CN104936378B - A kind of pcb board and its draw craft - Google Patents
A kind of pcb board and its draw craft Download PDFInfo
- Publication number
- CN104936378B CN104936378B CN201510305982.XA CN201510305982A CN104936378B CN 104936378 B CN104936378 B CN 104936378B CN 201510305982 A CN201510305982 A CN 201510305982A CN 104936378 B CN104936378 B CN 104936378B
- Authority
- CN
- China
- Prior art keywords
- pcb board
- copper foil
- jack
- top layer
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Abstract
The present invention discloses a kind of pcb board and its draw craft, the pcb board, including PCB substrate, PCB substrate installs the jack of plug-in components, the positioning hole of fixed installation and the first via for realizing interconnected provided with several, the periphery of the jack is further provided with 16 the second vias, jack pad edge and the second via edges beeline are 0.5 1mm, the second via inwall is covered with via copper foil, it is connected at the top of via copper foil with top layer copper foil, bottom is connected with bottom copper foil, realizes the interconnection of PCB substrate top layer and bottom.Pcb board and its draw craft of the present invention, solve double-layered circuit board pad via caused by plug-in components dismounting in maintenance and damage, the problem of causing wiring board to damage.
Description
Technical field
The present invention relates to a kind of pcb board and its draw craft, belong to technical field of PCB board.
Background technology
Pcb board(Circuit board)It is the carrier of electronic circuit, any circuit design is required for being installed in one piece of circuit board
On, it can just realize its function.In double-deck or multi-layer PCB board drawing process, it will usually directly insert welding component pin
Hole 1-1 serves as the via of top layer and bottom cabling, as shown in Figure 1-2, during production and use, when plug-in components damage
, it is necessary to which component is removed from pcb board 1-2 when badly needing repairing or change, and the pin of component in this process
1-3 is easy to take up jack copper foil 1-4 by jack tin material 1-7, or even top layer copper foil 1-5 is also taken up, and causes top layer copper
Paper tinsel 1-5 and bottom copper foil 1-6 disconnects, and then open circuit is failed, and it is difficult to repair that the situation of this pcb board damage, which is,.
In view of this, the present inventor is studied this, specially develops a kind of pcb board and its draw craft, this case by
This is produced.
The content of the invention
It is an object of the invention to provide a kind of pcb board and its draw craft, solves double-layered circuit board plug-in unit in maintenance
Pad via damages caused by component is dismantled, the problem of causing wiring board to damage.
To achieve these goals, solution of the invention is:
A kind of pcb board, including PCB substrate, the PCB substrate are provided with jacks of several installation plug-in components, consolidated
The positioning hole of Dingan County's dress and the first via for realizing interconnected, the periphery of the jack are further provided with 1-6 second
Via, jack pad edge and the second via edges beeline are 0.5-1mm, and the second via inwall is covered with via copper
Paper tinsel, via copper foil top are connected with top layer copper foil, and bottom is connected with bottom copper foil, realizes the interconnection of PCB substrate top layer and bottom.
Preferably, a diameter of 0.5-0.6mm of second via.
Preferably, the via copper thickness of second via is 0.1-0.2mm.
Preferably, being filled with tin material in second via, the electric current that can increase by the second via after filling tin material is cut
Area.
Preferably, a diameter of 0.8-1.2mm of the jack, increases 0.2-0.3mm on the basis of leg diameter.
Preferably, the periphery of the jack is further provided with 1-4 the second vias, the quantity of the second via is according to flowing through
Depending on the size of electric current, when flow through electric current it is larger when, it is necessary to the second via it is some more, when flow through electric current it is smaller when, it is necessary to
Two vias are less.
The draw craft of above-mentioned pcb board, comprises the following steps:
1)According to circuit arrangement protracting circuit schematic diagram, and component package corresponding to selecting;
2)Pcb board shape is drawn as requested;
3)Pcb board cloth version:The pcb board space of a whole page is laid out according to requirements, sets several that plug-in components are installed
Jack, fixed installation positioning hole and realize the first via of interconnected, while set 1-6 in jack periphery
Second via, jack pad edge and the second via edges beeline are 0.5-1mm;
4)Spread copper:Required according to safety, EMC is required and the size by electric current, the pcb board progress to being laid out completion
Copper, including top layer copper foil, bottom copper foil, jack copper foil, the first via copper foil and the second via copper foil are spread, will be identical by copper foil
Network node is chained up, and for needing jack to be protected, is first connected to prior arrangement with the mode of paving copper in pcb board bottom
The second good via, then by the second via be connected on pcb board top layer other cablings on consolidated network node, pad or
The via of person first;
5)Plate face arranges:The position number arrangement of component is neat.
The pcb board obtained by above-mentioned draw craft when in use, when the plug-in components damage in jack is changed,
Plug-in components pin is extracted into jack, jack copper foil is easy to be taken away by pin, or even top layer pad is heaved out, and causes PCB
Plate damages.Pcb board of the present invention sets up 1-6 the second vias in jack periphery, when pcb board damages, will can change
Plug-in components afterwards are still installed in original jack, and plug-in components pin is welded in into jack pad using flatiron and Xi Si
On, now the jack copper foil in jack no longer plays a part of linking together bottom copper foil and top layer copper foil, jack effect
Simply allow tin material to be filled between component's feet and jack copper foil, further fixation, top layer are played to component's feet
On pad be also no longer the part of top layer copper foil for needing to connect, now, by the second via for being arranged on jack periphery
Interior via copper foil, bottom copper foil and top layer copper foil are linked together, and ensure that the electric of PCB substrate bottom and top layer copper foil
Conduction property.
Pcb board of the present invention sets up several second vias in jack periphery on the basis of existing technology, works as plug-in unit
During component damage, the component of damage need to only be unloaded, then first-class component can is installed, greatly reducing two
The possibility of secondary damage circuit board, and the possibility that monoblock circuit board is scrapped caused by being damaged in producing maintenance process because of pcb board, together
When also reduce the difficulty of circuit board repair, accelerate maintenance speed.Moreover, whole pcb board drawing process is succinctly, conveniently, without
Additional process and cost.
The present invention is described in further detail below in conjunction with drawings and the specific embodiments.
Brief description of the drawings
Fig. 1 is pcb board partial structural diagram of the prior art;
Fig. 2 is Fig. 1 top view;
Fig. 3 is the pcb board partial structural diagram of the present embodiment;
Fig. 4 is Fig. 3 top view;
Fig. 5 is Fig. 3 upward view;
Fig. 6 is pcb board partial structural diagram after the present embodiment maintenance.
Embodiment
As in Figure 3-5, a kind of pcb board, including PCB substrate 1, the PCB substrate 1 are provided with several installation plug-in unit members
The jack 2 of device, the positioning hole of fixed installation and the first via for realizing interconnected, the periphery of the jack 2 enter one
Step is provided with 1-6 the second vias 3, and the edge of jack pad 4 and the edge beeline of the second via 3 are 0.5-1mm, second mistake
The inwall of hole 3 is connected covered with via copper foil 5, the top of via copper foil 5 with top layer copper foil 6, and bottom is connected with bottom copper foil 7, realizes
The interconnection of PCB substrate top layer and bottom.The diameter of second via is less than the diameter of jack 2, generally 0.5-0.6mm.Institute
The via copper thickness for stating the second via is 0.1-0.2mm, a diameter of generally 0.8-1.2mm of the jack, straight in pin
Add 0.2-0.3mm on the basis of footpath.
The setting quantity of each the second via of periphery 3 of jack 2 is depending on the size for flowing through electric current, generally 1-4, when
Flow through electric current it is larger when, it is necessary to the second via 3 it is some more, when flow through electric current it is smaller when, it is necessary to the second via 3 it is less.Jack 2
Interior to be provided with jack copper foil 8, plug-in components pin 9 is fixed in jack by jack tin material 10.Filled in second via 3
There is tin material, the current cross section product of the second via 3 can be increased after filling tin material.
The draw craft of above-mentioned pcb board, comprises the following steps:
1)Protracting circuit schematic diagram:According to selected circuit arrangement drawing principle figure, on the basis of selected circuit arrangement
On, while consider the factors such as space, temperature rise, power, corresponding component package is selected, is loaded on schematic diagram;
2)Draw pcb board shape:PCB shape is drawn out using Line instruments, concrete shape is depending on project demand;
3)Pcb board cloth version:According to safety, radiating, plate face size, project provide fabric swatch space and in next step paving copper
Prepare etc. under some requirements, each component is laid out, placing plug-in components(Such as transformer, electrochemical capacitor)
When, to be decided for the jack for needing to serve as top layer copper foil 6 and the connection via of bottom copper foil 7, and near jack pad 4
The second via 3 is put down in relevant position, and the edge of jack pad 4 and the edge beeline of the second via 3 are 0.5-1mm, and the second mistake
Hole 3 can not have influence on other components nearby.When the second via 3 needs super-high-current, multiple second vias can be set
3, become 2-3 or 4-5 by original 1, can specifically be calculated according to current density;
4)Spread copper:Required according to safety, EMC is required and the size by electric current, the pcb board progress to being laid out completion
Copper is spread, draws out the copper foil shape of needs, and identical network node is chained up by copper foil.For needing jack to be protected
2, the second via 3 arranged in advance is first connected to the mode of paving copper in the bottom of PCB substrate 1, then connect by the second via 3
Other cabling, pad or first vias on consolidated network node on to the top layer of PCB substrate 1;
5)Arrange plate face:The position number arrangement of component is neat, and what can be unified is placed on the left side or the right side of corresponding component
Side, in order to which which position clearly distinguished on pcb board corresponds to which component.
The pcb board obtained by above-mentioned draw craft when in use, when the plug-in components damage in jack 2 is carried out more
Changing, plug-in components pin 9 is extracted into jack 2, jack copper foil 8 is easy to be taken away by pin 9, or even top layer pad 4 is heaved out,
Pcb board is caused to damage., can will more when pcb board damages by setting up in the periphery of jack 2 1-6 the second vias 3 in pcb board
Plug-in components after changing still are installed in original jack 3, and plug-in components pin is welded in into jack using flatiron and Xi Si
On pad 4, as shown in fig. 6, now the jack copper foil 8 in jack 2 no longer plays and is connected to bottom copper foil 6 and top layer copper foil 7
One role, the effect of jack 2 simply allow tin material 10 can be filled into component's feet 9 and the bottom pad 4 of jack copper foil 8/ it
Between, play further fixation to component's feet 9, the pad 4 on top layer is also no longer need to connect one of top layer copper foil 6
Point, now, can be by bottom copper foil 7 and top layer copper foil by being arranged in the second via of the periphery of jack 23 via copper foil 5
6 link together, and ensure that the electrically conducting performance of PCB substrate bottom and top layer copper foil.After installation, except jack copper foil
8 and top layer pad 4 damage, the circuit of monoblock pcb board is stood intact, and circuit board can be avoided in the prior art with normal work
Because via copper foil and top layer pad damage, the problem of causing circuit board to fail.
Above-described embodiment and schema and non-limiting product form of the invention and style, any art it is common
The appropriate change or modification that technical staff is done to it, it all should be regarded as not departing from the patent category of the present invention.
Claims (7)
1. a kind of draw craft of pcb board, it is characterised in that comprise the following steps:
1)According to circuit arrangement protracting circuit schematic diagram, and component package corresponding to selecting;
2)Pcb board shape is drawn as requested;
3)Pcb board cloth version:The pcb board space of a whole page is laid out according to requirements, inserting for several installation plug-in components is set
Hole, fixed installation positioning hole and realize the first via of interconnected, while set 1-6 second in jack periphery
Via, jack pad edge and the second via edges beeline are 0.5-1mm;
4)Spread copper:Required according to safety, EMC requirement and the size by electric current, the pcb board for being laid out completion is spread
Copper, including top layer copper foil, bottom copper foil, jack copper foil, the first via copper foil and the second via copper foil, by copper foil by identical net
Network node is chained up, and for needing jack to be protected, is first connected to the mode of paving copper in pcb board bottom and arranged in advance
The second via, then by the second via be connected on pcb board top layer other cablings on consolidated network node, pad or
First via;
5)Plate face arranges:The position number arrangement of component is neat.
A kind of 2. draw craft of pcb board as claimed in claim 1, it is characterised in that:The second via inwall covered with
Via copper foil, via copper foil top are connected with top layer copper foil, and bottom is connected with bottom copper foil, realizes PCB substrate top layer and bottom
Interconnection.
A kind of 3. draw craft of pcb board as claimed in claim 1, it is characterised in that:Second via it is a diameter of
0.5-0.6mm。
A kind of 4. draw craft of pcb board as claimed in claim 1, it is characterised in that:The via copper foil of second via
Thickness is 0.1-0.2mm.
A kind of 5. draw craft of pcb board as claimed in claim 1, it is characterised in that:Tin is filled with second via
Material.
A kind of 6. draw craft of pcb board as claimed in claim 1, it is characterised in that:A diameter of 0.8- of the jack
1.2mm。
A kind of 7. draw craft of pcb board as claimed in claim 1, it is characterised in that:The periphery of the jack is provided with 1-4
Second via.
Priority Applications (1)
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CN201510305982.XA CN104936378B (en) | 2015-06-05 | 2015-06-05 | A kind of pcb board and its draw craft |
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CN201510305982.XA CN104936378B (en) | 2015-06-05 | 2015-06-05 | A kind of pcb board and its draw craft |
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CN104936378A CN104936378A (en) | 2015-09-23 |
CN104936378B true CN104936378B (en) | 2018-01-09 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108966484A (en) * | 2018-08-02 | 2018-12-07 | 临沂朝日电子有限公司 | A kind of laser power supply circuit plate and preparation method thereof |
CN109413850B (en) * | 2018-12-12 | 2020-06-05 | 珠海格力电器股份有限公司 | Improved design method for PCB (printed circuit board) packaging of plug-in component |
CN110808237A (en) * | 2019-10-16 | 2020-02-18 | 中国电子科技集团公司第十三研究所 | Miniaturized anti-interference circuit packaging structure and manufacturing method thereof |
Citations (3)
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CN1360465A (en) * | 2000-12-19 | 2002-07-24 | 株式会社东芝 | Parts mounting baseplate and making method therefor |
CN103906353A (en) * | 2012-12-25 | 2014-07-02 | 大连崇达电路有限公司 | Aluminum-based HDI/BUM printed circuit board and photo-induced etching hole forming method |
CN204721717U (en) * | 2015-06-05 | 2015-10-21 | 新际电子元件(杭州)有限公司 | A kind of pcb board |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN201608971U (en) * | 2009-10-28 | 2010-10-13 | 国基电子(上海)有限公司 | Circuit board |
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2015
- 2015-06-05 CN CN201510305982.XA patent/CN104936378B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1360465A (en) * | 2000-12-19 | 2002-07-24 | 株式会社东芝 | Parts mounting baseplate and making method therefor |
CN103906353A (en) * | 2012-12-25 | 2014-07-02 | 大连崇达电路有限公司 | Aluminum-based HDI/BUM printed circuit board and photo-induced etching hole forming method |
CN204721717U (en) * | 2015-06-05 | 2015-10-21 | 新际电子元件(杭州)有限公司 | A kind of pcb board |
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Address after: 310000 Dongzhou Industrial Function Area No. three, Dongzhou street, Hangzhou City, Zhejiang Province, 36 Patentee after: New time electronic component (Hangzhou) Co., Ltd. Address before: Hangzhou City, Zhejiang province 310000 Qiutao Road No. 489 China Mansion seven buildings near the river Patentee before: New time electronic component (Hangzhou) Co., Ltd. |