CN204189788U - A kind of SOT23-5L 20 arranges matrix frame structure - Google Patents

A kind of SOT23-5L 20 arranges matrix frame structure Download PDF

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Publication number
CN204189788U
CN204189788U CN201420637198.XU CN201420637198U CN204189788U CN 204189788 U CN204189788 U CN 204189788U CN 201420637198 U CN201420637198 U CN 201420637198U CN 204189788 U CN204189788 U CN 204189788U
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China
Prior art keywords
lead frame
frame unit
sot23
frame structure
substrate
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CN201420637198.XU
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Chinese (zh)
Inventor
刘兴波
梁大钟
宋波
黄立刚
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CHINA CHIPPACKING TECHNOLOGY Co Ltd
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CHINA CHIPPACKING TECHNOLOGY Co Ltd
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Abstract

A kind of SOT23-5L 20 arranges matrix frame structure, and comprise substrate and the lead frame unit being arranged on described thereon, described lead frame unit is multiple, and described lead frame unit 20 is a row, is divided into some rows and arranges on the substrate.Described lead frame unit every two is classified as one group, is divided into some groups and arranges on the substrate.Described lead frame unit has between 20 groups of adjacent two row lead frame unit and is provided with fabrication hole, and described fabrication hole is elongate holes.Described substrate length is 238mm, and described substrate width is 110mm.Described adjacent two lead frame unit spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit spacing is in the direction of the width 5mm.The utility model provides a kind of arrangement reasonably row's matrix frame structure.

Description

A kind of SOT23-5L 20 arranges matrix frame structure
Technical field
The utility model relates to a kind of lead frame structure, particularly relates to a kind of row's matrix frame structure.
Background technology
Lead frame structure must be used during integrated antenna package, existing 12 row SOT23-5L package lead mount structures, owing to limitting by technology, a slice SOT23-5 package lead mount structure can encapsulate at most 480 circuit, seal at most 8 to calculate by every mould, the IC quantity that so every mould can encapsulate at most is 3840, and thus efficiency still has room for promotion.Because chip package is tending towards meagre profit, therefore how to improve packaging efficiency, the cost-saving problem having become encapsulation enterprise and must pay attention to.Existing 12 row SOT23-5L package lead mount structures can not satisfy the demands, and need improvement badly.Need now a kind of arrangement reasonably row's matrix frame structure badly.
Utility model content
The utility model want technical solution problem to be, a kind of arrangement reasonably row's matrix frame structure is provided.For solving above technical problem, the technical solution of the utility model is: a kind of SOT23-5L 20 arranges matrix frame structure, its key is: comprise substrate and the lead frame unit being arranged on described thereon, described lead frame unit is multiple, described lead frame unit 20 is a row, is divided into some rows and arranges on the substrate.
As improvement of the present utility model, described lead frame unit every two is classified as one group, is divided into some groups and arranges on the substrate.Described lead frame unit has 20 groups
Further improve as the utility model, be provided with fabrication hole between adjacent two row lead frame unit, described fabrication hole is elongate holes.
Further improve as the utility model, described substrate length is 238mm, and described substrate width is 110mm.
Further improve as the utility model, described adjacent two lead frame unit spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit spacing is in the direction of the width 5mm.
By implementing, the utility model is desirable obtains following beneficial effect:
A kind of SOT23-5L 20 arranges matrix frame structure, and comprise substrate and the lead frame unit being arranged on described thereon, described lead frame unit is multiple, and described lead frame unit 20 is a row, is divided into some rows and arranges on the substrate.Because often row is provided with 20 lead frame unit, compare existing 12 row SOT23-5L package lead mount structures, production efficiency improves greatly, thus greatly reduces cost of labor; Also effectively can reduce the consumption of power consumption and resin, thus technique effect is obvious simultaneously.Described lead frame unit every two is classified as one group, is divided into some groups and arranges on the substrate.Described lead frame unit has between 20 groups of adjacent two row lead frame unit and is provided with fabrication hole, and described fabrication hole is elongate holes.Described substrate length is 238mm, and described substrate width is 110mm.Described adjacent two lead frame unit spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit spacing is in the direction of the width 5mm.This structure makes it to have higher electrical property and reliability, further increases utilization rate of raw materials, promotes packaging efficiency and saves production cost.The utility model is skillfully constructed, and this function is very practical, is with a wide range of applications.
Accompanying drawing explanation
Below in conjunction with Figure of description, the utility model is described in more detail, wherein:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of lead frame of the present utility model;
Wherein: 10 is substrate; 20 is lead frame unit; 30 is fabrication hole.
Embodiment
As shown in Figure 1, 2, a kind of SOT23-5L 20 arranges matrix frame structure, and comprise substrate 10 and the lead frame unit 20 being arranged on described thereon, described lead frame unit 20 is multiple, described lead frame unit 20 20 is a row, is divided into some rows and is arranged on described substrate 10.Described lead frame unit 20 every two is classified as one group, is divided into some groups and is arranged on described substrate 20.Described lead frame unit 20 has 20 groups, and be provided with fabrication hole 30 between adjacent two row lead frame unit 20, described fabrication hole 30 is elongate holes.Described substrate 10 length is 238mm, and described substrate 10 width is 110mm.Described adjacent two lead frame unit 20 spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit 20 spacing is in the direction of the width 5mm.
Must be pointed out, some non-restrictive explanations that above-mentioned embodiment is just made the utility model.But person of skill in the art will appreciate that, do not departing under aim of the present utility model and scope, can make amendment to the utility model, replace and change, these amendments, replacement and change still belong to protection range of the present utility model.

Claims (9)

1. a SOT23-5L 20 arranges matrix frame structure, it is characterized in that: comprise substrate (10) and be arranged on the lead frame unit (20) of described thereon, described lead frame unit (20) is for multiple, described lead frame unit (20) 20 is a row, is divided into some rows and is arranged on described substrate (10).
2. a kind of SOT23-5L 20 according to claim 1 arranges matrix frame structure, it is characterized in that: described lead frame unit (20) every two is classified as one group, is divided into some groups and is arranged on described substrate (10).
3. a kind of SOT23-5L 20 according to claim 2 arranges matrix frame structure, it is characterized in that: described lead frame unit (20) has 20 groups.
4. a kind of SOT23-5L 20 according to claim 3 arranges matrix frame structure, it is characterized in that: be provided with fabrication hole (30) between adjacent two row lead frame unit (20).
5. a kind of SOT23-5L 20 according to claim 4 arranges matrix frame structure, it is characterized in that: described fabrication hole (30) is elongate holes.
6. a kind of SOT23-5L 20 according to claim 5 arranges matrix frame structure, it is characterized in that: described substrate (10) length is 238mm.
7. a kind of SOT23-5L 20 according to claim 6 arranges matrix frame structure, it is characterized in that: described substrate (10) width is 110mm.
8. a kind of SOT23-5L 20 according to claim 7 arranges matrix frame structure, it is characterized in that: described adjacent two lead frame unit (20) spacing is in the longitudinal direction 6.5mm.
9. a kind of SOT23-5L 20 according to claim 8 arranges matrix frame structure, it is characterized in that: described adjacent two lead frame unit (20) spacing is in the direction of the width 5mm.
CN201420637198.XU 2014-10-30 2014-10-30 A kind of SOT23-5L 20 arranges matrix frame structure Active CN204189788U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420637198.XU CN204189788U (en) 2014-10-30 2014-10-30 A kind of SOT23-5L 20 arranges matrix frame structure

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Application Number Priority Date Filing Date Title
CN201420637198.XU CN204189788U (en) 2014-10-30 2014-10-30 A kind of SOT23-5L 20 arranges matrix frame structure

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CN204189788U true CN204189788U (en) 2015-03-04

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900625A (en) * 2015-06-08 2015-09-09 气派科技股份有限公司 High-density IDF SOP8 lead frame structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900625A (en) * 2015-06-08 2015-09-09 气派科技股份有限公司 High-density IDF SOP8 lead frame structure

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