CN209447207U - A kind of smart card module - Google Patents
A kind of smart card module Download PDFInfo
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- CN209447207U CN209447207U CN201920019769.6U CN201920019769U CN209447207U CN 209447207 U CN209447207 U CN 209447207U CN 201920019769 U CN201920019769 U CN 201920019769U CN 209447207 U CN209447207 U CN 209447207U
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- module
- smart card
- pcb board
- via hole
- bonding
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Abstract
The utility model discloses a kind of smart card modules, it include: double-layer circuit board, that is the first pcb board and the second pcb board, first pcb board is equipped with the multiple modules arranged by way of sheet material layout, it is attached between double-layer circuit board by via hole, chip is installed on first pcb board, wherein chip passes through the Parallel Design for meeting pcb board between Al wire bonding and bonding aluminum steel.A kind of smart card module provided by the utility model, electromagnetic compatibility is preferably realized by the doubling plate design of card class product, each module is arranged by special layout mode, improve production capacity, gold thread bonding is substituted by aluminum steel, it reduces costs, caused risk during the bonding of aluminum steel is avoided by the design that via hole connected and crossed hole site.
Description
Technical field
The utility model relates to field of intelligent cards, and in particular to a kind of smart card module.
Background technique
With the fast development of communication chip, support that the chip more applied is also more and more, the pin definitions of chip
Changing frequent occurrence, the pin definitions of some chips can carry out routing according to traditional card, the intersection of gold thread will not be generated,
But there is the pin of some chips but to be changed, if beaten also according to the pin definitions of original intelligent card chip
Line connection, the case where sometimes intersecting there is gold thread, although controlling gold thread halved belt by bonding techniques such as banks
Short-circuit risks come, but after all or there is certain risk since carry out can with control bank, that is certainly existed
The increase of encapsulation overhead.
Utility model content
It in view of the deficiencies in the prior art, can be with the purpose of this utility model is to provide a kind of smart card module
It realizes electromagnetic compatibility, improves production capacity, reduce cost.
To achieve the above object, the technical solution adopted in the utility model is as follows:
A kind of smart card module, comprising: double-layer circuit board, i.e. the first pcb board and the second pcb board, on first pcb board
Equipped with the multiple modules arranged by way of sheet material layout, it is attached between the double-layer circuit board by via hole, it is described
Chip is installed on first pcb board, wherein the chip is by meeting the parallel of pcb board between Al wire bonding and bonding aluminum steel
Design.
Further, the most edge of the double-layer circuit board is arranged in a kind of smart card module as described above, the via hole
And by being punched into half bore.
Further, the interposition of the double-layer circuit board is arranged in a kind of smart card module as described above, the via hole
It sets.
Further, a kind of smart card module as described above, the multiple module includes: I/O module, clock signal mould
Block, reset signal module, supply voltage module, GND module and varying supply voltage module.
Further, a kind of smart card module as described above, the size of the smart card module meet ISO7816 standard.
Further, a kind of smart card module as described above, the smart card module be SIM card, UIM card, usim card or
PSAM card.
The utility model has the beneficial effects that: a kind of smart card module provided by the utility model, is produced by card class
The doubling plate design of product preferably realizes electromagnetic compatibility, is arranged by special layout mode each module, is improved
Production capacity, substitutes gold thread bonding by aluminum steel, reduces costs, and the design that hole site is connected and crossed by via hole avoids aluminum steel
Bonding during caused by risk.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the smart card module provided in the utility model embodiment；
Fig. 2 is the front elevation of the existing product provided in the utility model embodiment；
Fig. 3 is the back view of the existing product provided in the utility model embodiment；
Fig. 4 is the structural schematic diagram of the existing product provided in the utility model embodiment；
Fig. 5 is the routing connection schematic diagram of the existing product provided in the utility model embodiment；
Fig. 6 is the via hole connection schematic diagram of the double-layer circuit board provided in the utility model embodiment；
Fig. 7 is the scale diagrams of the ISO7816 standard provided in the utility model embodiment；
Fig. 8 is that the contact of the ISO7816 standard provided in the utility model embodiment defines table；
Fig. 9 is the structural schematic diagram of the single product provided in the utility model embodiment；
Figure 10 is the chip pin distribution map provided in the utility model embodiment；
Figure 11 is the bonding effect schematic diagram of the aluminum steel provided in the utility model embodiment；
Figure 12 is the smart card module schematic diagram that middle position is arranged in the via hole provided in the utility model embodiment.
In attached drawing, 1, chip, 2, gold thread, 3, encapsulating compound, 4, substrate, 5, glue, 6, layer gold, via hole, 8, conducting wire, 9, aluminum steel.
Specific embodiment
The utility model is described in further detail with specific embodiment with reference to the accompanying drawings of the specification.
As shown in Figure 1, a kind of smart card module, comprising: double-layer circuit board, i.e. the first pcb board and the second pcb board, first
Pcb board is equipped with the multiple modules arranged by way of sheet material layout, is attached between double-layer circuit board by via hole, the
Chip is installed on one pcb board, wherein chip passes through the Parallel Design for meeting pcb board between Al wire bonding and bonding aluminum steel.
Via hole is arranged in the most edge of double-layer circuit board and by being punched into half bore.Or double-layer circuit board is arranged in via hole
Middle position.
Multiple modules include: I/O module, clock signal module, reset signal module, supply voltage module, GND module,
And varying supply voltage module.
The size of smart card module meets ISO7816 standard.Smart card module is SIM card, UIM card, usim card or PSAM
Card.
As shown in figure 4, existing smart card module includes: layer gold 6, layer gold 6 is equipped with substrate 4, by glue 5 by chip 1
It is fixed on substrate 4, chip 1 is encapsulated by 2 bonding of gold thread finally by encapsulating compound 3.Existing product uses traditional item
Chip before encapsulation, is placed on progress routing connection on band as Figure 2-3 by band.When the pin definitions of chip occur
When variation, if also there is the risk of gold thread intersection using above-mentioned routing, as shown in Figure 5.Or because electromagnetic compatibility etc.
Aspect needs cabling to have certain requirement.The utility model carries out cabling via hole by doubling plate, avoids in the presence of the wind intersected
Danger.It is connected as shown in fig. 6, being realized upper and lower two metal layer by via hole 7 and conducting wire 8, to solve, there is the wind that gold thread intersects
Danger, even if different variations has occurred in the pin of chip, bonding face by by way of cabling there is intersect risk
Pin carries out evacuation and opens.
The utility model can increase the product quantity of unit area using sheet material layout.Come by using the mode of layout
Increase the module number of unit area as far as possible, and reduces the area of single product according to ISO7816 standard, single production
The structure of product is as shown in Figure 9.Fig. 7 is the scale diagrams of ISO7816 standard.Fig. 8 is that the contact of ISO7816 standard defines table.
By above-mentioned layout mode, it can increase by about 40% or so product in unit area, improve production capacity, reduce costs.
Al wire bonding is substituted gold thread by the utility model, since the cost of gold thread is far longer than the cost of aluminum steel, and aluminium
Line from unit cross-sectional area can by electric current meet product demand.So being answered using aluminum steel is replaced gold thread from product
With product demand can be met.In order to reduce cost, gold thread is changed into aluminum steel 9, as shown in figure 11, the line tail of aluminum steel exists
Be shorted risk, since the lead pin pitch of all kinds of card chips is smaller, as shown in Figure 10.In order to improve Al wire bonding cause it is short
The risk connect is designed to doubling plate to guarantee the consistency of aluminum steel line tail, also to make to meet the parallel of pcb board between bonding aluminum steel
Design, thus there is no the risks of short circuit, but the thin plate cost of doubling plate is very high, not only needs as far as possible via hole
Do it is small, also to carry out via hole filling to reach effect, in this way, the cost of product is with regard to higher.In order to solve the problems, such as cost, such as
Via hole is accomplished most edge by fruit, by being punched into half bore, as shown in Figure 1, via hole is accomplished to intermediate position, such as Figure 12 institute
Show, neither influences appearance in this way, and the cost of plate can also be reduced.
The utility model embodiment also provides a kind of implementation method of smart card module, comprising the following steps:
S1, smart card module is made using double-layer circuit board, and is attached double-layer circuit board by via hole, double-layer electric
Road plate includes the first pcb board and the second pcb board；
The most edge of double-layer circuit board is arranged in via hole and by being punched into half bore.Alternatively, being arranged via hole in bilayer
The middle position of circuit board.
S2, multiple modules on the first pcb board are arranged by way of sheet material layout, and list is reduced according to standard
The area of product；
Standard is ISO7816 standard.
Module includes: I/O module, clock signal module, reset signal module, supply voltage module, GND module, and
Varying supply voltage module.
S3, the chip on the first pcb board；
S4, the Parallel Design for meeting pcb board between gold thread bonding and bonding aluminum steel is replaced by Al wire bonding, finally carry out
Chip package.
The technical solution of the utility model bring beneficial effect includes:
1, electromagnetic compatibility is preferably realized by the doubling plate design of card class product.
2, it may be implemented to cause routing bring to intersect wind when the PAD irrational distribution of chip by the design of doubling plate
Danger.
3, replacing gold thread by layout design and aluminum steel reduces cost, and is avoided by the special designing of PCB
Aluminum steel possible risk during bonding, preferably reduces the cost of product.
Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art
Novel spirit and scope.If in this way, these modifications and variations of the present invention belong to the utility model claims and
Within the scope of its equivalent technology, then the utility model is also intended to include these modifications and variations.
Claims (6)
1. a kind of smart card module characterized by comprising double-layer circuit board, i.e. the first pcb board and the second pcb board, described
One pcb board is equipped with the multiple modules arranged by way of sheet material layout, is carried out between the double-layer circuit board by via hole
It connects, chip is installed on first pcb board, wherein the chip is by meeting PCB between Al wire bonding and bonding aluminum steel
The Parallel Design of plate.
2. a kind of smart card module according to claim 1, which is characterized in that the via hole is arranged in the odt circuit
The most edge of plate and by being punched into half bore.
3. a kind of smart card module according to claim 1, which is characterized in that the via hole is arranged in the odt circuit
The middle position of plate.
4. a kind of smart card module according to claim 1, which is characterized in that the multiple module includes: I/O module,
Clock signal module, reset signal module, supply voltage module, GND module and varying supply voltage module.
5. a kind of smart card module according to claim 1, which is characterized in that the size of the smart card module meets
ISO7816 standard.
6. a kind of smart card module according to claim 1, which is characterized in that the smart card module is SIM card, UIM
Card, usim card or PSAM card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920019769.6U CN209447207U (en) | 2019-01-07 | 2019-01-07 | A kind of smart card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920019769.6U CN209447207U (en) | 2019-01-07 | 2019-01-07 | A kind of smart card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209447207U true CN209447207U (en) | 2019-09-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920019769.6U Active CN209447207U (en) | 2019-01-07 | 2019-01-07 | A kind of smart card module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109800845A (en) * | 2019-01-07 | 2019-05-24 | 北京握奇智能科技有限公司 | A kind of implementation method of smart card module and a kind of smart card module |
-
2019
- 2019-01-07 CN CN201920019769.6U patent/CN209447207U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109800845A (en) * | 2019-01-07 | 2019-05-24 | 北京握奇智能科技有限公司 | A kind of implementation method of smart card module and a kind of smart card module |
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