CN204189788U - A kind of SOT23-5L 20 arranges matrix frame structure - Google Patents
A kind of SOT23-5L 20 arranges matrix frame structure Download PDFInfo
- Publication number
- CN204189788U CN204189788U CN201420637198.XU CN201420637198U CN204189788U CN 204189788 U CN204189788 U CN 204189788U CN 201420637198 U CN201420637198 U CN 201420637198U CN 204189788 U CN204189788 U CN 204189788U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- frame unit
- sot23
- frame structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
A kind of SOT23-5L 20 arranges matrix frame structure, and comprise substrate and the lead frame unit being arranged on described thereon, described lead frame unit is multiple, and described lead frame unit 20 is a row, is divided into some rows and arranges on the substrate.Described lead frame unit every two is classified as one group, is divided into some groups and arranges on the substrate.Described lead frame unit has between 20 groups of adjacent two row lead frame unit and is provided with fabrication hole, and described fabrication hole is elongate holes.Described substrate length is 238mm, and described substrate width is 110mm.Described adjacent two lead frame unit spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit spacing is in the direction of the width 5mm.The utility model provides a kind of arrangement reasonably row's matrix frame structure.
Description
Technical field
The utility model relates to a kind of lead frame structure, particularly relates to a kind of row's matrix frame structure.
Background technology
Lead frame structure must be used during integrated antenna package, existing 12 row SOT23-5L package lead mount structures, owing to limitting by technology, a slice SOT23-5 package lead mount structure can encapsulate at most 480 circuit, seal at most 8 to calculate by every mould, the IC quantity that so every mould can encapsulate at most is 3840, and thus efficiency still has room for promotion.Because chip package is tending towards meagre profit, therefore how to improve packaging efficiency, the cost-saving problem having become encapsulation enterprise and must pay attention to.Existing 12 row SOT23-5L package lead mount structures can not satisfy the demands, and need improvement badly.Need now a kind of arrangement reasonably row's matrix frame structure badly.
Utility model content
The utility model want technical solution problem to be, a kind of arrangement reasonably row's matrix frame structure is provided.For solving above technical problem, the technical solution of the utility model is: a kind of SOT23-5L 20 arranges matrix frame structure, its key is: comprise substrate and the lead frame unit being arranged on described thereon, described lead frame unit is multiple, described lead frame unit 20 is a row, is divided into some rows and arranges on the substrate.
As improvement of the present utility model, described lead frame unit every two is classified as one group, is divided into some groups and arranges on the substrate.Described lead frame unit has 20 groups
Further improve as the utility model, be provided with fabrication hole between adjacent two row lead frame unit, described fabrication hole is elongate holes.
Further improve as the utility model, described substrate length is 238mm, and described substrate width is 110mm.
Further improve as the utility model, described adjacent two lead frame unit spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit spacing is in the direction of the width 5mm.
By implementing, the utility model is desirable obtains following beneficial effect:
A kind of SOT23-5L 20 arranges matrix frame structure, and comprise substrate and the lead frame unit being arranged on described thereon, described lead frame unit is multiple, and described lead frame unit 20 is a row, is divided into some rows and arranges on the substrate.Because often row is provided with 20 lead frame unit, compare existing 12 row SOT23-5L package lead mount structures, production efficiency improves greatly, thus greatly reduces cost of labor; Also effectively can reduce the consumption of power consumption and resin, thus technique effect is obvious simultaneously.Described lead frame unit every two is classified as one group, is divided into some groups and arranges on the substrate.Described lead frame unit has between 20 groups of adjacent two row lead frame unit and is provided with fabrication hole, and described fabrication hole is elongate holes.Described substrate length is 238mm, and described substrate width is 110mm.Described adjacent two lead frame unit spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit spacing is in the direction of the width 5mm.This structure makes it to have higher electrical property and reliability, further increases utilization rate of raw materials, promotes packaging efficiency and saves production cost.The utility model is skillfully constructed, and this function is very practical, is with a wide range of applications.
Accompanying drawing explanation
Below in conjunction with Figure of description, the utility model is described in more detail, wherein:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of lead frame of the present utility model;
Wherein: 10 is substrate; 20 is lead frame unit; 30 is fabrication hole.
Embodiment
As shown in Figure 1, 2, a kind of SOT23-5L 20 arranges matrix frame structure, and comprise substrate 10 and the lead frame unit 20 being arranged on described thereon, described lead frame unit 20 is multiple, described lead frame unit 20 20 is a row, is divided into some rows and is arranged on described substrate 10.Described lead frame unit 20 every two is classified as one group, is divided into some groups and is arranged on described substrate 20.Described lead frame unit 20 has 20 groups, and be provided with fabrication hole 30 between adjacent two row lead frame unit 20, described fabrication hole 30 is elongate holes.Described substrate 10 length is 238mm, and described substrate 10 width is 110mm.Described adjacent two lead frame unit 20 spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit 20 spacing is in the direction of the width 5mm.
Must be pointed out, some non-restrictive explanations that above-mentioned embodiment is just made the utility model.But person of skill in the art will appreciate that, do not departing under aim of the present utility model and scope, can make amendment to the utility model, replace and change, these amendments, replacement and change still belong to protection range of the present utility model.
Claims (9)
1. a SOT23-5L 20 arranges matrix frame structure, it is characterized in that: comprise substrate (10) and be arranged on the lead frame unit (20) of described thereon, described lead frame unit (20) is for multiple, described lead frame unit (20) 20 is a row, is divided into some rows and is arranged on described substrate (10).
2. a kind of SOT23-5L 20 according to claim 1 arranges matrix frame structure, it is characterized in that: described lead frame unit (20) every two is classified as one group, is divided into some groups and is arranged on described substrate (10).
3. a kind of SOT23-5L 20 according to claim 2 arranges matrix frame structure, it is characterized in that: described lead frame unit (20) has 20 groups.
4. a kind of SOT23-5L 20 according to claim 3 arranges matrix frame structure, it is characterized in that: be provided with fabrication hole (30) between adjacent two row lead frame unit (20).
5. a kind of SOT23-5L 20 according to claim 4 arranges matrix frame structure, it is characterized in that: described fabrication hole (30) is elongate holes.
6. a kind of SOT23-5L 20 according to claim 5 arranges matrix frame structure, it is characterized in that: described substrate (10) length is 238mm.
7. a kind of SOT23-5L 20 according to claim 6 arranges matrix frame structure, it is characterized in that: described substrate (10) width is 110mm.
8. a kind of SOT23-5L 20 according to claim 7 arranges matrix frame structure, it is characterized in that: described adjacent two lead frame unit (20) spacing is in the longitudinal direction 6.5mm.
9. a kind of SOT23-5L 20 according to claim 8 arranges matrix frame structure, it is characterized in that: described adjacent two lead frame unit (20) spacing is in the direction of the width 5mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420637198.XU CN204189788U (en) | 2014-10-30 | 2014-10-30 | A kind of SOT23-5L 20 arranges matrix frame structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420637198.XU CN204189788U (en) | 2014-10-30 | 2014-10-30 | A kind of SOT23-5L 20 arranges matrix frame structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204189788U true CN204189788U (en) | 2015-03-04 |
Family
ID=52621763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420637198.XU Active CN204189788U (en) | 2014-10-30 | 2014-10-30 | A kind of SOT23-5L 20 arranges matrix frame structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204189788U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104900625A (en) * | 2015-06-08 | 2015-09-09 | 气派科技股份有限公司 | High-density IDF SOP8 lead frame structure |
-
2014
- 2014-10-30 CN CN201420637198.XU patent/CN204189788U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104900625A (en) * | 2015-06-08 | 2015-09-09 | 气派科技股份有限公司 | High-density IDF SOP8 lead frame structure |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204189788U (en) | A kind of SOT23-5L 20 arranges matrix frame structure | |
CN205069624U (en) | Array high density lead frame | |
CN104900625A (en) | High-density IDF SOP8 lead frame structure | |
CN203277357U (en) | Leading wire frame for semiconductor | |
CN203850280U (en) | Double-chip plastic-sealed lead frame | |
CN204189787U (en) | A kind of SOT23-5L 12 arranges matrix frame structure | |
CN205264692U (en) | 15 IDF type SOP8 lead wire frame construction who arranges | |
CN203707117U (en) | High-density integrated lead frame | |
CN201898132U (en) | 18W lead frame | |
CN202816930U (en) | Lead frame structure of MSOP8 package | |
CN203503647U (en) | Lead frame structure of ESOP8 integration circuit package | |
CN203218252U (en) | EMSOP8 integrated circuit packaging lead frame structure | |
CN203503646U (en) | Lead frame structure of SOP28 integration circuit package | |
CN203503648U (en) | Lead frame structure of SSOP20 integration circuit package | |
CN203503645U (en) | Lead frame structure of SSOP24 integration circuit package | |
CN204632751U (en) | A kind of SOP8 lead frame structure of many arrangements | |
CN204361082U (en) | A kind of SSOP48 matrix frame structure | |
CN204792777U (en) | IDF type 208mil SOP8 frame construction that goes between | |
CN204189789U (en) | A kind of high density LQFP32 integrated circuit packaging lead mount structure | |
CN202423266U (en) | IDF-type large-matrix SOP14 (small outline package 14) lead frame structure | |
CN205264693U (en) | High density IDF type SOT23 -6 frame construction that goes between | |
CN205355048U (en) | Novel SOT223 packaging lead frame | |
CN202816931U (en) | Lead frame structure of integrated circuit EMSOP10 package | |
CN204668297U (en) | A kind of rectangular array SMBF lead frame | |
CN203774300U (en) | High-density frame applied in SOD323 semiconductor packaging |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |