CN202217310U - Smart card - Google Patents
Smart card Download PDFInfo
- Publication number
- CN202217310U CN202217310U CN2011202802920U CN201120280292U CN202217310U CN 202217310 U CN202217310 U CN 202217310U CN 2011202802920 U CN2011202802920 U CN 2011202802920U CN 201120280292 U CN201120280292 U CN 201120280292U CN 202217310 U CN202217310 U CN 202217310U
- Authority
- CN
- China
- Prior art keywords
- chip
- smart card
- antenna
- flexible pcb
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005530 etching Methods 0.000 claims abstract description 46
- 239000000126 substance Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract 1
- ARXHIJMGSIYYRZ-UHFFFAOYSA-N 1,2,4-trichloro-3-(3,4-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=C(Cl)C=CC(Cl)=C1Cl ARXHIJMGSIYYRZ-UHFFFAOYSA-N 0.000 description 23
- 239000000463 material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- Credit Cards Or The Like (AREA)
Abstract
A smart card comprises a flexible circuit board and a chip, wherein an etching antenna is arranged on the flexible circuit board, and the chip is installed on the flexible circuit board and is electrically connected with the etching antenna. The flexible circuit board is used for replacing the carrier tape, and has the characteristics of high wiring density, light weight and thin thickness. The chip is mounted on the flexible circuit board, and an etched antenna is fabricated on the flexible circuit board instead of the individual antenna, so that the chip and the etched antenna are electrically connected through the respective pads. The intelligent card realizes the integration of the chip and the etching antenna, and the flexible circuit board and the etching antenna have certain ductility and bending resistance, so that short circuit between the chip and the antenna can be effectively prevented, and the use reliability of the intelligent card is improved.
Description
[technical field]
The utility model relates to a kind of smart card, particularly relates to a kind of contactless smart card.
[background technology]
Smart card mainly comprises cover plate, chip, antenna, carrier band at present, and its chips and antenna all are separate units, when encapsulation, is installed in respectively on the corresponding position of carrier band, processes smart card through encapsulation cover plate more afterwards.The module that is equipped with of chip is welded and the direct two kinds of methods of chip of pasting in the contactless smart card at present; But each defectiveness: the chip cost of module package is too high; It is not enough to the protection of chip directly to paste chip, is prone to cause chip to damage or the chip pin short circuit, reduces the reliability that smart card uses.The injection moulding mode is generally adopted in the encapsulation of smart card cover plate; Because heat pressing process; The antenna that covers on the carrier band combines dynamics not strong with the cover plate base material; Cause its peel strength not enough, and adopt the ease of connection formation short circuit of its lead-in wire of antenna with the chip pin of bonding method installation, can reduce the reliability that smart card uses equally.
[utility model content]
Based on this, be necessary the smart card that provides a kind of dependability high.
A kind of smart card comprises flexible PCB and chip, and flexible PCB is provided with etching antenna, and chip is installed on the flexible PCB and with etching antenna and is electrically connected.
Utilize flexible PCB to replace carrier band, flexible PCB to have that distribution density is high, in light weight, the characteristics of thin thickness.Chip is installed on the flexible PCB, and the making etching antenna replaces stand-alone antenna on flexible PCB, makes chip and etching antenna be electrically connected through corresponding pad.It is integrated that above-mentioned smart card has realized that chip is connected with etching antenna, and flexible PCB and etching antenna have certain ductility and anti-bending property, can effectively prevent to be short-circuited between chip and the antenna, improved the reliability that smart card uses.
Further, flexible PCB is provided with pad, and etching antenna also comprises antenna lead, and chip is provided with chip pin, and antenna lead and pad directly are electrically connected, and chip pin is welded on the pad.
Thereby realized etching antenna, pad in chip pin connect integrated, and chip pin is connected with pad well, effectively prevented to be short-circuited between chip and the antenna.
Further, etching antenna encloses greater than one around chip on flexible PCB, has two-sided conductive through hole on the flexible PCB, and etching antenna is electrically connected respectively at said two-sided conductive through hole on the two sides of flexible PCB.
Through two-sided conductive through hole, can make etching antenna on the flexible PCB around a circle more than, and final realize closed.Prevent that etching antenna from intersecting in same plane, cause line short, improved the reliability that smart card uses.Simultaneously, also avoid the use of wire jumper, saved technology, reduced cost.
Further, smart card also comprises cover plate, cover plate packaged chip and flexible PCB.
Chip and etching antenna on the cover plate protection flexible PCB are not damaged.
Further, flexible PCB only is provided with the cover plate that polymkeric substance is processed in the one side that chip is installed.
The one side that chip is not installed must not be provided with cover plate, and economical with materials makes the thickness attenuation of smart card.
Further, smart card also comprises the protection glue-line, and the protection glue-line is between cover plate and chip, and the protection glue-line covers chip, chip pin and antenna lead.
On the junction of chip, chip pin and antenna lead, scribble the protection glue-line, and it is encapsulated, make the junction of chip pin and antenna lead be difficult for throwing off, prevented to be short-circuited between chip and the etching antenna.Said protection glue need have certain toughness, can bear uniform temperature, and certain ductility is arranged.Here, the protection glue-line can be selected UV glue or RTV silica gel for use.
Further, smart card also comprises packed layer, and packed layer is being protected between glue-line and the cover plate packed layer covering protection glue-line and flexible PCB.
Further, the thickness of packed layer is greater than the thickness of chip.
It is in order to be reduced in when on the flexible PCB cover plate being set the pressure of chip that protection is provided with packed layer above the glue-line, and packed layer plays the effect to pressure buffer, thereby has increased the protection to chip, reduces the disqualification rate of production of intelligent card.
Further, smart card also comprises contact smart card modules.Smart card is provided with the function that contact smart card modules makes a sheet smart card not only have the function of contact intelligent card but also contactless smart card is arranged.
[description of drawings]
Fig. 1 is the inner structure synoptic diagram of the smart card of an embodiment;
Fig. 2 is installed in the synoptic diagram on the flexible PCB for the chip of smart card shown in Figure 1;
Fig. 3 is installed in the cut-open view on the flexible PCB for the chip of smart card shown in Figure 2.
[embodiment]
For the ease of understanding the utility model, will more comprehensively describe the utility model with reference to relevant drawings below.Provided the preferred embodiment of the utility model in the accompanying drawing.But the utility model can be realized with many different forms, be not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make to the disclosure of the utility model understand comprehensively thorough more.
Need to prove, when element is called as " being fixed in " another element, it can be directly on another element or also can have element placed in the middle.When an element is considered to " connection " another element, it can be to be directly connected to another element or possibly to have element placed in the middle simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement do not represent it is unique embodiment just for illustrative purposes.
Only if definition is arranged in addition, the employed all technology of this paper are identical with the implication of the those skilled in the art's common sense that belongs to the utility model with scientific terminology.Among this paper in the instructions of the utility model employed term be not intended to be restriction the utility model just in order to describe the purpose of concrete embodiment.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
See also Fig. 1 and Fig. 2, the smart card 100 of present embodiment comprises flexible PCB 110 and chip 120.Flexible PCB 110 is provided with etching antenna 130.Chip 120 is installed on the flexible PCB 110 on the corresponding pad, and is electrically connected with etching antenna 130.
Utilize flexible PCB 110 to replace carrier bands, flexible PCB 110 has that distribution density is high, in light weight, the characteristics of thin thickness.
See also Fig. 2, flexible PCB 110 is provided with pad (figure does not show).Etching antenna 130 is etched on the flexible PCB 110, replaces stand-alone antenna.Etching antenna 130 comprises antenna lead (figure do not show), and it is that part of that antenna lead is meant that etching antenna links to each other with pad, when manufacturing flexible PCB 110, the pad of antenna lead and chip to be installed 120 directly is electrically connected.
The direct electric company of pad on antenna lead and the flexible PCB 110; Thereby it is integrated to have realized that chip pin is connected with antenna lead; And chip pin is connected with antenna lead well, has effectively prevented to open circuit or short circuit between chip 120 and the etching antenna 130.Effectively improved the reliability that smart card 100 uses.And flexible PCB 110 has certain ductility and anti-bending property with etching antenna 130, can effectively prevent to be short-circuited between chip 120 and the etching antenna 130, has improved the reliability that smart card 100 uses.
Also offer two-sided conductive through hole on the flexible PCB 110: first conductive through hole 112 and second conductive through hole 114.One end of etching antenna 130 and chip pin directly are electrically connected on pad, and etching antenna 130 will be around chip 120 pitch of the laps on flexible PCB 110, and etching antenna 130 is wanted closed connection but can not be intersected.Through two-sided conductive through hole make etching antenna 130 on flexible PCB 110 around chip 120 greater than a circle.See also Fig. 3; One end of etching antenna 130 and 112 conductings of first conductive through hole; The other end through with 114 conductings of second conductive through hole; At the other etching antenna 130 of flexible PCB 110 with first conductive through hole 112 and 114 conductings of second conductive through hole, thereby realized etching antenna 130 on flexible PCB 110 around chip 120 greater than a circle and etching antenna 130 closures, the two ends of etching antenna 130 and chip pin directly are electrically connected.
Through two-sided conductive through hole, etching antenna 130 is distributed in two planes of flexible PCB 110, etching antenna 130 can be realized closed on another plane of flexible PCB 110.Prevent that etching antenna 130 from intersecting in same plane, cause line short, improved the reliability that smart card 100 uses.Simultaneously, also avoid the use of wire jumper, saved technology, reduced cost.
See also Fig. 1, smart card 100 also comprises cover plate 140, cover plate 140 packaged chips 120 and flexible PCB 110.Chip 120 and etching antenna 130 on the protection flexible PCB 110 are not damaged.
Be appreciated that flexible PCB 110 is for only being provided with the cover plate that cover plate is processed in the one side that chip 120 is installed.The one side that chip 120 is not installed must not be provided with cover plate, and economical with materials makes the thickness attenuation of smart card 100.Be appreciated that cover plate can adopt PVC material or resin material.
Smart card 100 also comprises protection glue-line 150, and protection glue-line 150 is between chip 120 and cover plate 140, and protection glue-line 150 covers chip 120, chip pin and antenna lead.Between chip 120 and cover plate 140; Particularly scribble protection glue-line 150 on the junction of chip pin and antenna lead; And it is encapsulated, make the junction of chip pin and antenna lead be difficult for throwing off, prevented to be short-circuited between chip 120 and the etching antenna 130.Protection glue-line 150 need have certain toughness, can bear uniform temperature, and certain ductility is arranged.Here, protection glue-line 150 can be selected UV glue or RTV silica gel for use.
Be appreciated that protection glue-line 150 can omit, cover plate 140 directly overlays on chip 120 and the flexible PCB 110.
Smart card 100 also comprises packed layer 160, and packed layer 160 is at cover plate 140 and protect between the glue-line 150 packed layer 160 covering protection glue-lines 150 and flexible PCBs 110.The thickness of packed layer 160 is greater than the thickness of chip 120.
It is in order to be reduced in when on the flexible PCB 110 cover plate 140 being set the pressure to chip 120 that protection is provided with packed layer 160 above the glue-line 150; Packed layer 160 plays the effect to pressure buffer; Thereby increased protection, reduced the disqualification rate of production of intelligent card 100 chip 120.
Be appreciated that packed layer 160 can omit, cover plate 110 direct packaged chips 120.
Smart card 100 also comprises contact smart card modules (figure do not show), and smart card 100 is provided with the function that contact smart card modules (figure does not show) makes a sheet smart card not only have the function of contact intelligent card but also contactless smart card is arranged.
The above embodiment has only expressed several kinds of embodiments of the utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to the protection domain of the utility model.Therefore, the protection domain of the utility model patent should be as the criterion with accompanying claims.
Claims (9)
1. a smart card is characterized in that, said smart card comprises:
Flexible PCB is provided with etching antenna; And
Chip is installed on the said flexible PCB and with said etching antenna and is electrically connected.
2. smart card according to claim 1 is characterized in that said flexible PCB is provided with pad; Said etching antenna comprises antenna lead; Said chip is provided with chip pin, and said antenna lead and said pad directly are electrically connected, and said chip pin is welded on the said pad.
3. smart card according to claim 2; It is characterized in that; Said etching antenna encloses greater than one around chip on said flexible PCB; Have two-sided conductive through hole on the said flexible PCB, said etching antenna is electrically connected respectively at said two-sided conductive through hole on the two sides of said flexible PCB.
4. smart card according to claim 1 is characterized in that said smart card also comprises cover plate, and said cover plate encapsulates said chip and said flexible PCB.
5. smart card according to claim 4 is characterized in that, the one side that said flexible PCB is installed said chip is provided with the said cover plate that polymkeric substance is processed.
6. smart card according to claim 5 is characterized in that said smart card also comprises the protection glue-line, and said protection glue-line is between said cover plate and said chip, and said protection glue-line covers said chip, said chip pin and said antenna lead.
7. smart card according to claim 6 is characterized in that said smart card also comprises packed layer, and said packed layer is between said protection glue-line and said cover plate, and said packed layer covers said protection glue-line and said flexible PCB.
8. smart card according to claim 7 is characterized in that the thickness of said packed layer is greater than the thickness of said chip.
9. according to any described smart card of claim 1 to 8, it is characterized in that said smart card also comprises contact smart card modules.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202802920U CN202217310U (en) | 2011-08-03 | 2011-08-03 | Smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202802920U CN202217310U (en) | 2011-08-03 | 2011-08-03 | Smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202217310U true CN202217310U (en) | 2012-05-09 |
Family
ID=46016553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202802920U Expired - Fee Related CN202217310U (en) | 2011-08-03 | 2011-08-03 | Smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202217310U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104156756A (en) * | 2013-05-15 | 2014-11-19 | 苏州海博智能系统有限公司 | Visual intelligent card and packaging method thereof |
-
2011
- 2011-08-03 CN CN2011202802920U patent/CN202217310U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104156756A (en) * | 2013-05-15 | 2014-11-19 | 苏州海博智能系统有限公司 | Visual intelligent card and packaging method thereof |
| CN104156756B (en) * | 2013-05-15 | 2021-09-24 | 苏州海博智能系统有限公司 | Visual smart card and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120509 Termination date: 20150803 |
|
| EXPY | Termination of patent right or utility model |