electrode 10 by using electroless nickel plating. The plating thickness is preferably about 1 μm. Next, the electroless gold plating solution (ELG
B511: made by Uemura Kogyo Co., Ltd.) for 10 minutes to form a gold plating film of 0.1 μm, and the terminal electrode 10
A metal film composed of a two-layer film of a nickel plating film and a gold plating film is formed on top.
【0009】配線回路基板1の端子電極10上の金属膜
に、ワイヤボンディングマシン(UTC−50:新川
(株)製)を用いて、金線をボンディング接合して、ル
ープ状のワイヤ14を複数個形成する(図2(b)及び
図3(a)参照)。A gold wire is bonded to the metal film on the terminal electrode 10 of the printed circuit board 1 using a wire bonding machine (UTC-50: manufactured by Shinkawa Co., Ltd.) to form a plurality of loop-shaped wires 14. Individually formed (see FIG. 2B and FIG. 3A).
【0010】ループ状のワイヤ14を形成した後、絶縁
性樹脂(プロビマー:チバガイギ(株)製)をカーテン
コーター等によって配線回路基板上にコーティングし、
絶縁樹脂層15を形成する(図2(c)及び図3(b)
参照)。絶縁樹脂層15はループ状のワイヤ14が絶縁
性樹脂で完全に覆われる厚さに設定する。After forming the loop-shaped wire 14, an insulating resin (provimer: manufactured by Ciba-Geigy Co., Ltd.) is coated on the printed circuit board by a curtain coater or the like,
Form the insulating resin layer 15 (FIG. 2C and FIG. 3B)
reference). The insulating resin layer 15 is set to a thickness such that the loop-shaped wire 14 is completely covered with the insulating resin.
【0011】絶縁樹脂層15を形成した後、ループ状の
ワイヤ14が露出するまで樹脂層を研磨機によって研磨
し、ループ状のワイヤの先端部14aを検査電極とする
検査治具が得られる(図2(d)及び図3(c)参
照)。After the insulating resin layer 15 is formed, the resin layer is ground by a grinder until the loop-shaped wire 14 is exposed to obtain an inspection jig having the tip portion 14a of the loop-shaped wire as an inspection electrode ( 2 (d) and 3 (c)).
【0012】本発明の検査治具では、端子電極の絶縁樹
脂層に形成された異方性導電材によって被検査体の電極
(ボール・グリッド・アレイ用)との接触を得るように
したため、被検査体の電極に検査痕が残らず、高精細、
高密度の配線基板の検査に用いることができる。さら
に、異方性導電材を複数本使用しているため、若干位置
ずれを起こしても複数本のいずれかの異方性導電材が被
検査体の電極と接触するため、アライメント精度が緩和
される。In the inspection jig of the present invention, the anisotropic conductive material formed on the insulating resin layer of the terminal electrode is used to obtain contact with the electrode (for ball grid array) of the object to be inspected. High-definition, with no inspection marks left on the electrodes of the inspection object
It can be used for inspection of high-density wiring boards. Further, since a plurality of anisotropic conductive materials are used, even if a slight misalignment occurs, any one of the anisotropic conductive materials comes into contact with the electrode of the object to be inspected, so that the alignment accuracy is eased. It
【0013】[0013]
【実施例】以下、図面を参照しながら実施例により本発
明を詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the accompanying drawings.
【0014】ガラスエポキシの絶縁性基板11に厚さ1
8μmの銅箔が貼着された両面銅張積層板を用いて、両
面の銅箔をフォトリソグラフィー工程によってパターニ
ングして、一方の面に端子電極10、もう一方の面に配
線回路13を形成し、端子電極10と配線回路13をス
ルーホール12にて電気的導通を計った配線回路基板1
を作製した(図2(a)参照)。A glass epoxy insulating substrate 11 having a thickness of 1
Using a double-sided copper-clad laminate having a copper foil of 8 μm attached, the copper foils on both sides are patterned by a photolithography process to form a terminal electrode 10 on one surface and a wiring circuit 13 on the other surface. The wiring circuit board 1 in which the terminal electrodes 10 and the wiring circuit 13 are electrically connected through the through holes 12
Was produced (see FIG. 2A).
【0015】配線回路基板1の端子電極10上にボンデ
ィング性の良好な金属膜を形成するため、無電解ニッケ
ルめっきならびに金めっきを行う。まず、配線回路基板
1をアルカリ脱脂液(エースクリーン:奥野製薬工業
(株)製)にて70℃、30分間脱脂し、洗浄する。そ
の後、10容量%の塩酸溶液により30秒間酸洗し、塩
化パラジウム溶液(塩酸5容量%+塩化パラジウム0.
3g/l)に10秒間浸せきし、洗浄する。その後90
℃に加熱した無電解ニッケルめっき液(ニムデンLP
X:上村工業(株)製)に10分間浸せきすることで1
μm厚のニッケル膜を形成した。次に、90℃に加熱し
た無電解金めっき液(ELGB511:上村工業(株)
製)に10分間浸せきすることで、0.1μmの金めっ
き膜を形成し、端子電極10上にニッケルめっき膜と金
めっき膜の2層膜からなる金属膜を作製した。Electroless nickel plating and gold plating are performed in order to form a metal film having good bonding properties on the terminal electrodes 10 of the printed circuit board 1. First, the printed circuit board 1 is degreased with an alkaline degreasing liquid (A-screen: Okuno Chemical Industries Co., Ltd.) at 70 ° C. for 30 minutes and washed. Then, it was pickled with a 10% by volume hydrochloric acid solution for 30 seconds to obtain a palladium chloride solution (hydrochloric acid 5% by volume + palladium chloride 0.
Soak for 3 seconds in 3 g / l) and wash. Then 90
Electroless nickel plating solution (Nimden LP
X: 1 by soaking in Uemura Kogyo Co., Ltd. for 10 minutes
A μm thick nickel film was formed. Next, an electroless gold plating solution heated to 90 ° C. (ELGB511: Uemura Industry Co., Ltd.)
0.1 μm gold-plated film was formed by immersing the metal film into a metal film consisting of a two-layer film of a nickel-plated film and a gold-plated film on the terminal electrode 10.
【0016】配線回路基板1の端子電極10上の金属膜
にワイヤボンデングマシン(UTC−50:新川(株)
製)にて、金線をボンディング接合して、ループ状のワ
イヤ14を複数個形成した(図2(b)及び図3(a)
参照)。A wire bonding machine (UTC-50: Shinkawa Co., Ltd.) is formed on the metal film on the terminal electrode 10 of the printed circuit board 1.
A gold wire by bonding to form a plurality of loop-shaped wires 14 (see FIGS. 2B and 3A).
reference).
【0017】ループ状のワイヤ14形成した後、絶縁性
樹脂(フォトニース:東レ(株)製)をスピンコーター
によって配線回路基板上に数回コーティングし、ループ
状のワイヤ14の先端が完全に覆われた絶縁樹脂層15
を形成した(図2(c)及び図3(b)参照)。After the loop-shaped wire 14 is formed, an insulating resin (Photonice: manufactured by Toray Industries, Inc.) is coated on the printed circuit board several times by a spin coater to completely cover the tip of the loop-shaped wire 14. Insulated resin layer 15
Was formed (see FIG. 2 (c) and FIG. 3 (b)).
【0018】絶縁樹脂層15を形成した後、ループ状の
ワイヤ14が露出するまで樹脂層を研磨機によって研磨
し、表面の絶縁樹脂を除去し、ループ状のワイヤの先端
部14aを検査電極とする検査治具が完成した(図2
(d)及び図3(c)参照)。After forming the insulating resin layer 15, the resin layer is polished by a grinder until the loop-shaped wire 14 is exposed to remove the insulating resin on the surface, and the tip portion 14a of the loop-shaped wire is used as an inspection electrode. Inspection jig was completed (Fig. 2
(D) and FIG.3 (c)).
【0019】[0019]
【発明の効果】本発明の検査治具では、端子電極の絶縁
樹脂層に形成された異方性導電材によって被検査体の電
極(ボール・グリッド・アレイ用)との接触を得るよう
にしたため、被検査体の電極に検査痕をつけることな
く、高精細、高密度の配線基板の検査を可能にすること
ができた。さらに、異方性導電材を複数本使用している
ため、若干位置ずれを起こしても複数本のいずれかの異
方性導電材が被検査体の電極と接触するため、アライメ
ント精度が緩和された。In the inspection jig of the present invention, the anisotropic conductive material formed on the insulating resin layer of the terminal electrode is used to obtain contact with the electrode (for ball grid array) of the object to be inspected. It was possible to inspect a high-definition and high-density wiring board without making an inspection mark on the electrode of the inspection object. Further, since a plurality of anisotropic conductive materials are used, even if a slight misalignment occurs, any one of the anisotropic conductive materials comes into contact with the electrode of the object to be inspected, so that the alignment accuracy is eased. It was
【図1】本発明の実施の形態を示す部分断面図である。FIG. 1 is a partial cross-sectional view showing an embodiment of the present invention.
【図2】本発明の実施例の製造工程を示す部分断面図で
ある。FIG. 2 is a partial cross-sectional view showing the manufacturing process of the embodiment of the present invention.
【図3】本発明の実施例の製造工程を示す斜視図であ
る。FIG. 3 is a perspective view showing a manufacturing process according to an embodiment of the present invention.
1………配線回路基板 11………絶縁性基板 12………スルーホール 13………配線回路 14………ループ状のワイヤ 14a……ループ状のワイヤの先端部 15………絶縁樹脂層 15a……表面樹脂除去後の絶縁樹脂層 1 ... Wiring circuit board 11 ... Insulating board 12 ... Through hole 13 ... Wiring circuit 14 ... Loop wire 14a ... Loop wire tip 15 ... Insulating resin Layer 15a ... Insulating resin layer after surface resin removal
Claims (2)
が、もう一方の面に配線回路が形成されており、前記端
子電極は前記配線回路とスルーホールで電気的に接続さ
れた配線回路基板において、前記配線回路基板の前記端
子電極にループ状のワイヤを少なくとも1個以上形成
し、前記ループ状のワイヤの高さ以上の厚みの絶縁樹脂
層を形成した後前記ループ状のワイヤが露出するまで前
記絶縁樹脂層の表面樹脂を除去して、露出した前記ルー
プ状のワイヤの先端を検査電極とすることを特徴とする
異方性導電材を有する検査治具。1. A terminal electrode for inspection is formed on one surface of an insulating substrate, and a wiring circuit is formed on the other surface, and the terminal electrode is electrically connected to the wiring circuit through a through hole. In the wired circuit board, at least one loop-shaped wire is formed on the terminal electrode of the wired circuit board, and an insulating resin layer having a thickness equal to or greater than the height of the loop-shaped wire is formed and then the loop-shaped wire is formed. An inspection jig having an anisotropic conductive material, characterized in that the surface resin of the insulating resin layer is removed until the wire is exposed, and the tip of the exposed loop-shaped wire is used as an inspection electrode.
る請求項1記載の異方性導電材を有する検査治具の製造
方法。 (a)前記配線回路基板の前記端子電極にボンディング
性の良好な金属膜を形成する工程。 (b)前記端子電極に形成された前記金属膜にワイヤボ
ンディングによってループ状のワイヤを少なくとも1個
以上形成する工程。 (c)前記ループ状のワイヤが形成された前記端子電極
上に前記ループ状のワイヤの高さ以上の厚みの前記絶縁
樹脂層を形成する工程。 (d)前記ループ状のワイヤが露出するまで前記絶縁樹
脂層の表面樹脂を除去する工程。2. A method of manufacturing an inspection jig having an anisotropic conductive material according to claim 1, comprising the following series of steps (a) to (d). (A) A step of forming a metal film having good bonding properties on the terminal electrodes of the printed circuit board. (B) A step of forming at least one loop-shaped wire by wire bonding on the metal film formed on the terminal electrode. (C) A step of forming the insulating resin layer having a thickness equal to or higher than the height of the loop-shaped wire on the terminal electrode on which the loop-shaped wire is formed. (D) A step of removing the surface resin of the insulating resin layer until the loop wire is exposed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9239896A JPH09281145A (en) | 1996-04-15 | 1996-04-15 | Inspecting jig with anisotropic conductive material and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9239896A JPH09281145A (en) | 1996-04-15 | 1996-04-15 | Inspecting jig with anisotropic conductive material and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09281145A true JPH09281145A (en) | 1997-10-31 |
Family
ID=14053319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9239896A Pending JPH09281145A (en) | 1996-04-15 | 1996-04-15 | Inspecting jig with anisotropic conductive material and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09281145A (en) |
Cited By (4)
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US6528984B2 (en) | 1996-09-13 | 2003-03-04 | Ibm Corporation | Integrated compliant probe for wafer level test and burn-in |
US7282945B1 (en) | 1996-09-13 | 2007-10-16 | International Business Machines Corporation | Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof |
US7368924B2 (en) | 1993-04-30 | 2008-05-06 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof |
-
1996
- 1996-04-15 JP JP9239896A patent/JPH09281145A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7368924B2 (en) | 1993-04-30 | 2008-05-06 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof |
US6452406B1 (en) | 1996-09-13 | 2002-09-17 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips |
US6528984B2 (en) | 1996-09-13 | 2003-03-04 | Ibm Corporation | Integrated compliant probe for wafer level test and burn-in |
US7282945B1 (en) | 1996-09-13 | 2007-10-16 | International Business Machines Corporation | Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof |
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