CN204189787U - A kind of SOT23-5L 12 arranges matrix frame structure - Google Patents

A kind of SOT23-5L 12 arranges matrix frame structure Download PDF

Info

Publication number
CN204189787U
CN204189787U CN201420637081.1U CN201420637081U CN204189787U CN 204189787 U CN204189787 U CN 204189787U CN 201420637081 U CN201420637081 U CN 201420637081U CN 204189787 U CN204189787 U CN 204189787U
Authority
CN
China
Prior art keywords
sot23
lead frame
frame structure
frame unit
rotating shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420637081.1U
Other languages
Chinese (zh)
Inventor
刘兴波
梁大钟
黄立刚
周维
宋波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHINA CHIPPACKING TECHNOLOGY Co Ltd
Original Assignee
CHINA CHIPPACKING TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHINA CHIPPACKING TECHNOLOGY Co Ltd filed Critical CHINA CHIPPACKING TECHNOLOGY Co Ltd
Priority to CN201420637081.1U priority Critical patent/CN204189787U/en
Application granted granted Critical
Publication of CN204189787U publication Critical patent/CN204189787U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

A kind of SOT23-5L12 arranges matrix frame structure, comprise turret base and be arranged on the spherical turntable body in described turret base, described turntable body comprises the first movable part be arranged in the middle part of described turntable body and the second movable part being arranged on the described turntable body left and right sides.Described Novel turntable also comprises the first rotating shaft being arranged on the described first movable part left and right sides, be arranged on the first rotating shaft installing hole on described second movable part, the first motor be connected with described first rotating shaft, the first encoder be connected with the first rotating shaft, be arranged on the second rotating shaft installing hole in described turret base, the second encoder be connected with the second rotating shaft, be arranged on the master control PCB module in described second movable part and be arranged on the lightning protection PCB module in described turret base.The utility model provides a kind of Novel turntable that can effectively prevent picture pick-up device from shaking.

Description

A kind of SOT23-5L 12 arranges matrix frame structure
Technical field
The utility model relates to a kind of lead frame structure, particularly relates to a kind of arrangement reasonably row's matrix frame structure.
Background technology
Lead frame structure must be used during integrated antenna package, existing 8 row SOT23-5L package lead mount structures, owing to limitting by technology before, a slice SOT23-5 package lead mount structure can encapsulate at most 288 circuit, seal at most 12 to calculate by the every mould of plastic packaging, the IC quantity that so every mould can encapsulate at most is 3456, and thus efficiency still has room for promotion.Because chip package is tending towards meagre profit, therefore how to improve packaging efficiency, the cost-saving problem having become encapsulation enterprise and must pay attention to.Existing 8 row SOT23-5L package lead mount structures can not satisfy the demands, and need improvement badly.Need now a kind of arrangement reasonably row's matrix frame structure badly.
Utility model content
The utility model want technical solution problem to be, a kind of arrangement reasonably row's matrix frame structure is provided.For solving above technical problem, the technical solution of the utility model is: a kind of SOT-L arranges matrix frame structure, its key is: comprise substrate and the lead frame unit being arranged on described thereon, described lead frame unit is multiple, described lead frame unit 12 is a row, is divided into some rows and arranges on the substrate.
As improvement of the present utility model, between adjacent two row lead frame unit, be provided with fabrication hole.Described fabrication hole is elongate holes.
Further improve as the utility model, described substrate length is 238mm.Described substrate width is 70mm.
Further improve as the utility model, described adjacent two lead frame unit spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit spacing is in the direction of the width 5mm.
Further improve as the utility model, described lead frame unit every two is classified as one group, is divided into some groups and arranges on the substrate.Described lead frame unit has 12 groups.
By implementing, the utility model is desirable obtains following beneficial effect:
A kind of SOT-L arranges matrix frame structure, and comprise substrate and the lead frame unit being arranged on described thereon, described lead frame unit is multiple, and described lead frame unit 12 is a row, is divided into some rows and arranges on the substrate.Compare existing 8 row SOT23-5L package lead mount structures, production efficiency improves greatly, thus greatly reduces cost of labor; Also effectively can reduce the consumption of power consumption and resin, thus technique effect is obvious simultaneously.Fabrication hole is provided with between adjacent two row lead frame unit.Described fabrication hole is elongate holes.Described substrate length is 238mm.Described substrate width is 70mm.Described adjacent two lead frame unit spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit spacing is in the direction of the width 5mm.Described lead frame unit every two is classified as one group, is divided into some groups and arranges on the substrate.Described lead frame unit has 12 groups.This solves the arrangement problems between many row's circuit, both reduce the effective area of circuit paging as far as possible, thus save encapsulating material, consider reliability during whole piece circuit package again.The utility model is skillfully constructed, and this function is very practical, is with a wide range of applications.
Accompanying drawing explanation
Below in conjunction with Figure of description, the utility model is described in more detail, wherein:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of lead frame of the present utility model;
Wherein: 10 is substrate; 20 is lead frame unit; 30 is fabrication hole.
Embodiment
As shown in Figure 1, 2, a kind of SOT23-5L 12 arranges matrix frame structure, it is characterized in that: the lead frame unit 20 comprising substrate 10 and be arranged on above described substrate 10, described lead frame unit 20 is multiple, described lead frame unit 200 two is a row, is divided into some rows and is arranged on described substrate 10.Be provided with fabrication hole 30 between adjacent two row lead frame unit 20, described fabrication hole 30 is elongate holes.Described substrate 10 length is 238mm, and described substrate 10 width is 70mm.Described adjacent two lead frame unit 20 spacing is in the longitudinal direction 6.5mm.Described adjacent two lead frame unit 20 spacing is in the direction of the width 5mm.Described lead frame unit 20 every two is classified as one group, is divided into some groups and is arranged on described substrate 10.Described lead frame unit 20 has 12 groups.
Must be pointed out, some non-restrictive explanations that above-mentioned embodiment is just made the utility model.But person of skill in the art will appreciate that, do not departing under aim of the present utility model and scope, can make amendment to the utility model, replace and change, these amendments, replacement and change still belong to protection range of the present utility model.

Claims (9)

1. a SOT23-5L 12 arranges matrix frame structure, it is characterized in that: comprise substrate (10) and be arranged on the lead frame unit (20) above described substrate (10), described lead frame unit (20) is for multiple, described lead frame unit (20) 12 is a row, is divided into some rows and is arranged on described substrate (10).
2. a kind of SOT23-5L 12 according to claim 1 arranges matrix frame structure, it is characterized in that: be provided with fabrication hole (30) between adjacent two row lead frame unit (20).
3. a kind of SOT23-5L 12 according to claim 2 arranges matrix frame structure, it is characterized in that: described fabrication hole (30) is elongate holes.
4. a kind of SOT23-5L 12 according to claim 3 arranges matrix frame structure, it is characterized in that: described substrate (10) length is 238mm.
5. a kind of SOT23-5L 12 according to claim 4 arranges matrix frame structure, it is characterized in that: described substrate (10) width is 70mm.
6. a kind of SOT23-5L 12 according to claim 5 arranges matrix frame structure, it is characterized in that: described adjacent two lead frame unit (20) spacing is in the longitudinal direction 6.5mm.
7. a kind of SOT23-5L 12 according to claim 6 arranges matrix frame structure, it is characterized in that: described adjacent two lead frame unit (20) spacing is in the direction of the width 5mm.
8. a kind of SOT23-5L 12 according to claim 7 arranges matrix frame structure, it is characterized in that: described lead frame unit (20) every two is classified as one group, is divided into some groups and is arranged on described substrate (10).
9. a kind of SOT23-5L 12 according to claim 8 arranges matrix frame structure, it is characterized in that: described lead frame unit (20) has 12 groups.
CN201420637081.1U 2014-10-30 2014-10-30 A kind of SOT23-5L 12 arranges matrix frame structure Expired - Lifetime CN204189787U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420637081.1U CN204189787U (en) 2014-10-30 2014-10-30 A kind of SOT23-5L 12 arranges matrix frame structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420637081.1U CN204189787U (en) 2014-10-30 2014-10-30 A kind of SOT23-5L 12 arranges matrix frame structure

Publications (1)

Publication Number Publication Date
CN204189787U true CN204189787U (en) 2015-03-04

Family

ID=52621762

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420637081.1U Expired - Lifetime CN204189787U (en) 2014-10-30 2014-10-30 A kind of SOT23-5L 12 arranges matrix frame structure

Country Status (1)

Country Link
CN (1) CN204189787U (en)

Similar Documents

Publication Publication Date Title
CN104900625A (en) High-density IDF SOP8 lead frame structure
CN204189787U (en) A kind of SOT23-5L 12 arranges matrix frame structure
CN204189788U (en) A kind of SOT23-5L 20 arranges matrix frame structure
CN203733790U (en) Internal decoupling integrated circuit packaging
CN103441085B (en) A kind of flip-chip BGA package method
CN103441106A (en) Chip flip-mounting BGA encapsulating structure
CN205264692U (en) 15 IDF type SOP8 lead wire frame construction who arranges
CN203218252U (en) EMSOP8 integrated circuit packaging lead frame structure
CN202816930U (en) Lead frame structure of MSOP8 package
CN203503647U (en) Lead frame structure of ESOP8 integration circuit package
CN203503646U (en) Lead frame structure of SOP28 integration circuit package
CN201898132U (en) 18W lead frame
CN203503648U (en) Lead frame structure of SSOP20 integration circuit package
CN203218253U (en) MSOP10 integrated circuit packaging lead frame structure
CN203503645U (en) Lead frame structure of SSOP24 integration circuit package
CN205264693U (en) High density IDF type SOT23 -6 frame construction that goes between
CN204361082U (en) A kind of SSOP48 matrix frame structure
CN204792777U (en) IDF type 208mil SOP8 frame construction that goes between
CN204189789U (en) A kind of high density LQFP32 integrated circuit packaging lead mount structure
CN203492263U (en) QFN packaged PCB heat radiating bonding pad structure
CN103441080A (en) Chip front-mounting BGA encapsulating method
CN103441108A (en) Chip front-mounting BGA encapsulating structure
CN204011409U (en) Improve the SOP 8L 12R lead frame of stock utilization
CN204167636U (en) The black colloid of a kind of mobile phone USB flash disk
CN201549490U (en) sip substrate

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant