CN219017648U

CN219017648U - High-density LQFP packaging lead frame

Info

Publication number: CN219017648U
Application number: CN202223373802.6U
Authority: CN
Inventors: 彭勇; 周根强; 谢兵; 韩彦昭; 倪权; 申健; 李跃; 方元元; 杨士彬; 高勇进
Original assignee: Chizhou Huayu Electronic Technology Co ltd
Current assignee: Chizhou Huayu Electronic Technology Co ltd
Priority date: 2022-12-14
Filing date: 2022-12-14
Publication date: 2023-05-12
Anticipated expiration: 2032-12-14

Abstract

The utility model provides a high-density LQFP packaging lead frame, which relates to the field of semiconductors and comprises a frame, wherein a plurality of chip packaging units distributed in a rectangular array are arranged on the inner side of the frame, the frame is provided with a first thickened side edge and a second thickened side edge along the length direction, and the first thickened side edge and the second thickened side edge are arranged in parallel; a plurality of second group identification holes are formed in the surface of the frame along the direction of the first thickened side edge; the surface of the frame is provided with a plurality of first group identification holes along the direction of the second thickened side edge. Through the both sides limit (first thickening side, second thickening side) of thickening frame, can improve the holistic stability of frame, reduce the deflection, realize distributing the chip packaging unit of top and have very high precision.

Description

High-density LQFP packaging lead frame

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a high-density LQFP packaging lead frame.

Background

At present, the main frame of the LQFP is also 5R and 6R (i.e. the frame has 5 or 6 units in each column), the corresponding single products are 70EA and 84EA (each abbreviation, which indicates the number units in the electronic field, such as individual, only, piece, sheet, etc.), and in order to be able to adapt to the market demand, it is necessary to design the frame with a wider frame, thereby reducing the cost and improving the efficiency.

However, after the frame of the LQFP exceeds 6R, how to ensure the positioning accuracy of the chip package unit on the frame and the deformation existing in the frame itself becomes a problem to be solved urgently at present.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a high-density LQFP packaging lead frame, which solves the problems that after the frame of the LQFP exceeds 6R, the positioning precision of a chip packaging unit on the frame and the deformation of the frame are difficult to control.

(II) technical scheme

In order to achieve the above purpose, the utility model is realized by the following technical scheme:

the high-density LQFP packaging lead frame comprises a frame, wherein a plurality of chip packaging units distributed in a rectangular array are arranged on the inner side of the frame, the frame is provided with a first thickened side edge and a second thickened side edge along the length direction, and the first thickened side edge and the second thickened side edge are arranged in parallel;

a plurality of second group identification holes are formed in the surface of the frame along the direction of the first thickened side edge;

the surface of the frame is provided with a plurality of first group identification holes along the direction of the second thickened side edge.

Preferably, the first thickened side edge and the second thickened side edge are formed by hot extrusion.

Preferably, seven chip packaging units are in a column, each two columns of chip packaging units are in a group, and a widened area is arranged between the chip packaging units in adjacent groups.

Preferably, long slot holes are arranged between adjacent columns of chip packaging units in the same group.

Preferably, the chip packaging unit comprises a chip mounting area and bonding pins extending outwards from the chip mounting area, and positioning protruding points are arranged on the chip mounting area.

Preferably, the frame is provided with a plurality of third recognition holes, and the third recognition holes and the chip packaging units are in one-to-one correspondence.

(III) beneficial effects

The utility model provides a high-density LQFP packaging lead frame. Compared with the prior art, the method has the following beneficial effects:

1. according to the utility model, the two side edges (the first thickened side edge and the second thickened side edge) of the frame are thickened, so that the overall stability of the frame can be improved, the deformation is reduced, the chip packaging units distributed above the frame are realized to have high precision, and the second group of identification holes and the first group of identification holes are correspondingly arranged on the two side edges, so that the position of the frame structure can be accurately identified by identification equipment.

2. According to the utility model, seven chip packaging units are arranged in one row, every two rows of chip packaging units are arranged in one group, and a widened area is arranged between the chip packaging units in the adjacent groups, so that the chip packaging units are conveniently divided into groups after packaging, and then refined processing is carried out, so that the chip packaging technology is optimized.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is an overall schematic of the present utility model;

fig. 2 is a partial schematic view of fig. 1 at a.

Legend description:

1. a frame; 11. a first thickened side; 12. a second thickened side; 13. a first set of identification holes; 14. a second set of identification holes; 15. a chip packaging unit; 151. a chip mounting region; 152. bonding pins; 153. positioning the salient points; 16. a third identification hole; 17. a long slot; 18. widening the area.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions in the embodiments of the present utility model are clearly and completely described, and it is obvious that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

According to the embodiment of the application, the problem that the positioning accuracy of the chip packaging unit on the frame and the deformation existing in the frame are not easy to control after the frame of the LQFP exceeds 6R is solved by providing the high-density LQFP packaging lead frame, and the efficient and low-cost chip LQFP packaging is realized.

In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.

Referring to fig. 1-2, a high-density LQFP package lead frame includes a frame 1, a plurality of chip package units 15 distributed in rectangular arrays are disposed on an inner side of the frame 1, the frame 1 has a first thickened side 11 and a second thickened side 12 along a length direction, and the first thickened side 11 and the second thickened side 12 are disposed in parallel.

The frame 1 can have high structural stability, and the side shrinkage deformation and the inclination deformation can be relatively small in the processing process, and the distortion deformation can be resisted.

The first thickened side 11 and the second thickened side 12 are formed by hot extrusion, and the materials at the sides are thickened by extrusion through an electromagnetic heating framework and extrusion by using an extrusion module.

A plurality of second group identification holes 14 are arranged on the surface of the frame 1 along the direction of the first thickened side 11; the surface of the frame 1 is provided with a number of first sets of identification holes 13 in the direction of the second thickened side 12.

The second set of identifying holes 14 corresponds to the first thickened side 11, and the first set of identifying holes 13 and the second thickened side 12 identify the hole positions of the sides when monitoring, determine the positions of the two sides, and determine whether the two sides are deformed.

Preferably, seven chip packaging units 15 are arranged in a row, each two rows of chip packaging units 15 are arranged in a group, and a widened area 18 is arranged between the chip packaging units 15 of adjacent groups; elongated slot holes 17 are provided between adjacent columns of the chip packaging units 15 of the same group.

In particular use, it is preferable to cut the groups at the widened region 18 and then subdivide the groups into individual products to increase the production efficiency of the products.

The chip packaging unit 15 includes a chip mounting region 151 and bonding pins 152 extending outward from the chip mounting region 151, and positioning bumps 153 are provided on the chip mounting region 151.

The positioning bump 153 can be connected with the packaging plastic package body during plastic packaging.

The frame 1 is provided with a plurality of third identification holes 16, and the third identification holes 16 are in one-to-one correspondence with the chip packaging units 15.

When each packaging unit 15 is packaged, the packaging units 15 need to be further identified and positioned, so that the requirement of subsequent packaging precision is met.

It should be noted that the present structure is designed for a chip package frame above 6R, but the structure still fits into 5R and 6R, and other similar chip package frames, and is preferably used on 7R and above products in view of efficiency and economy, as shown in fig. 1, the total is 112EA for 7R frame, which can reduce cost and improve efficiency.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. The high-density LQFP packaging lead frame comprises a frame (1), wherein a plurality of chip packaging units (15) distributed in a rectangular array are arranged on the inner side of the frame (1), and the high-density LQFP packaging lead frame is characterized in that the frame (1) is provided with a first thickened side edge (11) and a second thickened side edge (12) along the length direction, and the first thickened side edge (11) and the second thickened side edge (12) are arranged in parallel;

a plurality of second group identification holes (14) are formed in the surface of the frame (1) along the direction of the first thickened side edge (11);

the surface of the frame (1) is provided with a plurality of first group identification holes (13) along the direction of the second thickened side edge (12).

2. The high-density LQFP package leadframe according to claim 1, wherein the first thickened side (11) and the second thickened side (12) are each formed by hot extrusion.

3. The high-density LQFP package leadframe according to claim 1, wherein seven of the chip package units (15) are in a row, each two of the chip package units (15) being in a group, a widening area (18) being provided between adjacent groups of chip package units (15).

4. A high-density LQFP package leadframe according to claim 3, wherein long slots (17) are provided between adjacent columns of die package units (15) of the same group.

5. The high-density LQFP package leadframe according to claim 1, wherein the chip package unit (15) comprises a chip mounting area (151) and bonding pins (152) extending outwardly from the chip mounting area (151), the chip mounting area (151) having positioning bumps (153) provided thereon.

6. The high-density LQFP package lead frame according to claim 5, wherein a plurality of third recognition holes (16) are provided on the frame (1), and the third recognition holes (16) are in one-to-one correspondence with the chip package units (15).