JP2684424B2 - Hybrid integrated circuit - Google Patents

Description

The present invention relates to a hybrid integrated circuit, and more particularly to a terminal structure of the hybrid integrated circuit including two hybrid integrated circuit substrates.

(B) Conventional Technique A conventional hybrid integrated circuit will be described with reference to FIGS. 4 and 5.

In the hybrid integrated circuit shown in FIG. 4, a conductive path (not shown) having a predetermined shape is formed on the surface of a ceramic substrate or an insulating metal substrate (41), and a plurality of circuit elements (42) are fixed on the conductive path. A metallic lead terminal (44) is fixed to a fixed pad (not shown) continuous to a predetermined conductive path to form a hybrid integrated circuit board, and the hybrid integrated circuit board is formed into a circuit element by a resin case (43). (42) is sealed so as to be hermetically sealed, and a resin (45) is further filled to reinforce the fixing portion of the lead terminal (44).

Along with the increase in the density of hybrid integrated circuits, a hybrid integrated circuit composed of two hybrid integrated circuit boards (51) (52) as shown in FIG. 5 has been proposed.

In the figure, substrates (51) (52) are insulating metal substrates in which one surface of a metal such as aluminum is coated with a resin, and a conductive path (not shown) of a predetermined shape is formed on each substrate. A plurality of circuit elements (53) (54) are fixed to the. Further, metallic lead terminals (55) (56) for external connection are fixed to a fixing pad (not shown) continuous to a predetermined conductive path. The substrate (51) (52) on which the circuit element and the lead terminal are fixed and the hybrid integrated circuit is formed is fixed on the case member (57) so that the circuit element (53) (54) faces each other, and integrated. It In order to match the vertical pitch l of the lead terminals with the standardized inter-electrode pitch of the sockets, the lead terminals are separated from the substrate by l'at a predetermined portion and have a substantially L shape.

The hybrid integrated circuit is mounted on a main circuit board,
Alternatively, sockets (not shown) are inserted into the lead terminals (55) (56) to connect to external circuits.

(C) Problems to be Solved by the Invention In the conventional hybrid integrated circuit, since the lead terminals are deformed, the lead terminals are attached above and below the lead terminals before the work of fixing the lead terminals.
The assembly work needed a high level of skill because the lead terminal fixing part had to be correctly opposed to the conductive path by simultaneously adjusting the left and right positions and adjusting the inclination.

Further, in the conventional hybrid integrated circuit, the lead terminals must be soldered and connected to a printed circuit board or the like, and the printed circuit board is always required.

Further, as described above, the soldering process is indispensable at the time of mounting, and there is a problem that mounting of the hybrid integrated circuit becomes very complicated.

(D) Means for Solving the Problems The present invention has been made in view of the problems described above,
A hybrid integrated circuit board made of two metals whose terminals are continuously formed in a predetermined conductive path, and a hybrid integrated circuit board arranged around the two hybrid integrated circuit boards and fixed and spaced apart by a predetermined distance. A case material that forms a closed space between two substrates, a connector housing formed by two hybrid integrated circuit boards and a case material, and a resin edge cover that covers an open end of the connector housing are provided. Solve the problem of.

(E) Operation According to the present invention, since terminals are formed continuously on a predetermined conductive path on the substrate itself, no special lead terminal structure is required, and the number of parts and the number of steps are reduced.

Further, the resin edge cover that covers the open end of the connector housing prevents short-circuiting of the connector terminals due to the metal substrate, and particularly prevents short-circuiting of the connector terminals due to metal burrs that occur at the peripheral edge of the metal substrate.

(F) Example First, the sectional structure of the example will be described with reference to FIG.

The hybrid integrated circuit of the present invention comprises a hybrid integrated circuit substrate (1) (2) (hereinafter, simply referred to as a substrate) made of two metal sheets to which a plurality of circuit elements (7) (8) are fixed.
It is arranged around the two substrates (1) and (2) so as to separate and fix the two substrates (1) and (2) and form a closed space between the two substrates (1) and (2). Case materials (11)
And a connector housing formed by the two substrates (1) and (2) and the case material (11), and a resin edge cover (12) covering the open end of the connector housing.

The surfaces of the substrates (1) and (2), which are preferably made of aluminum because of their physical properties, are subjected to alumite treatment by a well-known method, and copper foils are adhered with the adhesive resins (5) and (6). Adhesive resins such as epoxy or polyimide are used for the adhesive resins (5) and (6), and the above-mentioned copper foil is previously integrated on one main surface thereof.
Selectively etching the copper foil to form a conductive path (3)
(4) is formed and extends from the predetermined conductive paths (3) and (4) at one side edge of the substrates (1) and (2) to connect the terminals (9) (10).
Are formed. The adhesive resin is made into a hard insulating resin (5) (6) by baking treatment after the adhesion.
Further, a transistor, I, is provided on the conductive path (3) (4).
Multiple circuit elements such as C, LSI or chip resistors (7)
(8) is fixed to form a hybrid integrated circuit board.

Substrates (1) and (2) to which circuit elements (7) and (8) are fixed
So that the respective circuit elements (7) and (8) face each other,
The case material (11) formed in a frame shape is fixed by using an adhesive sheet or the like at the peripheral end portions of both substrates (1) and (2), and thereafter, the substrates (1) and (2) and the case material ( A resin edge cover (12) covers the open end of the connector housing formed at the end of (11).

This resin edge cover (12) covers metal burrs such as aluminum generated at the ends of the substrates (1) and (2) during the pressing process, and the terminals (1
Short circuit between 0) and between terminals (13) on the connector side is prevented. Further, the edge cover (12) is firmly press-fitted and arranged at the open end of the connector housing so as not to be separated from the housing when the connector is attached and detached.

Further description is continued with reference to FIG. 2 which illustrates the method of external connection of the hybrid integrated circuit of the present invention.

In the figure, a resin (5), one substrate (not shown) shown by a plurality of terminals (9), a heat dissipation fin (2 ').
The other substrate (2) including the case, the case material (11) and the edge cover (12) are shown as elements of the hybrid integrated circuit, and the terminals (13) connected to the plurality of terminals (9) are provided as external connection members. A connector (14) formed and to which a flat cable (15) is connected is shown. The heat radiation fins (2 ') can be formed on both substrates or omitted depending on the purpose of use.

As shown in the figure, the hybrid integrated circuit of the present invention has a connector housing formed by the peripheral ends of two substrates (1) and (2) and a case material (11), and a connector (14) is inserted into the connector housing to form an external circuit. Connection is made.

Next, the function of the edge cover (12) will be described with reference to FIGS. 3 (A), (B) and (C) showing the sectional structure of the connector housing.

When inserting the connector into the connector housing, the contact between the housing terminals (9) (10) and the connector terminal (13) is made close, so that the width of both the housing and the connector is in a state where there is almost no gap at the time of insertion. . Therefore, it is inevitable that the edge portions of the boards (1) and (2) come into contact with the connector when the connector is inserted. Further, as shown by an arrow in FIG. 3 (A), it is unavoidable that the connector is inserted with an inclination with respect to the substrate axis, and when the connector is repeatedly inserted and removed, the edge cover (12) is covered. If not, the ends of the resins (5) and (6) are rubbed by the connector and separated as shown in FIG. As the peeling progresses further, it is worn as shown in FIG. 6C, and the metal of the substrates (1) and (2) is exposed. In addition, the thickness of the resin (5) (6) is 10
Since it is within 0 μm, the metal burr generated in the pressing process of the metal substrate and the terminal on the connector side may be rubbed before the ends of the resins (5) and (6) are peeled off or worn. As a result, the substrate metal or the terminal metal adheres between the terminals (9) and (10) and the substrates (1) and (2) to short-circuit them.

However, when the resin edge cover (12) is coated on the open end of the connector housing as in the present invention, the smooth end face shape enables smooth insertion of the connector and short circuit between the substrate and the terminal due to the metal powder. Is avoided. The edge cover (12) is particularly preferably formed of a soft resin, and by appropriately designing the thickness dimension thereof, it becomes possible to prevent connector disconnection by utilizing elasticity.

(G) Effect of the Invention As described above, according to the present invention, since terminals are formed continuously on a predetermined conductive path on the substrate itself, no special lead terminal structure is required, and the number of parts and the number of steps are reduced. To be done.

Further, since the opening end of the connector housing formed by the hybrid integrated circuit board is covered with the resin edge cover, insertion of the connector is facilitated and a short circuit between the board and the terminal is avoided. When the edge cover is made of soft resin, it is possible to prevent the connector from coming off.

Further, in the present invention, even if a large number of connectors are inserted and removed, the connector is protected by the edge cover, so that the durability is significantly improved and the reliability of the entire system is improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a hybrid integrated circuit of the present invention, FIG. 2 is a perspective view for explaining a connecting method of the hybrid integrated circuit of the present invention, and FIGS. 3 (A), (B) and (C) are respectively. Sectional views for explaining the deformation of the terminal portion due to connector insertion / removal, and FIGS. 4 and 5 are sectional views showing conventional examples. (1) (2) ... hybrid integrated circuit board, (3) (4) ...
Conductive path, (5) (6) ... resin, (7) (8) ... circuit element, (9) (10) ... terminal, (11) ... case material,
(12) …… Edge cover, (13) …… Connector side terminal, (14) …… Connector, (15) …… Flat cable.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Yuichi Ito, No. 3 Shinchi, Fuchu-cho, Aki-gun, Hiroshima Prefecture Mazda Co., Ltd. (72) Inventor, Eternal Fujita No. 3 Shinchi, Fuchu-cho, Aki-gun, Hiroshima Prefecture Mazda Within the corporation

Claims (3)

(57) [Claims] 1. A hybrid integrated circuit board made of two metals, in which terminals are continuously formed in a predetermined conductive path, and two hybrid integrated circuit boards disposed around the two hybrid integrated circuit boards. A case member that is fixedly spaced and fixed and forms an enclosed space between the substrates, a connector housing formed by the two hybrid integrated circuit boards and the case member, and a resin edge cover that covers an open end of the connector housing. And a hybrid integrated circuit. 2. The hybrid integrated circuit according to claim 1, wherein the edge cover is formed in a frame shape. 3. The hybrid integrated circuit according to claim 1, wherein the edge cover is made of a soft resin and is designed to prevent the connector from being detached due to its elasticity.