CN201616429U - Array roundabout plating lead frame panel - Google Patents
Array roundabout plating lead frame panel Download PDFInfo
- Publication number
- CN201616429U CN201616429U CN 201020168203 CN201020168203U CN201616429U CN 201616429 U CN201616429 U CN 201616429U CN 201020168203 CN201020168203 CN 201020168203 CN 201020168203 U CN201020168203 U CN 201020168203U CN 201616429 U CN201616429 U CN 201616429U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip island
- lead
- array
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses an array roundabout plating lead frame panel piece and overcomes the defects that the traditional like products have high specific gravity in the manufacturing process and continuously-raising material cost. The array roundabout plating lead frame panel is formed by arraying base units comprising a plurality of identical lead frames in each array through side bands on the upper side and the lower side transversely and continuously, wherein each lead frame comprises a chip island and a plurality of lead pins; silver-plating welding areas are arranged at the root parts of the lead pins close to the chip island, and are arranged around the chip island in a rectangular manner; adjacent longitudinal lead frames are connected mutually by rib plates arranged on the upper sides and the lower sides of the lead frames; and regularly-arrayed pits are formed on the back side of the chip island uniformly. A front-side waterproof groove and a back-side waterproof groove are formed on the front side and the back side of the inside edges of the leading pins close to a packaging frame line, respectively. Compared with the traditional products, the utility model has the characteristics of high utilization rate for pure copper raw materials and strong bonding force for plastic sealing materials and a lead frame substrate, and can ensure that the mechanical impact resistance and the heat fatigue resistance of an electric device are improved remarkably.
Description
Technical field
The utility model relates to a kind of semiconductor electronic components and parts manufacturing technology field, especially refers to the arrangement architecture technology of circuit lead frame version part lead frame unit.
Background technology
In recent years, along with the fast development of microelectronics and mechanics of communication, the profile of semiconductor integrated circuit components and parts more and more become miniaturization and microminiaturization are therefore as also miniaturization day by day, the slimming of lead frame of basic discrete device.So guaranteeing how to enhance productivity, reduce the important means that raw materials consumption has become industry competition under the qualified prerequisite of finished product.The circuit lead frame version part of Xiao Shouing mostly is single or double block form arrangement architecture in the market, it is the utility model patent technology of ZL200920142081.3 that this type of comparatively typical product such as Patent Office of State Intellectual Property Office are called " a kind of circuit lead frame that plates welding zone that encircles " patent No. in the name of Granted publication on December 16th, 2009, its more early stage single lead frame is independently made and is compared, no matter be to make efficient, still encapsulate work efficiency and all significantly improve.But along with the lead frame base material---constantly riseing of the fine copper prices of raw and semifnished materials, this series products have exposed leftover pieces proportion height, the high problem of material cost.
The utility model content
The technical problems to be solved in the utility model is to overcome leftover pieces proportion height, high defective and the deficiency of material cost that exists in the existing like product manufacture process, provide a kind of array rotary island plating lead frame version part product to society, with the leftover pieces proportion in effective reduction manufacture process, reduce the fine copper cost of raw material, improve the lead frame price competitiveness.
The technical scheme that its technical problem that solves the utility model adopts is: array rotary island plating lead frame version part is comprised a plurality of same lead frame by every row elementary cell laterally is consecutively arranged to form through the sideband of both sides up and down; Described lead frame comprises chip island and a plurality of lead foot, and described lead foot is provided with silver-plated welding zone at the root near described chip island, and described silver-plated welding zone is around the rectangular setting all around of described chip island; Vertically adjacent described lead frame is connected to each other by the muscle sheet of both sides down provided thereon; The described chip island back side is evenly equipped with regularly arranged pit.
Described lead foot is respectively equipped with front capillary groove and back side capillary groove on the positive and negative surface near package frame line inside edge.
The utility model array rotary island plating lead frame version part, every row are provided with four independently lead frames, and vertically adjacent lead frame is connected to each other by the muscle sheet of both sides down provided thereon; After adopting such array architecture, the leftover pieces proportion that forms in the manufacture process reduces greatly, and the fine copper utilization rate of raw materials promotes; Plastic packaging material is filled in the uniform pit of the capillary groove and the chip island back side of lead foot front and back during encapsulation, can prevent effectively that plastic packaging material and lead frame base material from producing displacement, both adhesions have been strengthened greatly, help sealing and waterproof, humidity resistance to improve, the anti-mechanical shock and the heat-resistant anti-fatigue intensity of finished product obviously promote, and product prolongs useful life.
Description of drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is the elementary cell structure for amplifying schematic diagram of Fig. 1.
Fig. 3 is the utility model lead frame structure schematic diagram.
Fig. 4 is the utility model lead frame chip island structure schematic diagram.
Fig. 5 is that the A-A of Fig. 3 is to cross section structure for amplifying schematic diagram.
Embodiment
As depicted in figs. 1 and 2, the utility model array rotary island plating lead frame version part, the elementary cell 1 that is comprised a plurality of same lead frame 3 by every row laterally is consecutively arranged to form through the sideband 2 of both sides up and down; Described elementary cell 1 vertically, adjacent described lead frame 3 is connected to each other by the muscle sheet 5 of both sides down provided thereon successively; As shown in Figure 3, described lead frame 3 comprises the chip island 6 of central area and is periphery in a plurality of lead foots 4 all around that described chip island 6 is used for the bearing integrated chip; Described lead foot 4 is provided with silver-plated welding zone 7 at the root near described chip island 6, and described silver-plated welding zone 7 is around described chip island 6 rectangular settings all around; As shown in Figure 4, described chip island 6 back sides are evenly equipped with regularly arranged pit 11; As Fig. 3 and shown in Figure 5, described lead foot 4 is respectively equipped with front capillary groove 10 and back side capillary groove 9 on the positive and negative surface near package frame line 12 inside edges.
Continue in conjunction with the accompanying drawings the operation principle of summary the utility model product below.According to the requirement of encapsulation factory, in being equipped with the milling train of corresponding mould, process the array lead frame version part product that vertical four rows are connected by sideband 2, muscle sheet 5, to enhance productivity, reduce the loss of fine copper raw material.When silver-plated, just carry out, to save the consumption of coating noble metal at the described lead foot 4 silver-plated welding zones 7 around described chip island 6; When using this product encapsulated integrated circuit, plastic packaging material is filled in the capillary groove 10 in described lead foot 4 fronts and the capillary groove 9 at the back side, and the uniform pit 11 in described chip island 6 back sides, can prevent effectively that plastic packaging material and lead frame base material from producing displacement, both adhesions have been strengthened greatly, help sealing and waterproof, humidity resistance to improve, the anti-mechanical shock and the heat-resistant anti-fatigue intensity of finished product obviously promote, and product prolongs useful life.
Claims (2)
1. array rotary island plating lead frame version part, the elementary cell that is comprised a plurality of same lead frame by every row laterally is consecutively arranged to form through the sideband of both sides up and down; Described lead frame comprises chip island and a plurality of lead foot, and described lead foot is provided with silver-plated welding zone at the root near described chip island, and described silver-plated welding zone is around the rectangular setting all around of described chip island; It is characterized in that: vertically adjacent described lead frame is connected to each other by the muscle sheet of both sides down provided thereon; The described chip island back side is evenly equipped with regularly arranged pit.
2. the array rotary island plates lead frame version part according to claim 1, it is characterized in that: described lead foot is respectively equipped with front capillary groove and back side capillary groove on the positive and negative surface near package frame line inside edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020168203 CN201616429U (en) | 2010-04-16 | 2010-04-16 | Array roundabout plating lead frame panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020168203 CN201616429U (en) | 2010-04-16 | 2010-04-16 | Array roundabout plating lead frame panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201616429U true CN201616429U (en) | 2010-10-27 |
Family
ID=43002793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020168203 Expired - Lifetime CN201616429U (en) | 2010-04-16 | 2010-04-16 | Array roundabout plating lead frame panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201616429U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820231A (en) * | 2012-07-26 | 2012-12-12 | 浙江捷华电子有限公司 | Annular island plating device of integrated chip lead frame |
| CN104685621A (en) * | 2012-09-26 | 2015-06-03 | 丰田自动车株式会社 | Electric component |
| CN105449076A (en) * | 2015-12-17 | 2016-03-30 | 深圳市万兴锐科技有限公司 | Waterproof LED lead framework and manufacturing method therefor |
| CN115172320A (en) * | 2022-09-08 | 2022-10-11 | 广东气派科技有限公司 | High-density pin TO247 packaging lead frame and manufacturing method thereof |
-
2010
- 2010-04-16 CN CN 201020168203 patent/CN201616429U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820231A (en) * | 2012-07-26 | 2012-12-12 | 浙江捷华电子有限公司 | Annular island plating device of integrated chip lead frame |
| CN102820231B (en) * | 2012-07-26 | 2014-12-03 | 浙江捷华电子有限公司 | Annular island plating device of integrated chip lead frame |
| CN104685621A (en) * | 2012-09-26 | 2015-06-03 | 丰田自动车株式会社 | Electric component |
| CN104685621B (en) * | 2012-09-26 | 2017-05-10 | 丰田自动车株式会社 | Electric component |
| CN105449076A (en) * | 2015-12-17 | 2016-03-30 | 深圳市万兴锐科技有限公司 | Waterproof LED lead framework and manufacturing method therefor |
| CN105449076B (en) * | 2015-12-17 | 2019-02-05 | 深圳市万兴锐科技有限公司 | LED lead frame and its manufacturing method with water-proof function |
| CN115172320A (en) * | 2022-09-08 | 2022-10-11 | 广东气派科技有限公司 | High-density pin TO247 packaging lead frame and manufacturing method thereof |
| CN115172320B (en) * | 2022-09-08 | 2022-12-06 | 广东气派科技有限公司 | High-density pin TO247 packaging lead frame and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101027 |