CN104900625A - High-density IDF SOP8 lead frame structure - Google Patents
High-density IDF SOP8 lead frame structure Download PDFInfo
- Publication number
- CN104900625A CN104900625A CN201510307948.6A CN201510307948A CN104900625A CN 104900625 A CN104900625 A CN 104900625A CN 201510307948 A CN201510307948 A CN 201510307948A CN 104900625 A CN104900625 A CN 104900625A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- installation unit
- sop8
- frame base
- frame structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a high-density IDF SOP8 lead frame structure comprising a rectangular frame substrate and 600 mounting units arranged on the frame substrate. The mounting units are arranged into 15 rows along the width direction of the frame substrate and arranged into 40 columns along the length direction of the frame substrate, every two adjacent columns of mounting units constitute a structure unit, and the outer lead pins of the adjacent mounting units in the odd-numbered rows and in even-numbered rows are staggered in a cross manner, so that the mounting units on the frame substrate form a 15*40 IDF matrix structure. Consumption of raw materials is reduced, the production efficiency is greatly improved, the labor cost is lowered, and the consumption of power and the amount of resin used are reduced effectively.
Description
Technical field
The invention belongs to integrated antenna package technical field, particularly a kind of integrated circuit packaging lead frame structure, be specifically related to a kind of high density IDF type SOP8 lead frame structure.
Background technology
Little outline packages (Small Outline Package, SOP) is microelectronics assewbly and the encapsulation technology of a kind of advanced person, has been in ripe developing stage at present as a kind of middle-end packing forms.This encapsulation has the advantages such as failure rate is low, density is high, save space, cost is lower, can shorten time to market (TTM), reduce investment risk.
Existing SOP8 packaging lead frame structure, limit by technology before and be generally eight rows, a slice SOP8 packaging lead frame structure can encapsulate at most 256 circuit, seal at most 8 to calculate by every mould, the IC quantity that so every mould can encapsulate at most is 2048, and thus efficiency still has room for promotion.
Because chip package is tending towards meagre profit, therefore how to improve packaging efficiency, the cost-saving problem having become encapsulation enterprise and must pay attention to.Existing eight row SOP8 packaging lead frame structures can not satisfy the demands, and are badly in need of improving.
Summary of the invention
The object of the invention is for above-mentioned the deficiencies in the prior art, a kind of high density IDF type SOP8 lead frame structure is provided, makes it that there is higher electrical property and reliability, utilization rate of raw materials can be improved, promote packaging efficiency and reduce production cost.
The technical solution adopted for the present invention to solve the technical problems is: a kind of high density IDF type SOP8 lead frame structure, the frame base comprising rectangle and the installation unit be arranged in frame base, described installation unit has 600, installation unit arranges into 15 rows along the Width of frame base, installation unit lines up 40 row along the length direction of frame base, often adjacent two row installation units form a construction unit, in odd number row and even rows, the outer lead pin of adjacent installation unit is intersected with each other staggers, the installation unit in frame base is made to line up the IDF matrix type structure of 15x40.
Described a kind of high density IDF type SOP8 lead frame structure, its frame base long 300.00 ± 0.102mm, wide 100.00 ± 0.051mm.
Described a kind of high density IDF type SOP8 lead frame structure, the step pitch between its adjacent installation unit is 6.05 ± 0.025mm, and the step pitch between adjacent structural units is 15.00 ± 0.025mm.
Described a kind of high density IDF type SOP8 lead frame structure, is provided with the multiple fabrication holes formed a line between its adjacent two array structure unit.
Described a kind of high density IDF type SOP8 lead frame structure, its fabrication hole comprises the square opening and slotted hole that are laterally alternately arranged.
The invention has the beneficial effects as follows: 600 installation units in frame base line up the IDF matrix type structure that 15 rows 40 arrange, compare existing eight row SOP8 packaging lead frame structures, in frame base, the quantity of installation unit adds 134.37%, installation unit area list only reduces 31.04%, raw material are not only saved, also substantially increase production efficiency, reduce cost of labor, effectively reduce the consumption of power consumption and resin, thus technique effect is obvious simultaneously.
Accompanying drawing explanation
Fig. 1 is partial enlarged drawing of the present invention;
Fig. 2 is overall structure schematic diagram of the present invention;
Fig. 3 is the enlarged drawing of part A in Fig. 1 of the present invention.
Each Reference numeral is: 1-frame base, 2-installation unit, 3-fabrication hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
The design of high density IDF type SOP8 lead frame structure, the main arrangement problems that will solve exactly between many row's circuit, should reduce the effective area of circuit dispersion as far as possible, thus save encapsulating material, consider reliability during whole piece circuit package again.
The high density IDF type SOP8 lead frame structure of the present embodiment is as Fig. 1, shown in Fig. 2 and Fig. 3, the frame base 1 comprising rectangle and several installation units 2 be arranged in frame base 1, the length of frame base 1 is 300.00 ± 0.102mm, width is 100.00 ± 0.051mm, 600 installation units 2 are provided with altogether in frame base 1, all installation units 2 arrange into 15 rows along the Width of frame base 1, length direction along frame base 1 lines up 40 row, from first row installation unit 2, often adjacent two row installation units 2 form a construction unit, and odd number is arranged and the outer lead pin of installation unit 2 adjacent in even rows is intersected with each other staggers, in frame base 1 600 installation units 2 are made to line up the IDF matrix type structure of 15x40, step pitch between adjacent installation unit 2 is 6.05 ± 0.025mm, step pitch between adjacent structural units is 15.00 ± 0.025mm.In lead frame of the present invention and current industry, eight size lead frames arranged contrast, as shown in table 1:
This lead frame of table 1 and existing eight row lead frame size comparison
| Project | Overall length (mm) | Beam overall (mm) | Only/bar | Area (mm 2/ only) |
| The design's lead frame | 300.00 | 100.00 | 600 | 50.00 |
| Existing eight row lead frames | 238.00 | 78.00 | 256 | 72.51 |
As can be seen from Table 1, arrange compared with SOP8 package lead mount structure with existing eight, lead frame of the present invention, installation unit 2 quantity in every sheet frame base 1 adds 134.37%, and installation unit area list only reduces 31.04%, has saved raw material.
The present invention is furnished with 15 row 40 row installation units 2 in full wafer frame base 1, and the structural installation unit 2 of so every sheet SOP8 package leadframe amounts to 600, can fill 600 circuit.Can calculate by output 8 SOP8 package lead mount structures with every mould, packaged battery way can reach 4800.The production efficiency of lead frame of the present invention and eight row lead frames contrasts as shown in table 2.
This lead frame of table 2 and existing eight row lead frame production efficiencys contrast
| Project | Only/bar | Only/mould |
| The design's lead frame | 600 | 4800 |
| Existing eight row lead frames | 256 | 2048 |
As can be seen from Table 2, compare the SOP8 package lead mount structure of existing eight row's structures, when adopting lead frame of the present invention, plastic packaging production efficiency can improve 134.37%, thus greatly reduce cost of labor, with the consumption entering also can effectively reduce power consumption and resin, thus technique effect is obvious.
Be provided with the multiple fabrication holes 3 formed a line between adjacent two array structure unit, described fabrication hole 3 comprises the square opening and slotted hole that are laterally alternately arranged.The fabrication hole 3 of this structure can maximized saving material, the more important thing is and at plastic packaging and can cut the effect playing dispersive stress in muscle procedures, avoid frame deformation to affect the quality of product; And conveniently frame base 1 identified flexibly and install, various installation occasion can be applied in neatly.
Above-described embodiment is illustrative principle of the present invention and effect thereof only; and the embodiment that part is used, for the person of ordinary skill of the art, without departing from the concept of the premise of the invention; can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (5)
1. a high density IDF type SOP8 lead frame structure, the frame base (1) comprising rectangle and the installation unit (2) be arranged in frame base (1), it is characterized in that: described installation unit (2) has 600, installation unit (2) arranges into 15 rows along the Width of frame base (1), installation unit (2) lines up 40 row along the length direction of frame base (1), often adjacent two row installation unit (2) compositions construction unit, in odd number row and even rows, the outer lead pin of adjacent installation unit (2) is intersected with each other staggers, the installation unit (2) in frame base (1) is made to line up the IDF matrix type structure of 15x40.
2. a kind of high density IDF type SOP8 lead frame structure according to claim 1, is characterized in that, described frame base (1) long 300.00 ± 0.102mm, wide 100.00 ± 0.051mm.
3. a kind of high density IDF type SOP8 lead frame structure according to claim 1 and 2, is characterized in that, the step pitch between described adjacent installation unit (2) is 6.05 ± 0.025mm, and the step pitch between adjacent structural units is 15.00 ± 0.025mm.
4. a kind of high density IDF type SOP8 lead frame structure according to claim 3, is characterized in that, is provided with the multiple fabrication holes (3) formed a line between described adjacent two array structure unit.
5. a kind of high density IDF type SOP8 lead frame structure according to claim 4, is characterized in that, described fabrication hole (3) comprises the square opening and slotted hole that are laterally alternately arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510307948.6A CN104900625A (en) | 2015-06-08 | 2015-06-08 | High-density IDF SOP8 lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510307948.6A CN104900625A (en) | 2015-06-08 | 2015-06-08 | High-density IDF SOP8 lead frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104900625A true CN104900625A (en) | 2015-09-09 |
Family
ID=54033196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510307948.6A Pending CN104900625A (en) | 2015-06-08 | 2015-06-08 | High-density IDF SOP8 lead frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104900625A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185765A (en) * | 2015-09-28 | 2015-12-23 | 宁波港波电子有限公司 | Array high-density lead frame and method |
| CN105551972A (en) * | 2015-12-08 | 2016-05-04 | 广东气派科技有限公司 | SOP8 chip packaging technology |
| CN105552058A (en) * | 2015-12-08 | 2016-05-04 | 广东气派科技有限公司 | SOT23-6 chip packaging technology |
| CN115172320A (en) * | 2022-09-08 | 2022-10-11 | 广东气派科技有限公司 | High-density pin TO247 packaging lead frame and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2854809Y (en) * | 2005-11-10 | 2007-01-03 | 南通富士通微电子股份有限公司 | Integrated circuit multiple matrix lead frame |
| CN202888164U (en) * | 2012-10-30 | 2013-04-17 | 天水华天科技股份有限公司 | Novel TO (Triode)-series matrix type lead frame |
| CN202888166U (en) * | 2012-10-30 | 2013-04-17 | 天水华天科技股份有限公司 | Multi-row matrix lead frame of integrated circuit SOT89 |
| CN203674200U (en) * | 2013-12-25 | 2014-06-25 | 天水华天科技股份有限公司 | ESOP8L leading wire framework capable of preventing material overflowing of exposed radiation fin |
| CN204189788U (en) * | 2014-10-30 | 2015-03-04 | 气派科技股份有限公司 | A kind of SOT23-5L 20 arranges matrix frame structure |
| CN204361082U (en) * | 2014-11-05 | 2015-05-27 | 气派科技股份有限公司 | A kind of SSOP48 matrix frame structure |
-
2015
- 2015-06-08 CN CN201510307948.6A patent/CN104900625A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2854809Y (en) * | 2005-11-10 | 2007-01-03 | 南通富士通微电子股份有限公司 | Integrated circuit multiple matrix lead frame |
| CN202888164U (en) * | 2012-10-30 | 2013-04-17 | 天水华天科技股份有限公司 | Novel TO (Triode)-series matrix type lead frame |
| CN202888166U (en) * | 2012-10-30 | 2013-04-17 | 天水华天科技股份有限公司 | Multi-row matrix lead frame of integrated circuit SOT89 |
| CN203674200U (en) * | 2013-12-25 | 2014-06-25 | 天水华天科技股份有限公司 | ESOP8L leading wire framework capable of preventing material overflowing of exposed radiation fin |
| CN204189788U (en) * | 2014-10-30 | 2015-03-04 | 气派科技股份有限公司 | A kind of SOT23-5L 20 arranges matrix frame structure |
| CN204361082U (en) * | 2014-11-05 | 2015-05-27 | 气派科技股份有限公司 | A kind of SSOP48 matrix frame structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185765A (en) * | 2015-09-28 | 2015-12-23 | 宁波港波电子有限公司 | Array high-density lead frame and method |
| CN105551972A (en) * | 2015-12-08 | 2016-05-04 | 广东气派科技有限公司 | SOP8 chip packaging technology |
| CN105552058A (en) * | 2015-12-08 | 2016-05-04 | 广东气派科技有限公司 | SOT23-6 chip packaging technology |
| CN115172320A (en) * | 2022-09-08 | 2022-10-11 | 广东气派科技有限公司 | High-density pin TO247 packaging lead frame and manufacturing method thereof |
| CN115172320B (en) * | 2022-09-08 | 2022-12-06 | 广东气派科技有限公司 | High-density pin TO247 packaging lead frame and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104900625A (en) | High-density IDF SOP8 lead frame structure | |
| CN202888164U (en) | Novel TO (Triode)-series matrix type lead frame | |
| CN203277357U (en) | Leading wire frame for semiconductor | |
| CN204632751U (en) | A kind of SOP8 lead frame structure of many arrangements | |
| CN204792777U (en) | IDF type 208mil SOP8 frame construction that goes between | |
| CN207021260U (en) | A kind of encapsulating lead of high stock utilization | |
| CN205264692U (en) | 15 IDF type SOP8 lead wire frame construction who arranges | |
| CN205303458U (en) | To inserting type TO220F encapsulation lead frame | |
| CN205609511U (en) | Slim paster packaging lead frame structure of VHD | |
| CN206003768U (en) | A kind of DFN3810 9L lead frame | |
| CN207947273U (en) | A kind of lead frame for diode package | |
| CN204189788U (en) | A kind of SOT23-5L 20 arranges matrix frame structure | |
| CN202816930U (en) | Lead frame structure of MSOP8 package | |
| CN207009431U (en) | The staggeredly lead frame of pin | |
| CN208014690U (en) | A kind of improved 220FW-2L lead frames easy to process | |
| CN202423266U (en) | IDF-type large-matrix SOP14 (small outline package 14) lead frame structure | |
| CN204361082U (en) | A kind of SSOP48 matrix frame structure | |
| CN205335250U (en) | Six pin SOT23 integrated circuit package's lead wire frame construction | |
| CN205355049U (en) | Novel SOT23 -3 packaging lead frame | |
| CN111146173A (en) | Novel double-row type fully-encapsulated ITO-220F lead frame | |
| CN205264693U (en) | High density IDF type SOT23 -6 frame construction that goes between | |
| CN203339154U (en) | Lead frame structure with alternative pins | |
| CN205303459U (en) | Be used for quad flat not have pin lead frame of a package | |
| CN203218252U (en) | EMSOP8 integrated circuit packaging lead frame structure | |
| CN217306495U (en) | Lead frame containing solid cutting connecting rib |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150909 |