CN102937663A - Packaging structure and method for kernel module of intelligent electricity meter - Google Patents

Packaging structure and method for kernel module of intelligent electricity meter Download PDF

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Publication number
CN102937663A
CN102937663A CN 201110233805 CN201110233805A CN102937663A CN 102937663 A CN102937663 A CN 102937663A CN 201110233805 CN201110233805 CN 201110233805 CN 201110233805 A CN201110233805 A CN 201110233805A CN 102937663 A CN102937663 A CN 102937663A
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intelligent
chips
packaging
meter
electricity
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CN 201110233805
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Chinese (zh)
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CN102937663B (en )
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刘璟
谢伟东
李天石
田漪婷
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北京天中磊智能科技有限公司
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48095Kinked
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

The invention discloses a packaging structure for a kernel module of an intelligent electricity meter. The packaging structure comprises a substrate, a plurality of intelligent electricity meter functional chips, bonding wires, a protection layer and a ball grid array (BGA), wherein the substrate is used for bearing a plurality of chips, the plurality of the intelligent electricity meter functional chips are arranged at preset positions on the substrate surface, the bonding wires achieve electrical connection between the functional chips and circuits on the substrate, the protection layer is covered on the functional chips and the bonding wires, and the BGA is formed on the back side of the substrate. The packaging structure is compact, so that the area and the size of the whole module are reduced greatly. The invention further provides a packaging method for the kernel module of the intelligent electricity meter.

Description

智能电表核心模块的封装结构及封装方法 Packaging structure and packaging method of the smart meter core module

技术领域 FIELD

[0001] 本发明涉及芯片封装技术领域,特别涉及一种智能电表核心模块的封装结构及其封装方法。 [0001] The present invention relates to a chip packaging technology, and particularly relates to a packaging structure and packaging method of a smart meter core modules.

背景技术 Background technique

[0002] 随着人们对电子产品的要求向小型化、多功能、环保型等方向的发展,人们努力寻求将电子系统越做越小,集成度越来越高,功能越做越多,越来越强。 [0002] As people on the requirements of electronic products to the development direction of miniaturization, multi-functional, environmentally friendly and other people trying to find the electronic system becomes smaller and smaller, more integrated, multi-functional bigger and more be stronger.

[0003] 传统的智能电表模块,是将各个封装好的功能子电路最后通过相应的逻辑连接起来,这需要外接大量的布局布线来完成这一连接,从而会占据电路板上大量的面积,也增加走线难度。 [0003] Traditional smart meter module, is a function of the respective sub-circuit encapsulated last connected by respective logical up, which requires a large amount of external layout to complete this connection, which will occupy a large area on the circuit board, and increase the difficulty of alignment. 同时,由于电路板上的线路尺寸和过孔尺寸也过大,使整个系统的面积和体积也会跟着加大。 Meanwhile, since the size of the circuit board and the via hole size is too large, so that the whole system area and volume increase will follow. 这不但使整个智能电表模块的封装结构尺寸过大,也导致制造成本上升。 This not only makes the overall package size of the smart meter module is too large, the manufacturing cost increases.

[0004] 传统的智能电表封装结构越来越无法满足人们对电子产品小型化、高集成度的要求。 [0004] The traditional smart meter package increasingly unable to meet people's requirements for miniaturization of electronic products, high level of integration.

发明内容 SUMMARY

[0005] 本发明提供一种智能电表核心模块的封装结构及封装方法,以解决现有智能电表核心模块封装结构的上述问题。 [0005] The present invention provides a package structure and method of packaging an intelligent meter core modules, in order to solve the above smart meter core module package structure. 本发明另外提供一种智能电表核心模块的封装方法。 The present invention further provides a method of packaging a smart meter core modules.

[0006] 本发明提供一种智能电表核心模块的封装结构,包括: [0006] The present invention provides a smart meter core module package, comprising:

[0007] 用于承载多个芯片的基板; [0007] a plurality of chip carrier substrate;

[0008] 设置于基板表面上预定位置的复数个智能电表功能芯片; [0008] disposed on a predetermined position on the substrate surface a plurality of smart meter function chip;

[0009] 实现所述各个功能芯片与基板上电路之间电联接的键合引线; [0009] implementing the respective functions on the chip and the substrate circuit electrically coupled between the bonding wire;

[0010] 覆盖所述功能芯片以及键合引线的保护层; [0010] The function chip and a protective covering layer of bond wires;

[0011] 形成与所述基板背面的BGA(Ball Grid Array)焊球阵列。 [0011] The array of solder balls is formed in the rear surface of the substrate BGA (Ball Grid Array).

[0012] 可选的,所述基板为单层或多层化合物印刷线路板,在所述基板表面预留芯片的贴合位置周边设置有金丝压焊焊盘。 Peripheral bonding position [0012] Optionally, the substrate is a single or multilayer printed wiring board compound, the substrate surface is provided with reservation chip wire bonding pads.

[0013] 可选的,在所述基板的背面设置有BGA植球需要的焊盘金属。 [0013] Alternatively, the back surface of the substrate provided with a metal pad BGA ball needs.

[0014] 可选的,形成所述金丝压焊焊盘的材料铜、镍、金中的一种或其合金;形成所述BGA植球需要的焊盘金属的材料包括铜、镍、金中的一种或其合金。 Material such as copper, nickel, gold, or alloys thereof [0014] Alternatively, the wire bonding pad is formed; a metal material forming the BGA ball pad needs include copper, nickel, gold of one or alloys thereof.

[0015] 可选的,智能电表功能芯片包括MCU芯片、485芯片、计量芯片、ESAM,存储器、逻辑电路和时钟芯片及其他用于实现电表功能分立元器件。 [0015] Alternatively, the smart meter function chip includes MCU chip, the chip 485, the measurement chip, ESAM, memory, logic circuits, and clock chip meter, and other functions for implementing the discrete components.

[0016] 可选的,所述保护层为有机聚合物材料形成的塑封胶,其厚度和面积足以包覆基板表面的智能电表功能芯片、键合引线以及压焊焊盘。 [0016] Alternatively, the adhesive protective plastic layer is an organic polymeric material, and having a thickness sufficient to cover the area of ​​smart metering function chip surface of the substrate, and a bond wire bonding pads.

[0017] 可选的,形成所述键合引线材料包括金、铜或者所述金或铜合金。 [0017] Optionally, the material forming the bonding wire include gold, copper, or gold, or a copper alloy.

[0018] 可选的,所述BGA焊球阵列为钎料金属。 [0018] Optionally, the array is a BGA ball solder metal.

[0019] 本发明还提供一种智能电表核心模块的封装方法,包括如下步骤: [0019] The present invention further provides a method of packaging a smart meter core module, comprising the steps of:

[0020] 提供用于基板,在所述基板表面芯片的贴合位置周边设置有金丝压焊焊盘,所述基板中设置有连接智能电表功能芯片的连接电路; [0020] providing a substrate, and attached to the peripheral surface of the chip bonding position of the substrate is provided with a wire bonding pad, the substrate is provided with a connection circuit connected to a smart meter function chip;

[0021] 将所述智能电表功能芯片贴装于所述基板表面预定的指定位置; [0021] The smart meter function chip mounted on the substrate surface a predetermined specified position;

[0022] 通过引线将所述各个功能芯片的引线焊盘与所述基板表面相应的金丝压焊焊盘相连接; [0022] by the respective leads of the corresponding function chip pad and the substrate surface lead wire bonding pad is connected;

[0023] 在所述基板表面形成包覆所述基板表面的智能电表功能芯片、键合引线以及压焊焊盘的保护层; [0023] The coated surface of the substrate is formed on the surface of the substrate smart meter function chip, the bonding wire and the bonding pad protective layer;

[0024] 在所述基板背面形成BGA焊球阵列。 [0024] BGA ball grid array is formed in the rear substrate.

[0025] 可选的,在将所述智能电表功能芯片贴装于所述基板表面的步骤还包括如下子步骤: [0025] Optionally, the smart meter function chip mounted on the surface of the substrate step further comprises the substeps of:

[0026] 对基板进行预热; [0026] The preheating of the substrate;

[0027] 在预热后的基板表面预定位置涂胶; [0027] predetermined position in the rubberized surface of the preheated substrate;

[0028] 将智能电表芯片与基板表面涂胶位置相对准; [0028] The surface of the gumming position smart meter chip and the substrate is aligned;

[0029] 将智能电表芯片贴装于基板表面涂胶位置。 [0029] The die is attached to the surface of smart meters gumming position of the substrate.

[0030] 可选的,将智能电表芯片贴装于基板表面涂胶位置之后,还包括对所述基板高温处理,固化智能电表芯片的步骤。 [0030] Alternatively, the smart meter gumming position after the die is attached to the substrate surface, further comprising a high temperature treatment of the substrate, the curing step smart meter chip.

[0031] 可选的,所述保护层为一层或一层以上的塑封胶。 [0031] Alternatively, the protective layer is a plastic adhesive of one or more layers.

[0032] 可选的,采用点胶或者涂敷的方式在基板上表面形成所述塑封胶,并加温固化。 [0032] Alternatively, the use of dispensing or coating the surface of the mold compound manner on a substrate, and heat curing.

[0033] 可选的,在基板的背面通过C4工艺回流形成BGA焊球阵列。 [0033] Alternatively, the rear surface of the substrate is formed by a ball grid array BGA C4 process reflux.

[0034] 可选的,还包括如下步骤:对完成封装的整个模块切片,并做性能检测。 [0034] Optionally, further comprising the steps of: slicing complete the module package, and performance testing.

[0035] 与现有技术相比,本发明具有以下优点:本发明的智能电表核心模块的封装结构将电表系统中所用的各个不同大小尺寸型号的裸芯片,通过集成为一体,形成一个高密度,低损耗,低成本的小型电表模块,使得整个模块的面积和体积都大大减小;进一步的,本结构中电表模块中的各个芯片间的走线距离变短,更利于提高信号处理的速度,提高电表模块的性能。 [0035] Compared with the prior art, the present invention has the following advantages: a smart meter core module package structure of the present invention to various types of metering systems sizes used in the die, the integrated together to form a high density , low-loss, low-cost small meter module, the entire module so that the area and volume are greatly reduced; further, this configuration the distance between the traces in each meter module chip becomes shorter, more conducive to improve the signal processing speed improve the performance of the meter module.

[0036] 此外,本发明的方法成本低且易于控制,便于大规模量产。 [0036] Further, the method is low cost and easy control of the present invention, ease of mass production.

附图说明 BRIEF DESCRIPTION

[0037] 图I为本发明的智能电表核心模块的封装结构的实施例的剖视图; [0037] The cross-sectional view of an embodiment of a package structure of the core module of FIG smart meter I of the present invention;

[0038] 图2为本发明的智能电表核心模块的封装结构的实施例中智能电表芯片于基板表面分布的俯视图; [0038] a top view of an embodiment of a package structure of FIG smart meter core module 2 of the present invention a smart meter chip distribution on the substrate surface;

[0039] 图3至图6为本发明的智能电表核心模块的封装方法的各个步骤后形成的结构的示意图。 Schematic structure formed after the various steps of the packaging method smart meter core modules [0039] Figures 3 to 6 of the present invention.

具体实施方式 detailed description

[0040] 在下面的描述中阐述了很多具体细节以便于充分理解本发明。 [0040] numerous specific details are set forth in the following description in order to provide a thorough understanding of the present invention. 但是本发明能够以很多不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本发明内涵的情况下做类似推广,因此本发明不受下面公开的具体实施的限制。 However, the present invention can be in many other ways than to the embodiments described herein, those skilled in the art can make similar extensions without departing from the intension of the present invention, the present invention is not limited so particular embodiments disclosed below.

[0041] 下面结合附图对本发明的智能电表核心模块的封装结构的实施例进行详细描述。 Drawings, embodiments of the package structure of the smart meter core module of the present invention will be described in detail [0041] below in conjunction.

[0042] 图I为本发明的智能电表核心模块的封装结构的实施例的剖视图。 [0042] The cross-sectional view of the package of FIG smart meter core module I of the present embodiment of the invention. 请参看图1,本发明的实施例中,智能电表核心模块封装结构包括基板101,设置于基板101表面上预定位置的复数个智能电表功能芯片(图I中仅仅示出第一功能芯片104和第二功能芯片105);实现所述各个功能芯片与基板上电路之间电联接的键合引线106 ;覆盖所述功能芯片以及键合引线的保护层107 ;形成与所述基板背面的BGA(Ball Grid Array)焊球阵列108。 Referring to Figure 1, embodiments of the present invention, the smart meter core module package structure includes a substrate 101, 101 disposed on the surface of the substrate a plurality of predetermined positions of the smart meter function chips (FIG. I shows only the first chip 104 and functions the second function chip 105); implementing the respective functions of the chip and the substrate circuit electrically coupled between the bond wires 106; covering the functional chip and bond wires 107 of the protective layer; forming a back surface of the substrate BGA ( Ball Grid array) balls array 108.

[0043] 其中,所述基板101用于实现多芯片间逻辑连接并对芯片提供支撑。 [0043] wherein, the substrate 101 for implementing a logical connection between the multi-chip and chip provides support. 其可以是单层或多层化合物印刷电路板。 Which compound may be a single layer or a multilayer printed circuit board. 在所述基板101内部设置有一层以上的金属布线层,形成连接电路。 Disposed within the substrate 101 has more than one layer of the metal wiring layer, forming a connection circuit. 其用以根据芯片间的逻辑关系实现相应的电器连接。 To achieve their respective electrical connector according to the logic relation between the chips. 所述基板101材质可以塑料、陶瓷等。 The substrate 101 may be made of plastic, ceramics and the like.

[0044] 在所述基板101的表面预定位置用于贴合智能电表芯片,在预留用于贴装智能电表芯片位置的周边设置有金丝压焊焊盘102,金丝压焊焊盘102可以由铜、镍、金等材料中的一种或其合金构成。 [0044] for a predetermined position of the surface of the substrate 101 is bonded to the smart meter chip, wire bonding pads provided in the periphery of the chip reserved for the mounting position of the smart meter 102, wire bonding pad 102 may be made of copper, nickel, gold or an alloy of one material. 该金丝压焊焊盘与基板内部的电路相连通,并作为与智能电表芯片的键合的引线焊盘。 The circuit wire bonding pads and communicating the interior of the substrate, and as wire bonding pads and chip smart meters.

[0045] 在所述基板101的背面还设置有形成BGA阵列所需要的焊盘金属103,焊盘金属103也可以由铜、镍、金等材料中的一种或其合金构成。 [0045] The back surface of the substrate 101 is further provided with a pad array BGA desired metal 103, a metal pad 103 may be made of copper, nickel, gold or an alloy of one material. 该焊盘金属103也与基板内部的电路相连通。 The metal pad 103 is also connected to the circuit board through the interior.

[0046] 图2不出了上述智能电表功能芯片于基板表面的分布。 [0046] FIG. 2 not the distribution of the smart meter function chips to the substrate surface. 如图2所不,各个智能电表功能芯片通过粘贴剂粘贴与基板101的表面。 2 are not each smart meter function chip surface by adhesives laminated with the substrate 101. 智能电表功能芯片分别包括MCU芯片206、485芯片204、计量芯片208、ESAM芯片202、存储器210、逻辑电路104和时钟芯片105 (图I相当于图2中设置保护层后沿XX'方向的剖视图)。 Smart meter function chip MCU chip 206,485 respectively include chip 204, the measurement chip 208, ESAM chip 202, memory 210, logic circuit 104 and a clock chip 105 (FIG. 2 a sectional view I in the protective layer is provided in FIG XX 'direction corresponds to ). 当然也可以也包括实现电表模块功能的其他所需芯片及元器件。 Of course, it may also include other components and chips to achieve the desired function of the meter module. 上述的功能芯片通过贴装技术将每一款芯片及元器件贴装于基板101表面的相应位置。 The above-described function chip by a chip mount technology and each of the corresponding position of the component placement surface of the substrate 101. 上述芯片可以是市场流通芯片及元器件产品,也可以自行开发设计制造。 Of the chip market may be in circulation chips and components products, can also develop their own design and manufacture. 需要说明的是,图2中示出的各种功能芯片的贴装位置仅仅是示意性的。 Note that in FIG. 2 shows the mounting position of the various chip functions are merely illustrative. 本领域技术人员可以根据需要将构成电表模块的功能芯片在基板101表面任意设置,相应的,基板101内部的电路以及基板101表面的金丝压焊焊盘可根据功能芯片的设置位置而预先设计并制造,这里不再进行赘述。 Function chip skilled in the art may be required in any configuration meter module 101 is provided on the surface of the substrate, corresponding, wire bonding pads of the circuit board 101 and the inner surface of the substrate 101 can be designed in advance according to the setting position of the function chip and manufacturing, will not be repeated here.

[0047] 请继续参看图1,引线106 —端连接于芯片的焊盘上,另一端连接于基板101表面上分布于芯片周围的焊盘上,将芯片中的电路与基板101中的电路相连通。 [0047] Please continue to 1, the lead 106 - terminal connection pad on the chip, to the other end connected to the pads distributed around the surface of the chip on the substrate 101, a circuit chip connected to the circuit board 101 through. 所有芯片均通过引线与基板101上的电路想连通,从而可实现不同芯片之间的电气连接,并实现预期的电表模块功能。 All the chips are lead through the circuit on the substrate 101 like communication, which can achieve electrical connections between different chips, the meter module and achieve the desired functionality. 引线106材料包括金、铜或者所述金或铜合金。 Lead 106 materials include gold, copper, or gold, or a copper alloy.

[0048] 所述保护层107设置于所述基板101表面上,用于保护基板101表面上的芯片以及芯片与基板101的连接结构。 [0048] The chip and the chip connection structure 101 of the substrate 101 on the surface of the protective layer 107 is disposed on the substrate surface of the substrate 101, for protection. 本实施例中,所述保护层107为有机聚合材料形成的塑封胶,其厚度和面积足以包覆基板101表面的智能电表功能芯片、键合引线以及压焊焊盘。 In this embodiment, adhesive layer 107 is formed of plastic as the organic polymeric material is protected, its thickness and area enough to cover the surface of the substrate 101 of the smart meter function chip, bonding wires and bonding pads. 通过保护层107,可以为芯片以及键合引线结构提供物理机械以及热力保护,增强整体结构的可靠性。 , May provide mechanical and thermal protection for the chip structure and bond wires through the protective layer 107, to enhance the reliability of the overall structure. 当然,保护层107的材料并不限于所述的塑封胶,其还可以是其它能够实现保护功能以及提供物理强度的材质,这里不再一一列举。 Of course, the material of protective layer 107 is not limited to the mold compound, which may also be other possible to provide physical strength and protection of the material, are not enumerated here.

[0049] 在所述基板101的背面的焊盘金属103上形成有BGA焊球。 [0049] BGA balls formed on the back surface 103 of metal pad 101 of the substrate. 复数个焊球形成焊球阵列。 A plurality of ball grid array of solder balls. 所述焊球阵列形成该电表模块封装结构与下一级母板连接的端口。 The array of solder balls formed in the port and the meter module package connected to a motherboard. BGA焊球主要成分可以为常见的钎料金属。 BGA balls may be the main component of the common brazing filler metals.

[0050] 上述实施例的智能电表核心模块的封装结构将电表系统中所用的各个不同大小尺寸型号的裸芯片,通过集成为一体,形成一个高密度,低损耗,低成本的小型电表模块,使得整个模块的面积和体积都大大减小。 [0050] The smart meter core module package structure of the above embodiment of the models of various sizes used in the metering system bare chip, the integrated together to form a high density, low loss, low-cost small meter module, such that area and volume of the entire module is greatly reduced. 进一步的,本结构中电表模块中的各个芯片间的走线距离变短,更利于提高信号处理的速度,提高电表模块的性能。 Further, in this configuration the distance between the traces in each meter module chip becomes shorter, more conducive to improve the signal processing speed, improve the performance of the meter module.

[0051] 本发明还提供一种智能电表核心模块的封装方法。 [0051] The present invention further provides a method of packaging a smart meter core modules. 图3至图6为本发明的智能电表核心模块的封装方法的实施中各个步骤后形成的结构的示意图。 A schematic configuration of a smart meter encapsulation method embodiment of the core module of Figures 3 to 6 of the present invention is formed after the respective steps. 下面结合图3至图6对本发明的方法进行说明。 6 below method of the present invention will be described in conjunction with FIGS. 3 to FIG.

[0052] 首先,如图3所示,提供基板101。 [0052] First, as shown in FIG. 3, the substrate 101. 在所述基板表面芯片贴合位置周边设置有金丝压焊焊盘102,其一般由铜,镍,金等金属组成;在所述基板内部设置有连接智能电表功能芯片的连接的布线层,例如,可以为两层布线结构。 On the surface of the chip bonding position of the substrate is disposed around wire bonding pad 102, generally made of copper, nickel, gold and other metals; a wiring layer is provided with a smart meter connection function chip in the interior of the substrate, For example, a two-layer wiring structure. 在所述基板101背面设置有BGA植球所需的焊盘金属103。 The back surface of the substrate 101 is provided with the desired BGA ball pad metal 103. 所述基板101可以用常规的印刷电路板制造工艺而形成。 The substrate 101 may be a conventional printed circuit board manufacturing processes is formed. 这里不再赘述。 Not repeat them here.

[0053] 接着,将所述智能电表功能芯片贴装于所述基板表面预定的指定位置。 [0053] Next, the smart meter function chip mounted on the substrate surface a predetermined specified position. 图3示出了第一功能芯片104和第二功能芯片105贴装于基板贴装后的示意图。 FIG 3 shows a first function chip 104 and chip 105 mounted on the second functional schematic view of the mounting substrate.

[0054] 其中,贴装可采用表面贴装机,具体的步骤可包括对基板进行预热;在预热后的基板表面预定位置涂胶;将智能电表芯片与基板表面涂胶位置相对准;将智能电表芯片贴装于基板表面涂胶位置以及对基板高温处理,固化智能电表芯片的步骤。 [0054] wherein the mounting surface mounter may be employed, specific steps may include preheating the substrate; a predetermined position on the substrate surface after coating preheating; smart meter chip and the substrate surface aligned gumming location; and smart meters die-attach adhesive to the substrate surface and the position of the substrate to high temperature processing, curing step smart meter chip. 通过该步骤,智能电表功能芯片可牢固贴装与基板101的表面上。 By this step, the smart meter function chip can be firmly mounted on the surface of the substrate 101.

[0055] 然后,如图5所示,通过引线106将所述各个功能芯片的引线焊盘与所述基板表面相应的金丝压焊焊盘相连接。 [0055] Then, as shown in Figure 5, the lead 106 by the respective functions of the chip pads and the respective lead wire bonding pad is connected to the substrate surface. 该引线106—般为金属线或铜线,或其合金。 The wire is a metal wire or like 106- copper, or alloys thereof.

[0056] 再接着,如图6所示,在所述基板表面形成包覆所述基板表面的智能电表功能芯片、键合引线以及压焊焊盘的保护层107。 [0056] Then, as shown in FIG. 6, the smart meter function chip forming surface of the substrate coated surface of the substrate, the protective layer, the bonding wires 107 and bonding pads. 本实施例中,所述保护层107为一层或一层以上的塑封胶,塑封胶的成分一般为有机聚合物,高度以覆盖住所有裸芯片和引线为准。 In this embodiment, the adhesive layer 107 is a protective plastic one or more layers of plastic rubber component is generally an organic polymer, a height as to cover all bare chip and the lead prevail. 采用点胶或者涂敷的方式在基板上表面形成所述塑封胶,并加温固化。 Using glue or coating the surface of the mold compound manner on a substrate, and heat curing.

[0057] 最后,如图I所示,在所述基板101背面形成BGA焊球阵列108。 [0057] Finally, as shown in FIG. I, BGA ball array 108 is formed on the back surface of the substrate 101. 本实施例中,通过C4工艺回流形成BGA焊球阵列108. In this embodiment, BGA ball array 108 is formed by a process C4 reflux.

[0058] 完成上述步骤之后,还包括对完成封装的整个模块切片,并做性能检测的步骤。 After [0058] completing the above steps, further comprising the step of slicing module to complete the package, and the performance testing.

[0059] 上述实施例的方法摆脱了传统电表结构的多模块组装的方法,将裸芯片集成,整个模块的面积和体积都大大减小;而且,本方法将电表模块中的各个芯片间的走线距离变短,更利于提高信号处理的速度,提高电表模块的性能;此外,本发明的方法成本低且易于控制,便于大规模量产。 [0059] Example embodiments of the above method out of a conventional multi meter module assembly structure, bare chip integrated, area and volume of the entire module is greatly reduced; Furthermore, the present process will take between each chip meter module line distance becomes shorter, help to improve the signal processing speed, improve the performance of the meter module; in addition, the method is low cost and easy control of the present invention, ease of mass production.

[0060] 本发明虽然以较佳实施例公开如上,但其并不是用来限定本发明,任何本领域技术人员在不脱离本发明的精神和范围内,都可以做出可能的变动和修改,因此本发明的保护范围应当以本发明权利要求所界定的范围为准。 [0060] Although the preferred embodiments of the present invention disclosed in the above embodiments, but not intended to limit the present invention, anyone skilled in the art without departing from the spirit and scope of the invention, can be made possible variations and modifications, Therefore, the scope of the invention as claimed in the present invention should be defined by the scope of the subject claims.

Claims (15)

  1. 1. 一种智能电表核心模块的封装结构,其特征在于包括,用于承载多个芯片的基板;设置于基板表面上预定位置的复数个智能电表功能芯片;实现所述各个功能芯片与基板上电路之间电联接的键合引线;覆盖所述功能芯片以及键合引线的保护层;形成于所述基板背面的BGA(Ball Grid Array)焊球阵列。 1. A package structure smart meter core modules, characterized by comprising a substrate carrying a plurality of chips; smart meters disposed on a plurality of function chips of a predetermined position on the substrate surface; implemented on a chip and the substrate of the respective functional electrical coupling between the bond wires circuit; the function chip and a protective cover layer bonding wires; formed on BGA (Ball Grid array) balls back surface of the array substrate.
  2. 2.根据权利要求I所述的智能电表核心模块的封装结构,其特征在于,所述基板为单层或多层层化合物印刷线路板,在所述基板表面预留芯片的贴合位置周边设置有金丝压焊焊盘。 The package structure of claim I smart meter core module as claimed in claim, wherein the substrate is a single-layer or multi-layer printed wiring board compound, provided at a position bonded to the substrate surface of the chip periphery reserved there are wire bonding pads.
  3. 3.根据权利要求2所述的智能电表核心模块的封装结构,其特征在于,在所述基板的背面设置有BGA植球需要的焊盘金属。 3. The package of claim 2 module smart meter core according to claim, wherein the pad is provided with a desired metal BGA ball back surface of the substrate.
  4. 4.根据权利要求3所述的智能电表核心模块的封装结构,其特征在于,形成所述金丝压焊焊盘的材料铜、镍、金中的一种或其合金;形成所述BGA植球需要的焊盘金属的材料包括铜、镍、金中的一种或其合金。 4. The package of claim 3 module smart meter core according to claim, characterized in that the wire bonding pad is formed of material such as copper, nickel, gold or alloys thereof; forming the BGA bumping ball material needs pad metal include copper, nickel, gold, or alloys thereof.
  5. 5.根据权利要求I所述的智能电表核心模块的封装结构,其特征在于,智能电表功能芯片包括MCU芯片、485芯片、计量芯片、ESAM,存储器、逻辑电路和时钟芯片及其他用于实现电表功能的分立元器件。 The package structure of claim I smart meter core module as claimed in claim, wherein the chip comprises a smart meter function MCU chip, the chip 485, the measurement chip, ESAM, memory, and a logic circuit for realizing the clock and other chips meter function discrete components.
  6. 6.根据权利要求2所述的智能电表核心模块的封装结构,其特征在于,所述保护层为有机聚合物材料形成的塑封胶,其厚度和面积足以包覆基板表面的智能电表功能芯片、键合引线以及压焊焊盘。 6. The package of claim 2 module smart meter core according to claim, characterized in that the plastic adhesive layer formed of the protective material is an organic polymer having a thickness sufficient to cover the substrate surface and the area of ​​smart meter function chip, bonding wires and bonding pads.
  7. 7.根据权利要求I所述的智能电表核心模块的封装结构,其特征在于,形成所述键合引线材料包括金、铜或者所述金或铜合金。 The package structure of claim I smart meter core module as claimed in claim, wherein said bond wires forming materials include gold, copper, or gold, or a copper alloy.
  8. 8.根据权利要求I所述的智能电表核心模块的封装结构,其特征在于,所述BGA焊球阵列为钎料金属。 The package structure according to claim I smart meter core module as claimed in claim, wherein said array is a BGA ball solder metal.
  9. 9. 一种智能电表核心模块的封装方法,其特征在于包括如下步骤,提供用于基板,在所述基板表面芯片的贴合位置周边设置有金丝压焊焊盘,所述基板中设置有连接智能电表功能芯片的连接电路;将所述智能电表功能芯片贴装于所述基板表面预定的指定位置;通过引线将所述各个功能芯片的引线焊盘与所述基板表面相应的金丝压焊焊盘相连接;在所述基板表面形成包覆所述基板表面的智能电表功能芯片、键合引线以及压焊焊盘的保护层;在所述基板背面形成BGA焊球阵列。 A method of packaging a smart meter core modules, comprising the steps of providing a substrate, attached to the outside surface of the chip bonding position of the substrate is provided with a wire bonding pad, the substrate is provided with a smart meter circuit connection function chip; the smart meter function chip mounted on the substrate surface a predetermined specified position; lead by the respective corresponding function chip pad and the lead press-gold substrate surface It is connected to bond pads; smart meter function chip forming surface of the substrate coated surface of the substrate, the bonding wires and the protective layer bonding pad; ball grid array BGA is formed on the back surface of the substrate.
  10. 10.根据权利要求9所述的智能电表核心模块的封装方法,其特征在于,在将所述智能电表功能芯片贴装于所述基板表面的步骤还包括如下子步骤,对基板进行预热;在预热后的基板表面预定位置涂胶;将智能电表芯片与基板表面涂胶位置相对准;将智能电表芯片贴装于基板表面涂胶位置。 10. The packaging method of claim 9 smart meter core module according to claim, characterized in that the smart meter function chip mounted surface of the substrate at step further comprises the sub-step of preheating the substrate; preheating the surface of the substrate after coating a predetermined position; smart meter chip and the substrate surface is aligned gumming location; smart meters die-attach adhesive to a substrate surface position.
  11. 11.根据权利要求10所述的智能电表核心模块的封装方法,其特征在于,将智能电表芯片贴装于基板表面涂胶位置之后,还包括对所述基板高温处理,固化智能电表芯片的步骤。 Step 11. The packaging method of claim 10 core module smart meter according to claim, characterized in that the smart meters after the die is attached to the substrate surface gumming position, further comprising a high temperature treatment of the substrate, the cured chip smart meters .
  12. 12.根据权利要求9所述的智能电表核心模块的封装方法,其特征在于,所述保护层为一层或一层以上的塑封胶。 12. The packaging method of claim 9 smart meter core module according to claim, characterized in that the protective layer is a plastic adhesive of one or more layers.
  13. 13.根据权利要求12所述的智能电表核心模块的封装方法,其特征在于,采用点胶或者涂敷的方式在基板上表面形成所述塑封胶,并加温固化。 13. The method of encapsulating core 12 of the smart meter module according to claim, characterized in that the dispensing or use of the coated surface of the mold compound manner on a substrate, and heat curing.
  14. 14.根据权利要求9所述的智能电表核心模块的封装方法,其特征在于,在基板的背面通过C4工艺回流形成BGA焊球阵列。 14. The packaging method of claim 9 smart meter core module according to claim, wherein the ball grid array BGA is formed on the back surface of the substrate by the C4 process reflux.
  15. 15.根据权利要求9所述的智能电表核心模块的封装方法,其特征在于,还包括如下步骤:对完成封装的整个模块切片,并做性能检测。 15. The packaging method of claim 9 smart meter core module according to claim, characterized by further comprising the steps of: slicing complete the module package, and performance testing.
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