CN201725792U - Carrier tape for encapsulation of multi-range intelligent card module - Google Patents
Carrier tape for encapsulation of multi-range intelligent card module Download PDFInfo
- Publication number
- CN201725792U CN201725792U CN2010202655170U CN201020265517U CN201725792U CN 201725792 U CN201725792 U CN 201725792U CN 2010202655170 U CN2010202655170 U CN 2010202655170U CN 201020265517 U CN201020265517 U CN 201020265517U CN 201725792 U CN201725792 U CN 201725792U
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- CN
- China
- Prior art keywords
- card module
- carrier
- utility
- model
- carrier tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packages (AREA)
Abstract
The utility model discloses a carrier tape for the encapsulation of a multi-range intelligent card module, which is formed by connecting a plurality of carriers, wherein the carries are connected into a plurality of double-row carrier strips according to a double-row arrayed mode, the formed double-row carrier strips are connected in parallel for forming a carrier tape. The utility model has low price, can greatly reduce the production cost of the intelligent card module, and further improve the market competitiveness of products.
Description
Technical field:
The utility model relates to the semiconductor microelectronics encapsulation technology, is specifically related to a kind of carrier band that is used for the smart card module encapsulation.
Background technology:
Along with the continuous progress of integrated circuit encapsulation technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.In field of intelligent cards because fail safe and multi-functional requirement display gradually, require cost reduce or constant situation under increase reliability.
But the encapsulation of conventional intelligent object generally all is to use FR4 or the G10 substrate layer as carrier band, single face or two-sided deposited copper wire are set, then intelligent card chip paster, routing are connected, direct molding or UV encapsulate after waiting to finish, and realize the high reliability of smart card module.The corresponding carrier band of this technological requirement can directly be beaten gold thread, and this carrier band all is to be produced without competition by external producer at present, die cost height, and unit price costliness.The expense height that this makes intelligent object encapsulation greatly reduces the market competitiveness of corresponding intelligent object.
Therefore, design a kind of cheaply, and the smart card module carrier tape for packaging that can be applied to conventional production equipment is the problem that this area is needed solution badly.
The utility model content:
The utility model costs an arm and a leg at above-mentioned existing intelligent object carrier tape for packaging, thereby reduce the problem of the finished product market competitiveness, and provide a kind of novel smart card module carrier tape for packaging, the cost of this carrier band is low, and can be applied to conventional production equipment, the finished product of formation can effectively satisfy the reliability requirement of smart card industry to smart card module.
In order to achieve the above object, the utility model adopts following technical scheme:
A kind of many row's smart card module carrier tape for packaging, described carrier band is formed by connecting by some carriers, and described some carriers are connected to form some double carrier strip according to the mode of two row's permutations, and described double carrier strip connects into carrier band side by side.
The width of described double carrier strip is 35mm.
Described carrier band comprises the copper foil circuit layer of substrate layer, surface process electroplating technology and the anti-oxidation processing of PET material, and the tow sides of described substrate layer lay described copper foil circuit layer respectively.
The carrier band that the utility model provides is cheap, can greatly reduce the smart card module production cost, improves the market competitiveness of finished product then.
Simultaneously the carrier band that provides of the utility model adopts many parallelism and antithesis number to design in flakes, is many times of common belt for smart card width, to reach the effect of saving the production time.
The smart card module that the carrier band production that utilizes the utility model to provide obtains can be applied among all kinds of smart card processing, as bank card, consumption card, mobile phone card etc. widely; It helps the general of production equipment, the raising of product reliability, and the installation that makes things convenient for later process simultaneously.
Description of drawings:
Further specify the utility model below in conjunction with the drawings and specific embodiments.
Fig. 1 is a front schematic view of the present utility model;
Fig. 2 is a schematic rear view of the present utility model;
Fig. 3 is a cutaway view of the present utility model;
The standard intelligent card band schematic diagram that Fig. 4 forms for the utility model.
Embodiment:
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
At the expensive problem of normal procedure intelligent card module carrier tape for packaging, the utility model provides a kind of novel intelligent card module.
Whole carrier band is a strip, and it is interconnected by some single carriers and forms.Wherein carrier is connected to form some double carrier strip according to the mode of two row's permutations, and the double carrier strip that forms connects into carrier band side by side.
In order to improve the SMT production capacity, the width of every double carrier strip is 35mm.
Based on technique scheme, the utility model is specifically implemented as follows:
Referring to Fig. 1 and 2, strip carrier band 100 integral body are formed by connecting by some carriers 101, carrier 101 is connected to form the double carrier strip 102 that four width are 35mm according to two modes of arranging permutations and (but is not limited to four, can decide according to practical situations), four double carrier strip 102 that are connected to form are joined side by side successively, thereby form strip carrier band 100.
The equidistant registration holes 104 that offers in double carrier strip 102 both sides, its effect are to use this hole that product is carried out contraposition when attaching components and parts automatically.
Between two double carrier strip 102, be provided with dowel 103, when making carrier band, be used for electric plating of whole board technology.
Referring to Fig. 3, carrier band 100 comprises substrate layer 105 and copper foil circuit layer 106 on the composition structure.
Wherein the material of substrate layer 105 is the PET material, and its color is transparent or white or other colors; The tow sides of substrate layer 105 all lay copper foil circuit layer 106, and this copper foil circuit layer 106 is the copper foil circuit wiring board, and electroplating technology is carried out on its surface, and adds anti-oxidation processing.
The carrier band 100 that is obtained by technique scheme installs (as shown in Figure 1) after the components and parts and cuts into the standard intelligent card band (as shown in Figure 4) of double 35mm width, adds the general of equipment in man-hour with road, convenient back.
Simultaneously, again carrier band is cut into the standard intelligent card band of double 35mm width, carry out punching, test, fabrication again.
In order to increase production efficiency, when utilizing the utility model production of intelligent card module, adopt web-like pan feeding and web-like discharge method in the production process.
More than show and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in the foregoing description and the specification just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (3)
1. arrange the smart card module carrier tape for packaging one kind, described carrier band is formed by connecting by some carriers, it is characterized in that more, and described some carriers are connected to form some double carrier strip according to the modes of two row's permutations, and described double carrier strip connects into carrier band side by side.
2. a kind of many row's smart card module carrier tape for packaging according to claim 1 is characterized in that the width of described double carrier strip is 35mm.
3. a kind of many row's smart card module carrier tape for packaging according to claim 1, it is characterized in that, described carrier band comprises the copper foil circuit layer of substrate layer, surface process electroplating technology and the anti-oxidation processing of PET material, and the tow sides of described substrate layer lay described copper foil circuit layer respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202655170U CN201725792U (en) | 2010-07-20 | 2010-07-20 | Carrier tape for encapsulation of multi-range intelligent card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202655170U CN201725792U (en) | 2010-07-20 | 2010-07-20 | Carrier tape for encapsulation of multi-range intelligent card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201725792U true CN201725792U (en) | 2011-01-26 |
Family
ID=43494141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202655170U Expired - Fee Related CN201725792U (en) | 2010-07-20 | 2010-07-20 | Carrier tape for encapsulation of multi-range intelligent card module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201725792U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013023326A1 (en) * | 2011-08-18 | 2013-02-21 | 上海长丰智能卡有限公司 | Carrier tape for novel smart card module, smart card module, module production process, and smart card |
-
2010
- 2010-07-20 CN CN2010202655170U patent/CN201725792U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013023326A1 (en) * | 2011-08-18 | 2013-02-21 | 上海长丰智能卡有限公司 | Carrier tape for novel smart card module, smart card module, module production process, and smart card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110126 Termination date: 20170720 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |