CN201716756U - Smart card module - Google Patents
Smart card module Download PDFInfo
- Publication number
- CN201716756U CN201716756U CN2010202655147U CN201020265514U CN201716756U CN 201716756 U CN201716756 U CN 201716756U CN 2010202655147 U CN2010202655147 U CN 2010202655147U CN 201020265514 U CN201020265514 U CN 201020265514U CN 201716756 U CN201716756 U CN 201716756U
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- smart card
- module
- cfn
- card module
- carrier
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Abstract
The utility model discloses a smart card module which is bonded with a CFN module and a carrier tape. The smart card module combines CFN module and a PET circuit board, greatly improving production efficiency and lowering the material and manufacture cost of smart card module production.
Description
Technical field:
The utility model relates to the semiconductor microelectronics encapsulation technology, is specifically related to a kind of intelligent object based on the CFN module.
Background technology:
Along with the continuous progress of integrated circuit encapsulation technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.In field of intelligent cards because security and multi-functional requirement display gradually, require cost reduce or constant situation under increase reliability.
But the encapsulation of conventional intelligent object generally all is to use FR4 or the G10 substrate layer as carrier band, single face or two-sided deposited copper wire are set, then intelligent card chip paster, routing are connected, direct molding or UV encapsulate after waiting to finish, and realize the high reliability of smart card module.This method for packing requires corresponding carrier band can directly beat gold thread, and this carrier band all is to be produced without competition by external producer at present, die cost height, and unit price costliness.The expense height that this makes intelligent object encapsulation greatly reduces the market competitiveness of corresponding intelligent object.
Simultaneously during the normal procedure intelligent module package, damage inside chip and line kind easily when the degree of shrinkage of the degree of shrinkage of moulding compound and carrier band material is inconsistent, the performance of reduction product.
The utility model content:
The utility model need rely on expensive carrier band at above-mentioned existing intelligent object encapsulation technology, thereby reduce the problem of the finished product market competitiveness, and provide a kind of novel intelligent card module, this module has very low packaging cost, and can effectively satisfy the fiduciary level requirement of smart card industry to smart card module.
In order to achieve the above object, the utility model adopts following technical scheme:
A kind of smart card module, described smart card module comprise CFN (quad flat non-pin package) module and carrier, and described CFN module is bonded on the described carrier.
Described carrier comprises the copper foil circuit layer of substrate layer, surface process electroplating technology and the anti-oxidation processing of PET material, and the tow sides of described substrate layer lay described copper foil circuit layer respectively.
The thickness of described CFN module is 0.33-0.50mm.
Described CFN module is installed on the described carrier by the low-temperature conductive cementing agent of environment-friendly materials, and welds mutually with copper foil circuit on the described carrier.
The quantity that described CFN module is installed is one or more.
One or more paster components and parts also can be installed on the described carrier.
The novel intelligent card module that the utility model provides adopts on the direct bonding carrier of CFN module of quad flat non-pin package, avoid carrier band need beat the technology of gold thread, thereby realize need not to adopt expensive special carrier band, reduce cost of products greatly, greatly improve the competitiveness of product in market.
The novel intelligent card module that while the utility model provides can be applied among all kinds of smart cards processing, as bank card, consumption card, mobile phone card etc. widely; It helps the general of production equipment, the raising of product reliability, and the installation that makes things convenient for later process simultaneously.
Description of drawings:
Further specify the utility model below in conjunction with the drawings and specific embodiments.
Fig. 1 is a front schematic view of the present utility model;
Fig. 2 is a schematic rear view of the present utility model;
Fig. 3 is a cut-open view of the present utility model;
Embodiment:
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
Owing to during the encapsulation of conventional intelligent object, require corresponding carrier band can directly beat gold thread, moreover this carrier band all is to be produced without competition by external producer at present, die cost height, and unit price costliness.Thereby make the expense height that intelligent object encapsulates, greatly reduce the market competitiveness of corresponding intelligent object.
At above-mentioned situation, the utility model avoids adopting the encapsulating structure of normal procedure intelligent module, and a kind of novel smart card module is provided.
Referring to Fig. 1, the smart card module that the utility model provides comprises CFN module 1 and carrier 2 two parts.
Wherein, CFN module 1 is a quad flat non-pin package, and its thickness is 0.33-0.50mm, is attached on the carrier band by semi-conductor chip, and the line lead bonding of going forward side by side is packaged into ultra-thin, subminiature intelligent object at last, so that the follow-up SMT that carries out processes use.
The pin of CFN module 1 and circuit 4 electrically connect, and carry out the electrical property conducting by 5 pairs of smart card module pros and cons of through hole again.
Referring to Fig. 2, smart card module front contact 6 is the standard intelligent card contact size, by slotted eye 7 its eight contacts is isolated separately.
Referring to Fig. 3, carrier 2 comprises substrate layer 2-1 and copper foil circuit layer 2-2.The material of substrate layer 2-1 is the PET material, and its color is transparent or white or other colors; The tow sides of substrate layer 2-1 all lay copper foil circuit layer 2-2, and this copper foil circuit layer 2-2 is the copper foil circuit wiring board, and electroplating technology is carried out on its surface, and adds anti-oxidation processing.
Be to form smart card module, the utility model with the low-temperature conductive cementing agent 3 of CFN module 1 by environment-friendly materials directly bonding be installed on the corresponding site of carrier 2, and weld mutually with copper foil circuit on the carrier 2.Such structure avoid conventional module package required beat gold thread technology, thereby can avoid using special carrier band, thereby greatly reduce production costs, also do not influence the performance and the practical ranges of product simultaneously.
Further, CFN module 1 can be according to the functional requirement of actual application of IC cards in the utility model, the quantity of installation optional from one to a plurality of.
In addition, the paster components and parts of one or more other types can be installed as required, as resistance, electric capacity etc. on the carrier 2.
It is of a size of standard intelligent card size: 12.6mm * 11.4mm the smart card module that is obtained by such scheme, and its thickness is 0.53mm-0.56mm.
In order to increase production efficiency, adopt web-like pan feeding and web-like discharge method in the novel intelligent card module production run.Promptly whole volume carrier band is sent into patch device automatically by track, and carries out mounting of CFN module and components and parts automatically, mounting will put in order the volume carrier band automatically by the equipment track again after finishing and send.
More than show and described ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; that describes in the foregoing description and the instructions just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. a smart card module is characterized in that, described smart card module comprises CFN module and carrier, and described CFN module is bonded on the described carrier.
2. a kind of smart card module according to claim 1, it is characterized in that, described carrier comprises the copper foil circuit layer of substrate layer, surface process electroplating technology and the anti-oxidation processing of PET material, and the tow sides of described substrate layer lay described copper foil circuit layer respectively.
3. a kind of smart card module according to claim 1 is characterized in that, the thickness of described CFN module is 0.33-0.50mm.
4. a kind of smart card module according to claim 1 and 2 is characterized in that, described CFN module is installed on the described carrier by the low-temperature conductive cementing agent of environment-friendly materials, and welds mutually with copper foil circuit on the described carrier.
5. according to claim 1 or 3 described a kind of smart card modules, it is characterized in that the quantity that described CFN module is installed is one or more.
6. a kind of smart card module according to claim 1 and 2 is characterized in that, one or more paster components and parts also can be installed on the described carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202655147U CN201716756U (en) | 2010-07-20 | 2010-07-20 | Smart card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202655147U CN201716756U (en) | 2010-07-20 | 2010-07-20 | Smart card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201716756U true CN201716756U (en) | 2011-01-19 |
Family
ID=43462762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202655147U Expired - Fee Related CN201716756U (en) | 2010-07-20 | 2010-07-20 | Smart card module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201716756U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013023326A1 (en) * | 2011-08-18 | 2013-02-21 | 上海长丰智能卡有限公司 | Carrier tape for novel smart card module, smart card module, module production process, and smart card |
-
2010
- 2010-07-20 CN CN2010202655147U patent/CN201716756U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013023326A1 (en) * | 2011-08-18 | 2013-02-21 | 上海长丰智能卡有限公司 | Carrier tape for novel smart card module, smart card module, module production process, and smart card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110119 Termination date: 20170720 |