CN202816930U - Lead frame structure of MSOP8 package - Google Patents
Lead frame structure of MSOP8 package Download PDFInfo
- Publication number
- CN202816930U CN202816930U CN201220472202.2U CN201220472202U CN202816930U CN 202816930 U CN202816930 U CN 202816930U CN 201220472202 U CN201220472202 U CN 201220472202U CN 202816930 U CN202816930 U CN 202816930U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- msop8
- package
- frame structure
- frame unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model provides an MSOP8 package lead frame structure. The technical purpose is to provide the novel MSOP8 package lead frame structure to improve the package efficiency of an integrated circuit. The MSOP8 package lead frame structure comprises a substrate. 40 rows of lead frame units are arranged on the substrate. Each row of lead frame units is provided with 10 lead frame units. According to the utility model, the production efficiency is greatly improved, and the labor cost is greatly reduced; the power consumption and the resin consumption are effectively reduced; and the MSOP8 package lead frame structure is suitable for integrated circuit package.
Description
Technical field
The utility model relates to a kind of lead frame structure of integrated circuit, in particular, relates to a kind of MSOP8 package lead structure.
Background technology
Must use lead frame structure during integrated antenna package, existing MSOP8 package lead mount structure, because technology is limit before being subjected to, one row can only arrange at most five lead frames, can fill 140 circuit on a slice MSOP8 package lead mount structure, every mould can seal at most eight MSOP8 package lead mount structures, and every like this mould can go out at most 1120 in circuit, thereby efficient has much room for improvement.Because chip package has been tending towards meagre profit, therefore how improves packaging efficiency, save cost and become unavoidable problem.Therefore, existing MSOP8 package lead mount structure can not satisfy the demands, and needs to improve.
Summary of the invention
Technical purpose of the present utility model is to overcome in the prior art, during the encapsulation of integrated circuit is produced, the structure of leads of IC frame exists affects the technical problem that production efficiency improves, and a kind of new MSOP8 package lead mount structure is provided, to improve the packaging efficiency of integrated circuit.
MSOP8 package lead mount structure comprises that the described substrate of substrate is provided with 40 row lead frame unit, and described every row lead frame unit is provided with 10 lead frame unit.
Further, per two rows in described lead frame unit one are mounted on the described substrate.
Further, described lead frame unit has 20 groups, and proper alignment is on described substrate.
The beneficial effects of the utility model are: because every row is provided with ten lead frame unit, compare the MSOP8 package lead mount structure of existing five row's structures, production efficiency improves greatly, thereby greatly reduces cost of labor; With the consumption that advances also can effectively reduce power consumption and resin, thereby technique effect is obvious.
Description of drawings
Fig. 1 is the vertical view of the utility model embodiment MSOP8 package lead mount structure.
Fig. 2 is the front view of the utility model embodiment MSOP8 package lead mount structure.
Fig. 3 is the partial enlarged drawing of A part among Fig. 2.
Embodiment
Fig. 1 to Fig. 3 is described in further detail the utility model below in conjunction with accompanying drawing.
The design of MSOP8 package lead mount structure, the main arrangement problems that will solve exactly between a few row's circuit should reduce circuit paging effective area as far as possible, thereby saves copper material, the reliability when considering again the whole piece circuit package.The MSOP8 package lead mount structure of this embodiment comprises the substrate 1 of a rectangle as depicted in figs. 1 and 2, and is arranged in the some lead frames unit 2 on the substrate 1.And clearly visible by Fig. 1,2 per ten of lead frame unit are a row.As seen from Figure 2, per two row lead frame unit 2 are one group, for the svelteness of accompanying drawing as seen, Fig. 2 has adopted ellipse, Fig. 3 is the partial enlarged drawing of A part among Fig. 2, single lead frame unit 2 as seen from Figure 3.
On the MSOP8 package lead mount structure, be placed with 20 batch totals, 40 row lead frame unit 2 at whole substrate 1, the every structural lead frame of MSOP8 package leadframe unit 2 amounts to 400 like this, can fill 400 circuit.And every mould can go out 8 MSOP8 package lead mount structures, can go out the circuit number and reach 3200, compare the MSOP8 package lead mount structure of existing 5 row's structures, production efficiency improves 186%, thereby greatly reduce cost of labor, with advancing also can effectively reduce the consumption of power consumption and resin, thereby technique effect is obvious, is the not only practical but also novel technological improvement of one of this area.
Claims (3)
1.MSOP8 the package lead mount structure is characterized in that: comprise substrate, described substrate is provided with 40 row lead frame unit, and described every row lead frame unit is provided with 10 lead frame unit.
2. MSOP8 package lead mount structure according to claim 1 is characterized in that: per two rows in described lead frame unit one are mounted on the described substrate.
3. MSOP8 package lead mount structure according to claim 2, it is characterized in that: described lead frame unit has 20 groups, and proper alignment is on described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220472202.2U CN202816930U (en) | 2012-09-17 | 2012-09-17 | Lead frame structure of MSOP8 package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220472202.2U CN202816930U (en) | 2012-09-17 | 2012-09-17 | Lead frame structure of MSOP8 package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202816930U true CN202816930U (en) | 2013-03-20 |
Family
ID=47875770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220472202.2U Expired - Lifetime CN202816930U (en) | 2012-09-17 | 2012-09-17 | Lead frame structure of MSOP8 package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202816930U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474409A (en) * | 2013-09-11 | 2013-12-25 | 杰群电子科技（东莞）有限公司 | Arrangement method designed for high-density lead frames for discrete device |
-
2012
- 2012-09-17 CN CN201220472202.2U patent/CN202816930U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474409A (en) * | 2013-09-11 | 2013-12-25 | 杰群电子科技（东莞）有限公司 | Arrangement method designed for high-density lead frames for discrete device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Longgang District of Shenzhen City, Guangdong province 518000 Pinghu Street Wo flower community Ping new road No. 165 Building 1 floor 105 Hengshun Factory 1, 2-5 floor Patentee after: China Chippacking Technology Co.,Ltd. Address before: Longgang District of Shenzhen City, Guangdong province 518000 Pinghu Street Wo flower community Ping new road No. 165 Building 1 floor 105 Hengshun Factory 1, 2-5 floor Patentee before: Shenzhen Chippacking Technology Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130320 |
|
| CX01 | Expiry of patent term |