CN117750644A - Manufacturing method of printed circuit board with fully-coated side wall of bonding pad - Google Patents
Manufacturing method of printed circuit board with fully-coated side wall of bonding pad Download PDFInfo
- Publication number
- CN117750644A CN117750644A CN202311687049.4A CN202311687049A CN117750644A CN 117750644 A CN117750644 A CN 117750644A CN 202311687049 A CN202311687049 A CN 202311687049A CN 117750644 A CN117750644 A CN 117750644A
- Authority
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- China
- Prior art keywords
- gold
- bonding pad
- dry film
- side wall
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000010931 gold Substances 0.000 claims abstract description 49
- 229910052737 gold Inorganic materials 0.000 claims abstract description 49
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 238000007747 plating Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000000151 deposition Methods 0.000 claims abstract description 15
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 8
- 238000005553 drilling Methods 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 241000416536 Euproctis pseudoconspersa Species 0.000 claims 1
- 238000005253 cladding Methods 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to the technical field of PCB boards, and discloses a manufacturing method of a printed circuit board with fully-coated bonding pad side walls. The manufacturing method comprises the following steps: s1, providing a substrate, attaching a dry film on the substrate, exposing and developing to expose a gold-plated bonding pad area and electroplating clamping points at the frame position; s2, gold plating is carried out, and the top surface of the gold-plated bonding pad is obtained; s3, removing the film, pasting a dry film, exposing and developing to expose the area needing copper removal, and etching to remove copper; s4, removing films, namely sticking a dry film on the substrate, and exposing and developing the dry film to cover the top surface and the copper surface of the bonding pad and expose the side wall of the bonding pad; s5, depositing gold, and forming a gold layer on the side wall of the bonding pad to obtain the printed board with the fully-covered side wall of the bonding pad. The manufacturing method can realize full cladding of the side wall of the bonding pad of the circuit board, avoid the residue of a process wire and improve the dimensional accuracy of the bonding pad; and the design of the gold-plated circuit board is not limited by the size of the spacing between the gold-plated pads, so that the designability and the manufacturability of the gold-plated circuit board are improved.
Description
Technical Field
The invention belongs to the technical field of PCB boards, and particularly relates to a manufacturing method of a printed circuit board with fully-coated bonding pad side walls.
Background
Bonding pads refer to a metal wafer used to connect component pins to Printed Circuit Board (PCB) leads in electronic component surface mount technology. The bonding pad is usually made of tin-copper alloy or gold-plated material, and has good conductivity and corrosion resistance. The bonding pad plays a vital role in component installation, can ensure reliable connection between components and the PCB, and can provide better mechanical strength and thermal stability. In the soldering process, a layer of soldering paste is coated on the bonding pad, and the soldering paste is melted by heating and forms firm soldering connection with the pins of the component and the PCB wires.
At present, many gold-plated circuit boards require a gold-plated layer to wrap the side wall of a bonding pad, so that only when patterns are etched, a process wire is designed to connect the gold-plated bonding pad with a frame copper sheet to form a conductive network, and the process wire is treated after the bonding pad is gold-plated. The specific process is as follows: etching a gold-plated bonding pad on the substrate, designing a gold-plated wire, and connecting the frame with the bonding pad; then the whole board is stuck with a dry film, and the position of the gold-plated bonding pad is made into a windowing effect, and the dry film windowing is required to be larger than the gold-plated bonding pad, so that the gold-plated bonding pad is not covered by the anti-gold-plated dry film due to alignment deviation, and the partial exposure of a lead connected with the gold-plated bonding pad is also caused; after windowing, carrying out gold plating treatment on the welding disc (the gold plating welding disc is conducted through frame surface copper and a process wire); finally, the gold-plating-resistant dry film is removed, and the process wire is processed. The process has a complex preparation method, and irregular bumps remain on the edge of the bonding pad after the process wire is processed, so that the dimensional accuracy of the bonding pad designed by a customer is affected. Specifically, chemical etching is generally used to remove the process wire when the number of process wires is large, and manual cutting is generally used to remove the process wire when the number of process wires is small and the process wire is long, or mechanical cutting is performed by a drilling and milling machine or the like. No matter which way is used for processing, the bonding pads and the wire connecting positions have technological wire residues, when the bonding pad spacing is smaller than 10mil, the technological wires designed between the bonding pads cannot be effectively protected, when the dry film is pasted, the bonding pads are propped against the dry film, the technological wire positions cannot be effectively covered, gold permeation is caused during gold plating, and the residual technological wires are lengthened.
Therefore, it is needed to provide a method for manufacturing a printed circuit board with fully-covered bonding pads, which not only can fully cover the side walls of the bonding pads, but also can reduce or avoid the residues of process wires and improve the dimensional accuracy of the bonding pads.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a manufacturing method of a printed circuit board with fully-coated bonding pad side walls. The manufacturing method not only can realize full cladding of the side wall of the bonding pad, but also can reduce or avoid the residue of the process wire and improve the dimensional accuracy of the bonding pad.
The invention provides a manufacturing method of a printed circuit board with fully-coated bonding pad side walls, which comprises the following steps:
s1, providing a substrate, attaching a dry film on the substrate, exposing and developing to expose a gold-plated bonding pad area and electroplating clamping points at the frame position;
s2, gold-plating is carried out on the gold-plated pad area, and the gold-plated pad top surface is obtained;
s3, removing the film, pasting a dry film, exposing and developing to expose the area needing copper removal, and etching to remove copper;
s4, removing films, namely sticking a dry film on the substrate, and covering the top surface and the copper surface of the bonding pad by the dry film after exposure and development to expose the side wall of the bonding pad;
s5, depositing gold, and forming a gold layer on the side wall of the bonding pad to obtain the printed board with the fully-covered side wall of the bonding pad.
In step S1 of the above manufacturing method, the dry film is a gold plating resistant dry film.
In the step S1 of the above manufacturing method, before the step of attaching the gold plating resistant dry film, the method further includes drilling a photo-imaging alignment hole in the substrate.
In step S4 of the above manufacturing method, the dry film is a gold deposit resistant dry film.
In step S5 of the above manufacturing method, a plurality of pads are provided.
In step S5 of the manufacturing method, the spacing between adjacent bonding pads is less than 10mil.
In step S5 of the above manufacturing method, after forming the gold layer, a step of removing the dry film, that is, removing the anti-deposition dry film covering the top surface and the copper surface of the bonding pad is further included.
In step S5 of the above manufacturing method, the step of removing the dry film further includes the steps of welding prevention, text, molding, OSP and packaging in sequence.
More specifically, the manufacturing method of the printed circuit board with the fully-coated side wall of the bonding pad comprises the following steps:
s1, providing a substrate, and drilling a light imaging alignment hole on the substrate; then pasting a gold-plating-resistant dry film on the substrate, exposing and developing to expose a gold-plating pad area and electroplating clamping points at the frame position;
s2, gold-plating is carried out on the gold-plated pad area, and the gold-plated pad top surface is obtained;
s3, removing the gold-plating-resistant dry film, pasting the dry film, exposing a region needing copper removal after exposure and development, and etching to remove copper;
s4, removing the dry film in the step S3, attaching an anti-sinking gold dry film on the substrate, and covering the top surface and the copper surface of the bonding pad with the anti-sinking Jin Ganmo after exposure and development to expose the side wall of the bonding pad;
s5, depositing gold, forming a gold layer on the side wall of the bonding pad, and removing the anti-deposition Jin Ganmo in the step S4; and then the solder mask, characters, molding, OSP and packaging are carried out to obtain the printed board with the fully-covered gold side wall of the bonding pad.
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the manufacturing method of the printed circuit board with the fully-coated side wall of the bonding pad, the processing mode of gold plating and side wall gold sinking of the top surface of the bonding pad is adopted, so that the process wire is omitted, and the salient points and copper exposure at the residual positions of the process wire are avoided. The bonding operation requirement can be met by plating gold on the top surface of the bonding pad; and the side wall is deposited with gold, so that the copper exposure of the side wall can be effectively prevented. The preparation method provided by the invention not only realizes the full-gold-coating effect of the side wall of the bonding pad, but also ensures that the gold-coated circuit board is not limited by the spacing of the bonding pad without considering the process wire during design, and the printed circuit board without the process wire residue can be prepared when the spacing of the bonding pad is smaller than 10mil, and has high dimensional accuracy of the bonding pad and full-gold-coating of the side wall of the bonding pad.
(2) The manufacturing method provided by the invention can realize full cladding of the side wall of the bonding pad, avoid the residue of a process wire and improve the dimensional accuracy of the bonding pad; and the design of the gold-plated circuit board is not limited by the size of the spacing between the gold-plated pads, so that the designability and the manufacturability of the gold-plated circuit board are greatly improved.
The invention is described in further detail below with reference to the drawings and the detailed description.
Drawings
FIG. 1 is a process flow diagram of a printed circuit board with fully encapsulated solder pad sidewalls according to an embodiment of the present invention;
fig. 2 is a schematic processing diagram of step S1 in the manufacturing method according to the embodiment of the present invention;
FIG. 3 is a specific process diagram of a printed circuit board with fully encapsulated solder pad sidewalls according to an embodiment of the present invention;
reference numerals illustrate:
the manufacturing method comprises the following steps of a substrate-100, a registration hole-110, a frame position-120, an electroplating clamping point-130, a dry film-140 and a gold-plated bonding pad area-200.
Detailed Description
In order to make the technical solutions of the present invention more apparent to those skilled in the art, the following examples will be presented. It should be noted that the following examples do not limit the scope of the invention.
Referring to fig. 1, the invention provides a method for manufacturing a printed circuit board with fully-coated pad side walls, which comprises the following steps:
s1, providing a substrate 100, attaching a dry film 140 on the substrate 100, exposing and developing to expose a gold-plated pad area 200 and electroplating clamping points 130 of a frame position 120; further, before the step of applying the dry film 140, the method further includes drilling a photo-imaging alignment hole 110 on the substrate 100 (a schematic processing diagram of the step is shown in fig. 2). It will be appreciated that the dry film 140 is applied in this step to protect the copper side of the printed circuit board and other areas where gold plating is not required during the gold plating process, and thus the applied dry film 140 is preferably a dry film resistant to gold plating.
S2, gold-plating is carried out on the gold-plated pad area 200, and the gold-plated pad top surface is obtained; at this time, only the top surface of the bonding pad is plated with a gold layer, and the side wall is free of a gold layer.
S3, removing the film, pasting a dry film, exposing and developing to expose the area needing copper removal, and etching to remove copper.
S4, film stripping, namely sticking a dry film on the substrate 100, and exposing and developing to cover the top surface and the copper surface of the bonding pad and expose the side wall of the bonding pad. It will be appreciated that the dry film is applied in this step to protect the top and copper surfaces of the gold plated pads during the gold deposition process, and therefore the dry film applied is preferably a dry film resistant to gold deposition.
S5, depositing gold, and forming a gold layer on the side wall of the bonding pad to obtain the printed board with the fully-covered side wall of the bonding pad.
Further, in step S5, a plurality of pads are provided, and the pitch of adjacent pads is less than 10mil.
Further, in step S5, after the gold layer is formed, a step of removing the dry film, that is, removing the anti-deposition dry film covering the top surface and the copper surface of the bonding pad is further included.
Further, in step S5, the steps of solder mask, text, molding, OSP and packaging are further sequentially included after the step of removing the dry film.
Referring to fig. 3, the embodiment of the invention also provides a method for manufacturing a printed circuit board with fully-coated pad side walls, which specifically comprises the following steps:
(1) providing a substrate 100, and drilling a light-imaging alignment hole 110 on the substrate 100;
(2) attaching a gold-plating-resistant dry film on the substrate 100, exposing and developing to expose the gold-plating pad region 200 and the electroplating clamping points 130 of the printed circuit board frame positions 120;
(3) gold-plating the gold-plated pad region 200 to obtain a gold-plated pad top surface;
(4) removing the gold-plating-resistant dry film in the step (2);
(5) re-attaching a common dry film, exposing and developing to expose the area needing copper removal;
(6) etching to remove copper;
(7) removing the dry film in the step (5);
(8) then pasting a gold deposit resistance dry film on the substrate 100, exposing and developing, and covering the top surface and the copper surface of the bonding pad by the gold deposit resistance Jin Ganmo to expose the side wall of the bonding pad;
(9) depositing gold, and forming a gold layer on the side wall of the bonding pad;
and (3) removing the anti-gold deposition dry film in the step (8), and then performing the steps of welding prevention, characters, forming, OSP and packaging to obtain the printed board with the fully-coated gold on the side wall of the bonding pad.
It should be noted that in the description of the present invention, if an azimuth or positional relationship is indicated in relation to an azimuth description, for example, up, down, front, rear, left, right, etc., the azimuth or positional relationship is based on that shown in the drawings, only for convenience of describing the present invention and simplifying the description, and does not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured or operated in a specific azimuth, and should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and above, below, within, etc. are understood to include the present number. If any, first or second, etc. are described for the purpose of distinguishing between technical features only and not for the purpose of indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the invention, unless explicitly defined otherwise, terms such as arrangement, mounting, connection, etc. should be construed broadly and the specific meaning of the terms in the invention can be reasonably determined by a person skilled in the art in combination with the specific content of the technical solution. The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (9)
1. The manufacturing method of the printed circuit board with the fully-coated side wall of the bonding pad is characterized by comprising the following steps of:
s1, providing a substrate, attaching a dry film on the substrate, exposing and developing to expose a gold-plated bonding pad area and electroplating clamping points at the frame position;
s2, gold-plating is carried out on the gold-plated pad area, and the gold-plated pad top surface is obtained;
s3, removing the film, pasting a dry film, exposing and developing to expose the area needing copper removal, and etching to remove copper;
s4, removing films, namely sticking a dry film on the substrate, and covering the top surface and the copper surface of the bonding pad by the dry film after exposure and development to expose the side wall of the bonding pad;
s5, depositing gold, and forming a gold layer on the side wall of the bonding pad to obtain the printed board with the fully-covered side wall of the bonding pad.
2. The method according to claim 1, wherein in step S1, the dry film is a gold plating resistant dry film.
3. The method according to claim 2, further comprising drilling alignment holes for photoimaging on the substrate before the step of applying the gold plating resist dry film in step S1.
4. A method according to any one of claims 1 to 3, wherein in step S4, the dry film is a gold deposit resistant dry film.
5. A method according to any one of claims 1-3, wherein in step S5, the pads are provided in plurality.
6. The method of claim 5, wherein in step S5, the pitch between adjacent pads is less than 10 mils.
7. The method according to claim 4, further comprising a step of removing a dry film of anti-deposition gold after forming the gold layer in step S5.
8. The method according to claim 7, wherein in step S5, the step of removing the anti-deposition dry film further comprises the steps of solder mask, text, molding, OSP and packaging in this order.
9. The method of manufacturing of claim 8, comprising the steps of:
s1, providing a substrate, and drilling a light imaging alignment hole on the substrate; then pasting a gold-plating-resistant dry film on the substrate, exposing and developing to expose a gold-plating pad area and electroplating clamping points at the frame position;
s2, gold-plating is carried out on the gold-plated pad area, and the gold-plated pad top surface is obtained;
s3, removing the gold-plating-resistant dry film, pasting the dry film, exposing a region needing copper removal after exposure and development, and etching to remove copper;
s4, removing the dry film in the step S3, attaching an anti-sinking gold dry film on the substrate, and covering the top surface and the copper surface of the bonding pad with the anti-sinking Jin Ganmo after exposure and development to expose the side wall of the bonding pad;
s5, depositing gold, forming a gold layer on the side wall of the bonding pad, and removing the anti-deposition Jin Ganmo in the step S4; and then the solder mask, characters, molding, OSP and packaging are carried out to obtain the printed board with the fully-covered gold side wall of the bonding pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311687049.4A CN117750644A (en) | 2023-12-08 | 2023-12-08 | Manufacturing method of printed circuit board with fully-coated side wall of bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311687049.4A CN117750644A (en) | 2023-12-08 | 2023-12-08 | Manufacturing method of printed circuit board with fully-coated side wall of bonding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117750644A true CN117750644A (en) | 2024-03-22 |
Family
ID=90282616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311687049.4A Pending CN117750644A (en) | 2023-12-08 | 2023-12-08 | Manufacturing method of printed circuit board with fully-coated side wall of bonding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117750644A (en) |
-
2023
- 2023-12-08 CN CN202311687049.4A patent/CN117750644A/en active Pending
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