CN204189789U - A kind of high density LQFP32 integrated circuit packaging lead mount structure - Google Patents
A kind of high density LQFP32 integrated circuit packaging lead mount structure Download PDFInfo
- Publication number
- CN204189789U CN204189789U CN201420639885.5U CN201420639885U CN204189789U CN 204189789 U CN204189789 U CN 204189789U CN 201420639885 U CN201420639885 U CN 201420639885U CN 204189789 U CN204189789 U CN 204189789U
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- China
- Prior art keywords
- lqfp32
- mount structure
- integrated circuit
- frame unit
- high density
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
A kind of high density LQFP32 integrated circuit packaging lead of the utility model mount structure, technical purpose is to provide the higher and high density LQFP32 integrated circuit packaging lead mount structure of improving product yields of a kind of new packaging efficiency.Comprise substrate and some lead frame unit, described lead frame unit five is a row, is divided into 14 rows and arranges on the substrate.The utility model is provided with five lead frame unit owing to often arranging, and compare the LQFP32 package lead mount structure of existing three row's structures, production efficiency improves greatly, thus greatly reduces cost of labor; Also effectively can reduce the consumption of power consumption and resin, thus technique effect is obvious simultaneously, applies in the encapsulation field of suitable application integrated circuit.
Description
Technical field
The utility model relates to integrated antenna package technical field, in particular, relates to a kind of high density LQFP32 package lead mount structure.
Background technology
Lead frame structure must be used during integrated antenna package, existing LQFP32 package lead mount structure, limit owing to being subject to technology before, one row can only arrange at most three lead frames, a slice LQFP32 package lead mount structure can fill 36 circuit, every mould can seal at most two panels LQFP32 package lead mount structure, and so every mould can go out at most 72, circuit, and thus efficiency has much room for improvement.Because chip package is tending towards meagre profit, therefore how to improve packaging efficiency, cost-savingly become unavoidable problem.Therefore, existing LQFP32 package lead mount structure can not satisfy the demands, and needs to improve.
Summary of the invention
Technical problem to be solved in the utility model overcomes in existing LQFP32 encapsulation technology, limit by prior art, and LQFP32 package lead mount structure one is arranged and can only be arranged at most three lead frames and the technological deficiency causing packaging efficiency low; There is provided a kind of new packaging efficiency higher and the high density LQFP32 integrated circuit packaging lead mount structure of improving product yields.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of high density LQFP32 integrated circuit packaging lead mount structure, comprise substrate and some lead frame unit, described lead frame unit five is a row, is divided into 14 rows and arranges on the substrate.
Further, circular hole is placed with between described lead frame unit.
Further, to arrange between described lead frame unit well-regulated circular hole.
Further, irregular circular hole is placed with between described lead frame unit.
The beneficial effects of the utility model are: because often row is provided with five lead frame unit, and compare the LQFP32 package lead mount structure of existing three row's structures, production efficiency improves greatly, thus greatly reduces cost of labor; Also effectively can reduce the consumption of power consumption and resin simultaneously, thus technique effect is obvious, the rule arranged or irregular circular hole, the technological deficiency reducing the product rejection that prestressing force causes can be played in cutting process after integrated antenna package completes, improve the yields after integrated antenna package.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the utility model embodiment LQFP32 integrated circuit packaging lead mount structure.
Fig. 2 is the structure enlarged diagram of A marked position in Fig. 1.
Embodiment
Embodiment 1
Composition graphs 1 and Fig. 2.The design of high density LQFP32 integrated circuit packaging lead mount structure, the technical solution of the utility model is exactly mainly that the row solved between a few row's circuit arranges problem, circuit paging effective area should be reduced as far as possible, thus save copper material, consider reliability during whole piece circuit package again.The LQFP32 package lead mount structure of this embodiment as depicted in figs. 1 and 2, comprises the substrate 1 of one piece of rectangle, and is arranged in the some lead frame unit 2 on substrate 1.And clearly visible by Fig. 1, every five of lead frame unit 2 is a row.As seen from Figure 1, every row lead frame unit 2 is one group, and Fig. 2 is the enlarged diagram of A marked position in Fig. 1, as seen from Figure 2 single lead frame unit 2.
A kind of high density LQFP32 integrated circuit packaging lead mount structure, whole substrate 1 is placed with 14 row lead frame unit 2, and lead frame unit 2 five is a row; The lead frame unit 2 of so every block high density LQFP32 integrated circuit packaging lead mount structure amounts to 70, can fill 70 circuit.And every mould can go out 2 LQFP32 package lead mount structures, circuit number can be gone out and reach 140, compare the LQFP32 package lead mount structure of existing three row's structures, production efficiency improves 94.4%, thus greatly reduce cost of labor, with the consumption entering also can effectively reduce power consumption and resin, thus technique effect is obvious.
Embodiment 2
A kind of high density LQFP32 integrated circuit packaging lead mount structure, whole substrate 1 is placed with 28 row lead frame unit 2, and lead frame unit 2 five is a row; The lead frame unit 2 of so every block high density LQFP32 integrated circuit packaging lead mount structure amounts to 140, can fill 140 circuit.And every mould can go out 2 LQFP32 package lead mount structures, circuit number can be gone out and reach 280, compare the LQFP32 package lead mount structure of existing three row's structures, production efficiency greatly improves, thus greatly reduce cost of labor, with the consumption entering also can effectively reduce power consumption and resin, thus technique effect is obvious.
Above content is in conjunction with the concrete preferred implementation further description used to the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should be considered as belonging to protection range of the present utility model.
Claims (4)
1. a high density LQFP32 integrated circuit packaging lead mount structure, is characterized in that: comprise substrate and some lead frame unit, described lead frame unit five is a row, is divided into 14 rows and arranges on the substrate.
2. a kind of high density LQFP32 integrated circuit packaging lead mount structure according to claim 1, is characterized in that: be placed with circular hole between described lead frame unit.
3. a kind of high density LQFP32 integrated circuit packaging lead mount structure according to claim 2, is characterized in that: well-regulated circular hole of arranging between described lead frame unit.
4. a kind of high density LQFP32 integrated circuit packaging lead mount structure according to claim 2, is characterized in that: be placed with irregular circular hole between described lead frame unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420639885.5U CN204189789U (en) | 2014-10-31 | 2014-10-31 | A kind of high density LQFP32 integrated circuit packaging lead mount structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420639885.5U CN204189789U (en) | 2014-10-31 | 2014-10-31 | A kind of high density LQFP32 integrated circuit packaging lead mount structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204189789U true CN204189789U (en) | 2015-03-04 |
Family
ID=52621764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420639885.5U Active CN204189789U (en) | 2014-10-31 | 2014-10-31 | A kind of high density LQFP32 integrated circuit packaging lead mount structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204189789U (en) |
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2014
- 2014-10-31 CN CN201420639885.5U patent/CN204189789U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |