CN201222264Y - Smart card containing high adhesive strength multi-chip integrated module - Google Patents

Smart card containing high adhesive strength multi-chip integrated module Download PDF

Info

Publication number
CN201222264Y
CN201222264Y CNU2008200940356U CN200820094035U CN201222264Y CN 201222264 Y CN201222264 Y CN 201222264Y CN U2008200940356 U CNU2008200940356 U CN U2008200940356U CN 200820094035 U CN200820094035 U CN 200820094035U CN 201222264 Y CN201222264 Y CN 201222264Y
Authority
CN
China
Prior art keywords
substrate
card
smart card
integration module
plastic encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008200940356U
Other languages
Chinese (zh)
Inventor
于民
Original Assignee
于民
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 于民 filed Critical 于民
Priority to CNU2008200940356U priority Critical patent/CN201222264Y/en
Application granted granted Critical
Publication of CN201222264Y publication Critical patent/CN201222264Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

An intelligent card with a high bonding strength multichip integrated module comprises a card body (4) and an integrated module (1), wherein the integrated module (1) comprises a substrate (11) and a plastic encapsulated body (12), and the substrate (11) comprises a substrate inner circuit (112) and an intelligent card contact (111), the plastic encapsulated body (12) comprises chips (121), a passive component (122) and a conductor (123), especially the plastic encapsulated body (12) is a sheet structure with equal thickness, and the thickness thereof is smaller than the difference of the thickness of the card body (4) and the thickness of the substrate (11), and the area of the substrate (11) must contain the area of the plastic encapsulated body (12). A step groove is milled on the given position of the card body (4), and the step groove and the integrated module are in a sliding fit in the depth direction. The utility model extends the bonding area between the intelligent card module and the card body, thereby increasing the bonding strength and reliability.

Description

The smart card that comprises high bond strength multicore sheet integration module
Technical field
The present invention relates to the record carrier that uses together with machine, particularly relate to the chip that has integrated circuit, relate in particular to a kind of smart card that comprises high bond strength multicore sheet integration module.
Background technology
Smart card has had the history of decades, and its process for machining and manufacturing is very universal and ripe, and its key step is that chip is packaged into module earlier, module is implanted on the card base again.Because the existing standard of smart card is based on international standard IS07816, its apparent size is 85.60mm * 53.98mm * 0.76mm, the smart card that also has a kind of Plug-in size in addition, it is of a size of 25mm * 15mm * 0.76mm, the smart card of this kind size mainly as the mobile communication subscriber identification module, blocks as SIM (Subscriber Identity Model).
Traditional smart card adds the restriction that is subjected to the card module size man-hour, the packaging technology of intelligent card chip is different with the semiconductor packaging process of main flow, it adopts a kind of special process that is referred to as the Soft Roll envelope, because the carrier of Soft Roll envelope is that a kind of single face that is referred to as carrier band covers the copper bar band, its specification determines that a general carrier band can only encapsulate a chips.
Along with the widespread use and the development of semiconductor of smart card, the application technology intension of smart card has broken through tradition, develops into complicated chip functions, or even multicore sheet and electronic component combined system.This has proposed great challenge to the employed soft encapsulation technology of traditional smart card module, the original characteristics of soft encapsulation are faced with significant limitation on the contrary: the firstth, and described carrier band can only be used for very simply being electrically connected with chip, is difficult to satisfy the cabling requirement of tens of even up to a hundred lead-in wires between the multicore sheet; The secondth, UV (Ultraviolet Rays) glue, promptly ultraviolet irradiation solidifies glue, perhaps heat-curable glue, i.e. the packaged type of black glue, its package area and package strength are all more weak, and it is poor to encapsulate consistance, can't carry out permanently effective protection to the multicore sheet; The 3rd to be that this kind is encapsulated as the space that chip reserves very limited, is difficult to satisfy the demand of multichip system to package area.
Chinese patent 200610114738.6 has proposed a kind of plastic package process that adopts chip and elements combination has been packaged into the method for smart card, and this method can be so that smart card externally under the situation of size constancy, and built-in function and performance are broken through.This method designs and produces two-sided PCB substrate or multi-layer PCB board, adopt new packaging technology technology, a plurality of chips are become smart card module with the elements combination plastic packaging and are made into the Plug-in SIM card, and perhaps a plurality of chips become Plug-in size card with the direct plastic packaging of elements combination.The smart card module of plastic packaging is embedded in the rectangle cell body of card body then by die-cut formation rectangular module in this invention.
Chinese patent 200720033621.5 " the integrated SIM card of molding mode encapsulation multicore sheet " also proposes the integrated SIM card of a kind of molding mode encapsulation multicore sheet, its implementation is that passive device and chip are all sealed, constitute the integrated SIM card of multicore sheet, utilize this method can be directly with passive device and Chip Packaging, be made into the smart card that meets a certain requirement, but multicore sheet integration module and the form that the card body and function mutually combines can not be packaged into the smart card card that meets international standard, cause it producing, a plurality of links such as personalization and distribution and existing smart card production equipment are incompatible, can't realize industrialization.
The above-mentioned method that is packaged into smart card has the following disadvantages:
1, can not solve adhesion problem between the plastic packaging module and card body well, it is not firm to cause the module and card body to connect;
2, smart card module surface of contact size and shape must be consistent with plastic packaging module entity, can not resemble the shape of flexible change smart card module surface of contact traditional smart card, also can cause simultaneously the volume of plastic packaging module to become big for the consistance that keeps the smart card module surface of contact, cause cost to increase;
3, can not combine the smart card card that formation meets international standard to the integrated multicore sheet integration module of multicore sheet with PVC (polyoxyethylene) card base, thereby cause it incompatible, can't realize its industrialization in a plurality of links such as production, personalization and distribution and existing smart card production equipment.
Summary of the invention
The technical problems to be solved in the utility model is to avoid above-mentioned the deficiencies in the prior art part and proposes a kind of smart card that comprises high bond strength multicore sheet integration module.
The utility model is at these realistic problems of present existence and propose a kind of simple solution, this method can either solve run in the conventional smart card processing technology can not integrated multiple chips problem, can solve integration module again and be connected arbitrarily problem such as conversion of not firm, module profile with the card body.
The utility model solve the technical problem can be by realizing by the following technical solutions: a kind of smart card that comprises high bond strength multicore sheet integration module comprises card body and integration module; This integration module comprises substrate and plastic encapsulation body, and described substrate comprises substrate internal wiring and smart card contact; Smart card contact is produced on substrate back, and is electrically connected with the substrate internal wiring; Described plastic encapsulation body comprises chip, passive device and lead; Described chip and passive device place substrate front side; Described chip, passive device connect by lead and substrate internal wiring.
Especially, described plastic encapsulation body is the equal thickness schistose texture, and its thickness deducts the thickness of substrate again less than the thickness of card body, so that can embed fully in the card body body; Described substrate area must contain the plastic encapsulation bulk area greatly, so that the plastic encapsulation body is placed on it fully; Mill out a stairstepping groove at card body assigned position, this darker groove and plastic encapsulation body in stairstepping groove the inside is sliding fit at depth direction, this stairstepping groove outside is sliding fit than shallow grooves and substrate at depth direction, can adopt cold glue or hot melt adhesive technology that described integration module close and firm ground is implanted in the card body and also be adjacent to fully with it.
The equal thickness schistose texture of described plastic encapsulation body comprises rectangular structure, cube structure and cylindrical structure.
Described substrate area is implanted in the card body body thereby can finish less than the card bulk area.
Integrated radio-frequency antenna on the described substrate, this radio-frequency antenna links to each other with chip and circuit on the substrate by the substrate internal wiring, thereby makes described smart card possess radio-frequency enabled.
The flat shape of described substrate comprises rectangle, square, circle, ellipse.
Compare with prior art, the beneficial effect of the technique scheme that the utility model adopts is:
1, can be good at solving the multicore sheet integration module of molding mode encapsulation and the problem of intelligent card body bond strength, bigger thereby the utility model has been expanded the feasible intensity of gluing together of area of the glue bond between smart card module and the card body, increased reliability;
2, only need change the shape of substrate simply, just can resemble the shape of flexible change smart card module surface of contact traditional smart card, and not be subjected to the influence of molding encapsulated member and inside chip circuit thereof.
Description of drawings
Fig. 1 is the vertical view of the high bond strength multicore sheet integration module embodiment one of the utility model;
Fig. 2 is the front view of described multicore sheet integration module embodiment one;
Fig. 3 is the sectional view of described multicore sheet integration module embodiment one;
Fig. 4 is the substrate vertical view of the utility model multicore sheet integration module;
Fig. 5 is the sectional view that the utility model comprises the smart card of high bond strength multicore sheet integration module;
Fig. 6 is packaged smart card vertical view described in the utility model.
Embodiment
Be described in further detail below in conjunction with the most preferred embodiment shown in each accompanying drawing.
A kind of smart card that comprises high bond strength multicore sheet integration module of the utility model comprises card body 4 and integration module 1; As Fig. 1 or shown in Figure 2, this integration module 1 comprises substrate 11 and plastic encapsulation body 12, and described substrate 11 comprises substrate internal wiring 111 and smart card contact 112; As Fig. 2 or shown in Figure 3, smart card contact 111 is produced on substrate 11 back sides, and is electrically connected with substrate internal wiring 112; As shown in Figure 3, described plastic encapsulation body 12 comprises chip 121, passive device 122 and lead 123; Described chip 121 and passive device 122 place substrate 11 fronts; Described chip 121, passive device 122 are electrically connected by lead 123 and substrate internal wiring 111.
As shown in Figure 5, described plastic encapsulation body 12 is the equal thickness schistose texture, and its thickness deducts the thickness of substrate 11 again less than the thickness of card body 4, so that can embed fully in card body 4 bodies; As shown in Figure 1, described substrate 11 areas must contain plastic encapsulation body 12 areas, so that plastic encapsulation body 12 is placed on it fully; As shown in Figure 5, mill out a stairstepping groove at card body 4 assigned positions, the groove that this stairstepping groove the inside is darker and plastic encapsulation body 12 are sliding fit at depth direction, this stairstepping groove outside is sliding fit than shallow grooves and substrate 11 at depth direction, adopts cold glue or hot melt adhesive technology will described integration module 1 close and firm ground to implant in the card body 4 and also is adjacent to fully with it.
As shown in Figure 2, the thickness of the plastic encapsulation body 12 of described integration module 1 and substrate 11 thickness sums, must be less than the thickness of card body 4, could implant fully in card body 4 bodies, Fig. 1 to Fig. 6 is that encapsulated member 12 is rectangular parallelepiped, substrate 11 is the synoptic diagram of rectangle embodiment, in actual fabrication, can as required described encapsulated member 12 and substrate 11 be made into satisfactory structure.
The equal thickness schistose texture of described plastic encapsulation body 12 comprises rectangular structure, cube structure and cylindrical structure, the vertical view of embodiment when Fig. 1 is rectangular parallelepiped for the equal thickness schistose texture.
As shown in Figure 5, described substrate 11 areas are implanted in card body 4 bodies so that can finish less than card body 4 area sizes.
Integrated radio-frequency antenna on the described substrate 11, this radio-frequency antenna links to each other with chip 121 and circuit 112 on the substrate by the substrate internal wiring, thereby makes described smart card 5 possess radio-frequency enabled.
Described substrate 11 flat shapes comprise rectangle, square, circle, ellipse, the situation of embodiment when being substrate 11 for rectangle to figure shown in Figure 6 as Fig. 1, in practical application, can as required substrate 11 be made into satisfactory shape.
Make and described in the utility modelly comprise that the smart card step of high bond strength multicore sheet integration module is as follows:
A. designing substrate 11 by pre-designed wire bond composition, as shown in Figure 4, is the enough spaces of substrate in design, guarantees that plastic encapsulation body 12 can be placed on above the substrate 11 fully;
B. adopt modes such as flip-chip, load, routing, Surface Mount, Reflow Soldering that various chips and passive device are placed in the substrate front side regulation zone, and connect into the circuit of certain function;
C. with moulding technology substrate front side regulation zone and on chip, passive device and lead all seal with plastic encapsulation body 12, as shown in Figure 2;
D. whole module is carried out processing such as personalization, to play sign and effect attractive in appearance.

Claims (5)

1, a kind of smart card that comprises high bond strength multicore sheet integration module comprises card body (4) and integration module (1); This integration module (1) comprises substrate (11) and plastic encapsulation body (12), and described substrate (11) comprises substrate internal wiring (112) and smart card contact (111); Smart card contact (111) is produced on substrate (11) back side, and is electrically connected with substrate internal wiring (112); Described plastic encapsulation body (12) comprises chip (121), passive device (122) and lead (123); Described chip (121) and passive device (122) place substrate (11) front; Described chip (121), passive device (122) are electrically connected by lead (123) and substrate internal wiring (111), it is characterized in that:
Described plastic encapsulation body (12) is the equal thickness schistose texture, and its thickness deducts the thickness of substrate (11) again less than the thickness of card body (4), so that can embed fully in card body (4) body; Described substrate (11) area must contain the area of plastic encapsulation body (12), so that plastic encapsulation body (12) is placed on it fully; Mill out a stairstepping groove at card body (4) assigned position, this darker groove and plastic encapsulation body (12) in stairstepping groove the inside is sliding fit at depth direction, the groove outside of this stairstepping is sliding fit than shallow grooves and substrate (11) at depth direction, and employing cold glue or hot melt adhesive technology are implanted described integration module (1) close and firm ground in the card body (4) and also is adjacent to fully with it.
2, the smart card that comprises high bond strength multicore sheet integration module as claimed in claim 1 is characterized in that:
The equal thickness schistose texture of described plastic encapsulation body (12) comprises rectangular structure, cube structure and cylindrical structure.
3, the smart card that comprises high bond strength multicore sheet integration module as claimed in claim 1 is characterized in that:
Described substrate (11) area is less than card body (4) area, thereby can implant fully in card body (4) body.
4, the smart card that comprises high bond strength multicore sheet integration module as claimed in claim 1 is characterized in that:
Radio-frequency antenna gone up integrated by described substrate (11), and this radio-frequency antenna links to each other with chip (121) and circuit (111) on the substrate by the substrate internal wiring, thereby makes described smart card (5) possess radio-frequency enabled.
5, the smart card that comprises high bond strength multicore sheet integration module as claimed in claim 1 is characterized in that:
The flat shape of described substrate (11) comprises rectangle, square, circle, ellipse.
CNU2008200940356U 2008-05-20 2008-05-20 Smart card containing high adhesive strength multi-chip integrated module Expired - Lifetime CN201222264Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200940356U CN201222264Y (en) 2008-05-20 2008-05-20 Smart card containing high adhesive strength multi-chip integrated module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200940356U CN201222264Y (en) 2008-05-20 2008-05-20 Smart card containing high adhesive strength multi-chip integrated module

Publications (1)

Publication Number Publication Date
CN201222264Y true CN201222264Y (en) 2009-04-15

Family

ID=40575767

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200940356U Expired - Lifetime CN201222264Y (en) 2008-05-20 2008-05-20 Smart card containing high adhesive strength multi-chip integrated module

Country Status (1)

Country Link
CN (1) CN201222264Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102254211A (en) * 2010-05-20 2011-11-23 上海伊诺尔信息技术有限公司 Mobile communication subscriber identity module packaged with stacked chip scale package
CN108171299A (en) * 2017-12-19 2018-06-15 中电智能卡有限责任公司 A kind of processing technology of smart card

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102254211A (en) * 2010-05-20 2011-11-23 上海伊诺尔信息技术有限公司 Mobile communication subscriber identity module packaged with stacked chip scale package
CN108171299A (en) * 2017-12-19 2018-06-15 中电智能卡有限责任公司 A kind of processing technology of smart card

Similar Documents

Publication Publication Date Title
CN100424721C (en) Method for fabricating and packaging chips and elements to smart card with plastic package technique
CN204720447U (en) A kind of electromagnetic shielding module package structure of groove substrate
CN106611212A (en) Dual-interface IC card
US7095103B1 (en) Leadframe based memory card
US20130181342A1 (en) Semiconductor package
CN101409275A (en) Double-interface smart card module and loading belt
CN100477286C (en) Semiconductor module
CN201222264Y (en) Smart card containing high adhesive strength multi-chip integrated module
CN101188232A (en) Laminated encapsulation structure and its making method
CN101477975A (en) SIM card encapsulation construction based on metal lead wire frame and encapsulation process thereof
CN206179848U (en) PoP stacked package structure
CN102446868A (en) Novel dual-interface smart card module and implementation method thereof
CN102339404A (en) Novel intelligent card module and productive technology thereof
CN105590904A (en) Fingerprint identification multi-chip package structure and preparation method thereof
CN106991466A (en) Double-interface smart card and its manufacture method
CN210897279U (en) Embedded packaging structure of integrated antenna and radio frequency front end based on metal substrate
CN207183249U (en) A kind of encapsulating structure of silicon hole memory chip and copper base
CN205211727U (en) Fingerprint identification multi -chip packaging structure
CN205016527U (en) Cover brilliant camera case chip
CN103208471B (en) Multi-chip encapsulation body
CN102013419A (en) Carrier band for packaging minitype radio-frequency module
CN104538529A (en) Low-cost LED packaging structure and wafer-level packaging method thereof
CN102468190A (en) Packaging mould and semiconductor packaging process using same
ES2747913T3 (en) Method for incorporating an inverted integrated circuit chip
CN202111082U (en) Multi-loop arrangement integrated circuit (IC) chip package element

Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CX01 Expiry of patent term

Granted publication date: 20090415

CX01 Expiry of patent term