WO2020143254A1

WO2020143254A1 - Implementation method of intelligent card module, and intelligent card module

Info

Publication number: WO2020143254A1
Application number: PCT/CN2019/109044
Authority: WO
Inventors: 王晓虎; 王幼君; 罗迎
Original assignee: 北京握奇智能科技有限公司; 北京握奇数据股份有限公司
Priority date: 2019-01-07
Filing date: 2019-09-29
Publication date: 2020-07-16
Also published as: CN109800845A

Abstract

An implementation method of an intelligent card module, and the intelligent card module. The method comprises: using a double-layer circuit board to manufacture an intelligent card module, and enabling the double-layer circuit board to be connected by means of a via hole, the double-layer circuit board comprising a first PCB and a second PCB (S1); arranging a plurality of modules on the first PCB in a sheet splicing manner, and reducing the area of a single product according to the standard (S2); installing a chip on the first PCB (S3); and replacing gold wire bonding with aluminum wire bonding, enabling the bonded aluminum wires to conform to the parallel design of the PCB, and finally performing chip packaging (S4). According to the implementation method of an intelligent card module and the intelligent card module, electromagnetic compatibility is well achieved by the double-layer board design of card products, all modules are arranged in a special makeup mode, and the productivity is improved; by replacing gold wire bonding with aluminum wires, the costs are reduced, and risks caused in the aluminum wire bonding process are avoided by means of via hole connection and via hole position design.

Description

Method for realizing smart card module and smart card module

Technical field

The invention relates to the technical field of smart cards, in particular to a method for implementing a smart card module and a smart card module.

Background technique

With the rapid development of communication chips, there are more and more chips that support multiple applications, and the pin definition of the chip often changes. The pin definition of some chips can be wired according to the traditional card without generating gold wire. Crossover, but the pins of some chips have changed. If you still make wire connections according to the original pin definition of the smart card chip, sometimes there will be gold wire crossovers, although it is said that through wire arc and other bonding technologies To control the short-circuit risk brought by the intersection of the gold wires, but there is still a certain risk after all. Since the wire arc can be controlled, there must be an increase in packaging costs.

Summary of the invention

In view of the defects in the prior art, the object of the present invention is to provide a method for implementing a smart card module and a smart card module, which can achieve electromagnetic compatibility, increase productivity, and reduce costs.

To achieve the above objectives, the technical solutions adopted by the present invention are as follows:

A method for implementing a smart card module includes the following steps:

S1. Use a double-layer circuit board to make a smart card module, and connect the double-layer circuit board through a via. The double-layer circuit board includes a first PCB board and a second PCB board;

S2. Arrange multiple modules on the first PCB board by sheet imposition, and reduce the area of a single product according to the standard;

S3. Install a chip on the first PCB board;

S4. The aluminum wire bonding is used to replace the gold wire bonding and the parallel design of the aluminum bonding wires conforms to the parallel design of the PCB board, and finally the chip packaging.

Further, in the method for implementing a smart card module as described above, in step S1, the via hole is provided at the outermost edge of the double-layer circuit board and punched into half holes.

Further, as described above, in a method for implementing a smart card module, in step S1, the via hole is provided at an intermediate position of the double-layer circuit board.

Further, as described above, in a method for implementing a smart card module, in step S2, the standard is the ISO7816 standard.

Further, as described above, in a method for implementing a smart card module, in step S2, the plurality of modules include: an I/O module, a clock signal module, a reset signal module, a power supply voltage module, a GND module, and a variable power supply voltage Module.

The present invention also provides a smart card module, including: a double-layer circuit board, that is, a first PCB board and a second PCB board, the first PCB board is provided with a plurality of modules arranged by sheet imposition, the The double-layer circuit boards are connected through vias, and a chip is installed on the first PCB board, wherein the chips are bonded by aluminum wires and the bonded aluminum wires conform to the parallel design of the PCB board.

Further, in a smart card module as described above, the via hole is provided at the outermost edge of the double-layer circuit board and cut into half holes by punching, or is provided at the middle position of the double-layer circuit board.

Further, as mentioned above, in a smart card module, the plurality of modules include: an I/O module, a clock signal module, a reset signal module, a power supply voltage module, a GND module, and a variable power supply voltage module.

Further, a smart card module as described above, the size of the smart card module conforms to the ISO7816 standard.

Further, as mentioned above, a smart card module, the smart card module is a SIM card, a UIM card, a USIM card or a PSAM card.

The beneficial effects of the present invention are as follows: a method for implementing a smart card module and a smart card module provided by the present invention, through the double-layer board design of card products, electromagnetic compatibility is better achieved, and each module is provided by a special imposition method Arrangement improves production capacity, replaces gold wire bonding with aluminum wires, reduces costs, and avoids the risks caused by the bonding process of aluminum wires through the design of via connection and via location.

BRIEF DESCRIPTION

1 is a schematic flowchart of a method for implementing a smart card module provided in an embodiment of the present invention;

2 is a front view of an existing product provided in an embodiment of the present invention;

3 is a rear view of an existing product provided in an embodiment of the present invention;

4 is a schematic structural diagram of an existing product provided in an embodiment of the present invention;

FIG. 5 is a schematic diagram of bonding connections of existing products provided in an embodiment of the present invention;

6 is a schematic diagram of via connection of a double-layer circuit board provided in an embodiment of the present invention;

7 is a schematic diagram of dimensions of the ISO7816 standard provided in an embodiment of the present invention;

8 is a contact definition table of the ISO7816 standard provided in an embodiment of the present invention;

9 is a schematic structural diagram of a single product provided in an embodiment of the present invention;

10 is a chip pin layout diagram provided in an embodiment of the present invention;

11 is a schematic diagram of the bonding effect of the aluminum wire provided in the embodiment of the present invention;

12 is a schematic diagram of a smart card module provided with a via hole in an intermediate position provided in an embodiment of the present invention;

FIG. 13 is a schematic diagram of a smart card module provided with vias at the edges provided by an embodiment of the present invention.

In the drawings, 1, chip, 2, gold wire, 3, encapsulant, 4, substrate, 5, glue, 6, gold layer, via, 8, wire, 9, aluminum wire.

detailed description

The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.

As shown in FIG. 1, a method for implementing a smart card module includes the following steps:

S1. A double-layer circuit board is used to make a smart card module, and the double-layer circuit board is connected through a via. The double-layer circuit board includes a first PCB board and a second PCB board;

The via hole is set at the outermost edge of the double-layer circuit board and punched into half holes. Or, place the via in the middle of the double-layer circuit board.

The standard is the ISO7816 standard.

Multiple modules include: I/O module, clock signal module, reset signal module, power supply voltage module, GND module, and variable power supply voltage module.

S3. Install the chip on the first PCB board;

As shown in FIG. 4, the existing smart card module includes: a gold layer 6, a substrate 4 is provided on the gold layer 6, the chip 1 is fixed on the substrate 4 through the glue 5, the chip 1 is bonded through the gold wire 2, and finally through the package The sealant 3 is encapsulated. Existing products use traditional strips, as shown in Figure 2-3. Before encapsulation, the chip is placed on the strip for wire bonding. When the pin definition of the chip changes, there is a risk of gold wire crossing if the above wire bonding is also used, as shown in Figure 5. Or there are certain requirements for wiring because of electromagnetic compatibility. In the present invention, a double-layer board is used for wiring via holes to avoid the risk of crossover. As shown in Figure 6, the upper and lower metal layers are connected through vias 7 and wires 8 to solve the risk of gold wires crossing. Even if the pins of the chip change differently, they will be routed on the bonding surface Way to avoid pins with cross risks.

The invention adopts sheet imposition to increase the number of products per unit area. To increase the number of modules per unit area by imposition, and to reduce the area of a single product according to the ISO7816 standard, the structure of a single product is shown in Figure 9. Figure 7 is a schematic diagram of the dimensions of the ISO7816 standard. Figure 8 is the contact definition table of the ISO7816 standard. After the above-mentioned imposition method, the product per unit area can be increased by about 40%, which increases the production capacity and reduces the cost.

In the present invention, the aluminum wire is substituted for the gold wire, because the cost of the gold wire is much greater than the cost of the aluminum wire, and the current that the aluminum wire can pass from a unit cross-sectional area is in line with product requirements. Therefore, the replacement of the aluminum wire with the gold wire from the product application can meet the product requirements. In order to reduce the cost, the gold wire is replaced with the aluminum wire 9, as shown in FIG. 11, there is a risk of short-circuiting the end of the aluminum wire, because the pin spacing of various card chips is relatively small, as shown in FIG. 10. In order to improve the risk of shorting caused by aluminum wire bonding, the double-layer board is designed to ensure the consistency of the aluminum wire tail, and the bonding aluminum wire conforms to the parallel design of the PCB board, so that there will be no short circuit Risk, but the cost of the thin plate of the double-layer board is very high, not only need to make the via hole as small as possible, but also fill the via hole to achieve the effect, so that the cost of the product is too high. In order to solve the cost problem, if the via is made to the edge, it is cut into half holes by punching, as shown in Figure 13, or the via is placed in the middle, as shown in Figure 12, which will not affect the appearance effect , And can also reduce the cost of the plate.

An embodiment of the present invention also provides a smart card module, including: a double-layer circuit board, that is, a first PCB board and a second PCB board, the first PCB board is provided with a plurality of modules arranged by sheet imposition, double-layer The circuit boards are connected through vias, and the first PCB board is provided with chips, wherein the chips are bonded by aluminum wires and the bonded aluminum wires conform to the parallel design of the PCB board.

The via hole is set at the outermost edge of the double-layer circuit board and cut into half holes by punching, or is set at the middle position of the double-layer circuit board.

The size of the smart card module conforms to the ISO7816 standard.

The smart card module is a SIM card, UIM card, USIM card or PSAM card.

The beneficial effects brought by the technical solution of the present invention include:

1. Through the double-layer board design of card products to achieve better electromagnetic compatibility.

2. The double-layer board design can realize the cross-risk caused by wire bonding when the chip's PAD distribution is unreasonable.

3. The cost is reduced by imposition design and the replacement of the gold wire by the aluminum wire, and the special design of the PCB is used to avoid the risks that the aluminum wire may bring during the bonding process, and the product cost is better reduced.

Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. In this way, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

A method for implementing a smart card module is characterized by including:

S1. Use a double-layer circuit board to make a smart card module, and connect the double-layer circuit board through a via. The double-layer circuit board includes a first PCB board and a second PCB board;

S2. Arrange multiple modules on the first PCB board by sheet imposition, and reduce the area of a single product according to the standard;

S3. Install a chip on the first PCB board;

S4. The aluminum wire bonding is used to replace the gold wire bonding and the parallel design of the aluminum bonding wires conforms to the parallel design of the PCB board, and finally the chip packaging.
The method for implementing a smart card module according to claim 1, characterized in that, in step S1, the via hole is disposed at the outermost edge of the double-layer circuit board and punched into half holes.
The method for implementing a smart card module according to claim 1, characterized in that, in step S1, the via hole is provided at an intermediate position of the double-layer circuit board.
The method for implementing a smart card module according to claim 1, wherein in step S2, the standard is the ISO7816 standard.
The method for implementing a smart card module according to claim 1, wherein in step S2, the plurality of modules include: an I/O module, a clock signal module, a reset signal module, a power supply voltage module, and a GND module, And variable power supply voltage module.
A smart card module is characterized by comprising: a double-layer circuit board, that is, a first PCB board and a second PCB board, the first PCB board is provided with a plurality of modules arranged by sheet imposition, the The double-layer circuit boards are connected through vias, and a chip is installed on the first PCB board, wherein the chips are bonded by aluminum wires and the bonded aluminum wires conform to the parallel design of the PCB board.
The smart card module according to claim 6, wherein the via hole is provided at the outermost edge of the double-layer circuit board and cut into a half-hole by punching, or is provided in the middle of the double-layer circuit board position.
The smart card module according to claim 6, wherein the plurality of modules include: an I/O module, a clock signal module, a reset signal module, a power supply voltage module, a GND module, and a variable power supply voltage module.
The smart card module according to claim 6, wherein the size of the smart card module conforms to the ISO7816 standard.
The smart card module according to claim 6, wherein the smart card module is a SIM card, a UIM card, a USIM card or a PSAM card.