CN205355048U - Novel SOT223 packaging lead frame - Google Patents
Novel SOT223 packaging lead frame Download PDFInfo
- Publication number
- CN205355048U CN205355048U CN201620024990.7U CN201620024990U CN205355048U CN 205355048 U CN205355048 U CN 205355048U CN 201620024990 U CN201620024990 U CN 201620024990U CN 205355048 U CN205355048 U CN 205355048U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- sot223
- packaging
- lead
- frame unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a novel SOT223 packaging lead frame, including base plate and a plurality of lead frame unit of evenly arranging on the base plate, 11 lead frame units are one, and per two classify as a set ofly, are equipped with 20 groups altogether to lead frame unit on every SOT223 packaging lead frame has 440, can adorn 440 circuit, and every mould can go out 8 SOT223 packaging lead frames, thereby can go out the circuit sum reaches 3520, thereby has improved the packaging efficiency greatly, greatly reduced manufacturing cost, and can also effectively reduce the quantity of power consumption and resin simultaneously.
Description
Technical field
This utility model relates to a kind of integrated circuit packaging lead framework, particularly relates to a kind of SOT223 encapsulating lead.
Background technology
Lead frame must be used during integrated antenna package, lead frame includes substrate and some lead frame unit being evenly spaced on substrate, in prior art, string can only arrange at most five lead frame unit, a piece of SOT223 encapsulating lead can fill 100 circuit, every mould can seal at most eight SOT223 encapsulating leads, and so every mould can go out at most 800, circuit, thus efficiency comparison is low.And tended to slight diarrhea due to chip package, therefore how to improve packaging efficiency, save cost have become as unavoidable problem, therefore, existing SOT223 encapsulating lead can not meet demand, it is necessary to improve.
Utility model content
The purpose of this utility model is in that the New type of S OT223 encapsulating lead providing a kind of packaging efficiency high.
For achieving the above object, this utility model be the technical scheme is that
A kind of New type of S OT223 encapsulating lead, including substrate and some lead frame unit being evenly spaced on described substrate, described lead frame unit 11 is string, is divided into some row and arranges on the substrate, and every two are classified as one group, are provided with 20 groups altogether.
The beneficial effects of the utility model are: be placed with 40 row lead frame unit on the whole substrate of this utility model SOT223 encapsulating lead altogether, so the lead frame unit on every piece of SOT223 encapsulating lead just has 440,440 circuit can be filled, and often mould can go out 8 SOT223 package leadframe, thus circuit sum can be gone out reach 3520, thus substantially increasing packaging efficiency, reducing production cost, and can also effectively reduce the consumption of power consumption and resin simultaneously.
Accompanying drawing explanation
Fig. 1 is this utility model SOT223 encapsulating lead side view；
Fig. 2 is this utility model SOT223 encapsulating lead front view；
Fig. 3 is according to the enlarged diagram of part A in Fig. 2.
Detailed description of the invention
As shown in Figure 1, 2, 3, this utility model SOT223 encapsulating lead includes substrate 1 and some lead frame unit 2 being evenly spaced on described substrate 1, and described lead frame unit 20 one is string, is divided into some row and is arranged on described substrate 1, and every two be classified as one group, it is provided with 20 groups altogether.
So, the whole substrate 1 of this utility model SOT223 encapsulating lead is placed with 11 row's x40 row lead frame unit 2 altogether, so the lead frame unit 2 on every piece of SOT223 encapsulating lead just has 440,440 circuit can be filled, and often mould can go out 8 SOT223 encapsulating leads, thus circuit sum can be gone out reach 3520, compare the SOT223 encapsulating lead of existing 5 row's structures, production efficiency improves 227%, thus greatly reducing cost of labor, it also is able to effectively reduce the consumption of power consumption and resin simultaneously, thus technique effect is obvious.
Claims (1)
1. a New type of S OT223 encapsulating lead, including substrate and some lead frame unit being evenly spaced on described substrate, it is characterised in that: described lead frame unit 11 is string, is divided into some rows and arranges on the substrate, and every two be classified as one group, it is provided with 20 groups altogether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620024990.7U CN205355048U (en) | 2016-01-12 | 2016-01-12 | Novel SOT223 packaging lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620024990.7U CN205355048U (en) | 2016-01-12 | 2016-01-12 | Novel SOT223 packaging lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205355048U true CN205355048U (en) | 2016-06-29 |
Family
ID=56175666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620024990.7U Active CN205355048U (en) | 2016-01-12 | 2016-01-12 | Novel SOT223 packaging lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205355048U (en) |
-
2016
- 2016-01-12 CN CN201620024990.7U patent/CN205355048U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI265617B (en) | Lead-frame-based semiconductor package with lead frame and lead frame thereof | |
| CN205069624U (en) | Array high density lead frame | |
| CN104900625A (en) | High-density IDF SOP8 lead frame structure | |
| CN205355048U (en) | Novel SOT223 packaging lead frame | |
| CN205264692U (en) | 15 IDF type SOP8 lead wire frame construction who arranges | |
| CN203218252U (en) | EMSOP8 integrated circuit packaging lead frame structure | |
| CN205355049U (en) | Novel SOT23 -3 packaging lead frame | |
| CN202816930U (en) | Lead frame structure of MSOP8 package | |
| CN204668297U (en) | A kind of rectangular array SMBF lead frame | |
| CN205335251U (en) | Novel five pin SOT23 packaging lead frames | |
| CN204668296U (en) | A kind of surface mount chip rectifier bridge lead frame | |
| CN202905705U (en) | High-density-arrangement low-power integrated circuit lead frame member | |
| CN205335250U (en) | Six pin SOT23 integrated circuit package's lead wire frame construction | |
| CN204189788U (en) | A kind of SOT23-5L 20 arranges matrix frame structure | |
| CN203503645U (en) | Lead frame structure of SSOP24 integration circuit package | |
| CN203503648U (en) | Lead frame structure of SSOP20 integration circuit package | |
| CN204361082U (en) | A kind of SSOP48 matrix frame structure | |
| CN203232865U (en) | 18 row lead wire framework | |
| CN204792777U (en) | IDF type 208mil SOP8 frame construction that goes between | |
| CN205960030U (en) | Emitting diode lead frame is support that intensity was arranged | |
| CN207009431U (en) | The staggeredly lead frame of pin | |
| CN202816931U (en) | Lead frame structure of integrated circuit EMSOP10 package | |
| CN204632751U (en) | A kind of SOP8 lead frame structure of many arrangements | |
| CN203503646U (en) | Lead frame structure of SOP28 integration circuit package | |
| CN203218253U (en) | MSOP10 integrated circuit packaging lead frame structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |