CN202153516U - Dual enhanced integrated circuit lead frame plate - Google Patents
Dual enhanced integrated circuit lead frame plate Download PDFInfo
- Publication number
- CN202153516U CN202153516U CN2011202959683U CN201120295968U CN202153516U CN 202153516 U CN202153516 U CN 202153516U CN 2011202959683 U CN2011202959683 U CN 2011202959683U CN 201120295968 U CN201120295968 U CN 201120295968U CN 202153516 U CN202153516 U CN 202153516U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- guide pins
- plate
- lead
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present utility model discloses a dual enhanced integrated circuit lead frame plate, and the plate is provided to overcome the defect of the prior like products that plastic packaging material and a lead frame base body are easily layered, cracked, misplaced and slipped after being packaged. The plate is composed of a plurality of basic units, each column of each basic unit comprises a plurality of same lead frames, and the basic units are horizontally and repeatedly extended after being connected through sidebands of the upper and lower sides. Each lead frame is provided with a tube chip and a plurality of guide pins, sealing holes are arranged on the guide pins inside a packaging area, and waterproof grooves are arranged on the surfaces of the guide pins between the sealing holes and the packaging area. The tube chip and end part welding parts of the guide pins are recessed relative to the lead frame base body plane to form a sinking bench, and neighboring basic units are provided with elongated holes. By adopting the plate, the phenomenon that integrated chips are misplaced and slipped relative to the tube chip after being vibrated can be effectively prevented, and the thickness of packaged finished products can be further shortened. The anti mechanical shock performance and the heatproof fatigue strength of the finished products are obviously enhanced, and the service life of the products is prolonged.
Description
Technical field
The utility model relates to semiconductor electronic components and parts manufacturing technology field, especially refers to the encapsulating structure technology between a kind of circuit lead frame matrix and the plastic packaging material.
Background technology
In recent years, occurred in succession on the market, brought new fast happy enjoyment to people's life such as various informative telecommunications and 3G network products such as iphone, ipad.But the industry personage also finds, because the miniaturization just day by day of semiconductor integrated circuit components and parts, slimming situation that numerous areas is used, so also miniaturization day by day, slimming of the leadframe parts that matches with it; Under the situation about further dwindle in profile, thickness further reducing; How to strengthen plastic packaging material and lead frame matrix bond firmness, stop plastic packaging material and heave cracking, strengthen the waterproof sealing performance, become the important leverage of guaranteeing microelectronics communication product reliability and useful life.State Intellectual Property Office once on January 6th, 2010 Granted publication the patent No. be called the utility model patent technology of " a kind of thin type integrated circuit lead frame " for the ZL200920142440.5 name, it comprises " the rectangular dies island of central area and a plurality of pins that are periphery around said chip island ... said pin is respectively equipped with multiple tracks groove and groove near the inboard positive and negative surface at said encapsulation region edge; The back side of said chip island is evenly equipped with pit." this product is as the main discrete device of producing integrated circuit; include tens of pins; but because plastic packaging material and Chip Area after the encapsulation are simple plane combined structure; so when this product was applied to high vibration, high temperature difference and wet environment, phenomenons such as the delamination splitting of plastic packaging material and lead frame, the slippage that misplaces happened occasionally, and have a strong impact on the functional reliability and the useful life of integrated circuit.
The utility model content
The technical problem that the utility model will solve be overcome that existing like product encapsulation back plastic packaging material is subject to the lead frame matrix vibrate, the temperature difference and the wet environment influence produces delamination splitting, the defective and the deficiency of the phenomenons such as slippage that misplace; To society a kind of circuit lead frame version product of dual enhancing is provided, to improve the integrated circuit job stability, to increase the service life.
The utility model solves the technical scheme that its technical problem adopted: the circuit lead frame version of dual enhancing; Comprise that every row comprise the elementary cell of a plurality of same lead frame, said elementary cell laterally repeats to extend after the sideband of upper and lower both sides connects; Said lead frame is provided with die and a plurality of lead foot; Said lead foot is provided with solid sealing of hole in the encapsulation region inboard, and the said lead foot surface between said solid sealing of hole and the said encapsulation region is provided with capillary groove; Said die and said lead foot end welding zone constitute heavy stand with respect to said lead frame matrix plane depression; Adjacent said elementary cell is provided with the slot crack.
The die of the utility model product and lead foot end welding zone with respect to lead frame matrix plane depression, constitute the heavy stand structure after; Both can effectively prevent to be vibrated the back integrated chip and produce the dislocation slippage, can further dwindle the thickness of encapsulation back finished product again with respect to die; Simultaneously and since said heavy stand with respect to said lead frame matrix plane bending after, make that this product more traditional plane series products anti-bending strength on cross-wise direction is excellent more.After the encapsulation of this product; Because the plastic packaging material complete filling is in said solid sealing of hole and capillary groove parts; Strengthened the adhesion of circuit lead frame matrix and plastic packaging material greatly; Help sealing and waterproof, humidity resistance to improve, the anti-mechanical shock and the heat-resistant anti-fatigue intensity of finished product obviously promote, and product prolongs useful life.
Description of drawings
Fig. 1 is the utility model product structure sketch map.
Fig. 2 is the lead frame structure sketch map of Fig. 1.
Fig. 3 be Fig. 2 look up direction cross section structure sketch map.
Embodiment
As depicted in figs. 1 and 2, the circuit lead frame version of the dual enhancing of the utility model comprises that every row comprise the elementary cell 1 of a plurality of same lead frame 3, and said elementary cell 1 laterally repeats to extend after the sideband 2 of upper and lower both sides connects; Adjacent said elementary cell 1 is provided with slot crack 4 to discharge machining stress; In said elementary cell 1, upper and lower adjacent said lead frame 3 is fixedly connected by contact pin 5.
As shown in Figure 2, said lead frame 3 is provided with the die 6 in centre and a plurality of lead foots 7 that are provided with around said die 6; Said lead foot 7 is provided with solid sealing of hole 9 being positioned at encapsulation region 8 edges shown in the rectangular broken line; Said lead foot 7 surfaces between said solid sealing of hole 9 and said encapsulation region 8 are provided with capillary groove 10;
As shown in Figures 2 and 3, said die 6 constitutes heavy stand 12, the said die 6 surface bears integrated chips at said heavy stand 12 positions with said lead foot 7 end welding zones 11 with respect to said lead frame 3 matrix planes depression; After adopting such heavy stand structure, both can effectively prevent to be vibrated the back integrated chip and produce the dislocation slippage, can further dwindle the thickness of encapsulation back finished product again with respect to die 6; Simultaneously and since said heavy stand 12 with respect to said lead frame 3 matrix plane bendings after, make that this product more traditional plane series products anti-bending strength on cross-wise direction is excellent more.After the encapsulation of this product; Because the plastic packaging material complete filling is in said solid sealing of hole 9 and capillary groove 10 parts; Strengthened the adhesion of circuit lead frame matrix and plastic packaging material greatly; Help sealing and waterproof, humidity resistance to improve, the anti-mechanical shock and the heat-resistant anti-fatigue intensity of finished product obviously promote, and product prolongs useful life.
Claims (2)
1. the circuit lead frame version of a dual enhancing comprises that every row comprise the elementary cell of a plurality of same lead frame (3) (1), and said elementary cell (1) laterally repeats to extend after the sideband (2) of upper and lower both sides connects; Said lead frame (3) is provided with die (6) and a plurality of lead foot (7); It is characterized in that: said lead foot (7) is provided with solid sealing of hole (9) in encapsulation region (8) inboard, and said lead foot (7) surface between said solid sealing of hole (9) and the said encapsulation region (8) is provided with capillary groove (10); Said die (6) and said lead foot (7) end welding zone (11) constitute heavy stand (12) with respect to said lead frame (3) matrix plane depression.
2. the circuit lead frame version of dual enhancing according to claim 1, it is characterized in that: adjacent said elementary cell (1) is provided with slot crack (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202959683U CN202153516U (en) | 2011-08-12 | 2011-08-12 | Dual enhanced integrated circuit lead frame plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202959683U CN202153516U (en) | 2011-08-12 | 2011-08-12 | Dual enhanced integrated circuit lead frame plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202153516U true CN202153516U (en) | 2012-02-29 |
Family
ID=45694010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202959683U Expired - Lifetime CN202153516U (en) | 2011-08-12 | 2011-08-12 | Dual enhanced integrated circuit lead frame plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202153516U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760716A (en) * | 2012-07-19 | 2012-10-31 | 无锡红光微电子有限公司 | TO-252 package lead frame structure |
| CN108493177A (en) * | 2018-02-06 | 2018-09-04 | 昆山市品能精密电子有限公司 | Grab the integrated circuit supporting structure and its manufacturing method of glue stabilization |
| CN111244058A (en) * | 2020-01-20 | 2020-06-05 | 无锡电基集成科技有限公司 | Lead frame structure and electronic device that base island was bent |
-
2011
- 2011-08-12 CN CN2011202959683U patent/CN202153516U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760716A (en) * | 2012-07-19 | 2012-10-31 | 无锡红光微电子有限公司 | TO-252 package lead frame structure |
| CN108493177A (en) * | 2018-02-06 | 2018-09-04 | 昆山市品能精密电子有限公司 | Grab the integrated circuit supporting structure and its manufacturing method of glue stabilization |
| CN111244058A (en) * | 2020-01-20 | 2020-06-05 | 无锡电基集成科技有限公司 | Lead frame structure and electronic device that base island was bent |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104934405A (en) | Lead wire framework based on DIP multiple substrates and method of using lead wire framework to manufacture packaging part | |
| CN202153516U (en) | Dual enhanced integrated circuit lead frame plate | |
| JP6408431B2 (en) | Lead frame, lead frame manufacturing method, and semiconductor device | |
| CN104241218A (en) | Flip chip plastic package structure with heat dissipation structure and manufacturing method | |
| CN202332836U (en) | Multi-positioned integrated circuit lead frame plate | |
| CN201215804Y (en) | Four-row double-column transistor lead frame plate piece | |
| CN201017876Y (en) | Waterproof type plastic capsulation series lead wire frame | |
| CN201215803Y (en) | Double-row double-column transistor lead frame plate piece | |
| TW201628107A (en) | Manufacturing method of semiconductor device | |
| CN203721709U (en) | Bonding structure | |
| CN203165882U (en) | Stacked package structure | |
| CN108389854B (en) | Ultrathin miniature bridge rectifier | |
| CN205752163U (en) | The framework of diode (led) module | |
| CN103296153A (en) | Encapsulating method for LED chips | |
| CN204596785U (en) | Based on the lead frame on DIP Duo Ji island | |
| CN201215802Y (en) | Double-row-in-parallel integrated circuit lead frame plate piece | |
| CN201853699U (en) | Anti-crack and anti-seepage integrated circuit lead wire framework | |
| CN202905705U (en) | High-density-arrangement low-power integrated circuit lead frame member | |
| CN202127015U (en) | Lead frame with blank holders at backs of matrixes | |
| CN201584405U (en) | Lead frame piece of integrated circuit of thansistor | |
| CN206877993U (en) | A kind of LED based on front pad can eutectic encapsulating structure | |
| CN202120901U (en) | Impermeable anticracking direct inserting type triode lead framework board | |
| CN203787414U (en) | Small-power paster lead frame member | |
| CN201853696U (en) | Lead wire frame body for triodes which are arrayed and combined densely and compactly | |
| JP2009065201A5 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120229 |