CN101477975A - SIM card encapsulation construction based on metal lead wire frame and encapsulation process thereof - Google Patents
SIM card encapsulation construction based on metal lead wire frame and encapsulation process thereof Download PDFInfo
- Publication number
- CN101477975A CN101477975A CN 200910028907 CN200910028907A CN101477975A CN 101477975 A CN101477975 A CN 101477975A CN 200910028907 CN200910028907 CN 200910028907 CN 200910028907 A CN200910028907 A CN 200910028907A CN 101477975 A CN101477975 A CN 101477975A
- Authority
- CN
- China
- Prior art keywords
- sim card
- lead frame
- card
- chip
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The invention relates to an SIM card package structure based on a metal lead frame, and a package method thereof, which are mainly used for packaging an SIM card. The structure comprises a lead frame, chips (4), a gold thread (3), a plastic package (5) and a carrier card (6). The method comprises the following processing steps: a plurality of lead frames comprising bases and pins are processed by metal material, each lead frame comprises a plurality of relatively independent blocks, and each block comprises a plurality of independent and identical units which are arranged in an array manner; chips are installed on the bases of the lead frame, and the chips and the lead frame are connected through the gold thread, so that SIM card semi-finished products are produced, and all the semi-finished products are packaged by the plastic package; an SIM module group is cut into a plurality of independent SIM card module groups, and the independent SIM card module groups are embedded into the array template of the carrier card through injection mode; finally an independent and complete SIM card is obtained by cutting. The structure has the advantages of low package cost, simple package process, high chip loading ball bonding efficiency and strong functional extendibility of the SIM card.
Description
(1) technical field
The present invention relates to a kind of SIM card encapsulating structure and method for packing thereof.Be mainly used in encapsulation SIM card (Subscriber Identity Module).Belong to smart card encapsulation technology field.
(2) background technology
Traditional SIM card is to adopt soft board to mount encapsulating structure, and its packing forms is the flexible soft board that is packaged with chip to be mounted embed card form support plate formation full unit.It mainly has the following disadvantages:
1, soft board cost height, the manufacturing process complexity.
2, with in the SIM card encapsulation process of soft board as loading plate, because soft board has flexibility, load ball bonding process efficiency is low.
3, soft board adopts the individual layer wiring, has limited the functions expanding ability of SIM card to a great extent.
(3) summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, provide that a kind of packaging cost is low, packaging technology is simple, strong the SIM card encapsulating structure and the method for packing thereof based on metal lead wire frame of functions expanding ability of load ball bonding process efficiency height and SIM card.
The object of the present invention is achieved like this: a kind of SIM card encapsulating structure based on metal lead wire frame, described SIM card encapsulating structure comprises lead frame, chip, gold thread, plastic encapsulation body and carrier card, described lead frame is made by metal material, lead frame comprises pin and Ji Dao, chip places on the Ji Dao of lead frame, gold thread links to each other chip with pin, the plastic encapsulation body is all sealed the pin and the Ji Dao of chip and lead frame, constitute the SIM card module, described SIM card module is embedded carrier card, constitute SIM card.
The method for packing that the present invention is based on the SIM card encapsulating structure of metal lead wire frame comprises following processing step:
Step 1, by pre-designed structure, go out the lead frame that several are made up of Ji Dao and pin with metal material processing, each lead frame is made up of several relatively independent pieces, and each piece is the array arrangement by the identical unit of several separate again and forms
Step 2, flip-chip on the Ji Dao of lead frame, gold thread links to each other the pin of various chips and lead frame, makes the SIM card semi-finished product,
Step 3, with the SIM card semi-finished product that step 2 is made, all seal with the plastic encapsulation body, constitute the SIM card module group that connects together in array aggregate mode,
Step 4, by mode die-cut or cutting, the SIM card module component that step 3 is made is severed, making is the SIM card module group that array aggregate mode connects together originally, through becoming several independently SIM card modular units after the cutting,
Step 5, step 4 is made several independently the SIM card modular unit be embedded in the carrier card array mould plate,
Step 6, carry out laser printing or carry out personalisation process finishing the carrier card array mould plate that embeds the SIM card modular unit,
Step 7, the mode by cutting cut into the carrier card array mould plate of finishing printing the SIM card of the independent completion that can conveniently use.
The present invention is based on the SIM card encapsulating structure and the method for packing thereof of lead frame, compare, have following advantage with traditional soft structure SIM card that mounts:
1, the metal lead wire frame manufacture craft is simple, and cost is low, thereby greatly reduces the production cost of whole SIM card.
2, lead frame generally adopts metals such as Cu to make, than soft board hardness height, and load ball bonding efficient height.
3, the higher metal lead wire frame of hardness can carry the encapsulation of multicore sheet, has widened the functions expanding ability of SIM card.
4, adopt the SIM card module whole to embed convenient printing in the carrier card array.
5, lead frame adopts the Cu metal material, and electrical and thermal conductivity is good.
(4) description of drawings
Fig. 1 is the sectional view that the present invention is based on the SIM card encapsulating structure of metal lead wire frame.
Fig. 2 seals the single SIM card module diagram that cuts into for lead frame of the present invention.
Fig. 3 is the plane graph of the present invention's SIM card arrays of modules to be embedded template.
Fig. 4 embeds RAID card plate plane figure after the SIM card module for the present invention.
Fig. 5 is the complete single SIM card plane graph of the present invention.
Among the figure: pin one, basic island 2, gold thread 3, chip 4, plastic encapsulation body 5, carrier card 6.
(5) embodiment
Referring to Fig. 1, the SIM card encapsulating structure based on metal lead wire frame that the present invention relates to is made up of lead frame, chip 4, gold thread 3, plastic encapsulation body 5 and carrier card 6.Described lead frame is made by metal material, lead frame comprises pin one and basic island 2, chip 4 places on the basic island 2 of lead frame, gold thread 3 links to each other chip 4 with pin one, plastic encapsulation body 5 is all sealed the pin one and the basic island 2 of chip 4 and lead frame, constitute the SIM card module, described SIM card module is embedded carrier card 6, constitute SIM card.Its method for packing comprises following processing step:
Step 1, by pre-designed structure, go out the lead frame that several are made up of Ji Dao and pin with metal material processing, each lead frame is made up of several relatively independent pieces, and each piece is the array arrangement by the identical unit of several separate again and forms.
Step 2, flip-chip on the Ji Dao of lead frame, gold thread links to each other the pin of various chips and lead frame, forms effective loop, makes the SIM card semi-finished product.
Step 3, with the SIM card semi-finished product that step 2 is made, all seal with the plastic encapsulation body, constitute the SIM card module group that connects together in array aggregate mode.
Step 4, by die-cut or the cutting mode, the SIM card module component that step 3 is made is severed, making originally is the SIM card module group that array aggregate mode connects together, through becoming several independently SIM card modular units after the cutting, as Fig. 2, this SIM card modular unit is the core of SIM card.
Step 5, step 4 is made several independently the SIM card modular unit be embedded in the carrier card array mould plate (as Fig. 3).
Step 6, carry out laser printing or carry out personalisation process, identify and effect attractive in appearance with the information that plays product to finishing the carrier card array mould plate (as Fig. 4) that embeds the SIM card modular unit.
Step 7, the mode by cutting cut into the SIM card of the independent completion that can conveniently use to the carrier card array mould plate of finishing printing, as Fig. 5.
The SIM card method for packing of this patent can also be applied in the intelligent cards of other form except that SIM card (as the IC phonecard) in addition.
The above only is the preferred embodiment of this patent, this patent is not done any pro forma restriction.Therefore, every content that does not break away from the art of this patent scheme, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of the technical program protection.
Claims (2)
1, a kind of SIM card encapsulating structure based on metal lead wire frame, it is characterized in that described SIM card encapsulating structure comprises lead frame, chip (4), gold thread (3), plastic encapsulation body (5) and carrier card (6), described lead frame is made by metal material, lead frame comprises pin (1) and Ji Dao (2), chip (4) places on the Ji Dao (2) of lead frame, gold thread (3) links to each other chip (4) with pin (1), plastic encapsulation body (5) is all sealed the pin (1) and the Ji Dao (2) of chip (4) and lead frame, constitute the SIM card module, described SIM card module is embedded carrier card (6), constitute SIM card.
2, a kind of according to claim 1 based on the method for packing of the SIM card encapsulating structure of metal lead wire frame, it is characterized in that described method comprises following processing step:
Step 1, by pre-designed structure, go out the lead frame that several are made up of Ji Dao and pin with metal material processing, each lead frame is made up of several relatively independent pieces, and each piece is the array arrangement by the identical unit of several separate again and forms
Step 2, flip-chip on the Ji Dao of lead frame, gold thread links to each other the pin of various chips and lead frame, makes the SIM card semi-finished product,
Step 3, with the SIM card semi-finished product that step 2 is made, all seal with the plastic encapsulation body, constitute the SIM card module group that connects together in array aggregate mode,
Step 4, by mode die-cut or cutting, the SIM card module component that step 3 is made is severed, making is the SIM card module group that array aggregate mode connects together originally, through becoming several independently SIM card modular units after the cutting,
Step 5, step 4 is made several independently the SIM card modular unit be embedded in the carrier card array mould plate,
Step 6, carry out laser printing or carry out personalisation process finishing the carrier card array mould plate that embeds the SIM card modular unit,
Step 7, the mode by cutting cut into the carrier card array mould plate of finishing printing the SIM card of the independent completion that can conveniently use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910028907 CN101477975A (en) | 2009-01-21 | 2009-01-21 | SIM card encapsulation construction based on metal lead wire frame and encapsulation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910028907 CN101477975A (en) | 2009-01-21 | 2009-01-21 | SIM card encapsulation construction based on metal lead wire frame and encapsulation process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101477975A true CN101477975A (en) | 2009-07-08 |
Family
ID=40838648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910028907 Pending CN101477975A (en) | 2009-01-21 | 2009-01-21 | SIM card encapsulation construction based on metal lead wire frame and encapsulation process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101477975A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102074530A (en) * | 2010-01-29 | 2011-05-25 | 江苏长电科技股份有限公司 | External cooling cap or board packaging structure of base-island embedded chip assembling lock hole radiating block |
| CN102082134A (en) * | 2010-01-29 | 2011-06-01 | 江苏长电科技股份有限公司 | Packaging structure of base island-embedded chip upright heat dissipation block external radiator |
| CN102013418B (en) * | 2009-09-08 | 2012-09-05 | 上海长丰智能卡有限公司 | Novel PCB (Printed Circuit Board) carrier tape for SIM card package |
| RU2665491C1 (en) * | 2017-11-30 | 2018-08-30 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Body for current power measuring microsystems |
| RU183076U1 (en) * | 2017-11-30 | 2018-09-10 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Case for microsystems for measuring current strength |
-
2009
- 2009-01-21 CN CN 200910028907 patent/CN101477975A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102013418B (en) * | 2009-09-08 | 2012-09-05 | 上海长丰智能卡有限公司 | Novel PCB (Printed Circuit Board) carrier tape for SIM card package |
| CN102074530A (en) * | 2010-01-29 | 2011-05-25 | 江苏长电科技股份有限公司 | External cooling cap or board packaging structure of base-island embedded chip assembling lock hole radiating block |
| CN102082134A (en) * | 2010-01-29 | 2011-06-01 | 江苏长电科技股份有限公司 | Packaging structure of base island-embedded chip upright heat dissipation block external radiator |
| RU2665491C1 (en) * | 2017-11-30 | 2018-08-30 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Body for current power measuring microsystems |
| RU183076U1 (en) * | 2017-11-30 | 2018-09-10 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Case for microsystems for measuring current strength |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102222657B (en) | Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof | |
| CN103155136B (en) | Singulation of IC packages | |
| CN101477975A (en) | SIM card encapsulation construction based on metal lead wire frame and encapsulation process thereof | |
| WO2007146310A3 (en) | Flash memory card | |
| TW200713301A (en) | Flash memory card | |
| CN102231372A (en) | Multi-turn arranged carrier-free IC (Integrated Circuit) chip packaging component and manufacturing method thereof | |
| CN105990269A (en) | Fingerprint identification chip packaging structure and packaging method thereof | |
| CN102231376A (en) | Multi-cycle arrangement carrier-free double-integrated chip (IC) package and production method | |
| CN102222658B (en) | Multi-circle arranged IC (integrated circuit) chip packaging member and producing method thereof | |
| CN101483168B (en) | Molding mode SIM card encapsulation construction based on metal frame and encapsulation method thereof | |
| CN201340607Y (en) | SIM card encapsulating structure based on metal lead frame | |
| CN102543934A (en) | Semiconductor device and semiconductor package | |
| CN102446868A (en) | Novel dual-interface smart card module and implementation method thereof | |
| CN201222264Y (en) | Smart card containing high adhesive strength multi-chip integrated module | |
| CN201853700U (en) | Array type double in-line package (DIP) lead frame and integrated circuit (IC) encapsulating piece of frame | |
| CN205211727U (en) | Fingerprint identification multi -chip packaging structure | |
| CN102254893A (en) | Quadrilateral flat leadless package with double convex points and production method thereof | |
| CN102013419A (en) | Carrier band for packaging minitype radio-frequency module | |
| CN103107145A (en) | Semiconductor package, prefabricated lead frame and manufacturing method thereof | |
| JP2003531033A (en) | Module card and manufacturing method thereof | |
| CN208014691U (en) | A kind of M2M wireless communication smart IC chip falls encapsulating structure | |
| CN105590904A (en) | Fingerprint identification multi-chip package structure and preparation method thereof | |
| CN201340608Y (en) | Molding-method SIM card encapsulating structure based on metal frame | |
| CN202042481U (en) | Power module | |
| CN202423270U (en) | Integrated circuit lead frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20090708 |