CN115172320B - High-density pin TO247 packaging lead frame and manufacturing method thereof - Google Patents
High-density pin TO247 packaging lead frame and manufacturing method thereof Download PDFInfo
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- CN115172320B CN115172320B CN202211092058.4A CN202211092058A CN115172320B CN 115172320 B CN115172320 B CN 115172320B CN 202211092058 A CN202211092058 A CN 202211092058A CN 115172320 B CN115172320 B CN 115172320B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4835—Cleaning, e.g. removing of solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
Abstract
The invention relates TO the technical field of TO247 packaging lead frames and manufacturing processes, in particular TO a high-density pin TO247 packaging lead frame and a manufacturing method thereof, wherein the packaging lead frame comprises a plurality of lead frame monomers which are divided into a plurality of groups; the lead frame monomers of each group are arranged into two rows, the lead frame monomers of different rows are paired in a one-to-one correspondence manner, pins are arranged in an interpenetration manner, and the pins of each pair of lead frame monomers are spaced by a first distance; the pins of the lead frame single bodies of the adjacent groups are longitudinally arranged at intervals of a second distance, the positioning holes are formed in the longitudinally arranged intervals of the pins of the lead frame single bodies of the adjacent groups, and the second distance meets the requirement that the diameter of the positioning holes is not less than 1.6mm. The manufacturing method comprises the steps of manufacturing the high-density pin TO247 packaging lead frame provided with the clamping plate by adopting a stamping process; the clamping plate is fixed through the clamp, and full-automatic silver plating treatment is carried out. The invention can utilize the frame material to the maximum extent, and greatly improves the utilization rate of the copper material.
Description
Technical Field
The invention relates TO the technical field of TO247 packaging lead frames and manufacturing processes, in particular TO a high-density pin TO247 packaging lead frame and a manufacturing method thereof.
Background
In the process of packaging an integrated circuit, a lead frame is used as a raw material of a main material, which directly affects the efficiency and reliability of packaging an IC product, and the structure of the lead frame is a key factor affecting the efficiency and reliability of the lead frame. For a long time, because of product structures, package manufacturing of TO247 series products is restricted by a lead frame mode developed in the early stage, the design of the lead frame mainly comprises a single row, and the utilization rate and the production efficiency of the frame are low. Copper and its alloys are widely used as IC lead frame materials due to their excellent electrical and thermal conductivity, but the cost of chip products is also increased as the price of copper materials is greatly increased. Therefore, the improvement of the structural design of the lead frame and the promotion of the structural development from the original single-row to the multi-row and high-density matrix arrangement have very important significance.
At present, all pins of the TO247 lead frame are located on the same side of the base island portion according TO the lead frame standard requirement, as shown in fig. 1, only a single-row design mode is available for manufacturing the TO247 lead frame, and no multi-row design mode is available, because: if the TO247 is designed by imitating lead frames of other chips (such as TO 220) TO form a multi-row high-density matrix, that is, a design of pins (that is, pins are inserted into each other) is adopted, the pins cause that the distance between two adjacent pairs of lead frame bodies on the TO247 lead frames is only 1.655mm, as shown in fig. 2, no positioning holes are arranged at enough positions, and the radius of the positioning holes cannot reach phi 1.6mm (only phi 0.8 mm) or more. The positioning pin corresponding to the too small positioning hole is fragile and is easily broken in the stamping process, and great difficulty is brought to lead frame manufacturing and chip packaging.
Disclosure of Invention
In order TO solve the technical problem, the invention provides a high-density pin TO247 packaging lead frame, which comprises a plurality of lead frame monomers, wherein the lead frame monomers are divided into a plurality of groups; the lead frame monomers of each group are arranged into two rows, the lead frame monomers of different rows are paired in a one-to-one correspondence manner, pins are arranged in an interpenetration manner, and the pins of each pair of lead frame monomers are spaced by a first distance;
the pins of the lead frame single bodies of the adjacent groups are longitudinally arranged at intervals of a second distance, the positioning holes are formed in the longitudinally arranged intervals of the pins of the lead frame single bodies of the adjacent groups, and the second distance meets the requirement that the diameter of the positioning holes is not less than 1.6mm.
Optionally, clamping plates are arranged at intervals between the base island portions of the lead frame units of adjacent longitudinally arranged groups, and the clamping plates are located in the middle of two adjacent base island portions in the same row.
Optionally, one end of the clamping plate is connected with the pin portion, and the other end of the clamping plate is flush with the end of the base island portion far away from the pin.
Optionally, the same lead frame monomer group at least includes a pair of lead frame monomers with pins mutually inserted.
Optionally, the same lead frame monomer group includes lead frame monomers in which one, two, three, four or five pairs of pins are mutually inserted.
Optionally, the positioning hole is provided with a horizontal slot hole at two horizontal sides, and a center line of the horizontal slot hole and a circle center of the positioning hole form a straight line.
Optionally, the base island portion and the pin portion are in different planes; the front surface of the base island part is provided with a base island for mounting a chip, the back surface of the connecting end of the base island part and the pin part is provided with a bulge, and the height of the bulge does not exceed the height of the back surface of the base island part.
Optionally, the back and the front of the connection end of the pipe foot part and the base island part are respectively provided with a first groove and a second groove, and the first groove and the second groove are arranged in a transversely staggered manner.
The invention also provides a manufacturing method of the high-density pin TO247 packaging lead frame, which comprises the following steps:
the high-density pin TO247 packaging lead frame provided with the clamping plate is manufactured into a shape by adopting a stamping process;
soaking in concentrated sulfuric acid at 40-50 deg.C for 3-8 min, taking out, and cleaning with clear water;
soaking the mixture in mixed solution of sodium carbonate, sulfuric acid and hydrochloric acid for 3-5 seconds, taking out and washing the soaked mixture with boiled dumpling water;
fixing the clamping plate through a clamp, and carrying out full-automatic silver plating treatment on the lead frame; and passivating after silver plating.
Optionally, the silver plating process comprises:
using an anode plate with a current density of 0.02-0.03A per square centimeter;
the preparation method comprises the following steps of 1:35-40 AgCO 3 And KCN electrolyte, and electroplating at 20-30 deg.C for 40-50 min;
re-miningComprises the following components in percentage by mass: 1 AgCO 3 And KCN electrolyte, and electroplating at 20-30 deg.C for 10-15 s.
The TO247 series packaging lead frame with the high-density pin is designed, the lead frame monomer is designed into one pair, two pairs, three pairs, four pairs or five pairs, the distance between the two groups is widened TO place the positioning holes with proper sizes, the previous problems are solved, the TO247 packaging high-density pin lead frame is applied and realized, the frame material can be utilized TO the maximum extent, and the utilization rate of copper materials is greatly improved. The design can reduce the cost of IC packaging products by more than 30 percent, greatly improves the production efficiency due to the high-density design, and has good application value.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic plan view of a prior art single gang TO247 packaged lead frame;
fig. 2 is a schematic plan view illustrating a TO247 package lead frame in the prior art, which is caused by double rows of positioning holes with too small diameter;
FIG. 3 is a schematic plan view of a high density pin TO247 package lead frame in accordance with an embodiment of the invention;
FIG. 4 is a side view of an embodiment of the high density pin TO247 packaged lead frame of FIG. 3 according TO the invention;
FIG. 5 is an enlarged view of portion A of the high density pin TO247 package lead frame of the embodiment of FIG. 4;
FIG. 6 is a schematic plan view of a high density pin TO247 packaged lead frame of an embodiment of the present invention with three pairs of lead frame units in one group and a clamping plate between the groups;
FIG. 7 is a schematic plan view of one set of two pairs of lead frame cells used in a high density pin TO247 package lead frame embodiment of the present invention;
fig. 8 is a schematic plan view of a high-density pin-TO-247 packaged lead frame of an embodiment of the invention, in which a group of lead frame units is provided and transverse slots are formed on two lateral sides of the positioning holes;
fig. 9 is a schematic view of a current stabilizing and adjusting circuit adopted in a silver plating process according TO an embodiment of a method for manufacturing a high-density pin TO247 package lead frame.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
As shown in fig. 3 and 4, an embodiment of the present invention provides a high-density pin TO247 package lead frame, including a plurality of lead frame units 1, where the lead frame units 1 include a base island portion 12 and a pin portion 13, the pin portion 13 is provided with pins 11, and the plurality of lead frame units 1 are divided into multiple groups; the lead frame monomers 1 in each group are arranged into two rows, the lead frame monomers in different rows are paired in a one-to-one correspondence manner, the pins 11 are arranged in an interpenetration manner, and the pins 11 of each pair of lead frame monomers 1 are spaced by a first distance;
the pins 11 of the lead frame single bodies 1 in the adjacent groups are longitudinally arranged at intervals of a second distance, the positioning holes 2 are arranged in the middle positions of the intervals of the pins 11 of the lead frame single bodies 1 in the adjacent groups, and the diameters of the positioning holes 2 are not smaller than 1.6mm due to the intervals of the second distance.
The working principle and the beneficial effects of the technical scheme are as follows: in the scheme, the lead frame monomers are designed into one group of one pair, two pairs, three pairs, four pairs or five pairs, and the distance between the two groups is widened, so that the second distance (inter-group gap distance) is greater than the first distance (pin gap distance of the same group of lead frame monomers), for example, the second distance is not less than 2.5 mm, the second distance can be set to be 3-5 mm, and if the diameter of the positioning hole 2 is 2.0mm, the second distance can be set to be 3.6 mm; the positioning holes with proper sizes are placed between the two groups after the widening, so that the previous problems are solved, and the application of the TO247 packaged high-density pin lead frame is realized; the lead frame is made of copper plate materials, so that the frame materials can be utilized to the maximum extent, and the utilization rate of copper materials is greatly improved. The design can reduce the cost of IC packaging products by more than 30 percent, and the high-density design also greatly improves the production efficiency and has good application value; the positioning holes can be used for positioning the lead frame in the chip packaging process, so that the packaging quality is prevented from being influenced by deviation, and the yield and the consistency of products are improved.
In one embodiment, as shown in fig. 6, the base island portions 12 of the lead frame units 1 of adjacent groups arranged longitudinally are provided with the clamping plate 3 at intervals, and the clamping plate 3 is located in the middle position of two adjacent base island portions in the same row;
one end of the clamping plate 3 is connected with the pin part 13, and the other end of the clamping plate 3 is flush with the end of the base island part 12 far away from the pins 11.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the subsequent electroplating mode is considered, the traditional hanging tin plating mode and the existing full-automatic tin plating mode are adopted, the corresponding schemes are designed for the two tin plating modes, the clamping plate is fixed by the clamp during silver plating, the shielding of the clamp on the single parts of the lead frame is avoided, each single part of the lead frame can be uniformly plated with silver, and the clamping plate can be cut off during cutting after packaging, so that the overall silver plating quality of the single parts of the lead frame in the final product is ensured.
In one embodiment, the same lead frame monomer group at least comprises a pair of lead frame monomers with pins mutually interpenetrated;
the same lead frame monomer group can comprise lead frame monomers which are arranged by mutually inserting one pair, two pairs, three pairs, four pairs or five pairs of pins; the dashed frames in fig. 3 and 6-8 are lead frame monomer sets, where one lead frame monomer set has a pair of lead frame monomers as shown in fig. 3, one lead frame monomer set has three pairs of lead frame monomers as shown in fig. 6, and one lead frame monomer set has two pairs of lead frame monomers as shown in fig. 7;
the number of the single-row lead frame monomers is 10, 12 or 14, and the number of the lead frame monomers of the adjacent groups is the same;
as shown in fig. 8, the positioning hole 2 is provided with lateral long holes 4 at both lateral sides thereof, and the center line of the lateral long hole 4 is aligned with the center of the positioning hole 2.
The working principle and the beneficial effects of the technical scheme are as follows: the same lead frame sheet comprises lead frame monomers which are arranged by mutually inserting one pair, two pairs, three pairs, four pairs or five pairs of pins, and the quantity of the lead frame monomers of adjacent groups can be the same or different in the lead frame manufactured on the same plate, so that the flexibility is improved; the transverse long holes with the center lines in a straight line with the circle center of the positioning hole are arranged on the two transverse sides of the positioning hole, so that the surface area of silver plating can be reduced, the cost of silver plating is reduced, and the division along the center lines after packaging is easier.
In one embodiment, as shown in fig. 4 and 5, the base island portion 12 and the pin portion 13 are in different planes;
the front surface of the base island part 12 is provided with a base island 122 for mounting a chip, the back surface of the connecting end of the base island part 12 and the pin part 13 is provided with a bulge 121, and the height of the bulge 121 does not exceed the height of the back surface of the base island part 12;
the back and front of the connection end of the leg portion 13 and the base island portion 12 are respectively provided with a first groove 131 and a second groove 132, and the first groove 131 and the second groove 132 are arranged in a laterally staggered manner.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the base island part and the pin part are staggered, and the base island for mounting the chip is arranged on the front surface of the base island part, so that the thickness of the packaging material on the front surface and the back surface after packaging is balanced, and the heat dissipation of the chip of the base island part is facilitated; the contact area between the bulge and the packaging material can be increased, and the packaging firmness is enhanced; set up first recess and second recess and be used for the mode locking when the encapsulation, conveniently encapsulate the location, improve encapsulation efficiency.
The embodiment of the invention provides a method for manufacturing a high-density pin TO247 packaged lead frame, which comprises the following steps:
the high-density pin TO247 packaging lead frame provided with the clamping plate is manufactured by adopting a stamping process;
soaking in concentrated sulfuric acid at 40-50 deg.C for 3-8 min, taking out, and cleaning with clear water;
soaking the mixture in mixed solution of sodium carbonate, sulfuric acid and hydrochloric acid for 3-5 seconds, taking out and washing the soaked mixture with boiled dumpling water;
fixing the clamping plate through a clamp, and carrying out full-automatic silver plating treatment; and passivating after silver plating.
The working principle and the beneficial effects of the technical scheme are as follows: the TO247 packaging lead frame is manufactured by adopting a stamping process, so that the production efficiency can be improved, and compared with an etching process, a chemical agent is not needed, so that the pollution and the manufacturing cost are reduced; the punched lead frame is soaked in concentrated sulfuric acid to remove surface oil stains, and then is soaked in a mixed solution to enhance surface activity, so that the silver plating efficiency and quality are improved; the clamping plate is fixed by the clamp during silver plating, so that shielding of the clamp on the single lead frame part is avoided, each single lead frame part can be uniformly plated with silver, and the clamping plate can be cut off during cutting after packaging, so that the overall silver plating quality of the single lead frame part in a final product is ensured; the passivation treatment can improve the life of the silver coating.
In one embodiment, the silver plating process comprises:
using an anode plate with a current density of 0.02-0.03A per square centimeter;
the preparation method comprises the following steps of 1:35-40 AgCO 3 And KCN electrolyte, and electroplating at 20-30 deg.C for 40-50 min;
then, the weight ratio of the components is 1:1 AgCO 3 And KCN electrolyte, and electroplating at 20-30 deg.C for 10-15 s.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the silver plating is carried out in two steps, and the electrolytes with different concentrations are adopted, so that the binding force between the silver plating layer and the surface of the plate can be improved, the conditions of bubbles, peeling or crispness and the like are prevented, the silver plating quality is improved, and the service life of the silver plating is prolonged.
In one embodiment, the current of the anode plate in the silver plating treatment is controlled by a steady flow adjusting circuit;
as shown in fig. 9, the regulated current regulator circuit includes a current limiting module, a field effect transistor Q1, a reference voltage module, an amplifier U1, an error amplifier U2, a variable resistor R1, a variable resistor R2, and a variable resistor R3;
the input end of the current limiting module is connected with a power supply, the output end of the current limiting module is connected with the source electrode of the field effect transistor Q1, and the drain electrode of the field effect transistor Q1 is a power supply output end;
the control end of the current limiting module is connected with a pin 4 of an error amplifier U2, an input pin 1 of the error amplifier U2 is connected with an output pin 4 of the amplifier U1 through a variable resistor R1, an input pin 2 of the error amplifier U2 is connected with a drain electrode of a field effect tube Q1, a pin 3 of the error amplifier U2 is respectively connected with a reference voltage module and an internal control module, and an output pin 5 of the error amplifier U2 is connected with a grid electrode of the field effect tube Q1; an input pin 1 of an amplifier U1 is connected with a reference voltage module, an input pin 2 of the amplifier U1 is respectively connected with one end of a variable resistor R2 and one end of a variable resistor R3, a pin 3 of the amplifier U1 is connected with an internal control module, the other end of the variable resistor R2 is connected with an input pin 1 of an error amplifier U2, and the other end of the variable resistor R3 is grounded;
the reference voltage module is connected with the controller.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, a steady current adjusting circuit is configured, a reference voltage provided by a reference voltage module is adopted as a reference by the steady current adjusting circuit, the reference voltage module is controlled by a controller, the reference voltage is processed by an amplifier U1, a plurality of variable resistors and an error amplifier U2 and then acts on a current limiting module and a field effect transistor Q1 to control the current output by power supply, the current limiting module is used for limiting the current supplied to a source electrode of the field effect transistor Q1, the adverse effect caused by power supply change can be avoided, and the current control precision can be reliably guaranteed; the current stabilization adjusting circuit adopted by the scheme has the advantages of high reaction speed and excellent transient response characteristics.
In one embodiment, when a TO247 packaging lead frame is manufactured by adopting a stamping process, the sheet material is tracked and positioned; the tracking and positioning method adopts monocular vision to shoot the moving plate, and when the position of the plate is changed, the shot image is processed as follows:
in order to simplify and count the number of pixel points of the plate image, a self-adaptive key frame algorithm is adopted to carry out binarization processing on all the pixel points in the plate image, and a gray threshold value is set during binarization
If the gray value of a certain pixel point is larger than the gray threshold value
Setting the gray value of the pixel point to 255, if the gray value of the pixel point is less than the gray threshold value
Then the grey value is set to 0; to set a uniform screening criterion for redundant video frames, a screening threshold is set
Screening threshold value
Is a percentage indicating that a threshold condition is satisfied in the video frame image of the plate
The proportion of the pixels in the whole sheet image is calculated; only greater than or equal to
If the video frame is classified as a key frame, otherwise, the video frame is a redundant frame, and the calculation meets the threshold value
The conditional pixel proportion formula is as follows:
in the formula (I), the compound is shown in the specification,
the threshold value of the plate video frame image during binarization is represented,
indicating that the gray value on the video frame image of the plate exceeds the threshold value
The number of the pixel points of (a),
representing the number of all pixels on the sheet video frame image,
showing the plate on the video frame image
The gray value of each pixel point;
in the formula (I), the compound is shown in the specification,
a flag indicating whether the current sheet video frame is a key frame,
a screening threshold value for representing the self-adaptive key frame algorithm to screen the video frame of the redundant plate is set if
And (4) when the current plate video frame is represented, continuing to perform a mean shift algorithm, and otherwise, performing target tracking by taking the current plate video frame as redundant screening.
The working principle and the beneficial effects of the technical scheme are as follows: according to the invention, the moving plate is shot through monocular vision, when the position of the plate is changed, the number of the plate pixel points is processed, the setting of a unified screening standard for redundant video frames is realized, the plate identification efficiency is improved, the number of the pixel points of the plate image is simplified and counted, the workload of a camera is reduced, a technical basis is provided for accurate identification of the plate, the position of the plate can be more accurately positioned on the basis of accurate identification, the stamping processing precision and the yield are improved, and the edge flatness of the stamped lead frame is enhanced.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A high-density pin TO247 packaging lead frame is characterized by comprising a plurality of lead frame monomers, wherein the lead frame monomers are divided into a plurality of groups; the lead frame monomers of each group are arranged into two rows, the lead frame monomers of different rows are paired in a one-to-one correspondence manner, pins are arranged in an interpenetration manner, and the pins of each pair of lead frame monomers are spaced by a first distance;
the pins of the lead frame single bodies of the adjacent groups are longitudinally arranged at intervals of a second distance, the positioning holes are arranged at the intervals of the pins of the lead frame single bodies of the adjacent groups, and the second distance meets the requirement that the diameter of the positioning holes is not less than 1.6 mm;
the TO247 packaging lead frame is manufactured by adopting a stamping process, and during manufacturing, the plate is tracked and positioned; the tracking and positioning adopt monocular vision to shoot the moving plate, and when the position of the plate is changed, the shot image is processed as follows:
adopting a self-adaptive key frame algorithm to carry out binarization processing on all pixel points in the plate image, and setting a gray threshold value during binarization
If the gray value of a certain pixel point is larger than the gray threshold value
Setting the gray value of the pixel point to 255, if the gray value of the pixel point is less than the gray threshold value
Then the grey value is set to 0; to set a uniform screening criterion for redundant video frames, a screening threshold is set
Screening threshold value
Is a percentage indicating that a threshold condition is satisfied in the video frame image of the plate
The pixel of (2) accounts for the proportion of the pixel of the whole plate image; only greater than or equal to
The video frame is classified as a key frame, otherwise, it is a redundant frame.
2. The high-density pin TO247 packaged lead frame as claimed in claim 1, wherein the clamping plates are arranged at intervals between the base islands of adjacent groups of lead frame units in the longitudinal direction, and the clamping plates are located at the middle position between two adjacent base islands in the same row.
3. The high-density pin-TO 247-package lead frame as claimed in claim 2, wherein one end of the clamping plate is connected TO the pin portion and the other end of the clamping plate is flush with the end of the base island portion away from the pins.
4. The high-density pin TO247 package lead frame as claimed in claim 1, wherein the same lead frame unit group comprises at least a pair of lead frame units with pins inserted into each other.
5. The high-density pin TO247 package lead frame as claimed in claim 1, wherein the same lead frame monomer group comprises lead frame monomers in which one, two, three, four or five pairs of pins are arranged TO be inserted into each other.
6. The high-density pin TO247 package lead frame as claimed in claim 1, wherein the locating holes are provided with transverse long holes at both transverse sides, and the central lines of the transverse long holes are aligned with the centers of the locating holes.
7. The high-density pin TO247 package lead frame of any one of claims 1 TO 6, wherein the base island portion and the pin portion are in different planes; the front surface of the base island part is provided with a base island for mounting a chip, the back surface of the connecting end of the base island part and the pin part is provided with a bulge, and the height of the bulge does not exceed the height of the back surface of the base island part.
8. The high-density pin TO247 package lead frame as claimed in any one of claims 1 TO 6, wherein the back and front sides of the connection end of the pin part and the base island part are respectively provided with a first groove and a second groove, and the first groove and the second groove are laterally displaced from each other.
9. A manufacturing method of a high-density pin TO247 packaging lead frame is characterized by comprising the following steps:
manufacturing the high-density pin TO247 packaged lead frame shape of claim 2 by adopting a stamping process;
soaking in concentrated sulfuric acid at 40-50 deg.C for 3-8 min, taking out, and cleaning with clear water;
soaking for 3-5 seconds by adopting a mixed solution of sodium carbonate, sulfuric acid and hydrochloric acid, taking out and cleaning by boiled dumpling water;
fixing the clamping plate through a clamp, and carrying out full-automatic silver plating treatment on the lead frame; and passivating after silver plating.
10. The method for manufacturing a high-density pin TO247 package lead frame according TO claim 9, wherein the silver plating process comprises:
using an anode plate with a current density of 0.02-0.03A per square centimeter;
the preparation method comprises the following steps of 1:35-40 AgCO 3 And KCN electrolyte, and electroplating at 20-30 deg.C for 40-50 min;
then, the weight ratio of the components is 1:1 AgCO 3 And KCN electrolyte, and electroplating at 20-30 deg.C for 10-15 s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211092058.4A CN115172320B (en) | 2022-09-08 | 2022-09-08 | High-density pin TO247 packaging lead frame and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211092058.4A CN115172320B (en) | 2022-09-08 | 2022-09-08 | High-density pin TO247 packaging lead frame and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115172320A CN115172320A (en) | 2022-10-11 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291448A (en) * | 1992-04-09 | 1993-11-05 | Fuji Electric Co Ltd | Lead frame for semiconductor device |
| CN201616429U (en) * | 2010-04-16 | 2010-10-27 | 宁波华龙电子股份有限公司 | Array roundabout plating lead frame panel |
| CN104900625A (en) * | 2015-06-08 | 2015-09-09 | 气派科技股份有限公司 | High-density IDF SOP8 lead frame structure |
| CN111146173A (en) * | 2018-11-06 | 2020-05-12 | 泰州友润电子科技股份有限公司 | Novel double-row type fully-encapsulated ITO-220F lead frame |
| CN215955271U (en) * | 2021-09-16 | 2022-03-04 | 光路新能源科技(江苏)有限公司 | Novel double-row outer frame type ITO-220AB lead frame |
-
2022
- 2022-09-08 CN CN202211092058.4A patent/CN115172320B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291448A (en) * | 1992-04-09 | 1993-11-05 | Fuji Electric Co Ltd | Lead frame for semiconductor device |
| CN201616429U (en) * | 2010-04-16 | 2010-10-27 | 宁波华龙电子股份有限公司 | Array roundabout plating lead frame panel |
| CN104900625A (en) * | 2015-06-08 | 2015-09-09 | 气派科技股份有限公司 | High-density IDF SOP8 lead frame structure |
| CN111146173A (en) * | 2018-11-06 | 2020-05-12 | 泰州友润电子科技股份有限公司 | Novel double-row type fully-encapsulated ITO-220F lead frame |
| CN215955271U (en) * | 2021-09-16 | 2022-03-04 | 光路新能源科技(江苏)有限公司 | Novel double-row outer frame type ITO-220AB lead frame |
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| CN115172320A (en) | 2022-10-11 |
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